KR101119748B1 - Apparatus and method for manufacturing organic el device, and apparatus and method for forming film - Google Patents

Abstract

An object of the present invention is to provide an organic EL device manufacturing apparatus or an organic EL device manufacturing method or a film forming apparatus or a film forming method which has a cluster structure and can shorten a line length or have a good space efficiency.

A vacuum chamber including a vacuum processing chamber including a processing unit for depositing vapor deposition material on a substrate, a transfer chamber for carrying in or taking out the substrate, and a transfer unit for transferring the substrate between the transfer chamber and the plurality of processing units. A plurality of in series are provided, a plurality of the processing units are provided in one vacuum processing chamber or a plurality of the vacuum processing chambers, and at least two or more processing units of the plurality of processing units are disposed adjacent to one of the conveying means, The conveyance angle of the said conveyance board | substrate is correct | amended while carrying in a board | substrate from a carrying-in load chamber and conveying to a carrying-out load chamber via each said cluster.

Vacuum Processing Chambers, Clusters, Transfer Substrates, Deposition Units, Shadow Masks

Description

Organic EL device manufacturing apparatus and organic EL device manufacturing method and film forming apparatus and film forming method {APPARATUS AND METHOD FOR MANUFACTURING ORGANIC EL DEVICE, AND APPARATUS AND METHOD FOR FORMING FILM}

BACKGROUND OF THE INVENTION Field of the Invention The present invention relates to an organic EL device manufacturing apparatus, an organic EL device manufacturing method, and a film forming apparatus and a film forming method, and more particularly, to an organic EL device manufacturing apparatus and an organic EL device manufacturing method suitable for manufacturing by vapor deposition by transporting a large substrate. will be.

An organic EL device is attracting attention as a display device, and there is a vacuum evaporation method as a viable method of manufacturing it. In order to manufacture an organic EL device, it is not just a structure which only forms a light emitting material layer (EL layer) and sandwiches it between electrodes, but a hole injection layer, a transport layer, or an electron injection layer, or a transport layer on a cathode, on an anode. In order to form a multilayer structure in which a variety of materials are formed as thin films, the organic EL device manufacturing apparatus has a configuration in which a plurality of clusters having a plurality of processing chambers are continuous. As such a prior art, the following are mentioned.

[Patent Document 1] Japanese Patent Application Laid-Open No. 2003-027213

However, in the conventional cluster structure, since each processing unit is disposed radially and spaced apart so as not to interfere with the processing unit between the clusters, it is necessary to take a long distance between the clusters, and there is a problem of lengthening the entire line. In particular, the substrate size used for a display device reaches 1500 mm x 1850 mm these days, and a line length becomes longer gradually. In addition, in the radial arrangement, dead space is created between the cluster and the processing unit, resulting in poor space efficiency.

In addition, the cluster in this invention means having a some board | substrate process part and a board | substrate carrying in / out part provided in at least one of the directions which convey a board | substrate.

Accordingly, a first object of the present invention is to provide an organic EL device manufacturing apparatus or an organic EL device manufacturing method or a film forming apparatus or a film forming method which has a cluster structure and can shorten a line length.

Moreover, the 2nd objective of this invention is providing the organic electroluminescent device manufacturing apparatus, organic electroluminescent device manufacturing method, the film-forming apparatus, or the film-forming method which have a cluster structure and are excellent in space efficiency.

In order to achieve the above object, the present invention provides a vacuum processing chamber including a processing unit for depositing a deposition material on a substrate, a transfer chamber for carrying in or taking out the substrate, and the substrate between the transfer chamber and the plurality of processing units. In the organic electroluminescent device manufacturing apparatus which has a cluster which is a vacuum chamber equipped with the conveying means conveyed by WHEREIN, A plurality of the said processing part is provided in one said vacuum processing chamber or a plurality of said vacuum processing chambers, and at least among the said several processing parts It is a 1st characteristic that two or more process parts were arrange | positioned adjacent to one side of the said conveying means.

Moreover, in order to achieve the said objective, this invention has a 2nd characteristic which has a plurality of said clusters, and connected the said plurality of clusters at right angles in series in addition to the said 1st characteristic.

Moreover, in order to achieve the said objective, this invention carries in a board | substrate from an carrying-in load chamber, conveys to a carrying-out load chamber through the cluster which has at least 1 vacuum chamber provided with a some process part, and is in the said vacuum chamber A third feature is that a vapor deposition material is deposited on the substrate, and the conveyance angle of the conveyance substrate is corrected in the middle of the conveyance.

Moreover, in order to achieve the said objective, this invention is equipped with the said vacuum processing chamber provided with two or more said processing parts which perform the same process in addition to any one of said 1st-3rd process, and performs the same process. It is characterized by the 4th thing.

Moreover, in order to achieve the said objective, in addition to the said 4th characteristic, this invention provides the said some process part symmetrically in up, down, left and right with respect to the conveyance direction, and after processing the said board | substrate in a 1st process part, The fifth feature is that the processing is performed by the second processing unit at a point symmetrical with the first processing unit.

According to the present invention, it is possible to provide an organic EL device manufacturing apparatus, an organic EL device manufacturing method or a film forming apparatus or a film forming method which has a cluster structure and can shorten a line length.

According to the present invention, it is possible to provide an organic EL device manufacturing apparatus, an organic EL device manufacturing method or a film forming apparatus or a film forming method having a cluster structure and excellent in space efficiency.

A first embodiment of the invention will be described with reference to FIGS. 1 to 7. The organic EL device manufacturing apparatus is not merely a structure in which a light emitting material layer (EL layer) is formed and sandwiched between electrodes, but various materials such as a hole injection layer or a transport layer on the anode and an electron injection layer or a transport layer on the cathode are thin films. A multi-layered structure is formed or the substrate is washed. 1 shows an example of the manufacturing apparatus.

The organic electroluminescent device manufacturing apparatus 100 in this embodiment processes the load cluster 3 and the said board | substrate 6 which carry in largely and carry in the board | substrate 6 (henceforth simply a board | substrate) of a process object. It consists of four delivery chambers 4 provided between four clusters A-D, each cluster A-D, or between a cluster and a load cluster 3, or the next process (sealing process). At the rear of the next step, there is an unloading chamber (not shown), such as at least a load chamber 31 described later, for carrying out the substrate.

The load cluster 3 receives the board | substrate 6 from the load chamber 31 which has the gate valve 10, and the said load chamber 31, and turns to the transfer chamber 4a in order to maintain a vacuum before and behind. It consists of the conveyance robot 5R which carries in the board | substrate 6. Each of the load chambers 31 and the transfer chambers 4 has a gate valve 10 before and after, and controls the opening / closing of the gate valve 10 to maintain the vacuum, thereby maintaining the substrate by the load cluster 3 or the next cluster. To pass.

The organic EL device manufacturing apparatus 100 arrange | positions the cluster which has not a radial shape but a rectangle or square shape in series with respect to the conveyance direction shown by the arrow of FIG. Each cluster A-D receives the board | substrate from the conveyance chamber 2 which has one conveyance robot 5, and the conveyance robot 5, and the two processes arrange | positioned up and down on the figure which performs predetermined | prescribed process. Has a chamber 1 (first subscripts a to d represent clusters, and second subscripts u and d represent upper and lower sides. In the English subscript, lowercase letters represent places and uppercase letters represent components). . Each process chamber has two process parts arrange | positioned in parallel with the conveyance direction shown by the arrow. For example, as will be described later, the processing chamber 1bu, which is a vacuum deposition chamber, includes processing units 1buL and 1buR. The same applies to other processing chambers. In FIG. 1, since the code becomes complicated, the subscripts L (left) and R (right) are given only to the processing chambers 1bu and 1cd. The gate valve 10 is provided in each process part of the conveyance chamber 2 and the process chamber 1.

2 shows an outline of the configuration of the transfer chamber 2 and the processing chamber 1. Although the configuration of the processing chamber 1 varies depending on the processing contents, the vacuum deposition chamber 1bu that forms the EL layer by depositing a light emitting material in a vacuum will be described as an example. FIG. 3: is a schematic diagram and operation explanatory drawing of the structure of the conveyance chamber 2b and the vacuum deposition chamber 1bu. The conveyance robot 5 in FIG. 2 can move the whole up and down (refer the arrow 53 of FIG. 3), has the arm 51 of the link structure which can be rotated left and right, and the front end part is used for substrate conveyance. It has two comb-shaped hands 52 in two steps of top and bottom. By setting the upper and lower stages, the upper part is used for carrying in and the lower part is used for carrying out, and the carrying in and taking out process can be performed simultaneously in one operation. Whether to use two hands or one hand is decided according to the processing contents. In the following description, for the sake of simplicity, one hand will be described.

On the other hand, the vacuum deposition chamber 1bu is classified into a vapor deposition unit 7 for evaporating a light emitting material to be deposited on a substrate 6, an alignment unit 8 for depositing a required portion of the substrate 6, and a transfer robot. The substrate is delivered by (5), and the process delivery section (9) moves the substrate (6) to the vapor deposition section (7). The alignment part 8 and the process delivery part 9 are provided with 8L and 9L in a left process part, and 8R and 9R in a right process part. The process delivery part 9 can transmit the board | substrate 6, without interfering with the comb-shaped hand 52 of the transfer robot 5, and has the comb-tooth shaped hand which has the means 94 which fixes the board | substrate 6 to. (91) and the substrate surface control means 92 which rotates the comb-shaped hand 91 to stand up the board | substrate 6, and moves to the alignment part 8 or the vapor deposition part 7, and faces it. As the fixing means, electromagnetic suction, a means for clipping, etc. are used in consideration of being in a vacuum.

The alignment 8 is aligned with the substrate 6 and the shadow mask 81 by the shadow mask 81 consisting of the mask 81M and the frame 81F shown in FIG. 8 and the alignment mark 84 on the substrate. It has an alignment drive part 83 shown in FIG.

The vapor deposition unit 7 moves up and down driving means 72 for moving the evaporation source 71 in the vertical direction along the rail 76, and moves the left and right alignment parts of the evaporation source 71 along the rail 75. It has a left and right drive base 74. The evaporation source 71 has a light emitting material which is a vapor deposition material therein, and a stable evaporation rate is obtained by heating control (not shown) of the vapor deposition material, and is arranged in a line as shown in the drawing figure of FIG. It is a structure sprayed from the some injection nozzle 73. As shown in FIG. If necessary, additives are also heated and deposited at the same time so as to obtain stable deposition.

In the above-described embodiment, the transfer robot 5 is constituted by three degrees of freedom in which the entire vertical movement, the rotation of the base portion, and the radial movement of the comb-shaped hand 52 are stretched and contracted in order to simplify the mechanism in the vacuum as much as possible. It is. Therefore, as shown in FIG. 4, the board | substrate 6 is carried in parallel to the delivery chamber 4b as shown with a broken line, and the conveyance robot 5b conveys the board | substrate 6 as it is to the process delivery part 9buL. The lower surface of the substrate 6 is installed at an angle with respect to the process delivery unit 9buL at an angle αL. In order to cope with this, as shown by the solid line in FIG. 4, the above-mentioned angle αR is corrected in the carrier system so that the rectangular substrate 6 overlaps in parallel with the process delivery unit 1buL, or (2 It is necessary to increase the degree of freedom of the transfer robot 5 or to correct it in the vapor deposition unit.

First, this embodiment of (1) is described. By the way, in description of said embodiment, what comprises a conveyance system is the load chamber 31 of the load cluster 3, the conveyance robot 5R, the conveyance chamber 4, and the conveyance robot 5 of the conveyance chamber 2. And the process delivery part 9 of the process chamber 1. At least one of these needs to be corrected. However, the inside of the vacuum chamber needs to be as simple as possible, and it is preferable to correct it in the load chamber 31 or the transfer chamber 4. Since the structures of the load chamber 31 and the transfer chamber 4 are basically the same, the transfer chamber 4 is taken as an example.

FIG. 5: is a figure which shows the angle correction mechanism in the transmission chamber 4 as 1st Example of an angle correction mechanism. FIG. 5A shows a bird's-eye view from the top when the comb-shaped hand 52 of the transfer robot 5 is inserted into the delivery chamber 4, and FIG. 5B shows a side view of the delivery chamber 4. Figure is shown.

The transmission chamber 4 has a mounting table 4D having gate valves 10I and 10E provided at substrate inlet / outlets on both sides, a plurality of support pins 4P, and an angle correction mechanism 4H. The mechanism 4H seals the mounting base support part 4S which supports the mounting base 4D, the rotation drive motor 4KM which rotates the mounting base support part 4S from side to side, and the mounting base support part 4S. It consists of 4 J of magnetic sealing parts.

In such a mechanism, as indicated by the broken line in FIG. 5A, the transfer robot 5a of the cluster A moves the substrate 6 to the mounting table 4D in a non-rotating state, and to the mounting table. After loading in a parallel state, suppose that the conveyance robot 5b conveys so that it may overlap with the process delivery part 1buL shown in FIG. In this case, as mentioned above, what is necessary is just to convey to the process delivery part 9buL in the state which rotated the board | substrate 6 to the right side also [alpha] L.

In view of the operation flow, first, the gate valve 10I is opened while the gate valve 10E is closed, and the substrate is removed from the opening 10IK of the gate valve by the comb-shaped hand 52a of the transfer robot 5a. It carries in and loads it in the loading stand 4D. After the comb-shaped hand 52a is retracted, the valve body 10IB is closed, and the mounting table 4D is rotated by αL to the right by the angle correction mechanism 4H. Thereafter, the gate valve 10E is opened, the comb-toothed hand 52b of the transfer robot 5b is inserted from the opening 10EK, and the substrate 6 is lifted and taken out. The transfer robot 5a loads the substrate 6 in the process delivery part 9buL while rotating the base to adjust the link length by rotating the direction of the process delivery part 1buL.

In the above description, the case where the board | substrate 6 is carried in parallel with the delivery chamber 4 and installed in the mounting table 4D was demonstrated, but when the board | substrate 6 is provided with the angle (beta), the board | substrate 6 The angle of the mounting table 4D is controlled so that the angle with respect to the comb-shaped hand 52b of () becomes αL.

In the present embodiment, after the mounting table 4D is corrected for angle, the carrier robot 5b can be inserted between the mounting table 4D and the substrate 6 without interfering with the supporting pins 4P. , The thickness of the support pin 4P, the spacing, and the number, width, etc. of the comb teeth of the comb-shaped hand 52 are determined. In (a) of FIG. 5, the state of the board | substrate 6 after angle correction and the support pin 4P at that time is shown with the solid line, and the broken line has shown the state before angle correction.

FIG. 6 is a diagram showing a second embodiment of the angle correction mechanism in the transmission chamber 4.

In the first embodiment, the carry-in area of the transfer robot 5b, that is, the carry-in angle αL and the like, is limited according to the size of the above-described support pin. As mentioned later, when the structure of each cluster is the same and the magnitude | size of the board | substrate to convey is constant, it is possible to make angle (alpha) L etc. constant. In such a case, the first embodiment is excellent in its simple mechanism. Otherwise, some restrictions arise in the first embodiment. Therefore, the angle correction mechanism 4H of the second embodiment has a mechanism for rotating only the substrate 6 without rotating the mounting table 4D. As a result, the shape of the carry-in route | route of the conveyance robot 5b becomes unchanged, it can respond to any angle, the width | variety of the comb-tooth of the comb-shaped hand 52b can be made small, and the board | substrate size which can cope can be expanded. .

In FIG. 6, the angle correction mechanism rotates the support pin 4P, the support pin swivel 4KD which fixed the said support pin, and the support pin swivel 4KD to the left and right through the swivel support part 4SJ. It consists of a drive motor 4KM and the vertical drive motor 4JM which moves up and down. In addition, 4V is a sealing bellow with respect to the vertical movement of the swivel support part 4SS. On the other hand, the mounting table 4D is fixed, and its cross section has a convex portion 4DT supporting the substrate 6, as shown in Fig. 6A. Further, the mounting table 4D has movable grooves 4SK for each of the support pins or the support pin groups that enable the support pins 4P to be rotatable.

In such a mechanism, first, the transfer robot 5a is carried into the delivery chamber 4b, and the board | substrate 6 is mounted in the convex part 4DT of the mounting table 4D. At this time, the support pin 4P is at the lowest position together with the support pin turntable 4KD. Thereafter, the support pin swivel 4KD is raised to support the substrate 6 with the support pin 4P, and a desired angle, for example, αL, the support pin swivel 4KD is rotated, and the support pin is in that state. The rotating table 4KD is lowered to load the substrate 6 on the mounting table 4D. Next, the transfer robot 5b is carried in, the board | substrate 6 is gripped, and it is carried out from the delivery chamber 4b.

As described above, in the present embodiment, the transport robot 5b can always be used as a carrying route between the convex portions 4DT of the mounting table 4D at any angle. In addition, in this embodiment, although the board | substrate 6 was mounted by the elongate convex part 4DT, you may mount by the support pin arrange | positioned linearly.

As explained above, according to this embodiment, by providing the angle correction mechanism of the conveyance angle of a board | substrate to a transfer chamber, the cluster structure which has a rectangular process chamber can be connected in series, and the whole line length can be shortened. An organic EL device manufacturing apparatus or an organic EL device manufacturing method can be provided.

Moreover, according to this embodiment, the line structure which has the above-mentioned cluster structure can be implement | achieved, and the organic EL device manufacturing apparatus or organic EL device manufacturing method with high space efficiency can be provided.

In the above description, it has been described without considering the relationship between αR and αL, for example.

Therefore, when the angle correction mechanism is provided in each transmission part 4, it can respond to the dimension or board | substrate size of each cluster or each processing chamber.

In a series of processes, as shown in FIG. 3, each process chamber in FIG. 1 or one process chamber can make several process parts the same shape, and same arrangement.

For example, in the embodiment of FIG. 1, the clusters A to D have the same shape and the same arrangement, and the two processing chambers arranged above and below each cluster are also linearly symmetrical with respect to the conveying direction, and one more. The two processing units in the processing chamber are also linearly symmetrical with respect to the vertical line in the conveying direction. Therefore, the transfer robot 5 is arrange | positioned in the transfer chamber, namely, the center position of a cluster. As a result, αR and αL in FIG. 4 become αR = −αL = α, and in the processing chamber 1bd are in a cross relationship with the processing chamber 1bu, and the value of α in the processing delivery unit 9bdR. The processing delivery unit 9bdL takes a value of -α.

Therefore, first, if the angle correction mechanism of the transmission chamber 4 processes the same size substrate, it does not need to take a continuous value, but just takes the value of 2 of constant angle + (alpha). In this case, the first example of the first embodiment becomes effective.

In this case, when conveying the board | substrate 6 to the process delivery part which has -alpha from-(alpha) or-(alpha)-(alpha) in the same cluster, it is necessary to perform angle correction in the delivery chamber 4 which the cluster contacts.

In the embodiment shown in FIG. 1, the processes of two processing units in the same processing chamber are the same as described later. Therefore, in the same cluster, it returns to the process delivery part which has from (alpha) to (alpha) or-(alpha)-(alpha). In addition, if the correction angles of the clusters are the same as ± α, all of the substrates are processed from the inlet to the outlet of the organic EL device manufacturing apparatus 100 at the correction angle α, and the next substrates are all at the correction angle -α. Will be returned. In this case, angle correction may be performed once on the upstream side as much as possible, and angle correction is unnecessary on the downstream side unless the precondition is changed. Of course, when the preconditions are changed, it is necessary to provide an angle correction mechanism.

Candidates in the present embodiment are the load chamber 31 and the transfer chamber 4a. In the load chamber 31, the same mechanism as that of the transfer chamber may be provided. However, when loading the substrate 6 into the load chamber 31, the load chamber 31 may be waited in advance at an angle of ± α and carried in. In addition, if it is not carried into the rod chamber 31 for every board | substrate, but is carried in the cassette unit accommodated in multiple sheets, the cassette which has an angle of (alpha) in the upper rod chamber 31, and-in the lower rod chamber 31- You may arrange a cassette having an angle of α.

According to this embodiment, since two identical lines can be arranged in parallel, the whole production line may be long in appearance, but the unit length with respect to the production can be made shorter than before.

Next, an embodiment of a method of increasing the degree of freedom of the transfer robot of (2) will be described. The degree of freedom in which the comb-tooth shaped hand 52 of the transfer robot 5 shown in FIG. 5 is rotated left and right is set. For example, the degree of freedom is set at the connecting portion 52J with the link of the comb-shaped hand 52. It is not preferable to newly install a mechanism moving in the vacuum chamber, but the same effects as in the first embodiment can be obtained.

Before explaining the method of correcting in the vapor deposition part of (3), the process chamber 1 shown in FIG. 1 to FIG. 3 is an angle corrected substrate in the transfer chamber 4 or upstream using FIG. 7. Process flow is demonstrated until 6) is carried in to the process delivery part 9, vacuum-deposited, and carried out. After this flow process, as mentioned above, it conveys to the process part on the diagonal of the same cluster, and performs the same vapor deposition process.

The basic consideration method of the vacuum vapor deposition process in this embodiment raises the upper surface conveyed board | substrate 6 perpendicularly, conveys it to the alignment part 8, and deposits it. If the lower surface of the substrate 6 is a vapor deposition surface at the time of conveyance, it is necessary to invert it. However, since the upper surface is a vapor deposition surface, it is only necessary to make it stand vertically.

Next, the vacuum deposition process flow in this embodiment is explained in detail using FIG. 7, referring FIG. In FIG. 3, the part in which the board | substrate 6 exists is shown with the solid line.

First, in the R line, the board | substrate 6R is carried in, the board | substrate 6R is made upright, it moves to the alignment part 8R, and the position is aligned with the board | substrate 6 and the shadow mask 81 (step R1). To step R3). At this time, since the board | substrate is the upper surface conveyance which made the vapor deposition surface upper, alignment can be performed immediately, without inversion or the like. As shown in the drawing figure of FIG. 3, positioning is picked up by the CCD camera 86, and the alignment mark 84 provided in the board | substrate 6 is centered on the window 85 provided in the mask 81M. The shadow mask 81R is controlled by the alignment driver 83. If the vapor deposition is a material that emits red (R), as shown in Fig. 8, a window is formed in a portion corresponding to R of the mask 81M, and the portion is deposited. The size of the window varies depending on the color, but on average it is about 50 µm wide and 150 µm high. The thickness of the mask 81M is 40 micrometers, and it tends to become thinner further.

When the alignment is finished, the evaporation source 71 is moved to the R line side (step R4), and then the evaporation source 71 on the line is moved to the upper or lower side and deposited (step R5). During the R line deposition, the processing of steps L1 to L3 is performed in the L line similarly to the R line. That is, another 6L of board | substrates are carried in, the said board | substrate 6L is erected vertically, it moves to the alignment part 8L, and the alignment with the shadow mask 81L is performed. Upon completion of the deposition of the substrate 6R of the R line, the evaporation source 71 moves to the L line (step L4) to deposit the substrate 6L on the L line (step L5). At this time, if the substrate 6R is spaced apart from the alignment portion 8R before the evaporation source 71 completely exits from the deposition region of the R line, there is a possibility that it is unnecessarily deposited, and after completely exiting, the processing chamber of the substrate 6R ( The carrying out operation from 1) is started, and then the preparation of a new substrate 6R is started. Partition plates 11 are provided between the lines to avoid unnecessary deposition. 3 shows the state of step R4 and step L1. That is, deposition is started on the R line, and the substrate is loaded into the vacuum deposition chamber 1bu on the L line.

Thereafter, by performing the flow continuously, it is possible to deposit without using the evaporation material unnecessarily except for the movement time of the evaporation unit 7. The time required for vapor deposition and other processing time are approximately 1 minute, and if the moving time of the evaporation source 71 is 5 seconds, the conventional undesired deposition time of 1 minute can be shortened to 5 seconds in this embodiment. According to the present embodiment, as shown in FIG. 6, the processing cycle of one processing substrate of the vacuum deposition chamber 1bu is substantially the movement time of the deposition time + evaporation source 71, and the productivity can be improved. . When the treatment time is evaluated under the conditions described above, in the present invention, it is about 1 minute and 5 seconds in the present invention, and the productivity per chamber can be approximately doubled.

In the above embodiments (1) and (2), the case where the substrate is erected has been described so that the vapor deposition surface of the substrate 6 can be conveyed upward and the vapor deposition surface can be deposited by standing shadow masks. As another vapor deposition method, there is a method in which both the substrate and the shadow mask are performed horizontally. In most cases in this case, as shown in Fig. 9, the deposition surface is lowered, and the deposition process is performed from below. In such a case, the method of correcting in the vapor deposition unit of (3) is also effective.

In this embodiment, in order to convey a substrate processing surface to a lower surface, the board | substrate 6 is put in the case and the both ends of a board | substrate are gripped and conveyed. The angle adjustment mechanism can apply the method shown to above-mentioned embodiment.

In addition, since the substrate is deposited vertically, it is difficult to rotate the process delivery part 9 in the processing chamber 1 in such a manner that it is complicated to entangle the mechanism of the shadow mask and the like, but when the substrate processing surface is horizontal, Fig. 5 If the mechanism shown in FIG. 9 is provided in the process delivery part 9, or if the correction angle is constant, as shown in FIG. 9, the alignment part 7 will be installed according to the angle, and the evaporation source 71 will be adjusted to the angle. It is also possible to substantially correct angle by scanning.

Also in this embodiment, the same effect as the previous embodiment can be obtained.

Therefore, the present invention can be applied regardless of the attitude of the shadow mask due to different deposition surface postures.

In addition, although the organic EL device has been described as an example in the above description, the present invention can also be applied to a film forming apparatus and a film forming method for performing vapor deposition on the same background as the organic EL device.

BRIEF DESCRIPTION OF THE DRAWINGS The figure which shows the organic electroluminescent device manufacturing apparatus which is embodiment of this invention.

2 is a diagram showing an outline of the configuration of the transfer chamber 2 and the processing chamber 1 according to the embodiment of the present invention.

3 is a schematic view and an operation explanatory diagram of the configuration of the transfer chamber and the processing chamber according to the embodiment of the present invention.

4 illustrates the necessity of an angle correction mechanism.

5 is a diagram showing a first example of the angle correction mechanism in the first embodiment of the present invention.

Fig. 6 is a diagram showing a second example of the angle correction mechanism in the first embodiment of the present invention.

7 is a view showing a processing flow of the processing chamber 1 according to the first embodiment of the present invention.

8 illustrates an example of a shadow mask.

9 is a view for explaining a third embodiment of the present invention.

<Explanation of symbols for the main parts of the drawings>

1: processing chamber

1bu: vacuum deposition chamber

2: conveying chamber

3: load cluster

4: delivery room

4H: Angle Correction Mechanism

4D: Loading table in the delivery room

4P: Board Support Pin in Transfer Room

5: carrier robot

6: substrate

7: deposition unit

8: alignment part

9: processing delivery unit

10: gate valve

11: partition plate

31: load room

71: evaporation source

81: shadow mask

100: manufacturing apparatus for organic EL device

A to D: cluster

Claims (21)

A cluster having a vacuum processing chamber including a processing unit for depositing a vapor deposition material on a substrate, a transfer chamber for carrying in or taking out the substrate, and a transfer unit for transferring the substrate between the transfer chamber and the processing unit In the organic EL device manufacturing apparatus provided with, A loading rod chamber which installs a plurality of said processing units in one said vacuum processing chamber or a plurality of said vacuum processing chambers, arrange | positions at least 2 or more processing parts of the said processing part adjacent one side of the said conveying means, and carries in the said board | substrate, and The carrying part which comprises a carrying out chamber which carries out a board | substrate, and the conveying system which conveys the said board | substrate from the said carrying rod chamber to a carrying-out rod chamber, Compensation means which corrects the conveyance angle of the said board | substrate conveyed by the said carrying part. An organic EL device manufacturing apparatus characterized by the above-mentioned. The organic EL device manufacturing apparatus according to claim 1, having a plurality of the clusters and connecting the plurality of clusters in series. The organic EL device manufacturing apparatus according to claim 1, wherein the load rod chamber is the transfer chamber. The organic EL device manufacturing apparatus according to claim 1, wherein the carrying-out load chamber is the transfer chamber. The said conveyance part which has the said correction means is at least one of the process delivery part of the board | substrate provided in the said transfer chamber, the said loading rod chamber, and the said process part, The said conveyance part of any one of Claims 1-4 characterized by the above-mentioned. Organic EL device manufacturing apparatus. The organic EL according to claim 5, wherein the correction means is a means for rotating a mounting table for loading the substrate provided in the carrying section, or a means for rotating the substrate away from the mounting table. Device manufacturing apparatus. The organic EL device manufacturing apparatus according to any one of claims 1 to 4, wherein the transfer section is a transfer robot provided in the cluster, the carry-in load chamber, or the carry-out rod chamber. 8. The organic EL device manufacturing apparatus according to claim 7, wherein the correction means is a means for changing an angle of a hand portion for carrying the substrate of the transfer robot. The organic EL device according to any one of claims 1 to 4, wherein the conveying portion is the carrying load chamber, and the correction means is provided with the substrate at a predetermined angle in the carrying load chamber. Manufacturing device. The organic EL device manufacturing apparatus according to claim 1 or 2, wherein the evaporation source to be deposited is scanned along the substrate obliquely carried in the process delivery section of the substrate provided in the processing section. The said plurality is four or more, The said plurality of process parts are provided symmetrically up and down and left and right with respect to the conveyance direction, and after processing the said board | substrate with a 1st process part, a 1st process part And a processing means for processing in the second processing unit at a point symmetrical position. The organic EL device manufacturing apparatus according to claim 1 or 2, wherein the cluster includes two vacuum processing chambers in which a plurality of the processing units that perform the same processing are provided. The organic EL device manufacturing method which carries in a board | substrate from an carrying-in load chamber, conveys to a carrying-out load chamber through the cluster which has at least 1 vacuum chamber provided with a some process part, and deposits a vapor deposition material to the said board | substrate in the said vacuum chamber. In The conveyance angle of the said conveyance board | substrate is correct | amended in the middle of the said conveyance, The organic electroluminescent device manufacturing method characterized by the above-mentioned. The said conveyance angle is correct | amended in at least 1 place of the process delivery part of the said loading rod chamber, the transfer chamber which carries in or carries out the said board | substrate to the said vacuum chamber, the said loading rod chamber, and the board | substrate provided in the said process part. The organic EL device manufacturing method characterized by the above-mentioned. The method of manufacturing an organic EL device according to claim 13, wherein the conveying angle is corrected by a conveying robot provided in the cluster, the loading rod chamber, or the loading rod chamber. The organic EL device manufacturing method according to claim 13, wherein the conveyance angle is corrected by being provided at a desired angle in the carry-in load chamber. The said plurality is four or more, The said some process part is installed symmetrically up-down and left-right with respect to the conveyance direction, and after processing the said board | substrate in a 1st process part, And a second processing unit located at a point symmetrical with the first processing unit, wherein the organic EL device manufacturing method is used. A cluster having a vacuum processing chamber including a processing unit for depositing a vapor deposition material on a substrate, a transfer chamber for carrying in or taking out the substrate, and a transfer unit for transferring the substrate between the transfer chamber and the processing unit In the film-forming apparatus provided with, A loading rod chamber which installs a plurality of said processing units in one said vacuum processing chamber or a plurality of said vacuum processing chambers, arrange | positions at least 2 or more processing parts of the said processing part adjacent one side of the said conveying means, and carries in the said board | substrate, and It has a conveyance part comprised from the carrying-out load chamber which carries out a board | substrate, and the conveying system which conveys the said board | substrate from the said loading rod chamber to a carrying-out load chamber, Comprising: It has correction means which corrects the conveyance angle of the said board | substrate conveyed in the said conveying part. A film forming apparatus. delete In the film-forming method which carries in a board | substrate from an carrying-in load chamber, conveys to a carrying-out load chamber through the cluster which has at least 1 vacuum chamber provided with a some process part, and deposits vapor deposition material in the said vacuum chamber to the said board | substrate, The film-forming method correct | amends the conveyance angle of the said conveyance board | substrate in the middle of the said conveyance. 21. The method according to claim 20, wherein the plurality is four or more, and the plurality of processing units are provided symmetrically in up, down, left and right with respect to the conveying direction, and the substrate is processed in the first processing unit. The film forming method, characterized in that the processing in the second processing unit in the position.

Images