CN101685848B - Organic el device manufacturing apparatus and method, film-forming apparatus and method - Google Patents
Organic el device manufacturing apparatus and method, film-forming apparatus and method Download PDFInfo
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- CN101685848B CN101685848B CN200910165275XA CN200910165275A CN101685848B CN 101685848 B CN101685848 B CN 101685848B CN 200910165275X A CN200910165275X A CN 200910165275XA CN 200910165275 A CN200910165275 A CN 200910165275A CN 101685848 B CN101685848 B CN 101685848B
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/568—Transferring the substrates through a series of coating stations
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
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Abstract
The invention provides an organic EL device manufacturing apparatus with high space efficiency, which is provided with a device group configuration and is capable of shortening the length of production line, an organic EL device manufacturing method, or a film-forming apparatus or a film-forming method. A plurality of device groups as vacuum chambers are connected in series, and the device group comprises a vacuum processing chamber for coating the evaporation-coating materials on the processing part on the substrate by evaporation, a hand-over chamber for moving the substrate in or out, and a transfer mechanism for transferring the substrate between the hand-over chamber and the plurality of processing parts, wherein, a plurality of the processing parts are arranged in the vacuum chamber or the plurality of the vacuum chambers, at least two processing parts are arranged next to one side of the transfer mechanism; the substrate is transferred from the move-in loading chamber, by means of the device groups, in the process of transferring the substrate into the move-out loading chamber, the transferring angel of the substrate is corrected.
Description
Technical field
The present invention relates to organic el device manufacture apparatus and manufacturing approach thereof and film formation device and film build method, relate in particular to the organic el device manufacture apparatus and the manufacturing approach thereof that are suitable for the carrying large substrate and make with vapour deposition method.
Background technology
Come into one's own as the display device organic EL device, vacuum vapour deposition is arranged as the strong method of its manufacturing.In order to make organic EL device; Be not only the structure that forms luminous material layer (EL layer) and clamp this layer with electrode; And; In order on anode, to form positive hole implanted layer and transfer layer, form on negative electrode that electron injecting layer and transfer layer etc. are made film with various materials and the sandwich construction that constitutes, organic el device manufacture apparatus adopts will have a plurality of continuous structures of equipment group of a plurality of process chambers.The content that the record of patent documentation 1-TOHKEMY 2003-027213 communique is arranged as such prior art.
Yet, with regard to existing equipment group structure,, and, need the distance between each equipment group of lengthening in order to make each handling part mutually noninterfere and the configured separate between the equipment group owing to each handling part is configured to radial, there is the problem that increases as whole production line.Especially from the past till now the employed substrate dimension of display device also reach 1500mm * 1850mm, the length of production line is also more and more longer.In addition, radial be configured between equipment group and the handling part forms wasted space and space efficiency worsened.
In addition, the present invention's so-called " equipment group " is meant that a plurality of substrate processing portions and the substrate of at least one side with the direction that is arranged on the carrying substrate move into the portion of taking out of.
Summary of the invention
Therefore, first purpose of the present invention provides a kind of organic el device manufacture apparatus or its manufacturing approach or the film formation device or film build method that can shorten the length of production line.
Second purpose of the present invention provides a kind ofly has equipment group structure, and high organic el device manufacture apparatus or/and manufacturing approach or film formation device or the film build method of space efficiency.
In order to achieve the above object; First characteristic of the present invention is; In the equipment group that has as vacuum chamber; This equipment group possesses: possess vacuum processing chamber with the handling part of deposition material vapor deposition on substrate, and the handing-over chamber that above-mentioned substrate is moved into or taken out of, and in the organic el device manufacture apparatus of the carrying mechanism that above-mentioned substrate is carried between above-mentioned handing-over chamber and above-mentioned a plurality of process chamber; In an above-mentioned vacuum processing chamber or a plurality of above-mentioned vacuum processing chamber, a plurality of above-mentioned handling parts are set, the plural at least handling part adjacency in above-mentioned a plurality of handling parts are configured in a side of above-mentioned carrying mechanism.
In order to achieve the above object, second characteristic of the present invention is on the basis of above-mentioned first characteristic, has a plurality of the said equipment groups, and above-mentioned a plurality of equipment groups in series at right angles connect.
Have, in order to achieve the above object, the 3rd characteristic of the present invention is again; Substrate is moved into from moving into load cell; By means of equipment group with at least one vacuum chamber that possesses a plurality of handling parts, take out of to taking out of load cell, above-mentioned vacuum chamber with the deposition material vapor deposition to above-mentioned substrate; In the process of above-mentioned carrying, the carrying angle of above-mentioned carrying substrate is revised.
In addition, in order to achieve the above object, the 4th characteristic of the present invention is on any one basis of above-mentioned first to the 3rd characteristic, and the said equipment group has two and is provided with a plurality of above-mentioned vacuum processing chambers that carry out the above-mentioned handling part of same treatment.
In order to achieve the above object; The 5th characteristic of the present invention is on the basis of above-mentioned the 4th characteristic; The direction of the above-mentioned relatively carrying of above-mentioned a plurality of handling parts is provided with up and down symmetrically; After first handling part has been handled above-mentioned substrate, handling with second handling part of the point-symmetric position of first handling part.
Effect of the present invention is,
According to the present invention, can provide to have equipment group structure, can shorten organic el device manufacture apparatus or its manufacturing approach or the film formation device or the film build method of the length of production line.
In addition,, can provide to have equipment group structure according to the present invention, and high organic el device manufacture apparatus or its manufacturing approach or film formation device or the film build method of space efficiency
Description of drawings
Fig. 1 is the figure of the organic el device manufacture apparatus of expression execution mode of the present invention.
Fig. 2 is the figure of summary of structure of carrying room 2 and the process chamber 1 of expression execution mode of the present invention.
Fig. 3 is the sketch map and the action specification figure of structure of carrying room and the process chamber of execution mode of the present invention.
Fig. 4 is the figure of the necessity of explanation angle modification mechanism.
Fig. 5 is the figure of first embodiment of the angle modification mechanism of expression first execution mode of the present invention.
Fig. 6 is the figure of second embodiment of the angle modification mechanism of expression first execution mode of the present invention.
Fig. 7 is the figure of handling process of the process chamber 1 of expression first execution mode of the present invention.
Fig. 8 is a presentation graphs.
Fig. 9 is the figure of explanation the 3rd execution mode of the present invention.
Among the figure:
The 1-process chamber, 1bu-vacuum evaporation chamber, the 2-carrying room, 3-load equipment group, 4-joins the chamber; 4H-angle modification mechanism, the mounting table of 4D-handing-over chamber, the substrate supports pivot pin of 4P-handing-over chamber, 5-conveying robot, 6-substrate; The 7-steam plating part, the 8-aligned portions, 9-handles junction, 10-gate valve, 11-dividing plate; The 31-load cell, 81-shadow mask, 71-evaporation source, the manufacturing installation of 100-organic EL device, A-D-equipment group.
Embodiment
Use Fig. 1-Fig. 7 that first execution mode of the present invention is described.Organic el device manufacture apparatus is not only the structure that forms luminous material layer (EL layer) and clip with electrode; And formation will form positive hole implanted layer and transfer layer on anode; On negative electrode, form the multi-ply construction that various materials such as electron injecting layer and transfer layer are made membrane structure, perhaps carry out the cleaning of substrate.What Fig. 1 represented is an example of this manufacturing installation.
The organic el device manufacture apparatus 100 of this execution mode is roughly by constituting with the lower part: the load equipment group 3 of moving into the substrate 6 (being designated hereinafter simply as " substrate ") of process object; Handle four equipment group A-D of above-mentioned substrate 6, be arranged between two equipment groups or equipment group and load equipment group 3 or subsequent processing (sealing process) between five join chambers 4.The rear of subsequent processing at least also be useful on transport substrate as after relief chamber (not shown) the load cell 31 stated.
Organic el device manufacture apparatus 100 in series disposes each equipment group with respect to the carrying direction shown in the arrow of Fig. 1, and each equipment group has rectangle or foursquare shape but not radial shape.Each equipment group A-D has: have a conveying robot 5 carrying rooms 2; And from conveying robot 5 reception substrates; (the first back mark a-d indication equipment group, the second back mark u, d represent the upside downside to two process chambers 1 that carry out predetermined process and on drawing, dispose up and down.In following back mark with English alphabet, lowercase is represented the place, and capitalization is represented inscape).Manage throughout and have two handling parts that dispose abreast with respect to the carrying direction shown in the arrow in the chamber.For example, the process chamber 1bu as the vacuum evaporation chamber has handling part 1buL and 1buR.At another process chamber too.In Fig. 1 because label becomes complicated, thereby only marked process chamber 1bu and 1cd etc. and the mark back mark L (left side), R (right side).Each handling part in carrying room 2 and chambers 1 is provided with gate valve 10.
Fig. 2 representes the summary of the structure of carrying room 2 and chambers 1.The structure of process chamber 1 is difference with handling content, and 1bu position, the vacuum evaporation chamber example that forms the EL layer with vapor deposition luminescent material in a vacuum describes.Fig. 3 is the sketch map and the action specification figure of the structure of this carrying room 2b and vacuum evaporation chamber 1bu.The conveying robot 5 of Fig. 2 is that integral body can move up and down (with reference to the arrow 53 of Fig. 3), have can about the arm 51 of the link rod structure that circles round, its front end has two broach shape hands 52 that divide the two-layer substrate carrying usefulness in position up and down.Two-layer up and down through making, can the upper strata be used for moving into, lower floor is used for transporting, and can come to move into simultaneously the processing that transports with an action.Making two hands still is that a hand determines according to contents processing.In the explanation afterwards, be that example describes with a hand for making explanation simple.
On the other hand; Vacuum evaporation chamber 1bu is roughly by constituting with lower component: make the luminescent material evaporation and the steam plating part of vapor deposition on substrate 6; The aligned portions 8 of vapor deposition on the necessary part of substrate 6; And the handing-over of carrying out conveying robot 5 and substrate, and make substrate 6 to processing junction 9 that steam plating part 7 moves.Be provided with 8L, the 9L of handling part in aligned portions 8 and processing junction 9, the 8R of handling part, 9R on the right side in the left side.Handle junction 9 and can join substrate 6 uninterruptedly, and have broach shape hand 91 and substrate surface controlling organization 92 with the broach shape hand 52 of conveying robot 5; This broach shape hand 91 has the mechanism 94 of stationary substrate 6, and this substrate surface controlling organization 92 circles round above-mentioned broach shape hand 91 and make substrate 6 upright and move to aligned portions 8 or steam plating part 7 and face with it.As said fixing mechanism, consider in a vacuum and use electromagnetism absorption or clamp system etc.
Aligned portions 8 has driven in registry portion 83 shown in Figure 2, and these driven in registry portion 83 usefulness are carried out the contraposition of substrate 6 and shadow mask 81 by shadow mask 81 and the alignment mark on the substrate 84 that mask 81M shown in Figure 8, framework 81F constitute.
In this above execution mode, conveying robot 5 is in order to simplify the mechanism that has in the vacuum as far as possible, and it moves up and down with integral body, the rotation of pedestal part and the radial flexible three degree of freedoms of broach shape hand 52 are constituted.So; As shown in Figure 4; If substrate 6 is moved into handing-over chamber 4b abreast shown in dotted line, conveying robot 5b carries with its original state substrate 6 to handling junction 9buL, and then substrate 6 is provided with the state that relative processing junction 9buL has certain angle [alpha] L obliquely.For this reason, then need carry out following processing: (1) is revised above-mentioned angle [alpha] L in handling system shown in the solid line of Fig. 4, overlaps abreast thereby make rectangular substrate 6 handle junction 9buL relatively; Or (2) increase the degree of freedom of conveying robot 5; Or (3) are in the steam plating part correction.
This execution mode of (1) at first, is described.So in the explanation of above-mentioned execution mode, what wherein constitute handling system is the load cell 31 of load equipment group 3, conveying robot 5R, handing-over chamber 4, the conveying robot 5 of carrying room 2 and the processing junction 9 of process chamber 1.At least need any one correction therein.But, need make simple structure as far as possible in the vacuum chamber, preferably revise in load cell 31 or handing-over chamber 4.Because load cell 31 is identical with the structure of handing-over chamber 4 basically, thereby be the example explanation to join chamber 4.
Fig. 5 is the figure of expression as the angle modification mechanism of the handing-over chamber of first embodiment of angle modification mechanism.Fig. 5 (a) is the stereogram when the broach shape hand 52 with conveying robot 5 that the top is seen is inserted into the handing-over chamber 4, Fig. 5 (b) expression be the end view of handing-over chamber 4.
Handing-over chamber 4 has: the substrate that is arranged on both sides is moved into gate valve 10I, the 10E that takes out of mouth, has mounting table 4D and the 4H of angle modification mechanism of a plurality of supporting pin 4P; The above-mentioned angle modification 4H of mechanism is by constituting with lower component: supports the mounting table support portion 4S of mounting table 4D, makes the rotary driving motor 4KM of above-mentioned mounting table support portion 4S left rotation and right rotation, and the 4J of magnetic seal portion of sealing mounting table support portion 4S.
In this mechanism; Shown in the dotted line of Fig. 5 (a); The conveying robot 5a of equipment group A is placed on substrate 6 on the mounting table 4D of rotation status not with the state parallel with its mounting table after, suppose the occasion that conveying robot 5b carries with the mode that overlaps with the processing junction 9buL shown in Fig. 4.At this moment, as stated, as long as from conveying robot 5b observe so that substrate 6 to the right the state of rotation alpha L degree be transported to and handle junction 9buL.
If observe the flow process of this action then do, at first, under the state of closing gate valve 10E, open gate valve 10I, the broach shape hand 52a that utilizes conveying robot 5a moves into substrate from the peristome 10IK of gate valve, is placed on the mounting table 4D.After above-mentioned broach shape hand 52a withdraws from, in valve body 10IB, utilize the above-mentioned angle modification 4H of mechanism to make mounting table 4D rotation alpha L degree to the right.Then, open gate valve 10E, the broach shape hand 52b from its peristome 10EK inserts conveying robot 5b lifts taking-up with substrate 6.Conveying robot 5a to the direction rotation of handling junction 9buL, is placed into its base and handles on the 9buL of junction when regulating link rod length and with substrate 6.
In above explanation; Though what explain is to move into substrate 6 and to be arranged on the situation on the mounting table 4D with handing-over chamber 4 parallel states; But the occasion that is provided with angle beta at substrate 6 is the angle that the mode of α L is controlled mounting table 4D with substrate 6 with respect to the angle of broach shape hand 52b then.
In the present embodiment; After mounting table 4D has carried out angle modification; So that conveying robot 5b can not interfere with supporting pin 4P, the mode between mounting table 4D and the substrate 6 of can being inserted into decides the radical, width etc. of broach of thickness, interval and the broach shape hand 52 of supporting pin 4P.In Fig. 5 (a), the state of the supporting pin 4P when representing substrate 6 and this after the angle modification with solid line, dotted line is represented the state before the angle modification.
Fig. 6 is the figure of second embodiment of the angle modification mechanism of expression handing-over chamber 4.
In first embodiment, conveying robot 5b moves into the zone, promptly moves into the restriction that angle [alpha] L etc. receives the size of above-mentioned supporting pin 4P.As mentioned below, when the structure of each equipment group is identical, big or small certain occasion of the substrate of carrying can make angle [alpha] L etc. keep certain.In this case, first embodiment is simple and preferable because of mechanism.But if not this situation, first embodiment will receive many restrictions.Therefore, the 4H of angle modification mechanism of second embodiment has the mechanism that does not allow mounting table 4D rotation and only make substrate 6 rotations.Its result, the shape invariance of moving into track of conveying robot 5b, whatsoever the angle of appearance can both be corresponding, can reduce the width value of broach shape hand 52b, can widen the substrate dimension that it can be handled.
Among Fig. 6; Angle modification mechanism is by constituting with lower component: supporting pin 4P; Fixed the supporting pin rotating platform 4KD of above-mentioned supporting pin; Make the drive motor 4KM of above-mentioned supporting pin rotating platform 4KD left rotation and right rotation by means of rotating platform support portion 4SJ, and the 4JM of drive motor up and down that above-mentioned supporting pin rotating platform 4KD is moved up and down.In addition, 4V is the bellows that seals usefulness that moves up and down to rotating platform support portion 4SS.On the other hand, mounting table 4D fixes, and its cross section has the protuberance 4DT of support substrates 6 shown in Fig. 6 (a).And, on mounting table 4D, have relatively supporting pin 4P made revolvable each supporting pin or the movable movable groove 4SK of supporting pin group ability.
In this mechanism, at first, conveying robot 5a enters into handing-over chamber 4b, substrate 6 is placed on the protuberance 4DT of mounting table 4D.At this moment, supporting pin 4P is in supporting pin rotating platform 4KD and descends bit position most.Thereafter, supporting pin rotating platform 4KD is risen, with supporting pin 4P support substrates 6, make supporting pin rotating platform 4KD rotate desirable angle, for example α L angle makes supporting pin rotating platform 4KD descend under this state, and substrate 6 is placed on the mounting table 4D.Subsequently, conveying robot 5b is got into, control substrate 6 and it is taken out of from handing-over chamber 4b.
As above, in the present embodiment, with regard to conveying robot 5b, whatsoever the appearance angle, always can with between the protuberance 4DT of mounting table 4D as taking out of the path.In addition, in the present embodiment,, also can scheme to carry substrate 6 with the supporting pin that is configured to linearity though carry substrate 6 with elongated protuberance 4DT.
That kind as described above; According to this execution mode; Through the angle modification mechanism of the carrying angle of substrate is set in the handing-over chamber; Can be connected in series has rectangular process chamber large equipment set constructor, and organic el device manufacture apparatus or its manufacturing approach of the length that can shorten whole production line can be provided.
In addition,, can realize having the production line structure of the said equipment set constructor, the high organic el device manufacture apparatus of space efficiency or its manufacturing approach can be provided according to this execution mode.
In above explanation, be to describe according to the relation of for example not considering α R, α L.
Therefore, as long as angle modification mechanism is set, just can mutually should with the size or the substrate dimension of each equipment group or chambers in each handing-over chamber 4.
In this a series of processing, as shown in Figure 3, each other or in process chamber, can a plurality of handling parts be made identical shape, identical configuration each other in the chambers of Fig. 1.
For example; In the execution mode of Fig. 1; Equipment group A-D is identical shape, identical configuration; And two process chambers up and down that are configured in each equipment group still be the line symmetry with respect to the carrying direction, and two handling parts of a process chamber with respect to the big vertical line of carrying direction also be that line is symmetrical.Therefore, conveying robot 5 is configured in carrying room, says the center that is configured in the equipment group limpingly.Its result, the α R of Fig. 4, α L then are α R=-α L=α, then are the relation of intersecting with process chamber 1bu in process chamber 1bd, are handling the value that junction 9bdR gets α, and are handling junction 9bdL and get-value of α.
So, at first the first, continuous value then needn't be got, as long as get the value of these two values of certain angle ± α if handle the substrate of same size by the angle modification mechanism of handing-over chamber 4.In this case, first embodiment of first execution mode becomes effective.
This occasion, in same equipment group with substrate 6 from have α (or-α) processing junction be transported to have-during the processing junction of α (or α), need carry out angle modification in the handing-over chamber 4 that this equipment group is joined.
In the execution mode shown in Figure 1, as mentioned below, the processing of two handling parts in same process chamber is identical.Therefore, in same equipment group, then for substrate 6 from have α (or-α) processing junction be transported to and have α (or-α) processing junction.Have again, the angle correction of each equipment group if with ± α is identical, then some substrate is all with angle correction α, and other substrate all carries out moving into mouthful to processing, the carrying of taking out of mouthful from organic el device manufacture apparatus 100 with angle correction-α.In this case, as long as carry out angle modification one time at upstream side as far as possible, as long as above-mentioned precondition not variation just need not to carry out angle modification in downstream.Certainly, when above-mentioned precondition changes, angle modification mechanism need be set.
As the candidate of this execution mode is load cell 31 and handing-over chamber 4a.Though load cell 31 can be provided with and join the same mechanism in chamber, when substrate 6 is moved into load cell 31, also can make it to have in advance ± angle of α moves into.In addition, in load cell 31, not to move into by each substrate, so long as move into by the box unit that holds multi-disc, the box that can have the angle of α in load cell 31 configurations of upside and has in load cell 31 configurations of downside-box of the angle of α.
According to this execution mode, owing to can have two production lines side by side, thereby the production line length overall sees sometimes also lengthening from apparent, but with regard to regard to the unit length of output, more still can shorten with the past.
Secondly, the execution mode to the method for the degree of freedom of the relevant increase conveying robot of (2) describes.
Setting makes the degree of freedom of broach shape hand 52 left rotation and right rotation of conveying robot shown in Figure 55.For example, the link rod connecting portion 52J for broach shape hand 52 is provided with its degree of freedom.Though had better not newly be arranged on the mechanism that moves in the vacuum chamber, but still can play and the identical effect of above-mentioned first execution mode.
Before the method that explanation is revised with the vapour deposition method of (3); Use Fig. 7 explanation will be from Fig. 1 to process chamber shown in Figure 31 in handing-over chamber 5 or its upper reaches the substrate 6 after angle modification moved into handled junction 9; Carry out vacuum evaporation, up to the handling process of taking out of.After this flow processing, as stated, the handling part that is transported on the diagonal that is positioned at same equipment group carries out same vapor deposition treatment.
The basic scheme that the vacuum evaporation of this execution mode is handled is that the substrate 6 that upper surface is carried as the vapor deposition face vertically erects, and is transported to aligned portions 8, carries out vapor deposition.If when carrying, the lower surface of substrate 6 was that the vapor deposition face then need overturn it, owing to upper surface is that the vapor deposition face needs only vertically and erects.
Below, use Fig. 7 to specify the vacuum evaporation handling process of this execution mode with reference to Fig. 3.Represent the position that substrate 6 exists with solid line among Fig. 3.
At first,, move into substrate 6R, substrate 6R is vertically erected and move to aligned portions 8, carry out the contraposition (from step R1 to step R3) of substrate 6R and shadow mask 81 at the R production line.At this moment, substrate is owing to be the upper surface carrying that vapor deposition is faced up and carries out, thereby need not overturn etc. and just can carry out contraposition immediately.Contraposition is drawn shown in the figure like Fig. 3's, with ccd video camera 86 shooting, carries out through controlling shadow mask 81R with above-mentioned driven in registry portion 83, thereby makes the alignment mark 84 that is arranged on the substrate 6 reach the center of the window 85 that is arranged at mask 81M.This vapor deposition is as if the material with burn red (R), and is then as shown in Figure 8, in the part corresponding with the R of mask 81M window arranged, and then this part carried out vapor deposition.The size of this window is according to the different average out to width of color 50 μ m, about height 150 μ m.The thickness of mask 81M is 0 μ m, and the tendency of further attenuate will be arranged from now on.
If contraposition finishes, just evaporation source 71 is moved to R production line side (step R4), the evaporation source 71 of wire is made progress or the mobile down vapor deposition (step R5) that carries out.In the vapor deposition of R production line, carry out processing equally from step R1 to step R3 at L production line and R production line.That is, move into other substrate 6L, this substrate 6L is vertically erected and move to aligned portions 8L, carry out contraposition with shadow mask 81L.If the vapor deposition of the substrate 6R of R production line finishes, then evaporation source 71 is moved to L production line (step L4).The substrate that is positioned at the L production line is carried out vapor deposition (step L5).The upper surface carrying that faces up and carry out, thereby need not overturn etc. and just can carry out contraposition immediately.At this moment, before evaporation source 71 withdraws from from the vapor deposition zone of R production line fully, if substrate 6R leaves from aligned portions 8R; Then owing to have unnecessarily by the possibility of vapor deposition; Thereby after withdrawing from fully, the action of taking out of of beginning substrate 6R, the preparation that gets into new substrate 6R then from process chamber 1.For fear of above-mentioned unnecessary vapor deposition, between production line, be provided with dividing plate 11.In addition, Fig. 3 representes the state of step R4 and step L1.That is, be illustrated in the R production line and begin vapor deposition, substrate is moved into the state among the 1bu of vacuum evaporation chamber at the L production line.
Through continuously carry out above-mentioned flow process, except the traveling time of evaporation part 7, can not have lavishly use deposition material carry out vapor deposition thereafter.The necessary time of vapor deposition is roughly 1 minute with other processing time, if the traveling time of evaporation source 71 is 5 seconds, then this execution mode can shorten to 5 seconds with the vapor deposition time that will take 1 minute in the past.According to above-mentioned execution mode, as shown in Figure 6, the processing cycle of a substrate of vacuum evaporation chamber 1bu processing is actually the traveling time of vapor deposition time+evaporation source 71, can boost productivity.If with the above-mentioned condition evaluating processing time, then with respect to 2 minutes of the past, the present invention was 1 minute 5 seconds in addition, and the productivity ratio of each process chamber can rise to about twice.
Above (1) (2) execution mode explanation be that vapor deposition with substrate 6 faces up and carries entirely, in order to carry out vapor deposition and situation that substrate is erected with the shadow mask of erectting.In other evaporation coating method, also have substrate, shadow mask horizontal positioned method of carrying out all.This situation is as shown in Figure 9, how vapor deposition is faced down, and carries out vapor deposition treatment from the below.In this case, the method for revising with (3) big steam plating part also is effective.
In such execution mode, for the treated side of substrate as below carry, put in the special-purpose box substrate 6 and carry at the two ends of controlling substrate.Angle adjusting mechanism goes for the method for above-mentioned execution mode.
In addition, carry out vapor deposition for the vertical placement of substrate, it is complicated that the contraposition mechanism of shadow mask etc. becomes; Though be difficult to make processing junction 9 rotations in the process chamber 1, be the occasion of horizontal positioned at the substrate processing face, through being arranged on, mechanism shown in Figure 5 handles junction 9; Perhaps, aligned portions 8 is arranged to consistent with this angle if angle correction is certain, then as shown in Figure 9; Evaporation source 71 and this angle are as one man scanned, thereby in fact also can carry out angle modification.
This execution mode also can obtain the effect identical with previous execution mode.
Therefore, the posture regardless of the shadow mask that is determined by different vapor deposition face postures can both adopt the present invention.
In addition, in above-mentioned explanation,, also can be applied to have the film formation device that carries out vapor deposition treatment and the film build method of same background with organic EL device though be that example is illustrated with the organic EL device.
Claims (23)
1. organic el device manufacture apparatus; It has the equipment group as vacuum chamber; This equipment group possesses: possess the vacuum processing chamber with the handling part of deposition material vapor deposition on substrate; The handing-over chamber that above-mentioned substrate is moved into or taken out of, and the carrying mechanism that above-mentioned substrate is carried between above-mentioned handing-over chamber and above-mentioned handling part; It is characterized in that:
In an above-mentioned vacuum processing chamber or a plurality of above-mentioned vacuum processing chamber, a plurality of above-mentioned handling parts are set; Plural at least handling part in above-mentioned a plurality of handling parts in abutting connection with a side that is configured in above-mentioned carrying mechanism, and is disposed above-mentioned plural at least handling part with respect to carrying direction abreast.
2. organic el device manufacture apparatus as claimed in claim 1 is characterized in that, has a plurality of the said equipment groups, and above-mentioned a plurality of equipment groups are connected in series.
3. according to claim 1 or claim 2 organic el device manufacture apparatus is characterized in that, have different with above-mentioned handing-over chamber move into substrate move into load cell and the load cell of taking out of of taking out of substrate.
4. according to claim 1 or claim 2 organic el device manufacture apparatus is characterized in that, has different with above-mentioned handing-over chamber the moving into load cell or taking out of the load cell of substrate of substrate of moving into.
5. organic el device manufacture apparatus as claimed in claim 3; It is characterized in that; Constitute with above-mentioned substrate from the above-mentioned load cell of moving into to the trucking department of taking out of the handling system that load cell carries, have the correction mechanism of the carrying angle of the above-mentioned substrate carried being revised at above-mentioned trucking department.
6. organic el device manufacture apparatus as claimed in claim 5 is characterized in that, the above-mentioned trucking department with above-mentioned correction mechanism in above-mentioned handing-over chamber, above-mentioned move into load cell and be arranged in the processing junction of substrate of above-mentioned handling part have a place at least.
7. organic el device manufacture apparatus as claimed in claim 5 is characterized in that, above-mentioned correction mechanism is the mechanism that makes the mounting table rotation of the above-mentioned substrate of placement that is arranged at above-mentioned trucking department.
8. organic el device manufacture apparatus as claimed in claim 5 is characterized in that, above-mentioned correction mechanism is the mechanism that can leave and make above-mentioned substrate rotation from mounting table, and said mounting table is arranged at above-mentioned trucking department and places above-mentioned substrate.
9. organic el device manufacture apparatus as claimed in claim 5 is characterized in that, above-mentioned trucking department be arranged at the said equipment group, manipulator is used in the above-mentioned carrying of moving into load cell or taking out of load cell.
10. organic el device manufacture apparatus as claimed in claim 9 is characterized in that, above-mentioned correction mechanism is with the mechanism of above-mentioned carrying with the angle change of the hand of the above-mentioned substrate of carrying of manipulator.
11. organic el device manufacture apparatus as claimed in claim 5 is characterized in that, above-mentioned trucking department is positioned at the above-mentioned load cell of moving into, and above-mentioned correction mechanism is arranged on the above-mentioned load cell of moving into predetermined angle with above-mentioned substrate.
12. organic el device manufacture apparatus according to claim 1 or claim 2 is characterized in that, the evaporation source that will carry out above-mentioned vapor deposition scans along the above-mentioned substrate in the processing junction of moving into the substrate that is arranged at above-mentioned handling part obliquely.
13. organic el device manufacture apparatus according to claim 1 or claim 2; It is characterized in that; Above-mentioned a plurality of handling part is more than four; Having the direction that above-mentioned a plurality of handling parts are configured in respect to the above-mentioned substrate of carrying is on line symmetry and the point-symmetric position, after first handling part has been handled above-mentioned substrate, at the processing mechanism of handling with second handling part of the point-symmetric position of first handling part.
14. organic el device manufacture apparatus according to claim 1 or claim 2 is characterized in that, the said equipment group has two above-mentioned vacuum processing chambers, and above-mentioned vacuum processing chamber is provided with a plurality of above-mentioned handling parts that carry out same treatment.
15. manufacturing approach that is used to utilize the organic EL device of organic el device manufacture apparatus as claimed in claim 1; This method is that substrate is moved into from moving into load cell; By means of equipment group with at least one vacuum chamber that possesses a plurality of handling parts; To taking out of load cell carrying, in above-mentioned vacuum chamber with the deposition material vapor deposition to above-mentioned substrate; It is characterized in that:
Carrying angle to above-mentioned carrying substrate in the process of above-mentioned carrying is revised.
16. the manufacturing approach of organic EL device as claimed in claim 15; It is characterized in that the correction of above-mentioned carrying angle is above-mentionedly being moved into load cell, moved into or take out of the handing-over chamber of above-mentioned substrate and be arranged at that at least one place carries out in the processing junction of the above-mentioned substrate of moving into load cell and above-mentioned handling part to above-mentioned vacuum chamber.
17. the manufacturing approach of organic EL device as claimed in claim 15 is characterized in that, the correction of above-mentioned carrying angle be arranged at the said equipment group, the above-mentioned carrying of moving into load cell or taking out of load cell is carried out with manipulator.
18. the manufacturing approach of organic EL device as claimed in claim 15 is characterized in that, the correction of above-mentioned carrying angle is carried out through be arranged on the above-mentioned load cell of moving into desired angle.
19. manufacturing approach like any one described organic EL device in the claim 15 to 18; It is characterized in that; Above-mentioned a plurality of handling part is more than four; The direction that above-mentioned a plurality of handling parts are configured in respect to the above-mentioned substrate of carrying is on line symmetry and the point-symmetric position, after first handling part has been handled above-mentioned substrate, is handling with second handling part of the point-symmetric position of first handling part.
20. film formation device; It has the equipment group as vacuum chamber; This equipment group possesses: possess the vacuum processing chamber with the handling part of deposition material vapor deposition on substrate; The handing-over chamber that above-mentioned substrate is moved into or taken out of, and the carrying mechanism that above-mentioned substrate is carried between above-mentioned handing-over chamber and above-mentioned handling part; It is characterized in that:
In an above-mentioned vacuum processing chamber or a plurality of above-mentioned vacuum processing chamber, a plurality of above-mentioned handling parts are set; Plural at least handling part in above-mentioned a plurality of handling parts in abutting connection with a side that is configured in above-mentioned carrying mechanism, and is disposed above-mentioned plural at least handling part with respect to carrying direction abreast.
21. film formation device as claimed in claim 20; It is characterized in that; What possess that a plurality of the said equipment groups and different with above-mentioned handing-over chamber move into substrate moves into load cell and at least one side in the load cell that takes out of who takes out of substrate; Carry the trucking department of handling system of above-mentioned substrate to the above-mentioned load cell of taking out of constituting, have the correction mechanism of correction in the carrying angle of the above-mentioned substrate of above-mentioned trucking department carrying from the above-mentioned load cell of moving into.
22. film build method that utilizes organic el device manufacture apparatus as claimed in claim 1; This method is that substrate is moved into from moving into load cell; By means of equipment group with at least one vacuum chamber that possesses a plurality of handling parts; To taking out of load cell carrying, in above-mentioned vacuum chamber with the deposition material vapor deposition to above-mentioned substrate; It is characterized in that:
Carrying angle to above-mentioned carrying substrate in the process of above-mentioned carrying is revised.
23. film build method as claimed in claim 22; It is characterized in that; Above-mentioned a plurality of handling part is more than four; The direction that above-mentioned a plurality of handling parts are configured in respect to the above-mentioned substrate of carrying is on line symmetry and the point-symmetric position, after first handling part has been handled above-mentioned substrate, is handling with second handling part of the point-symmetric position of first handling part.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008246499A JP5173699B2 (en) | 2008-09-25 | 2008-09-25 | Organic EL device manufacturing equipment |
| JP2008246499 | 2008-09-25 | ||
| JP2008-246499 | 2008-09-25 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012101858909A Division CN102709491A (en) | 2008-09-25 | 2009-08-17 | Organic EL device manufacturing apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101685848A CN101685848A (en) | 2010-03-31 |
| CN101685848B true CN101685848B (en) | 2012-07-18 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200910165275XA Expired - Fee Related CN101685848B (en) | 2008-09-25 | 2009-08-17 | Organic el device manufacturing apparatus and method, film-forming apparatus and method |
| CN2012101858909A Pending CN102709491A (en) | 2008-09-25 | 2009-08-17 | Organic EL device manufacturing apparatus |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2012101858909A Pending CN102709491A (en) | 2008-09-25 | 2009-08-17 | Organic EL device manufacturing apparatus |
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| JP (1) | JP5173699B2 (en) |
| KR (2) | KR101119748B1 (en) |
| CN (2) | CN101685848B (en) |
| TW (2) | TW201023291A (en) |
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| SE0103835L (en) | 2001-11-02 | 2003-05-03 | Neonode Ab | Touch screen realized by display unit with light transmitting and light receiving units |
| US9778794B2 (en) | 2001-11-02 | 2017-10-03 | Neonode Inc. | Light-based touch screen |
| US8775023B2 (en) | 2009-02-15 | 2014-07-08 | Neanode Inc. | Light-based touch controls on a steering wheel and dashboard |
| KR101321690B1 (en) * | 2010-04-28 | 2013-10-23 | 가부시키가이샤 알박 | Vacuum processing device, method for moving substrate and alignment mask, alignment method, and film forming method |
| JP5492027B2 (en) * | 2010-08-31 | 2014-05-14 | 株式会社日立ハイテクノロジーズ | Organic EL device manufacturing apparatus and manufacturing method |
| JP2013172015A (en) * | 2012-02-21 | 2013-09-02 | Hitachi High-Technologies Corp | Deposition device, and substrate transfer mechanism therefor |
| KR101346071B1 (en) * | 2012-03-27 | 2013-12-31 | 에스엔유 프리시젼 주식회사 | organic matter evaporation system |
| KR101963400B1 (en) * | 2012-09-24 | 2019-03-28 | 주식회사 원익아이피에스 | Substrate processing apparatus |
| JP2014070241A (en) * | 2012-09-28 | 2014-04-21 | Hitachi High-Technologies Corp | Vapor deposition device and vapor deposition method |
| US9092093B2 (en) | 2012-11-27 | 2015-07-28 | Neonode Inc. | Steering wheel user interface |
| KR101990555B1 (en) | 2012-12-24 | 2019-06-19 | 삼성디스플레이 주식회사 | Thin film encapsulation manufacturing device and manufacturing method of thin film encapsulation |
| JP2013110114A (en) * | 2012-12-27 | 2013-06-06 | Hitachi High-Technologies Corp | Apparatus for manufacturing organic el device and angle correction mechanism |
| KR20160087953A (en) * | 2015-01-14 | 2016-07-25 | 에스엔유 프리시젼 주식회사 | Cluster type evaporation device for manufacturing of OLED |
| JP7202168B2 (en) * | 2018-12-13 | 2023-01-11 | キヤノントッキ株式会社 | Film forming apparatus, organic EL panel manufacturing system, and film forming method |
| WO2021013358A1 (en) * | 2019-07-25 | 2021-01-28 | Applied Materials, Inc. | System and method to evaporate an oled layer stack in a vertical orientation |
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Also Published As
| Publication number | Publication date |
|---|---|
| JP5173699B2 (en) | 2013-04-03 |
| KR20110081129A (en) | 2011-07-13 |
| KR20100035099A (en) | 2010-04-02 |
| JP2010077487A (en) | 2010-04-08 |
| TW201023291A (en) | 2010-06-16 |
| CN102709491A (en) | 2012-10-03 |
| TW201330162A (en) | 2013-07-16 |
| KR101119748B1 (en) | 2012-03-23 |
| KR101090590B1 (en) | 2011-12-08 |
| CN101685848A (en) | 2010-03-31 |
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