WO2011136075A1 - Vacuum processing device, method for moving substrate and alignment mask, alignment method, and film forming method - Google Patents

Vacuum processing device, method for moving substrate and alignment mask, alignment method, and film forming method Download PDF

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WO2011136075A1
WO2011136075A1 PCT/JP2011/059576 JP2011059576W WO2011136075A1 WO 2011136075 A1 WO2011136075 A1 WO 2011136075A1 JP 2011059576 W JP2011059576 W JP 2011059576W WO 2011136075 A1 WO2011136075 A1 WO 2011136075A1
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substrate
mask
pin
hand
plate
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French (fr)
Japanese (ja)
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裕子 加藤
正志 菊池
厚治 亀崎
智彦 岡山
圭介 下田
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株式会社アルバック
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Priority to CN201180021220.7A priority Critical patent/CN102859031B/en
Priority to KR1020127027869A priority patent/KR101321690B1/en
Priority to JP2012512785A priority patent/JP5506921B2/en
Publication of WO2011136075A1 publication Critical patent/WO2011136075A1/en

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/04—Coating on selected surface areas, e.g. using masks
    • C23C16/042—Coating on selected surface areas, e.g. using masks using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
    • C23C16/4582—Rigid and flat substrates, e.g. plates or discs
    • C23C16/4583—Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially horizontally
    • C23C16/4586—Elements in the interior of the support, e.g. electrodes, heating or cooling devices
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/54—Apparatus specially adapted for continuous coating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass

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  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Physical Vapour Deposition (AREA)
  • Electroluminescent Light Sources (AREA)
  • Chemical Vapour Deposition (AREA)

Abstract

Provided is a vacuum processing device capable of replacing an alignment mask without exposing the inside of a vacuum chamber to air. A plate (23), into which a substrate lifting and lowering pin (46) and a mask lifting and lowering pin (45) that is longer in a vertical direction than the substrate lifting and lowering pin (46) are inserted, is disposed below a gas introduction device (12). A pin supporting member (24) is disposed below the plate (23). The pin supporting member (24) is structured so that when the distance from the plate (23) is made to be close to a first distance or less, the substrate lifting and lowering pin (46) and the mask lifting and lowering pin (45) can be each vertically mounted on the pin supporting member (24). The substrate lifting and lowering pin (46) and the mask lifting and lowering pin (45) are each provided with a locking member (47). The locking member (47) is used for suspending the substrate lifting and lowering pin (46) and the mask lifting and lowering pin (45) by the plate (23), above the pin supporting member (24), apart from the pin supporting member (24), when the distance between the plate (23) and the pin supporting member (24) is set to a second distance or more having a wider separation than the first distance.

Description

真空処理装置並びに基板とアラインメントマスクの移動方法及び位置合わせ方法並びに成膜方法Vacuum processing apparatus, substrate and alignment mask moving method, alignment method, and film forming method
　本発明は、真空処理装置並びに基板とアラインメントマスクの移動方法及び位置合わせ方法並びに成膜方法に関する。 The present invention relates to a vacuum processing apparatus, a method for moving and aligning a substrate and an alignment mask, and a film forming method.
　有機ＥＬ素子は、発光効率が高く、薄い発光装置を組み立てることができることから、近年では、大面積化する表示装置や照明機器の用途に注目されている。
　有機ＥＬ素子の製造過程では、基板上に下部電極、有機発光層、上部電極を形成し、次いでこの基板上に窒化シリコンもしくは酸窒化シリコンなどの保護膜を形成する。
　有機発光層は熱により損傷しやすいため、保護膜の形成方法には、熱ＣＶＤ法よりも低温で成膜できるプラズマＣＶＤ（ＰＥ－ＣＶＤ）法が用いられる。 Since organic EL elements have high luminous efficiency and can assemble thin light emitting devices, attention has recently been paid to applications for display devices and lighting equipment that have a large area.
In the manufacturing process of the organic EL element, a lower electrode, an organic light emitting layer, and an upper electrode are formed on a substrate, and then a protective film such as silicon nitride or silicon oxynitride is formed on the substrate.
Since the organic light emitting layer is easily damaged by heat, a plasma CVD (PE-CVD) method capable of forming a film at a lower temperature than the thermal CVD method is used as a method for forming the protective film.
　保護膜を例えば配線用の接続部が露出した状態となるように成膜する必要があることから、基板上にはアラインメントマスクを配置する。真空槽内にＳｉＨ4などの原料ガスと、Ｎ2、ＮＨ3、Ｏ2などの反応ガスとを導入し、プラズマを発生させる。原料ガスと反応ガスはアラインメントマスクの開口部で露出している基板上に到達し、基板上には開口部の平面形状に従った平面形状の薄膜が形成される。 Since it is necessary to form the protective film so that, for example, the connection portion for wiring is exposed, an alignment mask is disposed on the substrate. A source gas such as SiH 4 and a reaction gas such as N 2 , NH 3 , and O 2 are introduced into the vacuum chamber to generate plasma. The source gas and the reactive gas reach the substrate exposed at the opening of the alignment mask, and a planar thin film is formed on the substrate in accordance with the planar shape of the opening.
　現在、上述のようなアラインメントマスクは成膜装置の真空槽内を大気に開放した後、人の手で真空槽内に配置していた。従って、真空槽内のパーティクル管理がしにくいという問題があった。また、装置のダウンタイムも長くかかり、人手も必要であった。
　さらに、アラインメントマスクは、同一の装置で生産する基板の品種が変わるごとに変更をしなくてはいけないので、真空槽を大気に開放してアラインメントマスクを交換するという作業を一日に何回も現場で行う場合もあり、作業時間を短縮することが難しかった。 At present, the alignment mask as described above is placed in the vacuum chamber by a human hand after the inside of the vacuum chamber of the film forming apparatus is opened to the atmosphere. Therefore, there is a problem that it is difficult to manage particles in the vacuum chamber. In addition, the downtime of the apparatus takes a long time, and manpower is required.
Furthermore, since the alignment mask must be changed each time the type of substrate produced by the same device changes, the process of opening the vacuum chamber to the atmosphere and replacing the alignment mask is repeated several times a day. In some cases, it was difficult to shorten the work time.
特開２００８－３１５２８号公報JP 2008-31528 A 特開２００７－３０８７６３号公報JP 2007-307663 A 特開２０１０－８６８０９号公報JP 2010-86809 A 特開２００９－６４６０８号公報JP 2009-64608 A
　本発明は上記従来技術の不都合を解決するために創作されたものであり、その目的は、真空槽内を大気に曝さなくてもアラインメントマスクを交換できる真空処理装置を提供することにある。 The present invention was created to solve the disadvantages of the prior art described above, and an object of the present invention is to provide a vacuum processing apparatus capable of exchanging the alignment mask without exposing the inside of the vacuum chamber to the atmosphere.
　上記課題を解決するために本発明は、真空槽と、基板が設置されるプレートと、前記プレートに形成されたマスク昇降用貫通孔に挿入され、上端にアラインメントマスクを配置可能に構成されたマスク昇降ピンと、前記プレートに形成された基板昇降用貫通孔に挿入され、上端に基板を配置可能に構成された基板昇降ピンと、前記プレートの下方位置に配置され、前記プレートに対して上下に相対移動可能なピン支持部材と、を有し、前記マスク昇降ピンは前記基板昇降ピンよりも上下方向に長く形成され、前記プレートの下方を向いた面と前記プレートに吊り下げられた前記基板昇降ピンの下端との間の距離を第一の距離とし、前記プレートの下方を向いた面と前記プレートに吊り下げられた前記マスク昇降ピンの下端との間の距離を第二の距離とすると、前記プレートの下方を向いた面と前記ピン支持部材の上方を向いた面との間が前記第一の距離より小さい時、前記マスク昇降ピンと前記基板昇降ピンが前記ピン支持部材に支持され、前記プレートの下方を向いた面と前記ピン支持部材の上方を向いた面との間が前記第一の距離より大きく、前記第二の距離より小さい時、前記マスク昇降ピンが前記ピン支持部材に支持され、前記基板昇降ピンは前記プレートに吊り下げられ、前記プレートの下方を向いた面と前記ピン支持部材の上方を向いた面との間が前記第二の距離より大きい時、前記マスク昇降ピンと前記基板昇降ピンが前記プレートに吊り下げられる、真空処理装置である。
　本発明は真空処理装置であって、前記マスク昇降ピンと前記基板昇降ピンとが前記ピン支持部材上に乗り、前記マスク昇降ピン上に前記アラインメントマスクが配置され、前記基板昇降ピン上に前記基板が配置された状態で、前記アラインメントマスクと前記基板との間に、基板搬送ロボットのハンドが挿入可能に構成された真空処理装置である。
　本発明は真空処理装置であって、前記基板昇降ピンの上端を横方向に移動させることで、前記基板昇降ピン上に配置された前記基板を移動させ、前記アラインメントマスクと前記基板とを位置合わせする位置合わせ装置と、前記真空槽内の前記プレートの上方に配置された配置部と、前記配置部上に配置され、前記マスク昇降ピン上に配置された前記アラインメントマスクの周囲が下方から上方に移動して当接されて、前記アラインメントマスクを前記真空槽に対して仮固定する枠体とを有し、前記位置合わせは、前記アラインメントマスクが前記枠体に当接された状態で行われる真空処理装置である。
　本発明は真空処理装置であって、前記アラインメントマスクが配置された前記マスク昇降ピンの上昇により、前記枠体は、前記アラインメントマスク上に乗って、前記アラインメントマスクと共に前記配置部から離間して上昇できるように構成された真空処理装置である。
　本発明は、前記真空処理装置を用いた基板とアラインメントマスクの移動方法であって、前記真空槽内に基板とアラインメントマスクとが配置されていない状態で、前記プレートと前記ピン支持部材と前記マスク昇降ピンの上端と前記基板昇降ピンの上端とを、第一のハンドを挿入する位置より下方に位置させておき、アラインメントマスクを前記第一のハンドに載せて前記真空槽内に搬入し、前記ピン支持部材を上昇させて前記マスク昇降ピンを上昇させ、前記マスク昇降ピンの上端を前記アラインメントマスクの裏面に当接させ、前記アラインメントマスクを前記第一のハンド上から前記マスク昇降ピン上に移載し、前記第一のハンドを前記真空槽内から抜去するアラインメントマスク搬入工程と、前記マスク昇降ピン上の前記アラインメントマスクを第二のハンドを挿入する位置より上方に位置させ、かつ前記基板昇降ピンの上端を前記第二のハンドを挿入する位置より下方に位置させておき、基板を前記第二のハンドに載せて前記真空槽内に搬入し、前記アラインメントマスクと前記基板昇降ピンの上端との間に挿入し、前記ピン支持部材を上昇させて前記基板昇降ピンを上昇させ、前記基板昇降ピンの上端を前記基板の裏面に当接させ、前記基板を前記第二のハンド上から前記基板昇降ピン上に移載し、前記第二のハンドを前記真空槽内から抜去する基板搬入工程と、を有する基板とアラインメントマスクの移動方法である。
　本発明は基板とアラインメントマスクの移動方法であって、前記第一のハンドと前記第二のハンドは同一の搬送ロボットのハンドである基板とアラインメントマスクの移動方法である。
　本発明は基板とアラインメントマスクの移動方法であって、前記第一のハンドと前記第二のハンドは互いに異なる搬送ロボットのハンドである基板とアラインメントマスクの移動方法である。
　本発明は、前記真空処理装置を用いた基板とアラインメントマスクの移動方法であって、前記マスク昇降ピンと前記基板昇降ピンとが前記ピン支持部材上に乗り、前記マスク昇降ピン上にアラインメントマスクが配置され、前記基板昇降ピン上に基板が配置された状態で、前記基板を第三のハンドを挿入する位置より上方に位置させ、かつ前記プレートを前記第三のハンドを挿入する位置より下方に位置させておき、前記第三のハンドを前記基板と前記プレートとの間に挿入し、前記ピン支持部材を降下させて前記基板昇降ピンを降下させ、前記基板の裏面を前記第三のハンドに接触させ、前記基板を前記基板昇降ピン上から前記第三のハンド上に移載し、前記基板を前記第三のハンドに載せて前記真空槽内から搬出する基板搬出工程と、前記アラインメントマスクを第四のハンドを挿入する位置より上方に位置させ、かつ前記プレートを前記第四のハンドを挿入する位置より下方に位置させておき、前記第四のハンドを前記アラインメントマスクと前記プレートとの間に挿入し、前記ピン支持部材を降下させて前記マスク昇降ピンを降下させ、前記アラインメントマスクの裏面を前記第四のハンドに接触させ、前記アラインメントマスクを前記マスク昇降ピン上から前記第四のハンド上に移載し、前記アラインメントマスクを前記第四のハンドに載せて前記真空槽内から搬出するアラインメントマスク搬出工程と、を有する基板とアラインメントマスクの移動方法である。
　本発明は基板とアラインメントマスクの移動方法であって、前記第三のハンドと前記第四のハンドは同一の搬送ロボットのハンドである基板とアラインメントマスクの移動方法である。
　本発明は基板とアラインメントマスクの移動方法であって、前記第三のハンドと前記第四のハンドは互いに異なる搬送ロボットのハンドである基板とアラインメントマスクの移動方法である。
  本発明は、前記真空処理装置を用いた基板とアラインメントマスクとの位置合わせ方法であって、前記マスク昇降ピンと前記基板昇降ピンとが前記ピン支持部材上に乗り、前記マスク昇降ピン上にアラインメントマスクが配置され、前記基板昇降ピン上に基板が配置された状態で、前記ピン支持部材を上昇させて前記マスク昇降ピンを上昇させ、前記マスク昇降ピン上の前記アラインメントマスクを前記枠体に当接させ、前記基板昇降ピンの上端を横方向に移動させて、前記基板昇降ピン上の前記基板を移動させ、前記アラインメントマスクと前記基板とを位置合わせする、基板とアラインメントマスクとの位置合わせ方法である。
　本発明は、前記基板とアラインメントマスクとの位置合わせ方法によって前記基板と前記アラインメントマスクとが位置合わせされた状態を維持しながら、前記プレートを上昇させて前記プレートの表面を前記基板の裏面に接触させ、前記基板を前記基板昇降ピンから前記プレート上に移載させ、前記基板昇降ピンを前記ピン支持部材から持ち上げて前記プレートに吊り下げ、前記プレートを上昇させて前記プレート上の前記基板の表面を前記アラインメントマスクの裏面に接触させ、前記アラインメントマスクを前記マスク昇降ピンから前記基板上に移載させ、前記マスク昇降ピンを前記ピン支持部材から持ち上げて前記プレートに吊り下げ、前記アラインメントマスクの上方から薄膜形成用の材料ガスを散布して、前記アラインメントマスクの開口部から露出した前記基板の表面に薄膜を成膜する成膜方法である。 In order to solve the above-described problems, the present invention provides a mask configured to be capable of disposing an alignment mask at the upper end, inserted into a vacuum chamber, a plate on which a substrate is installed, and a mask lifting / lowering through hole formed on the plate. Elevating pins, substrate elevating pins inserted into through holes for elevating the substrate formed in the plate and configured to be able to arrange the substrate at the upper end, and disposed below the plate, and moved up and down relative to the plate A mask support pin, and the mask lift pins are formed to be longer in the vertical direction than the substrate lift pins, and the surface of the substrate lift pins suspended from the plate and the surface facing downward of the plate. The first distance is the distance between the lower end and the second distance is the distance between the surface facing the lower side of the plate and the lower end of the mask lifting pin suspended from the plate. When the distance between the surface facing downward of the plate and the surface facing upward of the pin support member is smaller than the first distance, the mask lift pins and the substrate lift pins are attached to the pin support member. The mask lift pin is supported by the pin when the distance between the surface facing downward of the plate and the surface facing upward of the pin support member is larger than the first distance and smaller than the second distance. When supported by a support member, the substrate lifting pins are suspended from the plate, and when a distance between a surface facing downward of the plate and a surface facing upward of the pin support member is larger than the second distance, The vacuum processing apparatus, wherein the mask lifting pins and the substrate lifting pins are suspended from the plate.
The present invention is a vacuum processing apparatus, wherein the mask elevating pins and the substrate elevating pins are placed on the pin support member, the alignment mask is arranged on the mask elevating pins, and the substrate is arranged on the substrate elevating pins. In this state, the vacuum processing apparatus is configured such that a hand of a substrate transfer robot can be inserted between the alignment mask and the substrate.
The present invention is a vacuum processing apparatus, wherein the substrate disposed on the substrate lifting pins is moved by moving the upper end of the substrate lifting pins in the lateral direction, and the alignment mask and the substrate are aligned. An alignment device that is disposed above the plate in the vacuum chamber, and the periphery of the alignment mask that is disposed on the placement portion and disposed on the mask raising / lowering pin from above to below. A frame that moves and abuts to temporarily fix the alignment mask to the vacuum chamber, and the alignment is performed in a state where the alignment mask is abutted against the frame. It is a processing device.
The present invention is a vacuum processing apparatus, wherein the frame is placed on the alignment mask and lifted away from the placement portion together with the alignment mask by raising the mask elevating pin on which the alignment mask is placed. It is a vacuum processing apparatus configured to be able to.
The present invention is a method for moving a substrate and an alignment mask using the vacuum processing apparatus, wherein the substrate, the alignment support mask, and the mask are not disposed in the vacuum chamber. The upper end of the lifting pins and the upper end of the substrate lifting pins are positioned below the position where the first hand is inserted, and an alignment mask is placed on the first hand and carried into the vacuum chamber, The mask support pins are raised to raise the mask raising / lowering pins, the upper ends of the mask raising / lowering pins are brought into contact with the back surface of the alignment mask, and the alignment mask is transferred from the first hand onto the mask raising / lowering pins. An alignment mask loading step for removing the first hand from the vacuum chamber, and the alignment on the mask lifting pins The substrate mask is positioned above the position where the second hand is inserted, and the upper end of the substrate lifting pin is positioned below the position where the second hand is inserted, and the substrate is placed on the second hand. And is inserted between the alignment mask and the upper end of the substrate elevating pin, the pin support member is raised to raise the substrate elevating pin, and the upper end of the substrate elevating pin is A substrate carrying step of contacting the back surface of the substrate, transferring the substrate from the second hand onto the substrate lifting pins, and removing the second hand from the vacuum chamber; and This is a method of moving the alignment mask.
The present invention is a method of moving a substrate and an alignment mask, wherein the first hand and the second hand are the same transfer robot hand.
The present invention is a method for moving a substrate and an alignment mask, wherein the first hand and the second hand are different transfer robot hands, respectively.
The present invention is a method for moving a substrate and an alignment mask using the vacuum processing apparatus, wherein the mask elevating pin and the substrate elevating pin are placed on the pin support member, and an alignment mask is disposed on the mask elevating pin. With the substrate placed on the substrate lifting pins, the substrate is positioned above the position where the third hand is inserted, and the plate is positioned below the position where the third hand is inserted. The third hand is inserted between the substrate and the plate, the pin support member is lowered to lower the substrate lifting pin, and the back surface of the substrate is brought into contact with the third hand. A substrate unloading step of transferring the substrate from the substrate lifting pins onto the third hand, placing the substrate on the third hand, and unloading the substrate from the vacuum chamber; An alignment mask is positioned above a position where a fourth hand is inserted, and the plate is positioned below a position where the fourth hand is inserted, and the fourth hand is positioned on the alignment mask and the plate. And the pin support member is lowered to lower the mask elevating pin, the back surface of the alignment mask is brought into contact with the fourth hand, and the alignment mask is moved from above the mask elevating pin to the first. An alignment mask unloading step of transferring the alignment mask onto a fourth hand and placing the alignment mask on the fourth hand and unloading the substrate from the vacuum chamber.
The present invention is a method for moving a substrate and an alignment mask, wherein the third hand and the fourth hand are the same transfer robot's hand.
The present invention is a method of moving a substrate and an alignment mask, wherein the third hand and the fourth hand are different transfer robot hands.
The present invention is a method of aligning a substrate and an alignment mask using the vacuum processing apparatus, wherein the mask elevating pin and the substrate elevating pin are placed on the pin support member, and the alignment mask is disposed on the mask elevating pin. In the state where the substrate is disposed on the substrate lift pins, the pin support member is raised to raise the mask lift pins, and the alignment mask on the mask lift pins is brought into contact with the frame body. The alignment method of the substrate and the alignment mask is a method of aligning the alignment mask and the substrate by moving an upper end of the substrate lifting pin in a lateral direction to move the substrate on the substrate lifting pin. .
The present invention raises the plate so that the surface of the plate contacts the back surface of the substrate while maintaining the state where the substrate and the alignment mask are aligned by the alignment method of the substrate and the alignment mask. The substrate is transferred from the substrate lifting pins onto the plate, the substrate lifting pins are lifted from the pin support member and suspended from the plate, and the plate is lifted to raise the surface of the substrate on the plate. Is brought into contact with the back surface of the alignment mask, the alignment mask is transferred onto the substrate from the mask elevating pins, the mask elevating pins are lifted from the pin support member and suspended from the plate, and the upper side of the alignment mask is A thin film forming material gas is sprayed from On the surface of the substrate exposed from the opening portion of the click is a film forming method for forming a thin film.
　本発明の真空処理装置では、薄膜形成用の材料ガスを導入するガス導入装置を前記プレートの上方に設ければ、プレート上に基板とアラインメントマスクとが積層された状態で、ガス導入装置から真空槽内に材料ガスを導入すると、アラインメントマスクの開口部から露出した前記基板の表面に薄膜を成膜することができる。 In the vacuum processing apparatus of the present invention, if a gas introducing device for introducing a material gas for forming a thin film is provided above the plate, a vacuum is applied from the gas introducing device in a state where the substrate and the alignment mask are stacked on the plate. When a material gas is introduced into the tank, a thin film can be formed on the surface of the substrate exposed from the opening of the alignment mask.
　真空槽内を大気に曝さなくてもアライメントマスクを交換することが可能となり、作業時間の短縮、ダウンタイムの向上、パーティクル管理をしやすくなる。
　基板を真空処理する間、基板昇降ピンとマスク昇降ピンをピン支持部材から離間させておくことができるので、ピン間の距離が、基板やプレートの熱伸びに従って自由に移動することができ、ピン変形が生じない。 It is possible to replace the alignment mask without exposing the inside of the vacuum chamber to the atmosphere, shortening the working time, improving the downtime, and facilitating particle management.
While the substrate is vacuum processed, the substrate lift pins and mask lift pins can be kept away from the pin support member, so the distance between the pins can move freely according to the thermal elongation of the substrate and plate, and pin deformation Does not occur.
本発明の真空処理装置の基板とアラインメントマスクとが、真空槽の内部に配置されていない状態を説明するための内部構成図The internal block diagram for demonstrating the state which the board | substrate and alignment mask of the vacuum processing apparatus of this invention are not arrange | positioned inside a vacuum chamber 本発明の真空処理装置のハンド上に乗せられたアラインメントマスクをハンドと共に真空槽内に搬入した状態を説明するための内部構成図The internal block diagram for demonstrating the state which carried the alignment mask mounted on the hand of the vacuum processing apparatus of this invention into the vacuum chamber with the hand. 本発明の真空処理装置のマスク昇降ピンの上端をアラインメントマスクの裏面に当接させた状態を説明するための内部構成図The internal block diagram for demonstrating the state which contacted the upper end of the mask raising / lowering pin of the vacuum processing apparatus of this invention with the back surface of the alignment mask 本発明の真空処理装置のアラインメントマスクをハンド上からマスク昇降ピン上に移載した状態を説明するための内部構成図The internal block diagram for demonstrating the state which transferred the alignment mask of the vacuum processing apparatus of this invention on the mask raising / lowering pin from the hand 本発明の真空処理装置のハンドを真空槽内から抜去した状態を説明するための内部構成図The internal block diagram for demonstrating the state which extracted the hand of the vacuum processing apparatus of this invention from the inside of a vacuum chamber 本発明の真空処理装置の基板を乗せたハンドを真空槽内に搬入した状態を説明するための内部構成図The internal block diagram for demonstrating the state which carried in the vacuum chamber the hand which put the board | substrate of the vacuum processing apparatus of this invention 本発明の真空処理装置の基板昇降ピンの上端を基板の裏面に当接させた状態を説明するための内部構成図The internal block diagram for demonstrating the state which made the upper end of the board | substrate raising / lowering pin of the vacuum processing apparatus of this invention contact the back surface of a board | substrate 本発明の真空処理装置のアラインメントマスクが、マスク昇降ピンによって枠体に当接された状態を説明するための内部構成図The internal block diagram for demonstrating the state which the alignment mask of the vacuum processing apparatus of this invention contact | abutted to the frame with the mask raising / lowering pin 本発明の真空処理装置の真空槽内からハンドを抜去した状態を説明するための内部構成図The internal block diagram for demonstrating the state which extracted the hand from the inside of the vacuum chamber of the vacuum processing apparatus of this invention 本発明の真空処理装置の基板とアラインメントマスクとが位置合わせされた状態を説明するための内部構成図The internal block diagram for demonstrating the state by which the board | substrate and alignment mask of the vacuum processing apparatus of this invention were aligned. 本発明の真空処理装置の基板とアラインメントマスクとが位置合わせされた状態で密着した状態を説明するための内部構成図The internal block diagram for demonstrating the state closely_contact | adhered in the state which the board | substrate and alignment mask of the vacuum processing apparatus of this invention aligned. 本発明の真空処理装置のプレート上に、基板と、アラインメントマスクが積層された状態を説明するための内部構成図The internal block diagram for demonstrating the state by which the board | substrate and the alignment mask were laminated | stacked on the plate of the vacuum processing apparatus of this invention 本発明の真空処理装置の基板が基板昇降ピン上に乗った状態を説明するための内部構成図The internal block diagram for demonstrating the state which the board | substrate of the vacuum processing apparatus of this invention got on the board | substrate raising / lowering pin 本発明の真空処理装置の基板とプレートの間にハンドを挿入した状態を説明するための内部構成図The internal block diagram for demonstrating the state which inserted the hand between the board | substrate and plate of the vacuum processing apparatus of this invention 本発明の真空処理装置の基板を基板昇降ピン上からハンド上に移載した状態を説明するための内部構成図The internal block diagram for demonstrating the state which transferred the board | substrate of the vacuum processing apparatus of this invention from the board | substrate raising / lowering pin on the hand 本発明の真空処理装置のハンドを真空槽内から抜去した状態を説明するための内部構成図The internal block diagram for demonstrating the state which extracted the hand of the vacuum processing apparatus of this invention from the inside of a vacuum chamber 本発明の真空処理装置のアラインメントマスクとプレートの間にハンドを挿入した状態を説明するための内部構成図The internal block diagram for demonstrating the state which inserted the hand between the alignment mask and plate of the vacuum processing apparatus of this invention 本発明の真空処理装置のアラインメントマスクをマスク昇降ピン上からハンド上に移載した状態を説明するための内部構成図The internal block diagram for demonstrating the state which transferred the alignment mask of the vacuum processing apparatus of this invention from the mask raising / lowering pin on the hand 本発明の真空処理装置のハンドを真空槽内から抜去した状態を説明するための内部構成図The internal block diagram for demonstrating the state which extracted the hand of the vacuum processing apparatus of this invention from the inside of a vacuum chamber アライメントマスクの構造を説明するための立体図Three-dimensional view for explaining the structure of the alignment mask 真空槽内に搬入されたハンドの平面図Top view of the hand carried into the vacuum chamber
　符号１は、本発明の一例の真空処理装置を示している。
　先ず、真空処理装置１の構造を説明する。
　図１を参照し、この真空処理装置１は、真空槽１１を有しており、真空槽１１の内部の天井側には、シャワーノズルから成るガス導入装置１２が配置され、その真下位置には、処理台１３が配置されている。 Reference numeral 1 denotes a vacuum processing apparatus according to an example of the present invention.
First, the structure of the vacuum processing apparatus 1 will be described.
Referring to FIG. 1, this vacuum processing apparatus 1 has a vacuum chamber 11, and a gas introduction device 12 including a shower nozzle is disposed on the ceiling side inside the vacuum chamber 11, and a position directly below the gas introduction device 12. A processing table 13 is arranged.
　真空槽１１は、真空排気系３１に接続されており、ガス導入装置１２は原料ガス導入系３２に接続されている。真空排気系３１を動作させ、真空槽１１の内部を真空排気しながら、原料ガス導入系３２からガス導入装置１２に薄膜形成用の材料ガスである原料ガスと反応ガスとが供給されると、ガス導入装置１２から真空槽１１内に原料ガスと反応ガスとが散布される。 The vacuum chamber 11 is connected to an evacuation system 31, and the gas introduction device 12 is connected to a source gas introduction system 32. When the source gas and the reaction gas, which are material gases for forming a thin film, are supplied from the source gas introduction system 32 to the gas introduction device 12 while operating the evacuation system 31 and evacuating the inside of the vacuum chamber 11, The raw material gas and the reaction gas are dispersed into the vacuum chamber 11 from the gas introduction device 12.
　真空槽１１内のガス導入装置１２と処理台１３との間の位置の真空槽１１の壁面には、配置部１８が設けられており、配置部１８上には枠体１４が乗せられている。枠体１４は、配置部１８上で離間と配置が可能に構成されているが、配置部１８上に乗ったときには、配置部１８によって、真空槽１１内で動かないように固定される。枠体１４は枠状で、中央には開口が形成されている。 An arrangement portion 18 is provided on the wall surface of the vacuum chamber 11 at a position between the gas introduction device 12 and the processing table 13 in the vacuum chamber 11, and the frame body 14 is placed on the arrangement portion 18. . The frame body 14 is configured so as to be separated and arranged on the arrangement portion 18, but when the frame body 14 rides on the arrangement portion 18, the frame body 14 is fixed by the arrangement portion 18 so as not to move in the vacuum chamber 11. The frame 14 is frame-shaped and has an opening at the center.
　成膜の際には、図１１に示すように、処理台１３上に基板１０とアラインメントマスク１５とがこの順序で積層され、更に、アラインメントマスク１５の外周付近の部分の上に枠体１４が乗った状態で、ガス導入装置１２から原料ガスと反応ガスが供給される。
　アラインメントマスク１５は、図２０に示すように、剛性を有する矩形枠３５に所定形状の遮蔽部３６が設けられ、遮蔽部３６と遮蔽部３６との間に基板が露出するように開口部３７が形成されている。 At the time of film formation, as shown in FIG. 11, the substrate 10 and the alignment mask 15 are stacked in this order on the processing table 13, and a frame body 14 is formed on a portion near the outer periphery of the alignment mask 15. In the state of getting on, the raw material gas and the reactive gas are supplied from the gas introducing device 12.
As shown in FIG. 20, the alignment mask 15 has a rigid rectangular frame 35 provided with a shield 36 having a predetermined shape, and an opening 37 is formed between the shield 36 and the shield 36 so that the substrate is exposed. Is formed.
　図１１を参照し、ガス導入装置１２はアラインメントマスク１５上に位置している。ガス導入装置１２から真空槽１１内に散布された原料ガスと反応ガスは、開口部３７で露出している基板１０表面に到達し、遮蔽部３６で遮られて基板１０表面へ到達しないため、開口部３７の平面形状に従った平面形状の薄膜が形成される。図２０では、線状の遮蔽部３６を有するアライメントマスク１５が示されているが、これに限定されず、複数の開口部３７がマトリックス状に並んだ形状など、遮蔽部３６と開口部３７の形状は特に限定されない。 Referring to FIG. 11, the gas introduction device 12 is positioned on the alignment mask 15. Since the source gas and the reaction gas sprayed into the vacuum chamber 11 from the gas introduction device 12 reach the surface of the substrate 10 exposed at the opening 37, and are blocked by the shielding portion 36, do not reach the surface of the substrate 10. A planar thin film according to the planar shape of the opening 37 is formed. In FIG. 20, the alignment mask 15 having the linear shielding part 36 is shown. However, the alignment mask 15 is not limited to this, and the shielding part 36 and the opening part 37 are not limited to this, such as a shape in which a plurality of opening parts 37 are arranged in a matrix. The shape is not particularly limited.
　図１は、基板１０とアラインメントマスク１５とが、真空槽１１の内部に配置されていない状態を示しており、この図１を用いて、真空処理装置１の内部の構成を説明する。
　処理台１３は、筒状の第一の昇降部材２１と、軸状の第二の昇降部材２２と、プレート２３と、ピン支持部材２４とを有している。 FIG. 1 shows a state in which the substrate 10 and the alignment mask 15 are not arranged in the vacuum chamber 11, and the internal configuration of the vacuum processing apparatus 1 will be described with reference to FIG.
The processing table 13 includes a cylindrical first elevating member 21, a shaft-like second elevating member 22, a plate 23, and a pin support member 24.
　第一の昇降部材２１は、真空槽１１の底面に気密に挿通されており、ピン支持部材２４は、第一の昇降部材２１の上端に、第一の昇降部材２１の内部空間２５を閉塞しないように取り付けられている。
　第二の昇降部材２２は第一の昇降部材２１の内部空間２５内に挿通されている。 The first elevating member 21 is airtightly inserted into the bottom surface of the vacuum chamber 11, and the pin support member 24 does not block the inner space 25 of the first elevating member 21 at the upper end of the first elevating member 21. It is attached as follows.
The second lifting member 22 is inserted into the internal space 25 of the first lifting member 21.
　ここでは、ピン支持部材２４は貫通孔２６を有する平板であり、貫通孔２６が第一の昇降部材２１の端部に位置し、第一の昇降部材２１の内部空間２５上に配置され、第二の昇降部材２２は貫通孔２６を通って第一の昇降部材２１の内部空間２５に挿通されている。
　第一の昇降部材２１と第二の昇降部材２２は、鉛直に配置されている。 Here, the pin support member 24 is a flat plate having a through hole 26, the through hole 26 is located at the end of the first elevating member 21, and is disposed on the internal space 25 of the first elevating member 21. The second elevating member 22 is inserted into the internal space 25 of the first elevating member 21 through the through hole 26.
The first elevating member 21 and the second elevating member 22 are arranged vertically.
　第一の昇降部材２１と第二の昇降部材２２は、下端を昇降装置２９に取り付けられており、昇降装置２９を動作させると、第一の昇降部材２１と第二の昇降部材２２は、それぞれ独立して上下移動できるようにされている。第一の昇降部材２１と第二の昇降部材２２が上下移動する際には、真空槽１１内の真空雰囲気が維持されるようになっている。昇降装置２９は、第一の昇降部材２１と第二の昇降部材２２が、それぞれ独立して上下移動できれば、駆動系が個別に設置されていても、共通に設置されていてもよい。また、貫通孔２６は、第一の昇降部材２１と第二の昇降部材２２に個別に設けられ、それぞれベローズなどのシール部材が設けられてもよい。 The first elevating member 21 and the second elevating member 22 have lower ends attached to the elevating device 29. When the elevating device 29 is operated, the first elevating member 21 and the second elevating member 22 are respectively It can be moved up and down independently. When the first elevating member 21 and the second elevating member 22 move up and down, the vacuum atmosphere in the vacuum chamber 11 is maintained. As long as the first elevating member 21 and the second elevating member 22 can move up and down independently, the elevating device 29 may be installed individually or in common. Moreover, the through-hole 26 is provided in the 1st raising / lowering member 21 and the 2nd raising / lowering member 22 separately, respectively, and sealing members, such as a bellows, may be provided.
　プレート２３は、第二の昇降部材２２の上端に取り付けられている。
　プレート２３は、その上方を向いた面である表面が水平にされており、第二の昇降部材２２を上下移動させると、プレート２３の表面は水平な状態で鉛直に上下移動する。
　プレート２３には、マスク昇降用貫通孔４１と基板昇降用貫通孔４２がそれぞれ複数個形成されている。
　各マスク昇降用貫通孔４１にはマスク昇降ピン４５がそれぞれ挿通され、各基板昇降用貫通孔４２には、基板昇降ピン４６がそれぞれ挿通されている。 The plate 23 is attached to the upper end of the second elevating member 22.
The surface of the plate 23, which is the surface facing upward, is horizontal, and when the second elevating member 22 is moved up and down, the surface of the plate 23 moves up and down vertically in a horizontal state.
The plate 23 is formed with a plurality of mask raising / lowering through holes 41 and a plurality of substrate raising / lowering through holes 42.
Mask raising / lowering pins 45 are inserted into the respective mask raising / lowering through holes 41, and substrate raising / lowering pins 46 are respectively inserted into the respective substrate raising / lowering through holes 42.
　プレート２３の下方を向いた面である裏面と後述するようにプレート２３に吊り下げられた基板昇降ピン４６の下端との間の距離を第一の距離と呼び、プレート２３の裏面と後述するようにプレート２３に吊り下げられたマスク昇降ピン４５の下端との間の距離を第二の距離と呼ぶ。 The distance between the back surface, which is the surface facing the lower side of the plate 23, and the lower end of the substrate lifting pins 46 suspended from the plate 23 as will be described later is referred to as a first distance, and will be described later. The distance between the lower end of the mask lifting pins 45 suspended from the plate 23 is called a second distance.
　マスク昇降ピン４５と基板昇降ピン４６の真下位置には、ピン支持部材２４が位置しており、プレート２３の裏面とピン支持部材２４の上方を向いた面との間の距離が、互いに近接する第一の距離以下にされたとき、マスク昇降ピン４５の下端と基板昇降ピン４６の下端はピン支持部材２４上に乗り、マスク昇降ピン４５の上端と基板昇降ピン４６の上端は、プレート２３の表面よりも上方に突き出すことができるようになっている。 The pin support member 24 is positioned immediately below the mask lift pins 45 and the substrate lift pins 46, and the distance between the back surface of the plate 23 and the surface facing the pin support member 24 is close to each other. When the distance is equal to or less than the first distance, the lower end of the mask elevating pin 45 and the lower end of the substrate elevating pin 46 ride on the pin support member 24, and the upper end of the mask elevating pin 45 and the upper end of the substrate elevating pin 46 are It can protrude above the surface.
　マスク昇降ピン４５の長さは、基板昇降ピン４６よりも上下方向に長くされており、マスク昇降ピン４５の下端と基板昇降ピン４６の下端がピン支持部材２４上に乗っているとき、下端の高さは等しいから、上端は、マスク昇降ピン４５の方が、基板昇降ピン４６よりも高い位置にある。 The length of the mask raising / lowering pin 45 is longer than the substrate raising / lowering pin 46 in the vertical direction. When the lower end of the mask raising / lowering pin 45 and the lower end of the substrate raising / lowering pin 46 are on the pin support member 24, Since the heights are equal, the upper end of the mask raising / lowering pin 45 is located higher than the substrate raising / lowering pin 46.
　第一の昇降部材２１を上下移動させることでピン支持部材２４を上下移動させると、マスク昇降ピン４５と基板昇降ピン４６は、マスク昇降用貫通孔４１内と基板昇降用貫通孔４２内とにそれぞれ挿通された状態で、プレート２３に対して上下移動される。 When the pin support member 24 is moved up and down by moving the first lifting member 21 up and down, the mask lifting pins 45 and the substrate lifting pins 46 are placed in the mask lifting and lowering through holes 41 and 42. With each inserted, the plate 23 is moved up and down.
　マスク昇降ピン４５の上部と基板昇降ピン４６の上部には、プレート２３の一部と接触する鍔状の係止部材４７が設けられている。なお、プレート２３の穴に係止されれば、係止部材４７の形状は図に示されている形状に限定されず、上部の直径が大きくなっている形状でもよい。 A hook-like locking member 47 that contacts a part of the plate 23 is provided on the upper part of the mask raising / lowering pins 45 and the upper part of the substrate raising / lowering pins 46. In addition, if it latches in the hole of the plate 23, the shape of the latching member 47 is not limited to the shape shown by the figure, The shape where the diameter of the upper part is large may be sufficient.
　各貫通孔４１、４２内には突起又は段差が設けられている。図９を参照し、マスク昇降ピン４５と基板昇降ピン４６が、マスク昇降用貫通孔４１内と基板昇降用貫通孔４２内とにそれぞれ挿通されてピン支持部材２４上に乗った状態で、プレート２３を上昇させ、ピン支持部材２４をプレート２３に対して相対的に降下させ、マスク昇降ピン４５と基板昇降ピン４６をプレート２３に対して相対的に降下させると、図１０を参照し、基板昇降ピン４６の係止部材４７が基板昇降用貫通孔４２内のプレート２３の一部である突起や段差に接触し、基板昇降ピン４６の相対的な降下が停止する。更にピン支持部材２４を相対的に降下させると、図１１を参照し、基板昇降ピン４６の下端からピン支持部材２４表面が離間する。更にピン支持部材２４を相対的に降下させると、次いで、マスク昇降ピン４５の係止部材４７がマスク昇降用貫通孔４１内の同様の突起や段差に接触し、マスク昇降ピン４５の相対的な降下が停止し、図１２を参照し、プレート２３の裏面とピン支持部材２４の上方を向いた面との間の距離が第一の距離よりも離間する第二の距離以上にされたとき、マスク昇降ピン４５の下端からピン支持部材２４は離間する。 A protrusion or a step is provided in each through hole 41, 42. Referring to FIG. 9, the mask lifting pins 45 and the substrate lifting pins 46 are inserted into the mask lifting / lowering through holes 41 and the substrate lifting / lowering through holes 42, respectively, and ride on the pin support members 24. 23, the pin support member 24 is lowered relative to the plate 23, and the mask raising / lowering pins 45 and the substrate raising / lowering pins 46 are lowered relative to the plate 23. With reference to FIG. The locking member 47 of the elevating pin 46 comes into contact with a protrusion or a step which is a part of the plate 23 in the substrate elevating through hole 42, and the relative lowering of the substrate elevating pin 46 stops. When the pin support member 24 is further lowered, the surface of the pin support member 24 is separated from the lower end of the substrate elevating pin 46 with reference to FIG. When the pin support member 24 is further lowered, the locking member 47 of the mask raising / lowering pin 45 comes into contact with the same protrusion or step in the mask raising / lowering through hole 41, and the mask raising / lowering pin 45 is relatively moved. When the descent stops and the distance between the back surface of the plate 23 and the upwardly facing surface of the pin support member 24 is set to a second distance or more apart from the first distance, referring to FIG. The pin support member 24 is separated from the lower end of the mask elevating pin 45.
　この状態では、マスク昇降ピン４５と基板昇降ピン４６とはプレート２３に吊り下げられており、そのマスク昇降ピン４５の上端と基板昇降ピン４６の上端とは、プレート２３の表面以下の高さに位置しており、プレート２３の表面上には突出しないようにされている。
　プレート２３の裏面とプレート２３に吊り下げられた基板昇降ピン４６の下端との間の距離が上述の第一の距離であり、プレート２３の裏面とプレート２３に吊り下げられたマスク昇降ピン４５の下端との間の距離が上述の第二の距離である。 In this state, the mask raising / lowering pins 45 and the substrate raising / lowering pins 46 are suspended from the plate 23, and the upper end of the mask raising / lowering pins 45 and the upper end of the substrate raising / lowering pins 46 are below the surface of the plate 23. It is located so that it does not protrude on the surface of the plate 23.
The distance between the back surface of the plate 23 and the lower end of the substrate lift pins 46 suspended from the plate 23 is the first distance described above, and the mask lift pins 45 suspended from the back surface of the plate 23 and the plate 23 are disposed. The distance between the lower end is the second distance described above.
　次に、真空処理装置１を用いた成膜工程について説明する。
　図１１に示すように、真空槽１１の壁面には開口３９が設けられている。
　開口３９の外部には、開口３９によって、真空槽１１と内部が連通した搬送室１７が配置されており、搬送室１７内には基板搬送ロボット５０が配置されている。 Next, a film forming process using the vacuum processing apparatus 1 will be described.
As shown in FIG. 11, an opening 39 is provided on the wall surface of the vacuum chamber 11.
Outside the opening 39, a transfer chamber 17 that communicates with the vacuum chamber 11 through the opening 39 is disposed. In the transfer chamber 17, a substrate transfer robot 50 is disposed.
　ピン支持部材２４とプレート２３とを降下させておくと、図２を参照し、基板搬送ロボット５０のハンド４８は、開口３９を通過して、搬送室１７から真空槽１１の内部に移動できるようにされている。
　真空槽１１内で成膜される基板１０と、基板１０の成膜に用いられるアラインメントマスク１５とは、両方とも四角形であり、アラインメントマスク１５の方が、少なくとも矩形枠３５の分だけ大きくなっている（図２０参照）。 When the pin support member 24 and the plate 23 are lowered, the hand 48 of the substrate transfer robot 50 can move from the transfer chamber 17 into the vacuum chamber 11 through the opening 39 with reference to FIG. Has been.
The substrate 10 formed in the vacuum chamber 11 and the alignment mask 15 used for forming the substrate 10 are both square, and the alignment mask 15 is larger by at least the rectangular frame 35. (See FIG. 20).
　基板搬送ロボット５０は、基板１０とアラインメントマスク１５との、いずれも搬送可能に構成されている。
　搬送室１７と真空槽１１は真空排気によって真空雰囲気に置かれており、ここで、基板搬送ロボット５０のハンド４８上にアラインメントマスク１５が乗せられているものとすると、先ず、基板搬送ロボットを動作させ、図２に示すように、基板搬送ロボットのハンド４８上に乗せられたアラインメントマスク１５をハンド４８と共に真空槽１１内に搬入する。図２１は真空槽１１内に搬入されたハンド４８の平面図を示している。 The substrate transfer robot 50 is configured to be able to transfer both the substrate 10 and the alignment mask 15.
The transfer chamber 17 and the vacuum chamber 11 are placed in a vacuum atmosphere by evacuation. Here, assuming that the alignment mask 15 is placed on the hand 48 of the substrate transfer robot 50, first, the substrate transfer robot is operated. 2, the alignment mask 15 placed on the hand 48 of the substrate transfer robot is carried into the vacuum chamber 11 together with the hand 48. FIG. 21 shows a plan view of the hand 48 carried into the vacuum chamber 11.
　その状態からピン支持部材２４によってマスク昇降ピン４５を上昇させ、マスク昇降ピン４５にハンド４８の指４９の間を通過させ、図３に示すように、マスク昇降ピン４５の上端をアラインメントマスク１５の裏面に当接させる。
　その状態からマスク昇降ピン４５を上昇させ、図４に示すように、アラインメントマスク１５をハンド４８上からマスク昇降ピン４５上に移載する。
　このとき、アライメントマスク１５は、マスク昇降ピン４５上を滑動し、定められた位置に設置される。 In this state, the pin lifting member 45 is lifted by the pin support member 24, and the mask lifting pin 45 is passed between the fingers 49 of the hand 48. As shown in FIG. Contact the back.
From that state, the mask raising / lowering pins 45 are raised, and the alignment mask 15 is transferred from the hand 48 onto the mask raising / lowering pins 45 as shown in FIG.
At this time, the alignment mask 15 slides on the mask raising / lowering pins 45 and is installed at a predetermined position.
　アラインメントマスク１５をハンド４８上からマスク昇降ピン４５上に移載する間には基板昇降ピン４６はアラインメントマスク１５とは接触せず、また、基板昇降ピン４６の上端はハンド４８の高さよりも低くされており、図５に示すように、ハンド４８を真空槽１１内から抜去し、次いで、図６に示すように、基板１０を乗せたハンド４８を真空槽１１内に搬入する。
　アラインメントマスク１５と基板１０とは、同一の基板搬送ロボット５０のハンド４８に乗せて真空槽１１内に搬入することもできるし、互いに異なる個別の基板搬送ロボット５０のハンド４８で搬入することもできる。 While the alignment mask 15 is transferred from the hand 48 onto the mask lifting pins 45, the substrate lifting pins 46 do not contact the alignment mask 15, and the upper end of the substrate lifting pins 46 is lower than the height of the hand 48. As shown in FIG. 5, the hand 48 is removed from the vacuum chamber 11, and then the hand 48 on which the substrate 10 is placed is carried into the vacuum chamber 11 as shown in FIG. 6.
The alignment mask 15 and the substrate 10 can be carried on the hand 48 of the same substrate transfer robot 50 and carried into the vacuum chamber 11, or can be carried by the hands 48 of the individual substrate transfer robots 50 different from each other. .
　次に、ピン支持部材２４を上昇させることによって基板昇降ピン４６とマスク昇降ピン４５とを上昇させ、図７に示すように基板昇降ピン４６に、ハンド４８の指４９間を通過させ、基板昇降ピン４６の上端を基板１０の裏面に当接させる。
　枠体１４は、アラインメントマスク１５の矩形枠３５の上方に位置しており、ピン支持部材２４によって、基板昇降ピン４６とマスク昇降ピン４５とを上昇させると、図８に示すように、アラインメントマスク１５は、マスク昇降ピン４５によって枠体１４に当接される。 Next, by raising the pin support member 24, the substrate elevating pin 46 and the mask elevating pin 45 are raised, and as shown in FIG. 7, the substrate elevating pin 46 is passed between the fingers 49 of the hand 48 to elevate the substrate. The upper end of the pin 46 is brought into contact with the back surface of the substrate 10.
The frame 14 is located above the rectangular frame 35 of the alignment mask 15, and when the substrate lifting pins 46 and the mask lifting pins 45 are raised by the pin support member 24, as shown in FIG. 15 is brought into contact with the frame body 14 by the mask lifting pins 45.
　このとき、アラインメントマスク１５に設けられた勘合部と、枠体１４の所定位置に設けられた勘合部とが合せられ相対的に決められた位置で静止する。勘合部を凹部と凸部により形成し物理的に滑動して位置が合うように形成してもよい。アラインメントマスク１５を枠体１４に接触させることで相対的に決められた位置に静止させることを仮固定するという。 At this time, the fitting portion provided on the alignment mask 15 and the fitting portion provided at a predetermined position of the frame body 14 are combined and stopped at a relatively determined position. The fitting portion may be formed by a concave portion and a convex portion so that the fitting portion is physically slid. Making the alignment mask 15 come into contact with the frame body 14 to be stationary at a relatively determined position is referred to as temporarily fixing.
　基板１０は基板昇降ピン４６によって、ハンド４８上から持ち上げられており、図９に示すように、真空槽１１内からハンド４８を抜去する。
　この状態では、基板１０とプレート２３とは離間しており、また、基板１０とアラインメントマスク１５とは離間している。 The substrate 10 is lifted from above the hand 48 by the substrate lifting pins 46, and the hand 48 is removed from the vacuum chamber 11 as shown in FIG.
In this state, the substrate 10 and the plate 23 are separated from each other, and the substrate 10 and the alignment mask 15 are separated from each other.
　基板昇降用貫通孔４２と基板昇降ピン４６との間には隙間が形成されており、基板昇降ピン４６を傾けて、基板昇降ピン４６の上端を横方向に移動させることが出来るようになっている。
　例えば、基板１０の四辺に沿って配置された基板昇降ピン４６の内、直交する２辺の基板昇降ピン４６（可動ピン）はばね等により内側に傾く向きに設置されており、可動ピンを傾けてその上端を横方向に移動させ、その上端に配置された基板１０を可動ピンの上端が移動する方向と同一方向に移動させて他の２辺の基板昇降ピン４６（不動ピン）に押し付けることで、基板１０を決められた位置に配置する（図２１の符号４６ａは可動ピンを示し、符号４６ｂは不動ピンを示す）。上記により、基板１０とアラインメントマスク１５が定められた位置に配置される。ここではピン支持部材２４を水平方向であるＸＹ方向に移動させることで、可動ピンの下端が支点となって可動ピンを傾けて可動ピンの上端をピン支持部材２４の移動方向と逆方向である横方向に移動させる。 A gap is formed between the substrate elevating through hole 42 and the substrate elevating pin 46, and the upper end of the substrate elevating pin 46 can be moved in the lateral direction by tilting the substrate elevating pin 46. Yes.
For example, among the substrate elevating pins 46 arranged along the four sides of the substrate 10, the two substrate elevating pins 46 (movable pins) orthogonal to each other are installed so as to be inclined inward by a spring or the like. Then, the upper end of the movable pin is moved in the horizontal direction, and the substrate 10 arranged at the upper end is moved in the same direction as the upper end of the movable pin and is pressed against the other two sides of the substrate lifting pins 46 (non-moving pins). Then, the substrate 10 is arranged at a predetermined position (reference numeral 46a in FIG. 21 indicates a movable pin, and reference numeral 46b indicates an immobile pin). By the above, the board | substrate 10 and the alignment mask 15 are arrange | positioned in the defined position. Here, by moving the pin support member 24 in the XY direction, which is the horizontal direction, the movable pin is tilted with the lower end of the movable pin serving as a fulcrum, and the upper end of the movable pin is opposite to the moving direction of the pin support member 24. Move horizontally.
　なお、上記はピンの形状や勘合部により基板１０、アラインメントマスク１５および枠体１４の位置合わせを行う例を示したが、アライメントマスク１５と枠体１４をＸＹ方向に移動する位置調整機構（図示なし）に受け渡して、カメラでアライメントマークを測定しながら基板１０とアラインメントマスク１５の位置合わせをしてもよい。 In the above, an example in which the substrate 10, the alignment mask 15 and the frame body 14 are aligned by the pin shape and the fitting portion has been described. However, a position adjustment mechanism (illustrated) that moves the alignment mask 15 and the frame body 14 in the XY directions. (None), and alignment of the substrate 10 and the alignment mask 15 may be performed while measuring alignment marks with a camera.
　位置合わせが終了するとピン支持部材２４の静止によって、基板１０を静止させ、次に、図１０に示すように、アラインメントマスク１５と基板１０とが位置合わせされた状態を維持しながらプレート２３を上昇させて基板１０の裏面にプレート２３の表面を接触させ、基板１０をプレート２３上に乗せる。この状態では、基板１０とアラインメントマスク１５とは位置合わせがされている。 When the alignment is completed, the substrate 10 is stopped by stopping the pin support member 24, and then the plate 23 is raised while maintaining the alignment mask 15 and the substrate 10 aligned as shown in FIG. Then, the surface of the plate 23 is brought into contact with the back surface of the substrate 10, and the substrate 10 is placed on the plate 23. In this state, the substrate 10 and the alignment mask 15 are aligned.
　次に、プレート２３を更に上昇させると、図１１に示すように基板１０はプレート２３上に乗った状態で上方に移動し、基板１０の表面はアラインメントマスク１５の裏面に当接され、基板１０とアラインメントマスク１５とは位置合わせがされた状態で密着する。
　このとき、基板昇降ピン４６は、プレート２３によってピン支持部材２４上から持ち上げられ、プレート２３に吊り下げられた状態になっている。 Next, when the plate 23 is further raised, the substrate 10 moves upward while being on the plate 23 as shown in FIG. 11, and the surface of the substrate 10 is brought into contact with the back surface of the alignment mask 15. And the alignment mask 15 are in close contact with each other in an aligned state.
At this time, the substrate lifting pins 46 are lifted from the pin support member 24 by the plate 23 and are suspended from the plate 23.
　次いで、図１２に示すように、プレート２３を更に上昇させると、プレート２３上に、基板１０と、アラインメントマスク１５が積層され、アラインメントマスク１５の外周上には、枠体１４が乗った状態になる。プレート２３の上昇により、枠体１４は、配置部１８から離間して配置部１８の上方に、基板１０とアラインメントマスク１５と共に上昇し、基板昇降ピン４６に加え、マスク昇降ピン４５もプレート２３から吊り下げられた状態になる。 Next, as shown in FIG. 12, when the plate 23 is further raised, the substrate 10 and the alignment mask 15 are stacked on the plate 23, and the frame body 14 is on the outer periphery of the alignment mask 15. Become. Due to the rise of the plate 23, the frame body 14 rises together with the substrate 10 and the alignment mask 15 apart from the placement portion 18 and above the placement portion 18, and in addition to the substrate lift pins 46, the mask lift pins 45 also move from the plate 23. It becomes a suspended state.
　この状態では、基板１０の表面はアラインメントマスク１５の裏面に密着し、基板１０の裏面はプレート２３の表面に密着しており、ガス導入装置１２から原料ガスと反応ガスを放出させると、原料ガスと反応ガスは、アラインメントマスク１５の開口部３７を通過して、基板１０の表面の開口部３７と面する位置に到達し、その部分に薄膜が成長する。 In this state, the front surface of the substrate 10 is in close contact with the back surface of the alignment mask 15, and the back surface of the substrate 10 is in close contact with the surface of the plate 23. When the source gas and the reactive gas are released from the gas introduction device 12, the source gas The reactive gas passes through the opening 37 of the alignment mask 15 and reaches a position facing the opening 37 on the surface of the substrate 10, and a thin film grows there.
　薄膜が所定膜厚に形成された後、ガス導入装置１２からの原料ガスと反応ガスの放出を停止し、プレート２３を降下させ、枠体１４を配置部１８上に乗せると共に、基板昇降ピン４６の上端に基板１０を乗せた状態で、プレート２３を降下させ、基板１０をアラインメントマスク１５の裏面から離間させると共に、基板昇降ピン４６もピン支持部材２４上に乗せ、図１３に示すように、基板１０が基板昇降ピン４６上に乗った状態にする。 After the thin film is formed to a predetermined thickness, the release of the source gas and the reactive gas from the gas introduction device 12 is stopped, the plate 23 is lowered, the frame body 14 is placed on the placement portion 18, and the substrate lifting pins 46 With the substrate 10 placed on the upper end of the substrate, the plate 23 is lowered to separate the substrate 10 from the back surface of the alignment mask 15, and the substrate lifting pins 46 are also placed on the pin support member 24, as shown in FIG. The substrate 10 is put on the substrate lifting pins 46.
　このとき、基板１０をハンド４８よりも高い位置に静止させ、プレート２３をハンド４８よりも低い位置に配置しておき、図１４に示すように、基板１０とプレート２３の間にハンド４８を挿入し、次いで、図１５に示すように、ピン支持部材２４を降下させて基板昇降ピン４６を降下させ、基板１０を基板昇降ピン４６上からハンド４８上に移載し、図１６のように、ハンド４８を真空槽１１内から抜去する。 At this time, the substrate 10 is stopped at a position higher than the hand 48, the plate 23 is placed at a position lower than the hand 48, and the hand 48 is inserted between the substrate 10 and the plate 23 as shown in FIG. Then, as shown in FIG. 15, the pin support member 24 is lowered to lower the substrate lifting pins 46, and the substrate 10 is transferred from the substrate lifting pins 46 to the hand 48, as shown in FIG. 16. The hand 48 is removed from the vacuum chamber 11.
　そして、未成膜の基板をハンド４８上に乗せて真空槽１１内に搬入し、上記と同様に基板表面にアラインメントマスク１５を乗せて成膜を行うことができ、複数回繰り返すと、複数の基板に成膜処理を行うことが出来る。
　多数枚数の基板に成膜処理を行い、アラインメントマスク１５を交換する場合は、図１７に示すように、アラインメントマスク１５とプレート２３の間にハンド４８を挿入し、次いで、ピン支持部材２４を降下させてマスク昇降ピン４５を降下させ、図１８に示すように、アラインメントマスク１５をマスク昇降ピン４５上からハンド４８上に移載し、図１９に示すように、ハンド４８を真空槽１１内から抜去すると、新しいアラインメントマスクを乗せたハンドを真空槽１１内に搬入し、アラインメントマスクの交換を行うことが出来る。 Then, an undeposited substrate can be placed on the hand 48 and carried into the vacuum chamber 11, and the alignment mask 15 can be deposited on the substrate surface in the same manner as described above. A film formation process can be performed.
When the film forming process is performed on a large number of substrates and the alignment mask 15 is replaced, as shown in FIG. 17, the hand 48 is inserted between the alignment mask 15 and the plate 23, and then the pin support member 24 is lowered. Then, the mask raising / lowering pins 45 are lowered, and the alignment mask 15 is transferred from the mask raising / lowering pins 45 to the hand 48 as shown in FIG. 18, and the hand 48 is moved from the vacuum chamber 11 as shown in FIG. When extracted, the hand carrying the new alignment mask is carried into the vacuum chamber 11 and the alignment mask can be exchanged.
　アラインメントマスク１５と基板１０とは、同一の基板搬送ロボット５０のハンド４８に乗せて真空槽１１内に搬出することもできるし、互いに異なる個別の基板搬送ロボット５０のハンド４８で搬出することもできる。
　なお、上記実施例は成膜装置であったが、アラインメントマスクを用いた真空処理装置であれば、例えばエッチング装置等、他の種類の真空処理装置にも用いることが出来る。 The alignment mask 15 and the substrate 10 can be carried on the hand 48 of the same substrate transfer robot 50 and carried out into the vacuum chamber 11, or can be carried out by the hands 48 of individual substrate transfer robots 50 different from each other. .
Although the above embodiment is a film forming apparatus, any vacuum processing apparatus using an alignment mask can be used for other types of vacuum processing apparatuses such as an etching apparatus.
　１……真空処理装置
　１０……基板
　１１……真空槽
　１２……ガス導入装置
　１４……枠体
　１５……アライメントマスク
　１８……配置部
　２１……第一の昇降部材
　２２……第二の昇降部材
　２３……プレート
　２４……ピン支持部材
　４１……マスク昇降用貫通孔
　４２……基板昇降用貫通孔
　４５……マスク昇降ピン
　４６……基板昇降ピン
　４７……係止部材
　４８……ハンド
　５０……基板搬送ロボット
  DESCRIPTION OF SYMBOLS 1 ... Vacuum processing apparatus 10 ... Substrate 11 ... Vacuum tank 12 ... Gas introduction apparatus 14 ... Frame 15 ... Alignment mask 18 ... Arrangement part 21 ... First raising / lowering member 22 ... Second Elevating member 23 …… Plate 24 …… Pin support member 41 …… Mask elevating through hole 42 …… Substrate elevating through hole 45 …… Mask elevating pin 46 …… Substrate elevating pin 47 …… Locking member 48 …… Hand 50 …… Board transfer robot

Claims (12)

  1. 　真空槽と、
    　基板が設置されるプレートと、
    　前記プレートに形成されたマスク昇降用貫通孔に挿入され、上端にアラインメントマスクを配置可能に構成されたマスク昇降ピンと、
    　前記プレートに形成された基板昇降用貫通孔に挿入され、上端に基板を配置可能に構成された基板昇降ピンと、
    　前記プレートの下方位置に配置され、前記プレートに対して上下に相対移動可能なピン支持部材と、
    を有し、
    　前記マスク昇降ピンは前記基板昇降ピンよりも上下方向に長く形成され、
    　前記プレートの下方を向いた面と前記プレートに吊り下げられた前記基板昇降ピンの下端との間の距離を第一の距離とし、前記プレートの下方を向いた面と前記プレートに吊り下げられた前記マスク昇降ピンの下端との間の距離を第二の距離とすると、
    　前記プレートの下方を向いた面と前記ピン支持部材の上方を向いた面との間が前記第一の距離より小さい時、前記マスク昇降ピンと前記基板昇降ピンが前記ピン支持部材に支持され、
    　前記プレートの下方を向いた面と前記ピン支持部材の上方を向いた面との間が前記第一の距離より大きく、前記第二の距離より小さい時、前記マスク昇降ピンが前記ピン支持部材に支持され、前記基板昇降ピンは前記プレートに吊り下げられ、
    　前記プレートの下方を向いた面と前記ピン支持部材の上方を向いた面との間が前記第二の距離より大きい時、前記マスク昇降ピンと前記基板昇降ピンが前記プレートに吊り下げられる、真空処理装置。     A vacuum chamber;
    A plate on which the substrate is installed;
    A mask lifting pin inserted into a mask lifting / lowering through-hole formed in the plate and configured to be able to arrange an alignment mask at the upper end; and
    A substrate lifting pin that is inserted into a substrate lifting / lowering through-hole formed in the plate and configured to be able to place the substrate at the upper end;
    A pin support member that is disposed at a lower position of the plate and is movable up and down relative to the plate;
    Have
    The mask lift pins are formed longer in the vertical direction than the substrate lift pins,
    The first distance is the distance between the lower surface of the plate and the lower end of the substrate lifting pin suspended from the plate, and the lower surface of the plate is suspended from the plate. When the distance between the lower end of the mask lifting pins is the second distance,
    When the distance between the surface facing downward of the plate and the surface facing upward of the pin support member is smaller than the first distance, the mask lifting pins and the substrate lifting pins are supported by the pin support member,
    When the distance between the surface facing the lower side of the plate and the surface facing the upper side of the pin support member is larger than the first distance and smaller than the second distance, the mask elevating pin is attached to the pin support member. Supported, the substrate lifting pins are suspended from the plate,
    A vacuum process in which the mask elevating pins and the substrate elevating pins are suspended from the plate when a distance between a surface facing the lower side of the plate and a surface facing the upper side of the pin support member is larger than the second distance. apparatus.
  2. 　前記マスク昇降ピンと前記基板昇降ピンとが前記ピン支持部材上に乗り、前記マスク昇降ピン上に前記アラインメントマスクが配置され、前記基板昇降ピン上に前記基板が配置された状態で、
    　前記アラインメントマスクと前記基板との間に、基板搬送ロボットのハンドが挿入可能に構成された請求項１記載の真空処理装置。     The mask elevating pin and the substrate elevating pin ride on the pin support member, the alignment mask is arranged on the mask elevating pin, and the substrate is arranged on the substrate elevating pin,
    The vacuum processing apparatus according to claim 1, wherein a hand of a substrate transfer robot can be inserted between the alignment mask and the substrate.
  3. 　前記基板昇降ピンの上端を横方向に移動させることで、前記基板昇降ピン上に配置された前記基板を移動させ、前記アラインメントマスクと前記基板とを位置合わせする位置合わせ装置と、
    　前記真空槽内の前記プレートの上方に配置された配置部と、
    　前記配置部上に配置され、前記マスク昇降ピン上に配置された前記アラインメントマスクの周囲が下方から上方に移動して当接されて、前記アラインメントマスクを前記真空槽に対して仮固定する枠体とを有し、
    　前記位置合わせは、前記アラインメントマスクが前記枠体に当接された状態で行われる請求項１又は請求項２のいずれか１項記載の真空処理装置。     An alignment device for moving the substrate disposed on the substrate lifting pins by moving the upper end of the substrate lifting pins in the lateral direction, and aligning the alignment mask and the substrate;
    An arrangement portion arranged above the plate in the vacuum chamber;
    A frame body that is disposed on the placement portion and that abuts around the alignment mask that is disposed on the mask raising / lowering pin is moved from the lower side to the upper side and is in contact with the alignment mask to temporarily fix the alignment mask to the vacuum chamber. And
    The vacuum processing apparatus according to claim 1, wherein the alignment is performed in a state where the alignment mask is in contact with the frame.
  4. 　前記アラインメントマスクが配置された前記マスク昇降ピンの上昇により、前記枠体は、前記アラインメントマスク上に乗って、前記アラインメントマスクと共に前記配置部から離間して上昇できるように構成された請求項３記載の真空処理装置。 4. The frame is configured to be able to ride on the alignment mask and rise away from the placement portion together with the alignment mask by raising the mask raising / lowering pins on which the alignment mask is arranged. Vacuum processing equipment.
  5. 　請求項１又は請求項２のいずれか１項記載の真空処理装置を用いた基板とアラインメントマスクの移動方法であって、
    　前記真空槽内に基板とアラインメントマスクとが配置されていない状態で、前記プレートと前記ピン支持部材と前記マスク昇降ピンの上端と前記基板昇降ピンの上端とを、第一のハンドを挿入する位置より下方に位置させておき、アラインメントマスクを前記第一のハンドに載せて前記真空槽内に搬入し、前記ピン支持部材を上昇させて前記マスク昇降ピンを上昇させ、前記マスク昇降ピンの上端を前記アラインメントマスクの裏面に当接させ、前記アラインメントマスクを前記第一のハンド上から前記マスク昇降ピン上に移載し、前記第一のハンドを前記真空槽内から抜去するアラインメントマスク搬入工程と、
    　前記マスク昇降ピン上の前記アラインメントマスクを第二のハンドを挿入する位置より上方に位置させ、かつ前記基板昇降ピンの上端を前記第二のハンドを挿入する位置より下方に位置させておき、基板を前記第二のハンドに載せて前記真空槽内に搬入し、前記アラインメントマスクと前記基板昇降ピンの上端との間に挿入し、前記ピン支持部材を上昇させて前記基板昇降ピンを上昇させ、前記基板昇降ピンの上端を前記基板の裏面に当接させ、前記基板を前記第二のハンド上から前記基板昇降ピン上に移載し、前記第二のハンドを前記真空槽内から抜去する基板搬入工程と、
    　を有する基板とアラインメントマスクの移動方法。     A method of moving a substrate and an alignment mask using the vacuum processing apparatus according to claim 1 or 2,
    The position where the first hand is inserted between the plate, the pin support member, the upper end of the mask elevating pin, and the upper end of the substrate elevating pin in a state where the substrate and the alignment mask are not disposed in the vacuum chamber. Place the alignment mask on the first hand and carry it into the vacuum chamber, raise the pin support member to raise the mask raising / lowering pin, and lift the upper end of the mask raising / lowering pin. Bringing the alignment mask into contact with the back surface of the alignment mask, transferring the alignment mask onto the mask lifting pins from the first hand, and removing the first hand from the vacuum chamber; and
    The alignment mask on the mask elevating pins is positioned above the position where the second hand is inserted, and the upper end of the substrate elevating pins is positioned below the position where the second hand is inserted, Is placed on the second hand and carried into the vacuum chamber, inserted between the alignment mask and the upper end of the substrate lifting pins, and the substrate support pins are raised to raise the substrate lifting pins, A substrate in which the upper end of the substrate lifting pin is brought into contact with the back surface of the substrate, the substrate is transferred from the second hand onto the substrate lifting pin, and the second hand is removed from the vacuum chamber. Carrying-in process;
    Substrate and alignment mask moving method.
  6. 　前記第一のハンドと前記第二のハンドは同一の搬送ロボットのハンドである請求項５記載の基板とアラインメントマスクの移動方法。 6. The method of moving a substrate and an alignment mask according to claim 5, wherein the first hand and the second hand are hands of the same transfer robot.
  7. 　前記第一のハンドと前記第二のハンドは互いに異なる搬送ロボットのハンドである請求項５記載の基板とアラインメントマスクの移動方法。 6. The method for moving a substrate and an alignment mask according to claim 5, wherein the first hand and the second hand are different transport robot hands.
  8. 　請求項１又は請求項２のいずれか１項記載の真空処理装置を用いた基板とアラインメントマスクの移動方法であって、
    　前記マスク昇降ピンと前記基板昇降ピンとが前記ピン支持部材上に乗り、前記マスク昇降ピン上にアラインメントマスクが配置され、前記基板昇降ピン上に基板が配置された状態で、前記基板を第三のハンドを挿入する位置より上方に位置させ、かつ前記プレートを前記第三のハンドを挿入する位置より下方に位置させておき、前記第三のハンドを前記基板と前記プレートとの間に挿入し、前記ピン支持部材を降下させて前記基板昇降ピンを降下させ、前記基板の裏面を前記第三のハンドに接触させ、前記基板を前記基板昇降ピン上から前記第三のハンド上に移載し、前記基板を前記第三のハンドに載せて前記真空槽内から搬出する基板搬出工程と、
    　前記アラインメントマスクを第四のハンドを挿入する位置より上方に位置させ、かつ前記プレートを前記第四のハンドを挿入する位置より下方に位置させておき、前記第四のハンドを前記アラインメントマスクと前記プレートとの間に挿入し、前記ピン支持部材を降下させて前記マスク昇降ピンを降下させ、前記アラインメントマスクの裏面を前記第四のハンドに接触させ、前記アラインメントマスクを前記マスク昇降ピン上から前記第四のハンド上に移載し、前記アラインメントマスクを前記第四のハンドに載せて前記真空槽内から搬出するアラインメントマスク搬出工程と、
    　を有する基板とアラインメントマスクの移動方法。     A method of moving a substrate and an alignment mask using the vacuum processing apparatus according to claim 1 or 2,
    The mask lifting pin and the substrate lifting pin are placed on the pin support member, an alignment mask is disposed on the mask lifting pin, and the substrate is disposed on the substrate lifting pin. And the plate is positioned below the position to insert the third hand, the third hand is inserted between the substrate and the plate, Lowering the pin support member to lower the substrate lifting pins, bringing the back surface of the substrate into contact with the third hand, transferring the substrate from the substrate lifting pins onto the third hand, A substrate unloading step of unloading the substrate from the vacuum chamber by placing it on the third hand;
    The alignment mask is positioned above the position where the fourth hand is inserted, and the plate is positioned below the position where the fourth hand is inserted, and the fourth hand is placed on the alignment mask and the Inserted between the plate and lowering the pin support member to lower the mask elevating pin, contacting the back of the alignment mask to the fourth hand, the alignment mask from above the mask elevating pin An alignment mask carry-out step of transferring onto the fourth hand, placing the alignment mask on the fourth hand and carrying it out of the vacuum chamber;
    Substrate and alignment mask moving method.
  9. 　前記第三のハンドと前記第四のハンドは同一の搬送ロボットのハンドである請求項８記載の基板とアラインメントマスクの移動方法。 9. The method for moving a substrate and an alignment mask according to claim 8, wherein the third hand and the fourth hand are hands of the same transfer robot.
  10. 　前記第三のハンドと前記第四のハンドは互いに異なる搬送ロボットのハンドである請求項８記載の基板とアラインメントマスクの移動方法。 9. The method for moving a substrate and an alignment mask according to claim 8, wherein the third hand and the fourth hand are different robot robot hands.
  11.   請求項３記載の真空処理装置を用いた基板とアラインメントマスクとの位置合わせ方法であって、
    　前記マスク昇降ピンと前記基板昇降ピンとが前記ピン支持部材上に乗り、前記マスク昇降ピン上にアラインメントマスクが配置され、前記基板昇降ピン上に基板が配置された状態で、
    　前記ピン支持部材を上昇させて前記マスク昇降ピンを上昇させ、前記マスク昇降ピン上の前記アラインメントマスクを前記枠体に当接させ、
    　前記基板昇降ピンの上端を横方向に移動させて、前記基板昇降ピン上の前記基板を移動させ、前記アラインメントマスクと前記基板とを位置合わせする、
    　基板とアラインメントマスクとの位置合わせ方法。     A method for aligning a substrate and an alignment mask using the vacuum processing apparatus according to claim 3,
    The mask lifting pins and the substrate lifting pins ride on the pin support member, an alignment mask is disposed on the mask lifting pins, and a substrate is disposed on the substrate lifting pins,
    Raising the pin support member to raise the mask raising and lowering pins, bringing the alignment mask on the mask raising and lowering pins into contact with the frame,
    Moving the upper end of the substrate lifting pins laterally, moving the substrate on the substrate lifting pins, and aligning the alignment mask and the substrate;
    Method for aligning the substrate and alignment mask.
  12. 　請求項１１記載の基板とアラインメントマスクとの位置合わせ方法によって前記基板と前記アラインメントマスクとが位置合わせされた状態を維持しながら、前記プレートを上昇させて前記プレートの表面を前記基板の裏面に接触させ、前記基板を前記基板昇降ピンから前記プレート上に移載させ、前記基板昇降ピンを前記ピン支持部材から持ち上げて前記プレートに吊り下げ、
    　前記プレートを上昇させて前記プレート上の前記基板の表面を前記アラインメントマスクの裏面に接触させ、前記アラインメントマスクを前記マスク昇降ピンから前記基板上に移載させ、前記マスク昇降ピンを前記ピン支持部材から持ち上げて前記プレートに吊り下げ、
    　前記アラインメントマスクの上方から薄膜形成用の材料ガスを散布して、前記アラインメントマスクの開口部から露出した前記基板の表面に薄膜を成膜する成膜方法。     The surface of the plate is brought into contact with the back surface of the substrate while maintaining the state where the substrate and the alignment mask are aligned by the alignment method of the substrate and the alignment mask according to claim 11. The substrate is transferred from the substrate lifting pins onto the plate, the substrate lifting pins are lifted from the pin support member and suspended from the plate,
    The plate is raised to bring the surface of the substrate on the plate into contact with the back surface of the alignment mask, the alignment mask is transferred from the mask lift pins to the substrate, and the mask lift pins are moved to the pin support member. Lift it from and hang it on the plate,
    A film forming method for forming a thin film on the surface of the substrate exposed from an opening of the alignment mask by spraying a material gas for forming a thin film from above the alignment mask.
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