JP2002246435A - Substrate processor and substrate-processing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate processor whose installation area is small and whose incorporation to a manufacture line is easy. SOLUTION: A substrate carry-in process for carrying in an erected substrate into a prescribed environment, a substrate moving process for moving the erected substrate upward or downward in the prescribed environment, a substrate processing process for processing the substrate during the substrate moving process and a substrate carry-out process for carrying out the erected substrate form within the prescribed environment are disposed, instead of the substrate processing method for processing a conventional substrate in the prescribed environment.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for processing a substrate (for example, a liquid crystal substrate or a semiconductor substrate) in a predetermined environment (for example, a vacuum environment or an inert gas atmosphere environment).
The present invention relates to a substrate processing apparatus that performs a surface treatment such as a film forming process and an etching process or a heat treatment. More specifically, the present invention relates to a substrate processing apparatus characterized by a method of transporting a substrate.

[0002]

2. Description of the Related Art In a production line for semiconductors, liquid crystals, etc., a substrate processing apparatus for performing a surface treatment or the like on a semiconductor substrate, a liquid crystal substrate, or the like is used. Generally, processing of a substrate is performed in a special atmosphere. For example, in order to perform a surface treatment of a substrate in a vacuum environment or a special gas atmosphere, a small space that can be closed and has a gate valve that can be opened and closed is used.
A procedure for processing a substrate using this small space will be described. First, the gate valve is opened and the substrate is carried into the processing chamber. Next, the gate valve is closed to shut off the processing chamber from the outside. The inside of the processing chamber is evacuated by a vacuum pump to evacuate the inside. Next, the substrate is processed. When the surface treatment is completed, the gate valve is opened and the substrate is taken out. When the substrate surface treatment apparatus is used as a part of a production line, a carry-in gate valve and a carry-out gate valve may be provided. Further, since it takes time to make the processing chamber a special environment, load lock chambers for loading and unloading may be provided before and after the processing chamber in order to improve the throughput of the processing apparatus.

[0003] The structure of a conventional substrate processing apparatus will be described using a sputter processing apparatus as an example. Conventional substrate surface treatment equipment includes a charging chamber, a heating chamber (processing chamber), and a sputtering chamber (processing chamber).
And a take-out chamber. A heating source is provided in the heating chamber. A sputtering apparatus is provided in the sputtering chamber. In accordance with the processing procedure, a charging chamber, a heating chamber, a sputtering chamber, and a take-out chamber are arranged in this order, and a gate valve is provided between the front and rear of the processing apparatus and between the respective chambers. For convenience of explanation, they are referred to as a first gate valve, a second gate valve, a third gate valve, a fourth gate valve, and a fifth gate valve according to the processing procedure. Each room is provided with a transfer mechanism for transferring a substrate. An evacuation line communicates with each chamber, and an argon gas supply line communicates with the sputter chamber and the extraction chamber.

[0004] Next, the operation of the conventional sputtering apparatus will be described.
A description will be given in accordance with the processing procedure. At first, all gate valves are closed and the brewing room is filled with air at atmospheric pressure,
The heating chamber, the sputtering chamber and the take-out chamber are evacuated.
A substrate is supported on the substrate holder. The first gate bubble is opened, and the substrate supported by the substrate holder is carried into the preparation chamber. Close the first gate valve and exhaust the air in the charging chamber. When the preparation chamber reaches a predetermined vacuum, the second gate valve is opened and the substrate is moved to the heating chamber. The second gate valve is closed, and the substrate is heated by the heating source. When the substrate reaches a predetermined temperature, the third gate valve is opened, and the substrate is moved to the sputtering chamber. The third gate valve is closed, and argon gas is introduced into the sputtering chamber. When the argon gas concentration reaches a predetermined value, the sputtering device is driven to form a predetermined film on the substrate. When the sputtering is completed, the argon gas in the sputtering chamber is exhausted, the fourth gate valve is opened, and the substrate is moved to the extraction chamber. Close the fourth gate valve and introduce air into the extraction chamber. When the unloading chamber is at atmospheric pressure, the fifth gate valve is opened and the substrate is unloaded. Close the fifth gate valve and exhaust the air in the extraction chamber. Thereafter, the substrate is processed sequentially and repeatedly from the first procedure.

In a conventional substrate processing apparatus, necessary rooms are connected in a horizontal series in the order of processing. In this type of substrate processing apparatus, as the number of processing procedures increases, the number of rooms connected in series increases, and the length of the substrate surface processing apparatus increases. In general, since these substrate surface treatment apparatuses are accommodated in a clean room, it is desirable to shorten the overall length of the apparatus incorporated in the production line in order to shorten the length of the production line.

Therefore, a structure and a method for shortening the overall length of the substrate processing apparatus have been studied. FIG. 5 shows a plan view and a side view of a conventional substrate processing apparatus 100. JP-A-08-196
No. 894 discloses that the substrate 10 can be transported while being supported so that the surface of the substrate 10 is vertical.
5 are folded vertically and stacked, and the loading chamber 103 is
No. 03 is disclosed. It is believed that the overall length of the device of this structure can be shorter than the overall length of the device of the conventional structure in which the rooms are connected in horizontal series.

[0007]

As described above, in the conventional substrate processing apparatus, as the number of substrate processing procedures increases, the overall length of the substrate processing apparatus increases, and a large installation area is required. There was a problem. Also,
Incorporating the substrate surface treatment equipment into the production line requires connection between the equipment in the previous process and the equipment in the post-process of the substrate processing equipment. In addition, there is a problem that an adjusting device for adjusting the height position, the horizontal position, and the left / right position is separately required, and the installation area of the manufacturing line is further increased. In addition, when processing is performed with the substrate kept horizontal, the substrate is bent by the influence of gravity, which has a problem of adversely affecting the characteristics of processing performance.

The present invention has been devised in view of the above-mentioned problems. Instead of a conventional substrate processing apparatus, the present invention has a small installation area or is easy to incorporate into a production line, and has a good processing performance on a substrate. An object of the present invention is to provide a substrate processing apparatus capable of performing the above.

[0009]

In order to achieve the above object, a substrate processing method for processing a substrate in a predetermined environment according to the present invention includes a substrate loading step of loading an upright substrate into a predetermined environment; A substrate moving step of moving the substrate up or down in a predetermined environment, a substrate processing step of processing the substrate during the substrate moving step, and a substrate unloading step of unloading the erected substrate from the predetermined environment; did.

According to the configuration of the present invention, the substrate in which the substrate carrying-in step is erected is carried into a predetermined environment, so that the substrate is hardly affected by gravity. Since the substrate in which the substrate moving step has been set up is moved up or down in a predetermined environment, the substrate is less likely to be affected by gravity, and the installation area required for moving the substrate up and down in the predetermined environment can be reduced. Since the substrate processing process processes the substrate during the substrate moving process, the processing of the substrate can be performed during the moving process. Since the substrate on which the substrate unloading step is set up is unloaded from the predetermined environment, the substrate is hardly affected by gravity.

Further, in the substrate processing method according to the present invention, the substrate moving step includes a first substrate moving step and a second substrate moving step, and the substrate on which the first substrate moving step is erected is placed in a predetermined environment. A substrate moving step of moving up or down, wherein the second substrate moving step is a substrate moving step of moving the erected substrate up or down in a predetermined environment, wherein the erected substrate is moved by the first substrate It is provided with a substrate transfer step of transferring from the step to the second substrate transfer step.

According to the configuration of the present invention, the substrate moving step is divided into a first substrate moving step and a second substrate moving step.
Since the substrate in which the substrate transfer step has been erected is transferred from the first substrate transfer step to the second substrate transfer step, it is possible to physically separate the first substrate transfer step and the second substrate transfer step. it can. Since the substrate on which the first substrate moving step has been set up is moved up or down within a predetermined environment, the installation area required for moving the substrate in the first substrate moving step can be reduced. Since the substrate in the second vertical movement step is moved up or down in a predetermined environment, the installation area required for the movement of the substrate in the second substrate movement step can be reduced.

According to the present invention, there is provided a substrate processing apparatus for processing a substrate in a predetermined environment, comprising: a substrate loading mechanism for loading an upright substrate into a predetermined environment; And a substrate processing mechanism for processing the substrate with the substrate mounted on the substrate moving mechanism, and a substrate unloading mechanism for unloading the erected substrate from a predetermined environment.

According to the configuration of the present invention, since the substrate loading mechanism transports the erected substrate into a predetermined environment, the substrate is less affected by gravity. Since the substrate moving mechanism moves the erected substrate up or down in a predetermined environment, the installation area required for moving the substrate up and down in the predetermined environment can be reduced. Since the substrate processing mechanism performs the processing while the substrate is mounted on the substrate moving mechanism, the processing of the substrate can be performed during the mounting on the substrate moving mechanism. Since the substrate unloading mechanism unloads the erected substrate from the predetermined environment, the substrate is less affected by gravity.

Further, in the substrate surface treating apparatus according to the present invention, the substrate moving mechanism has a first substrate moving mechanism and a second substrate moving mechanism, and the substrate on which the first substrate moving mechanism stands can be placed in a predetermined environment. A substrate moving mechanism that moves up or down in the substrate moving mechanism that moves the substrate upright or down in a predetermined environment, wherein the second substrate moving mechanism moves the substrate upright in the first environment. Provided with a substrate transfer mechanism for transferring from the substrate transfer mechanism to the second substrate transfer mechanism

According to the configuration of the present invention, the substrate moving mechanism is divided into a first substrate moving mechanism and a second substrate moving mechanism.
Since the substrate transfer mechanism transfers the erected substrate from the first substrate transfer mechanism to the second substrate transfer mechanism, it is possible to physically separate the first substrate transfer mechanism and the second substrate transfer mechanism. it can. Since the first substrate moving mechanism moves the standing substrate up or down in a predetermined environment, the installation area required for the first substrate moving mechanism can be reduced. Since the second substrate moving mechanism moves the standing substrate up or down in a predetermined environment, the installation area required for the second substrate moving mechanism can be reduced.

[0017]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will be described below with reference to the drawings. In each of the drawings, common portions are denoted by the same reference numerals, and redundant description will be omitted.

The structure of the substrate processing apparatus 20 according to the first embodiment of the present invention will be described. FIG. 1 is a side view of the first embodiment of the present invention. The substrate processing apparatus 20 is an apparatus that performs a substrate processing step 12 (12a, 12b) on a substrate 10 in a predetermined atmosphere 11 (11a, 11b).
The substrate processing apparatus 20 includes a substrate loading mechanism 21, a substrate moving mechanism 22 (22a, 22b), and a substrate processing mechanism 24 (24a,
24b) and a substrate unloading mechanism 23.

The substrate loading mechanism 12 is a mechanism for loading the substrate 10 from outside into the substrate moving mechanism 22 while supporting the substrate 10 in an upright posture. The substrate moving mechanism 22 (22
a, 22b) are mechanisms for moving the substrate 10 upward in a predetermined atmosphere 11 (11a, 11b) while supporting the substrate 10 in an upright posture. The substrate processing mechanism 24 (24a,
24b) is a mechanism for performing a substrate processing step 12 (12a, 12b) on the substrate 10 in a predetermined atmosphere 11 (11a, 11b) with the substrate 10 mounted on the substrate moving mechanism 22. The substrate processing mechanism 24 has a pre-processing mechanism 24a and a post-processing mechanism 24b. For example, if the present apparatus is a sputtering apparatus, the pre-processing mechanism 24a is a mechanism for performing the heating process 12a on the substrate 10 in the vacuum atmosphere 11a, and the post-processing mechanism 24b is a mechanism for performing the sputtering process 12b on the substrate 10 in the vacuum atmosphere 11b. Is a mechanism for applying The substrate unloading mechanism 23 is a mechanism that unloads the substrate 10 from the predetermined atmosphere 11 of the substrate moving mechanism 22 to the outside while supporting the substrate 10 in an upright state.

Next, a description will be given of a substrate surface treatment method performed using the substrate surface treatment apparatus 20 according to the first embodiment.
The substrate 10 stands up and its surface is oriented in the traveling direction for carrying in. (Substrate Loading Step 13) The substrate 10 is loaded into the predetermined atmosphere 11 of the substrate moving mechanism 22 by the substrate loading mechanism 21 in an upright posture. (Substrate moving step 14) The substrate 10 is moved upright by the substrate moving mechanism 22 in a predetermined atmosphere 11 (11a, 1a).
Within 1b), move upward. The substrate moving mechanism 22 has a first substrate moving mechanism 22a and a second substrate moving mechanism 22b. (Substrate processing step 12) The predetermined processing 12 is performed in the predetermined atmosphere 11 (11a, 11b) by the substrate processing mechanism 24.
(12a, 12b) is applied to the substrate 10. For example, if the present method is a sputtering method, the substrate 10 is subjected to the heat treatment 12a in the vacuum atmosphere 11a of the first substrate moving mechanism 22a, and the argon gas atmosphere 1 of the second substrate moving mechanism 22b.
The substrate 10 is subjected to a sputtering process 12b within 1b. (Substrate Unloading Step 15) The substrate unloading mechanism 23 unloads the substrate 10 from the predetermined atmosphere 11 of the second substrate moving mechanism 22b to the outside in a posture in which the substrate 10 stands upright.

The structure of a substrate processing apparatus 30 according to a second embodiment of the present invention will be described. FIG. 2 is a side view of the second embodiment of the present invention. The substrate processing apparatus 30 performs the first predetermined processing 12a in the first predetermined atmosphere 11a.
Is a device that performs a second predetermined process 12b on the substrate 10 in a second predetermined atmosphere 11b after performing the process on the substrate 10. The substrate processing apparatus 30 includes a substrate loading mechanism 31, a first substrate moving mechanism 32a, a first substrate processing mechanism 34a, a substrate transfer / transport mechanism 35, a second substrate moving mechanism 32b, and a second substrate processing mechanism 34b. And a substrate unloading mechanism 33.

The substrate loading mechanism 32 supports the substrate 10 in an upright posture, and externally receives the first substrate moving mechanism 32a.
This is a mechanism for carrying the substrate 10 into the inside. The first substrate moving mechanism 32a is a mechanism that moves the substrate 10 upward in the first predetermined atmosphere 11a while supporting the substrate 10 in an upright posture. The first substrate processing mechanism 34a performs the first predetermined processing 12a in the first predetermined atmosphere 11a while the substrate 10 is mounted on the first substrate moving mechanism 32a.
This is a mechanism applied to 0. The second substrate moving mechanism 32b is a mechanism that moves the substrate 10 downward in the second predetermined atmosphere 11b while supporting the substrate 10 in an upright posture. The second substrate processing mechanism is such that the substrate 10 is
b, the second predetermined processing 12b is performed on the substrate 10 in the second predetermined atmosphere 11b.
For example, if the present apparatus is a sputtering apparatus, the first substrate processing mechanism 32a is a mechanism for performing the heat treatment 12a on the substrate 10 in the vacuum atmosphere 11a, and the second substrate processing mechanism 32a.
b is a mechanism for performing a sputtering process 12b on the substrate 10 in an argon gas atmosphere 11b. The substrate transfer mechanism 35 is a mechanism for transferring the substrate 10 from the first substrate moving mechanism 32a to the second substrate moving mechanism 32b while supporting the substrate 10 in an upright posture. The substrate unloading mechanism 33 is a mechanism that unloads the substrate 10 from inside the second predetermined atmosphere 11b of the second substrate moving mechanism 32b while supporting the substrate 10 in an upright posture.

Next, a substrate processing method performed using the substrate processing apparatus 30 according to the second embodiment will be described. (Substrate Loading Step 13) The substrate 10 is loaded into the first predetermined atmosphere 11 of the first substrate moving mechanism 32 by the substrate loading mechanism 31 in an upright posture. (First substrate moving step 14a) First substrate moving mechanism 32
By a, the substrate 10 is moved upward in a predetermined atmosphere 11 (11a, 11b) with the substrate 10 standing upright. (First Substrate Processing Step 12a) First Substrate Processing Mechanism 34
By a, the first predetermined processing 12b is performed on the substrate 10 in the first predetermined atmosphere 11a in a state where the substrate 10 is mounted on the first substrate moving mechanism 32a. For example, if the present method is a sputtering method, the substrate 10 is placed in a vacuum atmosphere 11a.
Is subjected to a heat treatment 12a. (Substrate Transfer Step 16) The substrate 10 is transferred from the first substrate moving mechanism 32a to the second substrate moving mechanism 32b while supporting the substrate 10 in an upright posture by the substrate transferring mechanism 35. (Second Substrate Processing Step 12b) Second Substrate Processing Mechanism 34
b, the second predetermined processing 12b is performed on the substrate 10 in the second predetermined atmosphere 11b in a state where the substrate 10 is mounted on the second substrate moving mechanism 32b. For example, if the method is a sputtering method, the substrate 10 is subjected to a sputtering process 12b in an argon gas atmosphere 11b. (Second Substrate Moving Step 14b) Second Substrate Moving Mechanism 32
By b, the substrate 10 is moved downward in a predetermined atmosphere 11 (11a, 11b) in an upright posture. (Substrate Unloading Step 15) The substrate 10 is unloaded from the predetermined atmosphere 11b of the second substrate moving mechanism 32b to the outside by the substrate unloading mechanism 33 with the substrate 10 standing upright.

Next, the structure of a substrate processing apparatus 40 according to a third embodiment of the present invention will be described. FIG. 3 is a side view of the third embodiment of the present invention. This substrate processing apparatus 40
In a vacuum atmosphere 11a, the heat treatment 12a is applied to the substrate 10
This is an in-line type sputtering apparatus in which a sputter film forming process 12b is performed on the substrate 10 in an argon atmosphere 11b. The substrate processing apparatus 40 connects another processing apparatus (hereinafter, referred to as a forward processing apparatus 41) in front of the substrate flow, and another processing apparatus (hereinafter, referred to as a backward processing apparatus 42) behind the substrate flow. )). The substrate 10 is supported by the substrate holder 17 in an upright posture.

The substrate processing apparatus 40 includes a substrate loading mechanism 50, a first substrate moving mechanism 60, a first substrate processing mechanism 65, a substrate transferring mechanism 90, a second substrate moving mechanism 70, and a second substrate processing mechanism. 75 and a substrate unloading mechanism 80. The substrate carrying-in mechanism 50 is a mechanism that carries the substrate 10 from the outside into the first substrate moving mechanism 60 while supporting the substrate 10 in an upright posture. The substrate carrying-in chamber 51, the first gate valve 52, and the second The gate valve 53 and the substrate carry-in unit 54 are provided. The substrate loading room 51 is a room whose inside can be maintained in a vacuum environment. The first gate valve 52 is a gate valve that can be opened and closed, and includes the front processing device 41 and the substrate loading chamber 5.
1 is provided at a communication portion with the communication device 1. Second gate valve 53
Is a gate valve that can be opened and closed, and is a substrate loading chamber 51
And the first substrate moving mechanism 60. The substrate loading unit 54 is a machine that can operate in a vacuum environment and transports a substrate, and is provided in the substrate loading chamber 51.

The first substrate moving mechanism 60 is a mechanism for vertically moving the substrate 10 in a first predetermined atmosphere (vacuum atmosphere) 11a while supporting the substrate 10 in an upright posture.
First substrate moving chamber 61, substrate lifting mechanism 62, and substrate lifting table 6
3 and a substrate lifting motor 64. The first substrate moving chamber 61 is a room whose inside can be maintained in a vacuum environment. The substrate elevating mechanism 62 is a mechanism that elevates and lowers the substrate elevating table 63 that supports the substrate, and is provided in the first substrate moving chamber 61.
The substrate lifting table 63 is a mechanism that can hold the substrate folder 17 and is mounted on the substrate lifting mechanism 62. Substrate lifting motor 6
Reference numeral 4 denotes a motor that drives the substrate lifting mechanism 62. The first substrate processing mechanism 65 is a mechanism for performing a first predetermined process (heating process) 12a on the substrate 10 in a first predetermined atmosphere (vacuum atmosphere) 11a. Is provided.

The second substrate moving mechanism 70 is a mechanism for vertically moving the substrate 10 in a second predetermined atmosphere (argon gas atmosphere) 11b while supporting the substrate 10 in an upright posture. The substrate moving chamber 71, the substrate elevating mechanism 72, the substrate elevating table 73, and the substrate elevating motor 74 are provided. The second substrate moving chamber 71 is a room whose inside can be maintained in a vacuum environment or an argon gas atmosphere. Substrate lifting mechanism 72
Is a mechanism for elevating and lowering the substrate elevating table 73 that supports the substrate, and is provided in the second substrate moving chamber 71. The substrate lifting table 73 is a mechanism that can hold the substrate folder 17 and is mounted on the substrate lifting mechanism 72. The substrate lifting motor 74 is a motor that drives the substrate lifting mechanism 72. The second substrate processing mechanism 75 includes a second predetermined processing (sputtering processing) 12 in a first predetermined atmosphere (argon gas atmosphere) 11b.
b is applied to the substrate 10, and the second substrate moving chamber 71
Provided within.

The substrate transfer mechanism 90 holds the substrate 10 in an upright posture while holding the substrate 10 in the first substrate movement mechanism 60.
This is a mechanism for transferring the substrate from the first to the second substrate moving mechanism 70, the substrate transfer chamber 91, the third gate valve 92, the fourth gate valve 93, the substrate transfer cylinder 94, the substrate transfer cylinder moving screw 95, the substrate transfer It has a mounting motor 96, a substrate folder gripping hand 97, a substrate transfer cylinder table 98, and a substrate transfer cylinder table rail 99. The substrate transfer chamber 91 is a room whose interior can be maintained in a vacuum environment or an argon gas environment,
The first substrate moving chamber 61 and the second substrate moving chamber 71 communicate with each other. The third gate valve 92 is an openable and closable gate valve, and is provided at a communication portion between the first substrate transfer chamber 61 and the substrate transfer chamber 91. The fourth gate valve 93 is a gate valve that can be opened and closed, and is provided at a communication portion between the second substrate transfer chamber 71 and the substrate transfer chamber 91.

The substrate transfer cylinder base rail 99 is a rail for horizontal and linear movement, and is provided above the substrate transfer chamber 91. The substrate transfer cylinder table 98 is provided with the substrate transfer cylinder 94.
Is mounted on the board transfer cylinder base rail 99 so as to be able to move directly. The substrate transfer cylinder moving screw 95 is a feed screw, and the substrate transfer cylinder table 98
It is fitted with the nut fixed to the. Substrate transfer motor 9
Reference numeral 6 denotes a rotary motor, and a substrate transfer cylinder moving screw 9
5 is driven. Substrate transfer cylinder 9
Reference numeral 4 denotes a linear actuator, which is provided on a substrate transfer cylinder table 98 with a telescopic rod inserted into the substrate transfer chamber 91. The penetrating portion of the telescopic rod into the substrate transfer chamber 91 is sealed. Board folder gripping hand 9
Reference numeral 7 denotes a hand that grips the substrate folder 17 and is rotatable in a horizontal plane, and is fixed to the distal end of an extendable rod of the substrate transfer cylinder 94. Therefore, the substrate transfer mechanism 90 can rotate the substrate transfer motor 96 to move the substrate transfer cylinder 94 in the horizontal front-rear direction. Further, the substrate transfer mechanism 90 includes:
While holding the substrate folder 17 with the substrate folder gripping hand 97, the telescopic rod of the substrate transfer cylinder 94 can be extended and retracted to move the substrate folder 17 supporting the substrate 10 up and down, and furthermore, can rotate in a horizontal plane.

The substrate unloading mechanism 80 is a mechanism that unloads the substrate 10 from the second substrate moving mechanism 70 to the rear processing unit 42 while supporting the substrate 10 in an upright posture. It has a gate valve 82, a sixth gate valve 83, and a substrate transport unit 84. Substrate unloading room 8
1 is a room whose interior can be maintained in a vacuum environment. The fifth gate valve 82 is a gate valve that can be opened and closed, and is provided at a communication portion between the second substrate processing chamber 61 and the substrate unloading chamber 51. The sixth gate valve 53 is a gate valve that can be opened and closed, and is provided at a communication portion between the second substrate processing chamber 71 and the rear processing device 42. The substrate transport unit 84 is a mechanism that transports a substrate that can operate in a vacuum environment, and is provided in the substrate unloading chamber 81.

Next, a description will be given of a substrate surface processing method performed by using the substrate surface processing apparatus 40 according to the third embodiment. (Step A: Substrate Loading Step 13) First, the substrate 10 is set in the substrate folder 17 in an upright state. The first gate valve 52 is opened, and the substrate loading unit 54
The substrate folder 17 is transferred to the substrate loading chamber 51, and the first gate valve 52 is closed. The air in the substrate loading chamber 51 is exhausted. When the inside of the substrate loading chamber 51 reaches a predetermined vacuum environment, the second gate valve 53 is opened, and the substrate loading unit 54 transports the substrate folder 17 to the first substrate processing chamber 61, and moves the substrate folder 17 to the substrate lifting table 63. The substrate folder 17 is set. When the substrate lifting table 63 supports the substrate folder 17, the substrate loading unit 54 is drawn into the substrate loading chamber 51, and the second gate valve 53 is closed. (Step B: First Substrate Moving Step 14a) The substrate lifting motor 64 is driven to move the substrate lifting table 63 upward. When the substrate 10 moves to a predetermined position, the substrate lifting motor 64
To stop. (Step C: First Substrate Processing Step 12a) After confirming that the environment in the first substrate processing chamber 65 has a predetermined vacuum environment, the substrate 10 is subjected to a heat treatment. When the temperature of the substrate 10 reaches a predetermined temperature, the heating is stopped.

(Step D: Substrate Transfer Step 16a) The third gate valve 92 is opened, the extendable rod of the substrate transfer cylinder 94 is extended, and the substrate folder 17 is gripped by the substrate folder gripping hand 97. The telescopic rod is contracted, and the substrate folder 17 supporting the substrate 10 is stored in the substrate transfer chamber 91. The third gate valve 92 is closed, the substrate transfer motor 96 is rotated, and the substrate transfer cylinder 94 is moved to the upper portion of the second substrate lifting mechanism 72 and stopped. (E step: substrate transfer step 16b) Argon gas is introduced into the substrate transfer chamber 91. When the argon gas concentration in the substrate transfer chamber 91 reaches a predetermined concentration, the fourth gate valve 93
To release. The telescopic rod of the substrate transfer cylinder 94 is extended, and the substrate folder 17 is placed on the substrate lift 73 in the second substrate moving mechanism chamber 71. When the substrate elevating table 73 grips the substrate folder 17, the grip of the substrate folder gripping hand 97 is released, and the telescopic rod is contracted. After retracting the telescopic rod, the fourth gate valve 93 is closed.

(F step: second substrate processing step 12b) When the internal environment of the second substrate transfer chamber 71 reaches a predetermined argon gas concentration, the second substrate processing mechanism 75 performs the second predetermined processing ( (Sputtering process) 12 b is applied to the substrate 10. (Step G: second substrate moving step 14b) The substrate lifting motor 74 is driven to move the substrate lifting table 73 downward. When the substrate 10 moves to a predetermined position, the substrate lifting motor 64
To stop. (Step H: Substrate Unloading Step 15) Argon gas is introduced into the substrate unloading chamber 84. When the environment in the substrate unloading chamber 84 becomes a predetermined argon gas atmosphere, the fifth gate valve 8
2 is opened, the substrate unloading unit 84 transfers the substrate folder 17 to the substrate unloading chamber 81, and the fifth gate valve 82 is closed. The argon gas in the substrate loading chamber 51 is exhausted. When the inside of the substrate unloading chamber 81 reaches a predetermined environment,
The sixth gate valve 83 is opened, and the substrate unloading unit 8 is opened.
By 4, the substrate folder 17 is transported to the rear processing device. When the substrate unloading unit 84 is stored in the substrate unloading chamber 84, the second gate valve 53 is closed.

When the substrate processing method of the first embodiment is used, the substrate can be processed with a smaller installation area than the conventional one, and when the substrate processing apparatus of the first embodiment is adopted, the installation processing is smaller than the conventional one. It can be integrated into a production line in area. By using the substrate processing method of the second embodiment described above, a substrate can be processed with a smaller installation area than before, and by employing the substrate processing apparatus of the second embodiment, manufacturing can be performed with a smaller installation area than before. Can be incorporated into the line.
Furthermore, when incorporating into the production line, the adjustment of the outlet height of the upstream processing line and the entrance height of the substrate processing apparatus and the adjustment of the entrance height of the downstream processing line and the exit height of the substrate processing apparatus can be performed separately. There is no need for a separate additional adjustment device, and the production line can be shortened. If the sputtering apparatus according to the third embodiment described above is used, the substrate can be sputtered with a smaller installation area than before, and if the sputtering apparatus according to the third embodiment is used, manufacturing can be performed with a smaller installation area than before. Can be incorporated into the line. Furthermore, when incorporating into the production line, the adjustment of the outlet height of the upstream processing line and the entrance height of the substrate processing apparatus and the adjustment of the entrance height of the downstream processing line and the exit height of the substrate processing apparatus can be performed separately. There is no need for a separate additional adjustment device, and the production line can be shortened. Further, since the substrate is handled in an upright posture, the substrate can be easily supported. Further, since the substrate is not affected by gravity, the substrate is not easily bent, and the substrate can be satisfactorily processed. Further, since the substrate is transported up and down in an upright posture, the substrate is not affected by the vertical acceleration, and the substrate can be easily supported. The above effect is the greatest when the substrate is erected vertically.

The present invention is not limited to the embodiment described above, and various changes can be made without departing from the gist of the invention. As an embodiment of the present invention, the direction of the surface of the substrate that has been erected is described as a direction orthogonal to the horizontal movement direction, but is not limited to this. That is, the direction of the surface of the substrate that is erected may be the horizontal movement direction or may be inclined. Further, the third embodiment has been described by taking a sputtering apparatus as an example. However, the present invention is not limited to this, and may be applied to other film forming apparatuses, surface treatment apparatuses such as etching apparatuses, heat treatment apparatuses, and the like.

[0036]

As described above, the substrate processing method of the present invention for processing a substrate under a predetermined environment has the following effects depending on its configuration. The substrate is not easily affected by gravity, and the installation area required for the vertical movement of the substrate in a predetermined environment is small, and the substrate can be processed during the moving process. Can be performed with a small installation area. Further, the first substrate moving step and the second substrate moving step can be physically separated, and the installation area required for moving the substrate in the first substrate moving step can be reduced, and the second Since the installation area required for moving the substrate in the substrate moving step is small, the processing of the substrate which is not affected by gravity can be performed with a small area, and the first substrate processing step and the second substrate processing step can be performed. Can be performed separately. Further, the substrate processing apparatus for processing a substrate in a predetermined environment according to the present invention has the following effects due to its configuration. The substrate is less susceptible to gravity, requiring less installation area to move the substrate up and down in a given environment. It is possible to produce an apparatus capable of performing processing of a substrate that does not require a small installation area. Furthermore, the first substrate moving mechanism and the second substrate moving mechanism can be physically separated, so that the installation area required for the first substrate moving mechanism is small, and the second substrate moving mechanism is required. The substrate processing apparatus having a structure in which the first substrate processing mechanism and the second substrate processing mechanism are separated can perform the processing of the substrate which is not affected by gravity with a small installation area. Obtainable. Therefore, it is possible to provide a substrate processing apparatus which has a small installation area or can be easily incorporated into a production line, and can perform favorable processing on a substrate.

[0037]

[Brief description of the drawings]

FIG. 1 is a side view of a first embodiment of the present invention.

FIG. 2 is a side view of a second embodiment of the present invention.

FIG. 3 is a side sectional view of a third embodiment of the present invention.

FIG. 4 is a flowchart of a third embodiment of the present invention.

FIG. 5 is a plan view and a side view of a conventional device.

[Explanation of symbols]

 Reference Signs List 10 substrate 11 atmosphere 11a first predetermined atmosphere 11b second predetermined atmosphere 12 substrate processing step 12a first substrate processing step 12b second substrate processing step 13 substrate loading step 14 substrate moving step 14a first substrate moving Step 14b Second substrate moving step 15 Substrate unloading step 16 Substrate transferring step 17 Substrate folder 20 Substrate processing apparatus 21 Substrate loading mechanism 22 Substrate moving mechanism 22a First substrate moving mechanism 22b Second substrate moving mechanism 23 Substrate unloading mechanism 24a first substrate processing mechanism 24b second substrate processing mechanism 30 substrate processing apparatus 31 substrate loading mechanism 31 32 substrate moving mechanism 32a first substrate moving mechanism 32b second substrate moving mechanism 33 substrate unloading mechanism 34 substrate processing mechanism 34a First substrate processing mechanism 34b Second substrate processing mechanism 40 Substrate processing apparatus 50 Substrate Loading mechanism 51 Substrate loading chamber 52 First gate valve 53 Second gate valve 54 Substrate loading unit 60 First substrate moving mechanism 61 First substrate moving chamber 62 Substrate officer mechanism 63 Substrate lift 64 Substrate lifting motor 65 One substrate processing mechanism 70 Second substrate moving mechanism 71 Second substrate moving chamber 72 Substrate officer mechanism 73 Substrate elevating table 74 Substrate elevating motor 75 Second substrate processing mechanism 76 Sputter target 80 Substrate unloading mechanism 81 Substrate unloading chamber 82 Fifth gate valve 83 Sixth gate valve 84 Substrate unloading unit 90 Substrate transfer mechanism 91 Substrate transfer chamber 92 Third gate valve 93 Fourth gate valve 94 Substrate transfer cylinder 95 Substrate transfer cylinder moving screw 96 Substrate transfer motor 97 Substrate holder gripping hand 98 Substrate transfer cylinder table 99 Substrate transfer Rail 100 conventional substrate processing apparatus 101 supplying apparatus 102 gate valve 103 front chamber 104 gate valve 105 the chamber 106 processor 107 processor

──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) H01L 21/3065 H01L 21/31 B 21/306 21/302 B 21/31 PF term (Reference) 4K029 AA24 BD01 KA01 KA09 4K030 CA04 CA12 GA12 5F004 AA16 BA01 BA19 BB19 BC05 BC06 5F031 CA02 CA05 FA01 FA02 FA07 FA12 FA18 GA12 GA48 MA02 MA29 MA32 NA04 NA05 NA09 PA13 5F045 AA03 DP20 DQ06 EN04

Claims (4)

[Claims] 1. A substrate processing method for processing a substrate in a predetermined environment, comprising: a substrate loading step of loading an upright substrate into a predetermined environment; and a substrate moving the upright substrate up or down in a predetermined environment. A substrate processing method comprising: a moving step; a substrate processing step of processing a substrate during the substrate moving step; and a substrate unloading step of unloading an upright substrate from a predetermined environment. 2. The method according to claim 1, wherein the substrate moving step includes a first substrate moving step and a second substrate moving step, and moves the substrate on which the first substrate moving step stands up or down in a predetermined environment. A substrate moving step, in which the second substrate moving step is a substrate moving step of moving the erected substrate up or down in a predetermined environment, wherein the erected substrate is moved from the first substrate moving step to the second substrate 2. The substrate processing method according to claim 1, further comprising a substrate transfer step of transferring to the moving step. 3. A substrate processing apparatus for processing a substrate in a predetermined environment, comprising: a substrate loading mechanism for loading an upright substrate into a predetermined environment; and a substrate moving the upright substrate up or down in the predetermined environment. A substrate processing apparatus comprising: a moving mechanism; a substrate processing mechanism that processes a substrate mounted on the substrate moving mechanism; and a substrate unloading mechanism that unloads an upright substrate from a predetermined environment. Further, the substrate moving mechanism has a first substrate moving mechanism and a second substrate moving mechanism, and the first substrate moving mechanism moves the standing substrate up or down in a predetermined environment. A substrate moving mechanism, wherein the substrate on which the second substrate moving mechanism stands up or down in a predetermined environment is a substrate moving mechanism, and the standing substrate is moved from the first substrate moving mechanism to the second substrate moving mechanism. The substrate processing apparatus according to claim 3, further comprising a substrate transfer mechanism that transfers the substrate.