TW201319323A - Fabricating method of transfer printing mold, transfer printing mold fabricated with the same, and components fabricated with the transfer printing mold - Google Patents

Abstract

A transfer printing mold and components fabricated with the transfer printing mold are provided. The transfer printing mold is used for forming the components by an electroforming method, and the transfer printing mold is durable and has an aspect ratio. The invention includes: forming a photo-resist pattern in a shape of the component on a metal substrate 10, the photo-resist pattern in the shape of the component having an expected aspect ratio, a sidewall of the photo-resist pattern in the shape of the component having an expected angle α ; completely covering the photo-resist pattern in the shape of the component by using the electroforming method up to a predetermined thickness in order to fabricate a transfer printing mold; and separating the transfer printing mold and the metal substrate to fabricate a master mold 20.

Description

Manufacturing method of transfer mold, transfer mold manufactured by the method, and parts manufactured by using the transfer mold

The present invention relates to a method of manufacturing a transfer mold, a transfer mold manufactured by the method, and a part manufactured using the transfer mold. More specifically, the present invention relates to an electroforming (electroforming) The method for producing a transfer mold for forming a part, the transfer mold manufactured by the method for producing the transfer mold, and the parts manufactured by the transfer mold, the transfer mold is durable, and an aspect ratio can be obtained (aspect) Ratio) and using electroforming.

The electroforming method is limited in area and can form a thick film conductor. Therefore, the electroforming method is widely used for display parts such as display characters or hands of watches; small gears, springs, and tubes ( Mechanical parts such as pipe), diagram (sensor), and electronic parts such as wiring and coil of a semiconductor device.

Patent Document 1 discloses that when a cavity insert is manufactured, a cutting master is first formed, and the cutting masterbatch is previously formed with a fine pattern, followed by hot pressing. A hot press forms a transfer master from the cutting masterbatch, and then a cavity insert is formed from the transfer masterbatch by electroforming.

Patent Document 2 discloses that the surface plate is formed by the step of forming a mask pattern having an opening on the surface of a silicon wafer, and performing anisotropic etching ( a step of forming a common electrode film, a step of forming an electroformed film grown from the common electrode film, a step of etching the germanium wafer, and forming the electroformed film as a transfer mask The step of the resin-made dial plate.

6a and 6b are structural views of parts formed by a conventional transfer mold. In FIG. 6a, in order to form the part 95, a pattern of a part shape is formed on the metal substrate 90 by photowork in the photoresist 30. The metal substrate 90 on which the resist pattern is formed is used as a transfer mold, and a predetermined metal (Ag, Cu, Ni, or the like) is plated by electroforming (hereinafter referred to as electroforming) to form a part 95. .

In FIG. 6b, the part 95 formed by electroforming is transferred to the part substrate 97 via the adhesive 85. In this manner, a part of an arbitrary shape corresponding to the use is formed by electroforming, and the part is transplanted to the part substrate 97 for use.

In the above case, in order to facilitate peeling of the part 95 and subsequent grafting, the angle β of the side wall of the photoresist 30 is set to a gentle angle of less than 45°. Further, when an electronic component such as a wiring or a coil formed on a semiconductor substrate is produced, in order to reduce the electric resistance, it is necessary to make the thickness of the wire larger than the line width. Generally, the photoresist 30 needs a thickness of about 10 μm.

Since the part 95 is formed in a buried state by electroforming along the side wall of the photoresist 30 of about 10 μm, when the size of the wiring pattern or the inductive coil or the like is long, the contact area of the side walls of each other It will increase, and the peeling resistance during the peeling process at the time of transplantation will increase. As described above, when the following transfer mold is used, there is a problem that the peeling force which is increased in accordance with the increased peeling resistance is increased in order to be transferred to the component substrate 97, and therefore, it is adhered to the metal substrate. The edge of the photoresist pattern of the photoresist 30 of 90 is easily peeled off, and after 2 to 3 times, the photoresist is peeled off, resulting in the transfer mold being unusable, and the transfer mold uses a patterned photoresist.

Prior technical literature

Patent literature

Patent Document 1: Japanese Patent Laid-Open Publication No. 2004-1535

Patent Document 2: Japanese Patent Laid-Open Publication No. 2004-257861

The present invention has been made to solve the above problems, and an object of the present invention is to provide a transfer mold for forming a part by electroforming, and a part manufactured by the transfer mold It is durable and has an aspect ratio. Further, the transfer mold includes four types of a master mold, a mother mold, a sub-mold, and a transfer mold. Masterbatch molds are the basis for the manufacture of parts and are not usually used directly to make parts. The master mold is a mold manufactured by using a masterbatch mold to invert the unevenness of the master batch mold. The master mold is also not directly used to make parts. The sub-mold is a mold manufactured by using a mother mold to invert the unevenness of the mother mold. Therefore, the shape of the sub-mold is the same as that of the master mold. Usually, the sub-mold is subjected to an insulating layer treatment, a peeling layer treatment, or the like to manufacture a transfer mold, and then the transfer mold is used to manufacture the parts. When the transfer mold is worn, the master mold is again passed through the mother mold and the sub-mold. And make a new transfer mold.

A method of manufacturing a transfer mold according to the present invention includes the step of forming a resist pattern of a part shape on a metal substrate, the resist pattern of the part shape having a desired aspect ratio, and a sidewall of the resist pattern of the part shape having a desired angle α; a step of completely filling a photoresist pattern of a part shape by electroforming until a predetermined thickness is reached to manufacture a transfer mold; and moving the transfer mold away from the metal substrate to manufacture a master batch The steps of the mold.

A method of manufacturing a transfer mold according to the present invention includes the step of forming a resist pattern of a part shape on a metal substrate, the resist pattern of the part shape having a desired aspect ratio, and a sidewall of the resist pattern of the part shape having a desired angle α; a step of completely filling a photoresist pattern of a part shape by electroforming until a predetermined thickness is reached to manufacture a transfer mold; and moving the transfer mold away from the metal substrate to manufacture a master batch mold a step of transferring a sub-mold from a master mold through a master mold; and a step of performing a peeling layer treatment and an insulating layer treatment on the sub-mold to manufacture a transfer mold, the peeling layer treatment being formed by electroforming The parts are easily peeled off, and the insulating layer is treated at a portion other than the formed portion of the part to form an insulating layer.

The method for producing a transfer mold of the present invention includes the step of initially forming a roughened layer on the surface of the metal substrate.

A method of manufacturing a transfer mold according to the present invention includes the step of forming a resist pattern of a part shape on a metal substrate, the resist pattern of the part shape having a desired aspect ratio, and a sidewall of the resist pattern of the part shape having An angle of approximately 90°; a step of completely filling a photoresist pattern of a part shape by electroforming until a predetermined thickness is reached to manufacture a transfer mold; a step of moving the transfer mold away from the metal substrate; and performing light The step of resisting processing causes the photoresist pattern layer to remain on the portion of the transfer mold that has left the portion other than the transferred part; and the angle of the side wall of the part shape is approximately 90° to less than 90 The step of manufacturing a master batch mold by using a photoresist pattern layer as a protective layer and performing beam processing at an arbitrary angle of °.

A method of manufacturing a transfer mold according to the invention of the present application includes the step of forming a photoresist pattern of a part shape on a metal substrate, the photoresist pattern of the part shape having a desired aspect ratio, and the photoresist pattern of the part shape The side wall has an angle of substantially 90°; a step of completely filling the photoresist pattern of the part shape by electroforming until a predetermined thickness is reached to manufacture a transfer mold; and a step of moving the transfer mold away from the metal substrate; Performing a step of photoresist processing such that the photoresist pattern layer remains on a portion of the transfer mold that has left the portion other than the transferred part; so that the angle of the side wall of the part shape is approximately 90° to insufficient a step of manufacturing a master mold by using a photoresist pattern layer as a protective layer and performing beam processing to form a master mold; and transferring the sub-mold from the master mold through the master mold; And a step of performing a peeling layer treatment and an insulating layer treatment on the sub-mold to manufacture a transfer mold, wherein the peeling layer treatment makes the parts formed by electroforming easy to peel off, Portion of the insulating layer forming process other than some parts of the insulating layer is formed.

The method for producing a transfer mold of the present invention includes the step of initially forming a roughened layer on the surface of the metal substrate.

The masterbatch mold of the present invention is produced by the above-described method for producing a transfer mold having a cross section having a desired aspect ratio and an angle of a side wall of the master batch mold of 45 to 88.

In the transfer mold of the present invention, only the sub-mold manufactured using the master batch mold is subjected to an insulating layer treatment; or the insulating layer treatment and the release layer treatment are performed to manufacture the transfer mold.

A part manufactured by electroforming in the present invention is a part which is transferred by electroforming using the above transfer mold.

(Effect of the invention)

According to the present invention, it is possible to provide a part that is electroformed, which is durable and has an aspect ratio in the manufacturing process of electroformed display parts, machine parts, and electronic parts.

Example

The mode of the first embodiment of the present invention will be described with reference to the drawings. 1a to 1e are views showing a manufacturing step of a master batch mold by electroforming according to the present invention. In Fig. 1a, the upper surface of the metal substrate 10 has a roughening layer 15 for making the contact surface of the master batch mold formed by electroforming a rough surface. The roughened surface 15 can be formed by directly roughening the surface of the metal substrate 10 by hydrochloric acid treatment or the like. Further, as the roughened layer 15, a light pattern layer suitable for roughening such as a stripe or a lattice may be formed by photoprocessing. Further, when an insulating layer or the like is formed on the sub-mold 60 to be described later in FIGS. 3a to 3c, the roughened layer 15 may be omitted if there is no problem in the adhesion strength between the sub-molds 60.

In Fig. 1b, in order to have the desired aspect ratio of the part shape, and in order to obtain the shape of the part having the desired angle α of the side wall, the photoresist for patterning the above part is patterned at a predetermined thickness. The agent 30 is coated on the roughened layer 15 of the metal substrate 10. For example, in the case of a wiring or a coil of a semiconductor electronic component, in order to obtain a thickness of 10 μm with respect to a line width of, for example, 5 μm, the photoresist 30 is coated on the metal substrate 10 with a thickness of 10 μm. Rough surface layer 15. Next, exposure is performed from the direction of the arrow through a photo mask 40 having a pattern of desired parts. Figure 1c shows a photoresist pattern that is a pattern developed by the patterning of the exposed features of Figure 1b. The angle α of both side walls of the photoresist pattern of the component can be arbitrarily determined according to the material of the photoresist 30 applied in FIG. 1b, the film thickness, and the exposure conditions when the mask 40 is irradiated. In the case of using laser light, the illumination intensity of both side walls of the photoresist pattern can also be changed by a 3D lens. Also, a gray mask can be used to change the illumination intensity of both side walls.

In FIG. 1d, a desired metal such as Ni is electroplated to a predetermined thickness to form a master mold 20 by covering the photoresist pattern 30 of FIG. 1c. In Fig. 1e, the masterbatch mold 20 formed by electroforming in Fig. 1d is separated from the metal substrate 10. The rough surface shape of the roughened layer 15 is transferred to the masterbatch mold rough surface layer 17. Further, the angle α of the both side walls is maintained at the angle α shown in Fig. 1d.

The masterbatch mold rough surface layer 17 is transferred to the sub-mold 60 illustrated in FIGS. 3a to 3c which is finally used as a transfer mold for improving the adhesion strength of the insulating layer formed on the sub-mold 60. It is also possible to have no rough surface layer 17 of the masterbatch mold. Further, the angle α is set to a steep angle of 45° to 88°, whereby the pattern density of a desired device can be improved. Further, the thickness of 10 μm of the photoresist 30 in Fig. 1c is maintained by transfer to the inverted masterbatch mold 20.

2a to 2d are manufacturing steps of a master batch mold irradiated with a beam as a second embodiment of the present invention. In Fig. 2a, the angle α of the masterbatch mold 20 produced by the method illustrated in Figs. 1a to 1e is approximately 90°. In Fig. 2b, a photoresist 30 is applied to a predetermined thickness, and the photoresist 30 is used to pattern the reverse pattern of the shape of the part. The exposure is performed from the direction of the arrow through the photomask 40 having the reverse pattern of the parts. Therefore, in the above case, the photoresist of the part portion is removed by development, and the photoresist 30 remains only on the flat master mold rough surface layer 17.

In Fig. 2c, the photoresist pattern formed in Fig. 2b is used as a protective film, and the irradiation beam is adjusted so that the angle α reaches a predetermined angle, and both side walls of the pattern of the part are processed. The arrows indicate the direction of the beam. The processed masterbatch mold 20 of Figure 2d has the same shape as the masterbatch mold 20 of Figure 1d and has the same function and features. The illuminating beam can be an electron beam, an ion beam, or a focused ion beam (Focused Ion Bean, FIB) that changes the intensity of the beam by shrinking the beam by a lens.

3a to 3c are views showing a manufacturing step of the sub-mold of the present invention. In FIG. 3a, a desired metal such as Ni is plated only by a predetermined thickness by electroforming in the part pattern surface of the master mold 20 manufactured in FIGS. 1a to 1e or 2a to 2d. The master mold 50 is formed, and then the master mold 50 is separated. In Fig. 3b, a desired metal such as Ni is plated on the part pattern surface of the master mold 50 by electroforming only with a predetermined thickness, and the sub-mold 60 is formed in the same manner. The sub-mold 60 formed by electroforming in Fig. 3c is removed from the master mold 50.

Thus, the sub-mold 60 is further transferred from the mother mold 50, and the mother mold 50 is a mold obtained by transferring the master mold 50. Therefore, the sub-mold 60 directly inherits the same function as the master mold 20. ,feature. Further, since the sub-mold 60 is integrally formed by the same metal material, the desired peeling layer treatment and the insulating layer treatment are performed on the sub-mold rough surface layer 19 to be described later, whereby the following can be obtained. The transfer mold has a desired aspect ratio and angle α, and is not damaged even if it is used repeatedly, and is mass-produced.

4a to 4f are views showing a manufacturing step of the transfer mold of the present invention. Figure 4a shows the sub-mold 60 made in Figure 3c. In the sub-mold 60 of FIG. 4b, in order to facilitate peeling and transfer of the manufactured component, a peeling layer treatment is performed, that is, heat treatment is performed under predetermined conditions, and a NiOx film 70 having a predetermined film thickness is formed on the surface. Since the NiOx film 70 has electrical conductivity, it does not interfere with electroplating, and since the adhesion between the NiOx film 70 and the electroformed part is weak, it is easy to peel off.

Next, an insulating layer is formed so that plating is not performed on a surface other than the surface on which the component is formed. Therefore, the insulating layer treatment is performed, that is, the SiO ₂ film 80 is chemically formed by Chemical Vapor Deposition (CVD) on the surface, or is physically deposited by a sputtering method. The SiO ₂ film 80 is formed, or polysilazane is applied, and then heat treatment is performed to form the SiO ₂ film 80. In Fig. 4c, in order to remove the SiO ₂ film 80 formed on the pattern of the part, photoresist processing is performed, that is, the photoresist 30 is applied onto the SiO ₂ film 80 at a predetermined thickness. The photomask 40 having the reverse pattern of the component is exposed from the direction of the arrow, and the photoresist 30 is patterned into a predetermined shape. In FIG. 4d, the patterned photoresist 30 is used as a mask to irradiate the beam from the direction of the arrow, physically removing the SiO ₂ film 80, or chemically SiO by hydrofluoric acid or the like. ₂ film 80 is removed.

According to the shape of the patterned photoresist 30 and the removal conditions of the SiO ₂ film 80, as shown in FIG. 4e, both side walls of the SiO ₂ film 80 are left, and only the bottom portion is removed, or as shown in FIG. 4f. The both side walls and the bottom portion of the SiO ₂ film 80 are removed, thereby completing the transfer mold. Further, in the case of using polyazane, after the NiOx film 70 in Fig. 4b is produced by the same procedure as screen printing, then the polyazide is printed to a part pattern other than the part to be formed. The surface of the NiOx film 70 is subjected to heat treatment, whereby the same shape as that of Fig. 4f can be obtained.

As shown in FIG. 4b, the thickness which can maintain conductivity with respect to the thickness surface is 1 ~1000 A metal oxide (AlOx, TiOx, etc.), a nitride, or an organic substance (photoresist) is applied to the sub-mold 60, whereby the release layer treatment is performed. In the insulating layer treatment, an insulator such as a photoresist may be used instead of SiO ₂ . Furthermore, the processing steps of the release layer treatment and the insulation layer treatment may also be reversed.

Next, an electromoulded part manufactured using the transfer mold of the present invention will be described. 5a to 5c are views showing a manufacturing step of a part manufactured by the transfer mold of the present invention. In Fig. 5a, a desired metal (Ag, Cu, Ni, etc.) is electroplated on a transfer mold 60 by electroforming to form a part 95. In FIG. 5b, as in the case of FIG. 6b, the part 95 formed by electroforming is transferred to the part substrate 97 via the adhesive 85, or transplanted by a green sheet 98, and The green sheet 98 is heat treated to harden the green sheet. In the case of transplantation using the green sheet 98, since the green sheet 98 is soft enough to embed the part 95 before hardening, the adhesive 85 is not required. Thus, the part 95 having an arbitrary aspect ratio and angle α is formed by electroforming, and the part 95 is repeatedly grafted to the device substrate 97 or the green sheet 98, so that it can be used for various purposes.

As described above, according to the present invention, it is possible to provide a component in which a display part such as a display character or a pointer of an electroformed watch is used; a small gear, a spring, a tube, and a line diagram (pressure sensor) In the manufacturing process of electronic parts such as wirings and coils of semiconductor devices, it is durable and can obtain an aspect ratio.

10, 90. . . Metal substrate

15. . . Rough surface layer

17. . . Masterbatch mold rough surface

18. . . Master mold rough surface

19. . . Sub-mold rough surface

20. . . Masterbatch mould

30. . . Photoresist, photoresist pattern

40. . . Mask

50. . . Master mold

60. . . Sub-mold

70. . . NiOx film

75. . . Stripping layer

80. . . SiO ₂ film

85. . . Adhesive

95. . . Components

97. . . Part substrate/element substrate

98. . . Raw slice

α, β. . . Side wall angle

1a to 1e are views showing a manufacturing step of a master batch mold by electroforming according to the present invention.

2a to 2d are views showing a manufacturing step of a masterbatch mold by beam processing of the present invention.

3a to 3c are views showing a manufacturing step of the sub-mold of the present invention.

4a to 4f are views showing a manufacturing step of the transfer mold of the present invention.

5a to 5c are views showing a manufacturing step of the component of the present invention.

6a and 6b are structural views of parts formed by a conventional transfer mold.

10. . . Metal substrate

15. . . Rough surface layer

17. . . Masterbatch mold rough surface

20. . . Masterbatch mould

30. . . Photoresist, photoresist pattern

40. . . Mask

α. . . Side wall angle

Claims (9)

A manufacturing method of a transfer mold, comprising: forming a photoresist pattern of a part shape on a metal substrate, wherein the photoresist pattern of the part shape has a desired aspect ratio, and a sidewall of the photoresist pattern of the part shape has a a desired angle α; a step of completely filling a photoresist pattern of the above-described part shape by electrical casting until a predetermined thickness is reached to manufacture a transfer mold; and moving the transfer mold away from the metal substrate to manufacture The step of the masterbatch mold. A manufacturing method of a transfer mold, comprising: forming a photoresist pattern of a part shape on a metal substrate, wherein the photoresist pattern of the part shape has a desired aspect ratio, and a sidewall of the photoresist pattern of the part shape has a a desired angle α; a step of manufacturing a transfer mold by electrically casting the photoresist pattern of the part shape completely until a predetermined thickness is reached; and the transfer mold is separated from the metal substrate to manufacture a mother a step of feeding a mold; a step of transferring a sub-mold from the master mold through a mother mold; and a step of performing a peeling layer treatment and an insulating layer treatment on the sub-mold to manufacture a transfer mold, wherein the peeling layer treatment is performed The above-described components formed by the above-described electroforming are easily peeled off, and the insulating layer is treated to form an insulating layer at a portion other than the portion where the components are formed. The method for producing a transfer mold according to the first or second aspect of the invention, further comprising the step of forming a roughened layer on the surface of the metal substrate. A method for manufacturing a transfer mold, comprising: forming a photoresist pattern of a part shape on a metal substrate, wherein the photoresist pattern of the part shape has a desired aspect ratio, and a sidewall of the photoresist pattern of the part shape has a substantially An angle of 90°; a step of completely filling a photoresist pattern of the above-mentioned part shape by electroforming until a predetermined thickness is reached to manufacture a transfer mold; and a step of separating the transfer mold from the metal substrate; Performing a step of photoresist processing such that the photoresist pattern layer remains on a portion of the transfer mold that has left the portion other than the transferred part; and the angle of the side wall of the shape of the part is approximately 90 The step of manufacturing the master batch mold by using the above-described photoresist pattern layer as a protective layer and performing beam processing at a temperature of less than 90°. A method for manufacturing a transfer mold, comprising: forming a photoresist pattern of a part shape on a metal substrate, wherein the photoresist pattern of the part shape has a desired aspect ratio, and a sidewall of the photoresist pattern of the part shape has a substantially An angle of 90°; a step of completely filling a photoresist pattern of the above-mentioned part shape by electroforming until a predetermined thickness is reached to manufacture a transfer mold; and a step of separating the transfer mold from the metal substrate; Performing a step of photoresist processing such that the photoresist pattern layer remains on a portion of the transfer mold that has left the portion other than the transferred part; so that the angle of the side wall of the shape of the part is substantially 90° a step of manufacturing the master batch mold by using the photoresist pattern layer as a protective layer and performing beam processing to an arbitrary angle of less than 90°; transferring the manufacturer from the master mold through the master mold a step of a mold; and a step of performing a peeling layer treatment and an insulating layer treatment on the sub-mold to manufacture a transfer mold, wherein the peeling layer treatment causes the electric Said component made easy to peel is formed, portions of the insulating layer forming process other than the portion of the part forming the insulating layer. The method for producing a transfer mold according to Item 4 or 5, further comprising the step of forming a roughened layer on the surface of the metal substrate. A masterbatch mold, which is manufactured by the method for producing a transfer mold according to any one of the first, third, fourth, and sixth aspects of the invention, wherein the master batch mold The cross section has a desired aspect ratio, and the angle of the side wall of the master batch mold is 45 to 88. A transfer mold is produced by the method for producing a transfer mold according to any one of the second, third, fifth, and sixth aspects of the invention. A part produced by electroforming, which is characterized in that it is transferred by the above-described electroforming using a transfer mold as described in claim 8 of the patent application.