JP2010077476A - Method of manufacturing stamper - Google Patents

Method of manufacturing stamper Download PDF

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JP2010077476A
JP2010077476A JP2008245967A JP2008245967A JP2010077476A JP 2010077476 A JP2010077476 A JP 2010077476A JP 2008245967 A JP2008245967 A JP 2008245967A JP 2008245967 A JP2008245967 A JP 2008245967A JP 2010077476 A JP2010077476 A JP 2010077476A
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Prior art keywords
stamper
layer
thin film
convex
concave
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Takuya Shimada
拓哉 島田
Shinobu Sugimura
忍 杉村
Yoshiyuki Kamata
芳幸 鎌田
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Toshiba Corp
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Toshiba Corp
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Priority to JP2008245967A priority Critical patent/JP2010077476A/en
Priority to US12/585,756 priority patent/US20100072069A1/en
Publication of JP2010077476A publication Critical patent/JP2010077476A/en
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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/10—Moulds; Masks; Masterforms
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Magnetic Record Carriers (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a stamper by which difference in height of unevenness of a pattern of a mother stamper is increased for solving the following problems: a resist layer is made thinner with the narrowing and the densifying of a track pitch of an uneven pattern of the mother stamper and difference in height of the unevenness on a manufactured original disk is reduced, which often causes the defect of the uneven pattern of a resist mask on a medium due to the poor transfer in imprinting. <P>SOLUTION: A conductive thin film 19 is formed on the bottom surface 18a of the recessed part and the upper surface of the projecting part of the uneven pattern on the mother stamper 18 so that the thickness of the film on the projecting part upper surface is larger than that on the recessed part bottom surface. After that, a strippable layer 20 is formed on the surface of the conductive thin film and continuously an electroformed layer 21 is formed by immersing the strippable layer 20 in a nickel aminosulfonate solution using an electroforming method. After that, the electroformed layer is stripped off from the mother stamper to duplicate a son stamper 22 as a third stamper. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

本発明は、情報記録媒体の製造に関わる射出成形やインプリント技術等のパターンを大量の媒体に転写させる技術に使用される金型となるスタンパの製造方法に関する。   The present invention relates to a stamper manufacturing method used as a mold used in a technique for transferring a pattern such as injection molding or imprint technique related to manufacturing of an information recording medium to a large amount of medium.

最近、情報記録装置の記録容量の増大は、磁気記録媒体の記録密度の向上により実現しており、このような高記録密度を目指す磁気記録媒体として、例えば同心円状に形成され複数のデータ記録用トラックに、磁性部と非磁性部とからなるパターンが形成されたディスクリート型磁気記録媒体（Discrete Track Recording：ＤＴＲ）が知られている。   Recently, the increase in the recording capacity of information recording apparatuses has been realized by improving the recording density of magnetic recording media. As a magnetic recording medium aiming at such a high recording density, for example, concentric circles are used for recording a plurality of data. 2. Description of the Related Art Discrete magnetic recording media (Discrete Track Recording: DTR) in which a pattern including a magnetic part and a non-magnetic part is formed on a track are known.

このような磁気記録媒体の製造方法には、例えば特許文献１に開示されるようなニッケル（Ｎｉ）製スタンパを金型として利用するナノインプリント法等が採用されている。
特開２００８−１２７０５号公報 As a method for manufacturing such a magnetic recording medium, for example, a nanoimprint method using a nickel (Ni) stamper as a mold as disclosed in Patent Document 1 is employed.
JP 2008-12705 A

ところで、ディスクリート型磁気記録媒体の製造において用いられるスタンパは、媒体の高記録密度化にともない、例えばトラックピッチが１００ｎｍ以下の凹凸パターンを形成する微細加工技術が要求されるようになっている。   By the way, a stamper used in the manufacture of a discrete type magnetic recording medium is required to have a fine processing technique for forming a concavo-convex pattern with a track pitch of 100 nm or less, for example, as the recording density of the medium increases.

ところが、このように凹凸パターンのトラックピッチが狭くなり高密度化すると、ＥＢ描画のためのレジスト層は薄い方が描画性能が向上することから、パターンピッチが狭くなり高密度化するにつれてＥＢ描画律速によりレジスト層が薄くなっていき、この結果製造される原盤上の凹凸高さの差が小さくなることがある。しかし、このようにして作成される凹凸高さの差が小さいスタンパによると、インプリント時の転写不足により媒体上のレジストマスクの凹凸パターンに欠損が生じることがある。また、インプリント後の媒体上での凹凸高さの差が小さくなることから、記録媒体本来の隣接するトラック間の信号分離性能が低下するなど高記録密度化が難しくなるという問題を生じる。   However, when the track pitch of the concavo-convex pattern is narrowed and densified as described above, the drawing performance is improved when the resist layer for EB lithography is thin. As a result, the resist layer becomes thinner, and as a result, the difference in uneven height on the master disc produced may be reduced. However, a stamper with a small difference in height of the unevenness created in this way may cause defects in the uneven pattern of the resist mask on the medium due to insufficient transfer during imprinting. Further, since the difference in height of the unevenness on the medium after imprinting becomes small, there arises a problem that it is difficult to increase the recording density, for example, the signal separation performance between the adjacent tracks of the recording medium is lowered.

本発明は上記事情に鑑みてなされたもので、凹凸パターンの凹凸高さの差を大きくできるスタンパを提供することを目的とする。   The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a stamper that can increase the difference in the uneven height of the uneven pattern.

本発明に係るスタンパの製造方法は、
表面に凹凸パターンを有する原盤の前記凹凸パターン上に電鋳層を形成し、該電鋳層を剥離して第１のスタンパを作成する工程と、
前記第１のスタンパの凹凸パターン上に電鋳層を形成し、該電鋳層を剥離して第２のスタンパを複製するとともに、該第２のスタンパの凹凸パターン上に電鋳層を形成し、該電鋳層を剥離して第３のスタンパを複製する工程と、を備え、
前記第１および第２のスタンパの少なくとも一方には前記凹凸パターンの凹部底面及び凸部上面のうちの少なくとも凸部上面に導電性薄膜が形成されることを特徴としている。 A stamper manufacturing method according to the present invention includes:
Forming an electroformed layer on the concavo-convex pattern of the master having a concavo-convex pattern on the surface, and peeling the electroformed layer to create a first stamper;
Forming an electroformed layer on the concavo-convex pattern of the first stamper, peeling off the electroformed layer and replicating the second stamper, and forming an electroformed layer on the concavo-convex pattern of the second stamper; Separating the electroformed layer and replicating the third stamper,
At least one of the first and second stampers is characterized in that a conductive thin film is formed on at least the upper surface of the concave surface of the concave / convex pattern and the upper surface of the convex portion.

また、本発明に係るスタンパの製造方法は、
表面に凹凸パターンを有する原盤の前記凹凸パターン上に導電膜を形成し、該導電膜上に電鋳層を形成し、これら導電膜及び電鋳層を前記原盤から剥離しファザースタンパを形成する第１の工程と、
前記ファザースタンパの凹凸パターン上に離型層を形成し、該離型層上に電鋳層を形成し、その後、電鋳層を剥離してマザースタンパを形成する第２の工程と、
前記マザースタンパの凹凸パターンの凹部底面及び凸部上面のうちの少なくとも凸部上面に導電性薄膜を形成し、該導電性薄膜表面に離型層を形成するとともに、該離型層上に電鋳層を形成し、その後、電鋳層を剥離してサンスタンパを形成する第３の工程と、
を備えたことを特徴としている。 The stamper manufacturing method according to the present invention includes:
A conductive film is formed on the concave / convex pattern of the master having a concave / convex pattern on the surface, an electroformed layer is formed on the conductive film, and the conductive stamp and the electroformed layer are peeled off from the master to form a father stamper. 1 process,
Forming a release layer on the uneven pattern of the father stamper, forming an electroformed layer on the release layer, and then peeling the electroformed layer to form a mother stamper;
A conductive thin film is formed on at least the top surface of the concave portion and the top surface of the concave portion of the concave / convex pattern of the mother stamper, a release layer is formed on the conductive thin film surface, and electroforming is performed on the release layer. Forming a layer, and then peeling the electroformed layer to form a sun stamper;
It is characterized by having.

本発明によれば、凹凸パターンの凹凸高さの差を大きくできるスタンパを提供できる。   ADVANTAGE OF THE INVENTION According to this invention, the stamper which can enlarge the difference of the uneven | corrugated height of an uneven | corrugated pattern can be provided.

以下、本発明の実施の形態を図面に従い説明する。   Hereinafter, embodiments of the present invention will be described with reference to the drawings.

（第１の実施の形態）
図１は、第１の実施の形態にかかるスタンパの製造方法を説明するための断面模式図である。このスタンパの製造には、塗布装置、描画装置、現像装置、成膜装置および電鋳装置などが用いられ、以下の様なプロセスで作成される。 (First embodiment)
FIG. 1 is a schematic cross-sectional view for explaining the stamper manufacturing method according to the first embodiment. For manufacturing the stamper, a coating apparatus, a drawing apparatus, a developing apparatus, a film forming apparatus, an electroforming apparatus, and the like are used, and the stamper is manufactured by the following process.

まず、図１（ａ）に示すように塗布装置により、ガラスもしくはＳｉ基材などの原盤基板１１上に例えばスピンコート法によってレジストを塗布してレジスト層１２を形成する。   First, as shown in FIG. 1A, a resist layer 12 is formed by applying a resist by, for example, a spin coating method on a master substrate 11 such as glass or a Si base material using a coating apparatus.

次に、図１（ｂ）に示すように描画装置により、塗布装置によって形成されたレジスト層に電子線（ＥＢ）を照射することにより潜像を形成し、さらに、現像装置により、描画装置による潜像の形成が完了したレジスト層１２を現像することによって凹凸パターンを形成する。これら一連の工程で作製された基板を原盤１０と呼ぶ。   Next, as shown in FIG. 1B, a latent image is formed by irradiating the resist layer formed by the coating apparatus with an electron beam (EB) by a drawing apparatus as shown in FIG. A concavo-convex pattern is formed by developing the resist layer 12 in which the formation of the latent image has been completed. The substrate manufactured through these series of steps is called a master 10.

次に、図１（ｃ）に示すように成膜装置により、原盤１０の凹凸パターン上に導電膜１３を形成し、さらに、図１（ｄ）に示すように電鋳装置により、電解めっき処理によって導電膜１３の上に電鋳層１４を形成する。そして、原盤１０より導電膜１３と電鋳層１４からなる層を剥離し、図１（ｅ）に示す第１のスタンパとしてのファザースタンパ１５を作成する。   Next, as shown in FIG. 1C, a conductive film 13 is formed on the concave / convex pattern of the master 10 by a film forming apparatus, and further, an electroplating process is performed by an electroforming apparatus as shown in FIG. 1D. Thus, the electroformed layer 14 is formed on the conductive film 13. And the layer which consists of the electrically conductive film 13 and the electroformed layer 14 is peeled from the original disk 10, and the father stamper 15 as a 1st stamper shown in FIG.1 (e) is created.

次に、図１（ｆ）に示すようにファザースタンパ１５の凹凸パターン上に離型層として、陽極酸化法や酸素プラズマアッシング法等により酸化膜１６を形成し、その後、図１（ｇ）に示すように酸化膜１６上にＮｉからなる電鋳層１７を形成し、これを剥離して図１（ｈ）に示す第２のスタンパとしてのマザースタンパ１８を複製する。   Next, as shown in FIG. 1F, an oxide film 16 is formed as a release layer on the uneven pattern of the father stamper 15 by an anodic oxidation method, an oxygen plasma ashing method, or the like. As shown, an electroformed layer 17 made of Ni is formed on the oxide film 16, and this is peeled off to replicate the mother stamper 18 as the second stamper shown in FIG.

このようにして作成されたマザースタンパ１８に対し、本発明による凹凸パターンの凹凸高さの差、つまり、凹部底部と凸部上部の高低差が大きくなるような処理が施される。この場合、図２（ａ）に示すように、マザースタンパ１８の凹凸パターンの凹部底面及び凸部上面に導電性薄膜１９を形成する。具体的には、マザースタンパ１８として、凹凸パターンの凹凸ピッチ、つまりトラックピッチＬｔ＝１００ｎｍ、凹凸側面の傾き、つまりトラック側壁傾きＤｔ＝９０°のものを用い、このようなマザースタンパ１８の凹凸パターン表面にスパッタリング法等を用いて導電性薄膜１９を形成する。この場合、例えばＤＣスパッタ装置を用いて、系内圧力１．０Ｐａ、放電電力１００Ｗ、成膜時間２２５秒にて成膜したところ、凹部底面１８ａに１０ｎｍ、凸部上面１８ｂに２０ｎｍが成膜され、凹部底面１８ａの膜厚に比べ凸部上面１８ｂの膜厚を厚くでき凹凸パターンの凹凸高さの差を処理前に比べて１０ｎｍ大きくすることができた。   The mother stamper 18 produced in this way is subjected to a process that increases the difference in the uneven height of the uneven pattern according to the present invention, that is, the difference in height between the bottom of the concave portion and the upper portion of the convex portion. In this case, as shown in FIG. 2A, the conductive thin film 19 is formed on the concave bottom surface and the convex top surface of the concave / convex pattern of the mother stamper 18. Specifically, as the mother stamper 18, a concave / convex pitch of the concave / convex pattern, that is, a track pitch Lt = 100 nm, an inclination of the concave / convex side surface, that is, a track side wall inclination Dt = 90 °, is used. A conductive thin film 19 is formed on the surface by sputtering or the like. In this case, for example, using a DC sputtering apparatus, when the film is formed at an internal pressure of 1.0 Pa, a discharge power of 100 W, and a film formation time of 225 seconds, a film of 10 nm is formed on the concave bottom surface 18a and 20 nm is formed on the convex upper surface 18b. The film thickness of the convex upper surface 18b can be made thicker than the film thickness of the concave bottom surface 18a, and the difference in the uneven height of the uneven pattern can be increased by 10 nm compared to before the treatment.

このときの導電性薄膜１９は、凹凸部の側壁に成膜されてもよい。また、このような処理工程は、マザースタンパ１８をファザースタンパ１５から剥離した直後に実行するのが望ましい。これは時間が経過すると、マザースタンパ１８表面が酸化して導電性薄膜１９を安定して形成できないことがあるためである。   The conductive thin film 19 at this time may be formed on the side wall of the concavo-convex portion. Further, it is desirable that such a processing step be performed immediately after the mother stamper 18 is peeled from the father stamper 15. This is because when the time elapses, the surface of the mother stamper 18 is oxidized and the conductive thin film 19 may not be stably formed.

次に、図２（ｂ）に示すように、導電性薄膜１９表面に酸素によるＲＩＥ（Reactive Ion Etching）法等により剥離層２０を形成する。続いて、図２（ｃ）に示すようにスルファミン酸ニッケル液に浸漬し電鋳法を用いて、電鋳層２１を形成する。その後、電鋳層２１をマザースタンパ１８から剥離することで図２（ｄ）に示すような第３のスタンパとしてのサンスタンパ２２を複製する。そして、このようにして得られたサンスタンパ２２の凹凸パターン面に保護膜をスピンコートした後、乾燥させ、必要に応じて裏面研磨、打ち抜きなどの工程を経て最終形態の媒体大量転写のためのスタンパが完成する。   Next, as shown in FIG. 2B, a release layer 20 is formed on the surface of the conductive thin film 19 by an RIE (Reactive Ion Etching) method using oxygen or the like. Subsequently, as shown in FIG. 2C, the electroformed layer 21 is formed by dipping in a nickel sulfamate solution and using an electroforming method. Thereafter, the electroformed layer 21 is peeled from the mother stamper 18 to duplicate the sun stamper 22 as a third stamper as shown in FIG. Then, a protective film is spin-coated on the uneven pattern surface of the sun stamper 22 obtained in this way, and then dried, and if necessary, a stamper for mass transfer of the final form of the medium is performed through processes such as back surface polishing and punching. Is completed.

ここで、上述した導電性薄膜１９や剥離層２０などには、物理的、機械的強度が強く、腐食や磨耗に対して強く、しかも、電鋳材のＮｉとの密着性を考慮して、Ｎｉを主成分とするものを使用している。また、電鋳層２１には、Ｎｉ或いはＮｉの中にＣｏ、Ｓ、ＢもしくはＰを含む金属を用いる。   Here, the above-described conductive thin film 19 and release layer 20 have high physical and mechanical strength, strong against corrosion and wear, and considering the adhesion of the electroformed material with Ni, A material mainly composed of Ni is used. The electroformed layer 21 is made of Ni or a metal containing Co, S, B or P in Ni.

なお、上述した図２（ａ）に示す具体例では、マザースタンパ１８の凹凸パターンのトラックピッチ（凹凸ピッチ）Ｌｔを１００ｎｍ、トラック側壁傾き（凹凸側面の傾き）Ｄｔを９０°としたが、これらの数値は一例であり、例えば、トラックピッチＬｔが１０〜１００ｎｍ、トラック側壁傾きＤｔが６０〜１００°の範囲で適用できる。ここで、トラックピッチＬｔを１０ｎｍまでとしたのは、１０ｎｍ以下になると、マザースタンパ１８表面に導電性薄膜１９を形成しても凹凸高さに差を出すのが困難になるからである。また、トラック側壁傾きＤｔが６０°〜１００°としたのは、Ｄｔが６０°以下になると、記録媒体の磁性部として使用される凸部上面の面積が十分に確保できなくなるからであり、また、Ｄｔが１００°以上になると、マザースタンパ１８から剥離層２０を剥離させるのが困難になるためである。また、上述では、マザースタンパ１８上の導電性薄膜１９は、凹部底面に１０ｎｍ、凸部上面に２０ｎｍが成膜される例を述べたが、これらは一例で、例えば、ＤＣスパッタ装置による系内圧力、放電電力、成膜時間などのスパッタリング条件を変更して凹部底面の膜厚に比べ凸部上面の膜厚を厚くして凹部底部と凸部上部の高低差を大きくするようにしてもよい。   In the specific example shown in FIG. 2A described above, the track pitch (concave / convex pitch) Lt of the concavo-convex pattern of the mother stamper 18 is set to 100 nm, and the track side wall slope (tilt side slope) Dt is set to 90 °. Is an example, and can be applied in the range where the track pitch Lt is 10 to 100 nm and the track side wall inclination Dt is 60 to 100 °, for example. Here, the track pitch Lt is set to 10 nm because if it is 10 nm or less, it is difficult to make a difference in the uneven height even if the conductive thin film 19 is formed on the surface of the mother stamper 18. Further, the reason that the track side wall inclination Dt is set to 60 ° to 100 ° is that when the Dt is 60 ° or less, a sufficient area of the upper surface of the convex portion used as the magnetic portion of the recording medium cannot be secured. This is because, when Dt is 100 ° or more, it becomes difficult to peel the release layer 20 from the mother stamper 18. In the above description, an example in which the conductive thin film 19 on the mother stamper 18 has a thickness of 10 nm on the bottom surface of the recess and 20 nm on the top surface of the protrusion has been described as an example. Sputtering conditions such as pressure, discharge power, and film formation time may be changed to increase the film thickness on the top surface of the convex portion compared to the film thickness on the bottom surface of the concave portion, thereby increasing the height difference between the bottom portion of the concave portion and the top portion of the convex portion. .

したがって、このようにすれば、マザースタンパ１８上の凹凸パターンの凹部底面及び凸部上面に導電性薄膜１９を形成し、凹凸パターンの凹凸高さの差を大きくするようにした。これにより、このようなマザースタンパ１８より複製されるサンスタンパ２２についても凹凸パターンの凹凸高さの差を大きくできるので、その後のインプリント時の転写不足を解消でき、媒体上のレジストマスクの凹凸パターンを確実に形成することができる。また、インプリント後の媒体上での凹凸パターンの凹凸高さの差を大きくできるので、記録媒体本来の隣接するトラック間の信号分離性能を高めることもでき、さらなる高記録密度化を実現することもできる。また、マザースタンパ１８は、凹凸パターン表面を導電性薄膜１９で覆われているので、サンスタンパ２２を何度も複製しても、マザースタンパ１８本体が傷つくことがなく、長期間安定して使用できる。   Therefore, in this case, the conductive thin film 19 is formed on the concave bottom surface and the convex top surface of the concave / convex pattern on the mother stamper 18 to increase the difference in concave / convex height of the concave / convex pattern. Accordingly, the difference in the uneven height of the uneven pattern can be increased also for the sun stamper 22 replicated from such a mother stamper 18, so that the insufficient transfer during the subsequent imprinting can be eliminated, and the uneven pattern of the resist mask on the medium Can be reliably formed. In addition, since the difference in the uneven height of the uneven pattern on the medium after imprinting can be increased, the signal separation performance between the adjacent tracks of the recording medium can be improved, and further higher recording density can be realized. You can also. Further, since the mother stamper 18 has the concave / convex pattern surface covered with the conductive thin film 19, even if the sun stamper 22 is duplicated many times, the mother stamper 18 body is not damaged and can be used stably for a long time. .

なお、本発明は、上記実施の形態に限定されるものでなく、実施段階では、その要旨を変更しない範囲で種々変形することが可能である。例えば、上述した実施の形態では、マザースタンパ１８の凹凸パターンについて凹凸高さの差が大きくなるような処理を施す場合を述べたが、ファザースタンパ１５の凹凸パターン、さらにマザースタンパ１８及びファザースタンパ１５のそれぞれの凹凸パターンについて、凹凸高さの差が大きくなるような処理を施すようにしてもよい。この場合、上述したと同様に、それぞれの凹凸パターンの凹部底面及び凸部上面に導電性薄膜を形成し、凹凸高さの差が大きくなるようにすればよい。また、上述では、一貫して凹凸パターンの凹部底面及び凸部上面に導電性薄膜を形成した場合を述べたが、凹凸パターンの凹部底面及び凸部上面のうちの少なくとも凸部上面に導電性薄膜を形成すればよい。また、上述した実施の形態の形状や数値などは実際のものと異なる個所があるが、これらは公知の技術を参酌して適宜、設計変更することができる。   In addition, this invention is not limited to the said embodiment, In the implementation stage, it can change variously in the range which does not change the summary. For example, in the above-described embodiment, the case where the uneven pattern of the mother stamper 18 is processed so as to increase the difference in the uneven height has been described. However, the uneven pattern of the father stamper 15, the mother stamper 18 and the father stamper 15 are also described. Each of the concavo-convex patterns may be processed so as to increase the difference in the concavo-convex height. In this case, as described above, a conductive thin film may be formed on the concave bottom surface and the convex top surface of each concave / convex pattern so as to increase the difference in concave / convex height. In the above description, the conductive thin film is formed on the concave bottom surface and the convex top surface of the concave / convex pattern consistently. However, the conductive thin film is formed on at least the convex top surface of the concave bottom surface and convex top surface of the concave / convex pattern. May be formed. Moreover, although the shape, numerical value, etc. of embodiment mentioned above have a different location from an actual thing, these can be changed in design suitably in consideration of a well-known technique.

さらに、上記実施の形態には、種々の段階の発明が含まれており、開示されている複数の構成要件における適宜な組み合わせにより種々の発明が抽出できる。例えば、実施の形態に示されている全構成要件から幾つかの構成要件が削除されても、発明が解決しようとする課題の欄で述べた課題を解決でき、発明の効果の欄で述べられている効果が得られる場合には、この構成要件が削除された構成が発明として抽出できる。   Furthermore, the above embodiments include inventions at various stages, and various inventions can be extracted by appropriately combining a plurality of disclosed constituent elements. For example, even if some constituent requirements are deleted from all the constituent requirements shown in the embodiment, the problem described in the column of the problem to be solved by the invention can be solved, and is described in the column of the effect of the invention. If the above effect is obtained, a configuration from which this configuration requirement is deleted can be extracted as an invention.

本発明の第１の実施の形態にかかるスタンパの製造方法を説明するための断面模式図。The cross-sectional schematic diagram for demonstrating the manufacturing method of the stamper concerning the 1st Embodiment of this invention. 第１の実施の形態にかかるスタンパの製造方法を説明するための断面模式図。The cross-sectional schematic diagram for demonstrating the manufacturing method of the stamper concerning 1st Embodiment.

符号の説明Explanation of symbols

１０…原盤、１１…原盤基板
１２…レジスト層、１３…導電膜
１４…電鋳層、１５…ファザースタンパ
１６…酸化膜、１７…電鋳層
１８…マザースタンパ、１９…導電性薄膜
２０…剥離層、２１…電鋳層
２２…サンスタンパ DESCRIPTION OF SYMBOLS 10 ... Master disk, 11 ... Master disk board | substrate 12 ... Resist layer, 13 ... Conductive film 14 ... Electroformed layer, 15 ... Father stamper 16 ... Oxide film, 17 ... Electroformed layer 18 ... Mother stamper, 19 ... Conductive thin film 20 ... Peeling Layer, 21 ... Electroformed layer 22 ... Sun stamper

Claims (6)

表面に凹凸パターンを有する原盤の前記凹凸パターン上に電鋳層を形成し、該電鋳層を剥離して第１のスタンパを作成する工程と、
前記第１のスタンパの凹凸パターン上に電鋳層を形成し、該電鋳層を剥離して第２のスタンパを複製するとともに、該第２のスタンパの凹凸パターン上に電鋳層を形成し、該電鋳層を剥離して第３のスタンパを複製する工程と、を備え、
前記第１および第２のスタンパの少なくとも一方には前記凹凸パターンの凹部底面及び凸部上面のうちの少なくとも凸部上面に導電性薄膜が形成されることを特徴とするスタンパの製造方法。 Forming an electroformed layer on the concavo-convex pattern of the master having a concavo-convex pattern on the surface, and peeling the electroformed layer to create a first stamper;
Forming an electroformed layer on the concavo-convex pattern of the first stamper, peeling off the electroformed layer and replicating the second stamper, and forming an electroformed layer on the concavo-convex pattern of the second stamper; Separating the electroformed layer and replicating the third stamper,
A method of manufacturing a stamper, wherein a conductive thin film is formed on at least one of the first and second stampers on at least one of the concave bottom surface and the convex top surface of the concave / convex pattern. 前記導電性薄膜は、前記凹部底面の膜厚に比べ前記凸部上面の膜厚が厚く形成されることを特徴とする請求項１記載のスタンパの製造方法。   2. The method of manufacturing a stamper according to claim 1, wherein the conductive thin film is formed such that the thickness of the upper surface of the convex portion is larger than the thickness of the bottom surface of the concave portion. 前記導電性薄膜は、前記凹凸パターン表面にスパッタリング法により形成されることを特徴とする請求項１記載のスタンパの製造方法。   The stamper manufacturing method according to claim 1, wherein the conductive thin film is formed on the surface of the concavo-convex pattern by a sputtering method. 前記導電性薄膜は、前記凹凸パターンの凹凸ピッチが１０〜１００ｎｍ、凹凸側面の傾きが６０〜１００°のスタンパに対し形成されることを特徴とする請求項１記載のスタンパの製造方法。   The method for manufacturing a stamper according to claim 1, wherein the conductive thin film is formed with respect to a stamper having a concavo-convex pitch of the concavo-convex pattern of 10 to 100 nm and an inclination of the concavo-convex side surface of 60 to 100 °. 前記導電性薄膜は、導電性薄膜からなることを特徴とする請求項１乃至４のいずれか一記載のスタンパの製造方法。   The method for manufacturing a stamper according to claim 1, wherein the conductive thin film is formed of a conductive thin film. 表面に凹凸パターンを有する原盤の前記凹凸パターン上に導電膜を形成し、該導電膜上に電鋳層を形成し、これら導電膜及び電鋳層を前記原盤から剥離しファザースタンパを形成する第１の工程と、
前記ファザースタンパの凹凸パターン上に離型層を形成し、該離型層上に電鋳層を形成し、その後、電鋳層を剥離してマザースタンパを形成する第２の工程と、
前記マザースタンパの凹凸パターンの凹部底面及び凸部上面のうちの少なくとも凸部上面に導電性薄膜を形成し、該導電性薄膜表面に離型層を形成するとともに、該離型層上に電鋳層を形成し、その後、電鋳層を剥離してサンスタンパを形成する第３の工程と、
を備えたことを特徴とするスタンパの製造方法。 A conductive film is formed on the concave / convex pattern of the master having a concave / convex pattern on the surface, an electroformed layer is formed on the conductive film, and the conductive stamp and the electroformed layer are peeled off from the master to form a father stamper. 1 process,
Forming a release layer on the uneven pattern of the father stamper, forming an electroformed layer on the release layer, and then peeling the electroformed layer to form a mother stamper;
A conductive thin film is formed on at least the top surface of the concave portion and the top surface of the concave portion of the concave / convex pattern of the mother stamper, a release layer is formed on the conductive thin film surface, and electroforming is performed on the release layer. Forming a layer, and then peeling the electroformed layer to form a sun stamper;
A stamper manufacturing method comprising:
JP2008245967A 2008-09-25 2008-09-25 Method of manufacturing stamper Abandoned JP2010077476A (en)

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