TW201321159A - Fabricating method of transfer printing mold, and transfer printing mold - Google Patents

Abstract

A transfer printing mold is provided. The transfer printing mold is used for forming components by electroforming, and the transfer printing mold has an excellent operating characteristic and is of endurance. The invention includes: forming an inverted photo-resist pattern in a shape of the component on a metal substrate, in which a sidewall of the inverted photo-resist pattern of the component has expected angle α ; thermal curing the inverted photo-resist pattern; and forming a photo-resist enhanced portion by electroforming to electroplate metal on the metal substrate except for a place in which the inverted photo-resist pattern is formed.

Description

Method for manufacturing transfer mold and transfer mold

The present invention relates to a method for manufacturing a transfer mold and the transfer mold. More specifically, the present invention relates to a method for manufacturing a transfer mold and a transfer mold for borrowing The parts are formed by electroforming, which is excellent in workability and durability.

The electroforming method is limited in area and can form a thick film conductor. Therefore, the electroforming method is widely used for display parts such as display characters or hands of watches; small gears, springs, and tubes ( Mechanical parts such as pipe), diagram (sensor), and electronic parts such as wiring and coil of a semiconductor device.

Patent Document 1 discloses that when a cavity insert is manufactured, a cutting master is first formed, and the cutting masterbatch is previously formed with a fine pattern, followed by hot pressing. A hot press forms a transfer master from the cutting masterbatch, and then a cavity insert is formed from the transfer masterbatch by electroforming.

Patent Document 2 discloses that the surface plate is formed by the step of forming a mask pattern having an opening on the surface of a silicon wafer, and performing anisotropic etching ( a step of forming a common electrode film, a step of forming an electroformed film grown from the common electrode film, a step of etching the germanium wafer, and forming the electroformed film as a transfer mask The step of the resin-made dial plate.

4a and 4b are structural views of parts formed by the steps of a conventional electroforming method. In FIG. 4a, in order to form the part 50, a pattern of a part shape is formed on the metal substrate 10 by photowork in the photoresist 20. On the metal substrate 10 on which the photoresist pattern is formed, a predetermined metal (Ag, Cu, Ni, or the like) is plated by electroforming (hereinafter referred to as electroforming) to form the component 50.

In FIG. 4b, the part 50 formed by electroforming is transferred to the part substrate 70 via the adhesive 60. In this manner, a part of an arbitrary shape corresponding to the use is formed by electroforming, and the part is transplanted to the part substrate 70 for use.

In the above case, in order to facilitate the peeling of the component 50 and subsequent grafting, the angle β of the side wall of the photoresist 20 is set to a gentle angle β of the side wall of 45° or less. Further, when an electronic component such as a wiring or a coil formed on a semiconductor substrate is produced, the electronic component is formed in an embedded state by electroforming along the sidewall of the photoresist 20, and thus, when the wiring pattern is formed When the size of the inductive coil or the like is long, the contact area of the side walls of each other increases, and the peeling resistance during the peeling process at the time of transplantation increases. There is a problem that the peeling force against the increased peeling resistance increases in order to be transferred to the component substrate 70, and therefore, the photoresist pattern of the photoresist 20 adhered to the metal substrate 10 is increased. The edge is easily peeled off, and after 2 to 3 times, the photoresist is peeled off, resulting in the pattern being unusable.

Next, the manufacture of mechanical parts such as display parts such as display characters or hands of electric watches, small gears, springs, tubes, and line drawings (pressure sensors) will be described. Similarly, the conventional parts are also manufactured using the steps of Figs. 4a and 4b. In this case, the contact area between the metal substrate 10 and the component 50 increases depending on the type of the component such as the gear, and the peeling resistance during the peeling process when the component 50 is transferred increases, which makes the transplantation work difficult. Further, in the case of a spring or the like, since the contact of the side walls of each other is a long-range contact, the peeling resistance with the side wall of the photoresist 20 is increased, and the photoresist is removed during the peeling process at the time of transplantation. The edge of the photoresist pattern of the agent 20 is easily peeled off.

Prior technical literature

Patent literature

Patent Document 1: Japanese Patent Laid-Open Publication No. 2004-1535

Patent Document 2: Japanese Patent Laid-Open Publication No. 2004-257861

The present invention has been made to solve the above problems, and an object of the present invention is to provide a method of manufacturing a transfer mold for forming a part by electroforming, and a transfer mold Good workability and durability.

A manufacturing method of a first embodiment of a transfer mold according to the present invention includes the step of forming a reverse resist pattern of a part shape on a metal substrate, the side wall of the reverse resist pattern of the part shape having a desired angle α a step of thermally hardening the reverse resist pattern; and a step of electroplating the metal on a portion of the metal substrate other than the reverse resist pattern to form a photoresist enhancement portion.

The manufacturing method of the second embodiment of the transfer mold of the present invention includes the steps of: forming a rough surface layer on the upper surface of the metal substrate; and patterning the reverse resist pattern of the part shape on the metal substrate, The side wall of the reverse resist pattern of the shape of the above part has a desired angle α; a step of thermally hardening the reverse resist pattern; and electroplating to electroplate the metal to the metal substrate except for the reverse resist pattern The portion to form the photoresist enhancement portion.

The manufacturing method of the third embodiment of the transfer mold of the invention of the present application includes the steps of: forming a photoresist reinforcing groove on the metal substrate; and forming a reverse resist pattern of the part shape on the photoresist reinforcing groove; The side wall of the reverse resist pattern of the part shape has a desired angle α; and a step of thermally hardening the reverse resist pattern.

The first embodiment of the transfer mold of the present invention or the manufacturing method of the second embodiment further includes a step of forming an insulating layer on the photoresist reinforcing portion other than the portion where the component is formed.

The manufacturing method of the third embodiment of the transfer mold of the invention of the present application further includes a step of forming an insulating layer on a metal substrate other than the portion where the component is formed and the reverse resist pattern.

The transfer mold of the present invention is characterized in that it is produced by the method for producing a transfer mold as described above.

The parts of the present invention are characterized in that they are transferred and manufactured by electroforming using a transfer mold as described above.

(Effect of the invention)

According to the present invention, it is possible to provide a transfer mold for forming a part by electroforming, which is excellent in workability and durability.

Example

The manufacturing steps of the transfer mold of the present invention will be described with reference to the drawings. Fig. 1 is a structural view of a transfer mold of a first embodiment. In FIG. 1, in order to form the component 50, a pattern of a reverse pattern of a part shape is formed on the photoresist 20 by photo work on the metal substrate 10, and the reverse pattern of the shape of the part is formed. The side walls have a desired angle of inclination a. Next, a heat treatment is performed to thermally cure the photoresist 20 to form a solidified insulating layer. The inclination angle α of the both side walls can be arbitrarily determined depending on the material of the applied photoresist 20, the film thickness, and the exposure conditions when the irradiation is performed via a photomask (not shown).

Next, in order to form the photoresist reinforcing portion 30, metal is electroplated on the metal substrate 10 by electroforming. Next, the insulating layer treatment is performed to electrically insulate a portion other than the part pattern to complete the transfer mold, and the insulating layer treatment means that SiO ₂ is formed on the photoresist reinforcing portion 30 except for the portion where the part is formed. An insulating layer 35. The transfer mold is formed with a photoresist reinforcing portion 30 for preventing peeling of the photoresist 20 constituting the shape of the part, thereby preventing the edge of the photoresist 20 from peeling off, thereby It provides a transfer mold with excellent workability and durability.

Fig. 2 is a structural view of a transfer mold according to a second embodiment of the present invention. In FIG. 2, before the reverse pattern of the shape of the part is formed by the photoresist 20, a roughening treatment for forming the rough surface layer 40 on the upper surface of the metal substrate 10 is performed. For example, the surface of the metal substrate 10 may be directly subjected to hydrochloric acid treatment, whereby the surface layer is roughened to have an electrical conductivity to form the rough surface layer 40. In addition, the surface of the metal substrate 10 can be formed into a photo pattern layer suitable for roughening, such as a stripe or a lattice, which can maintain conductivity, by photoprocessing.

Next, in order to form the component 50, a pattern of a reverse pattern of a part shape is formed on the metal substrate 10 by photoprocessing in the same manner as in FIG. Next, a heat treatment is performed to thermally cure the photoresist 20 to form a solidified insulating layer. Next, in order to form the photoresist reinforcing portion 30, metal is electroplated on the metal substrate 10 by electroforming. Next, the insulating layer treatment is performed to electrically insulate a portion other than the part pattern to complete the transfer mold, and the insulating layer treatment means that SiO ₂ is formed on the photoresist reinforcing portion 30 except for the portion where the part is formed. An insulating layer 35. The transfer mold includes a photoresist 20 constituting a part shape and a rough surface layer 40 for reinforcing the adhesion with the photoresist reinforcing portion 30, and is formed to prevent peeling of the photoresist 20. Since the photoresist reinforcing portion 30 is provided, it is possible to provide a transfer mold which is excellent in workability and durable.

Fig. 3 is a view showing a manufacturing step of a transfer mold according to a third embodiment of the present invention. In FIG. 3, the metal substrate 10 is subjected to a reinforcing groove forming process for forming the photoresist reinforcing groove 15. The enhancement groove forming process can form a reverse pattern of the photoresist enhancement groove 15 by photoprocessing using a photoresist, and the reverse pattern is used as a mask, chemically, by chemical etching, or the like. Or by mechanically controlling the processing conditions by beam etching or the like to form the photoresist reinforcing groove 15; or by operating the cutting unit using an electron beam or a mechanical cutting tool, thereby directly forming the above The photoresist enhances the groove 15.

Next, in the same manner as in FIG. 1, an inverse pattern of the shape of the part 50 having a desired inclination angle α on the side wall is formed by photoprocessing on the photoresist reinforcing groove 15, and the patterned light is made. The resist 20 is thermally hardened to complete the transfer mold. The transfer mold forms the photoresist reinforcing groove 15 for preventing peeling of the photoresist 20, and therefore, the edge of the photoresist 20 can be prevented from peeling off, and a transfer mold having excellent workability and durability can be provided. Further, similarly to the first embodiment and the second embodiment, an insulating layer may be formed on the surface of the metal substrate 10 other than the photoresist 20 except for the portion where the component is formed.

As described above, it is possible to provide a transfer mold which is excellent in workability and durable in any of the above transfer molds. Further, since it is not easily peeled off, the inclination angle α of the side wall can be made steeper than the conventional 45°, so that a higher density pattern can be formed.

The metal substrate 10 may be a metal plate such as SUS, Ni, or Cu. The insulating layer 35 may be an organic or inorganic photoresist, in addition to an inorganic oxide film such as SiO ₂ . The electroformed material of the part 50 may also be Ag, Cu, Ni, Au, Sn, Pb, Fe, Cr, Pt, Pd, and alloys of these metals.

Further, in FIGS. 1 to 3, the component 50 manufactured by electroforming may be transferred to the component substrate 70 via the adhesive 60 in the same manner as in FIG. 4b, or may be formed by a green sheet (not shown). To transplant. In this case, the green sheet is hardened by heat treatment after the transplantation, but since the green sheet is softened to the extent that the part 50 can be buried before the hardening, the adhesive 60 is not required.

10. . . Metal substrate

15. . . Photoresist enhancement tank

20. . . Patterned photoresist/resist

30. . . Photoresist enhancer

35. . . Insulation

40. . . Rough surface

50. . . Components

60. . . Follower

70. . . Part substrate

α. . . Side wall tilt angle / tilt angle / angle

β. . . Angle of inclination of the side wall / angle of the side wall

Fig. 1 is a structural view of a transfer mold according to a first embodiment of the present invention.

Fig. 2 is a structural view of a transfer mold according to a second embodiment of the present invention.

Fig. 3 is a structural view of a transfer mold according to a third embodiment of the present invention.

4a and 4b are structural views of parts formed by the steps of a conventional electroforming method.

10. . . Metal substrate

20. . . Patterned photoresist/resist

30. . . Photoresist enhancer

35. . . Insulation

50. . . Components

α. . . Side wall tilt angle / tilt angle / angle

Claims (7)

A manufacturing method of a transfer mold, comprising: forming a reverse resist pattern of a part shape on a metal substrate, the side wall of the reverse resist pattern of the part shape having a desired angle α; a step of thermally hardening the pattern; and electroforming the metal to a portion of the metal substrate other than the reverse resist pattern to form a photoresist reinforcing portion. A manufacturing method of a transfer mold, comprising: a step of forming a rough surface layer on an upper surface of a metal substrate; and a step of patterning an inverted photoresist pattern of a part shape on the metal substrate, wherein the shape of the part is reversed a sidewall of the resist pattern having a desired angle α; a step of thermally hardening the inverted resist pattern; and electroforming, by electroforming, a metal on a portion of the metal substrate other than the reverse resist pattern A step of forming a photoresist enhancement portion. A method for manufacturing a transfer mold, comprising: forming a photoresist reinforcing groove on a metal substrate; forming a reverse resist pattern of the part shape on the photoresist reinforcing groove, and inverting the shape of the part The sidewall of the photoresist pattern has a desired angle α; and a step of thermally hardening the above-described inverted photoresist pattern. The method for producing a transfer mold according to the first or second aspect of the invention, further comprising the step of forming an insulating layer on the photoresist reinforcing portion other than the portion where the component is formed. The method for producing a transfer mold according to claim 3, further comprising the step of forming an insulating layer on the metal substrate other than the portion in which the component is formed and the inversion resist pattern. A transfer mold is produced by the method for producing a transfer mold according to any one of the first to fifth aspects of the invention. A part characterized in that it is transferred by electroforming using a transfer mold as described in claim 6 of the patent application.