JP2007070709A - Electroforming die, method for producing electroforming die, and method for producing electroformed component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electroforming die capable of producing a multistage type electroformed component whose inside is free from cavities using a photosensitive material, to provide a production method for producing the electroforming die with reduced stages, and to provide an electroformed component whose inside is free from cavities using the electroforming die. <P>SOLUTION: The electroforming die 1 is provided with: a substrate 2 whose one surface 2a has electrical conductivity; a first resin layer 3 arranged at a part of the one surface 2a of the substrate 2; a second resin layer 5 formed stepwise to the first resin layer 3; and metal layers (electrically conductive layer) 6 arranged only at the exposed face of the one surface 2a of the substrate 2 and the surface in the thickness direction of the first resin layer 3. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to an electroforming mold, a method for producing an electroforming mold, and a method for producing an electroformed part.

  As a method of manufacturing the multistage electroforming mold 100 as shown in FIG. 18, the resin 101 is heated and softened, and then the original mold is pressed, and the original shape is transferred to the resin 101 as shown in FIG. In addition, there is known a method in which a conductive layer 102 is formed on a surface on which electroforming is performed by a method such as vapor deposition (hereinafter referred to as an electroforming surface).

  On the other hand, there are those that produce electroforming molds by the LIGA (Lithographie Galvanoformung Abformung) method, which processes photosensitive materials into electroforming molds using a silicon process, and also produce parts and molds with minute shapes by electroforming. It has been proposed (see, for example, Patent Document 1). With such an electroforming mold, even a minute part can be produced with high precision.

  However, when the multistage electroformed part 103 is manufactured using the conventional electroformed mold 100 having the multistage structure, as shown in FIG. 20, the electroformed product 105 is formed on all electroformed surfaces on which the conductive layer 102 is formed. Due to precipitation, the electroformed product 105 tends to be large. Therefore, when manufacturing a small electroformed component 103 as shown in FIG. 21, the part to be removed becomes larger, and post-processing is troublesome. Further, since isotropic precipitation from the electroformed surface, a void 106 is formed inside the electroformed product as shown in FIG.

In addition, in the electroforming mold and the electroformed part and the manufacturing method thereof described in Patent Document 1, after forming the first stage of the electroforming mold and electroforming the part, the photosensitive material is once peeled off and the photosensitive material is applied again. And the second stage is formed. Therefore, the electroforming process for forming the stepped portion of the electroformed part, and the application of the photosensitive material for forming the second step of the electroforming mold used for forming the next layer on the formed stepped portion. And the exposure process must be repeated, and the entire process becomes complicated and takes time.
Japanese Patent Laid-Open No. 11-15126

  The present invention has been made in view of the above circumstances, and an electroforming mold capable of producing a multistage electroformed part having no voids inside using a photosensitive material, and for producing the electroforming mold with a small number of steps. It is an object of the present invention to provide a manufacturing method and a method for manufacturing an electroformed part having no void inside using the electroforming mold.

  The present invention employs the following means in order to solve the above problems.

  An electroforming mold according to the present invention includes a substrate having at least one surface of conductivity, and a resin layer laminated stepwise on the substrate in a state where a part of the one surface of the substrate is exposed, A conductive layer that is electrically insulated between the respective layers is disposed on the exposed surface of one surface and the surface in the thickness direction of the resin layer.

  In this electroforming mold, since the resin layers are stepped, it is not necessary to perform electroforming every time each layer is formed, and a desired electroformed part can be manufactured by a single electroforming. Moreover, when performing electroforming, it can electrocast only from the each conductive layer to the thickness direction of a board | substrate.

  Further, the electroforming mold according to the present invention is the electroforming mold, wherein the conductive layer arranged on the resin layer is arranged only on a surface in a thickness direction of the other layers excluding the uppermost layer of the resin layer. It is characterized by being.

  Since the electroforming is not electroformed on the uppermost layer of the resin layer, it is possible to suitably suppress the size of the parts electroformed by the electroforming from becoming larger than desired.

  The method for producing an electroforming mold according to the present invention includes a step of arranging a photosensitive material on the one surface of a substrate having one conductive surface, and exposing a photomask on the surface of the photosensitive material. A step of forming a cured layer and an uncured layer, a step of developing and removing the uncured layer to leave a cured layer formed in a stepped shape, and the one surface of the exposed substrate and the cured Forming a conductive layer on the surface of the layer by vapor deposition, and leaving the conductive layer only on one surface of the substrate and a part or all of the thickness direction of the hardened layer on the other surface And a step of forming a removing step.

  In this electroforming method, since the hardened layer has a stepped shape, it is not necessary to perform electroforming every time each step is formed, and a desired electroformed part can be manufactured by a single electroforming. . Further, since the conductive layer is formed only on one surface of the substrate and the surface in the thickness direction of the hardened layer, it can be electroformed only from the conductive layer in the thickness direction of the substrate when performing electroforming. .

  The electroforming mold according to the present invention is the electroforming mold, wherein the resin layer is made of a negative photosensitive material.

  In this electromold, the resin layer is formed by curing a negative photosensitive material without using a resin layer having a different curing method such as a positive photosensitive material. The exposure process can be simplified as compared with the case of using it, and the process in the dark room can be reduced.

  The electroforming method according to the present invention is the electroforming method, wherein the photosensitive material is made of a negative photosensitive material.

  In this electroforming method, the positive photosensitive material is formed by curing the negative photosensitive material without using a cured layer in combination with a different photosensitive curing method such as a positive photosensitive material. The exposure process can be simplified compared to the case of using a dark room, and the process in the dark room can be reduced.

  The electroforming mold according to the present invention is the electroforming mold, wherein the conductive layer is made of copper.

  When forming a metal layer by vapor deposition, this electroform forms the thickness of the conductive layer on the surface other than one surface of the substrate and the surface in the thickness direction of the resin layer on the other surface. It can be made thicker than the thickness of the conductive layer formed. Accordingly, even if the entire conductive layer is to be removed by etching or the like, the conductive layer formed on one surface of the substrate and the surface in the thickness direction of the resin layer is left, for example, another surface such as a cross-sectional surface of the cured layer. The conductive layer on the surface can be easily removed.

  In addition, the electroforming method according to the present invention is the electroforming method, wherein the conductive layer is made of copper.

  In this electroforming method, when the conductive layer is formed by vapor deposition, the thickness of the conductive layer formed on one surface of the substrate and a part other than the entire surface in the thickness direction of the cured layer is determined. The thickness of the conductive layer formed on the other surface can be made thicker. Therefore, even if the entire conductive layer is removed by etching or the like, the conductive layer formed on one surface of the substrate and a part or all of the thickness direction of the cured layer is left, for example, in the cross-sectional direction of the cured layer. A conductive layer formed on another surface such as a surface can be easily removed.

  The method for producing an electroformed part according to the present invention includes a step of immersing an electroforming mold produced by the electroforming method according to the present invention in an electroforming solution having metal ions, and applying a voltage to the conductive layer to form an electron. And a step of depositing a metal of the metal ion on the conductive layer.

  In this method for producing an electroformed part, electroforming is performed using the electroforming mold according to the present invention, so that an electroformed part having a multi-stage structure can be produced by a single electroforming. At this time, a product having no void inside can be manufactured.

  ADVANTAGE OF THE INVENTION According to this invention, it can suppress suitably that a void is formed inside the electroformed part obtained by electroforming.

  An embodiment according to the present invention will be described with reference to FIGS.

  As shown in FIG. 1, the electroforming mold 1 according to this embodiment includes a substrate 2 having a conductive surface 2a and a first resin on the substrate 2 in a state where a part of the surface 2a of the substrate 2 is exposed. And a resin layer 4 in which a layer 3 and a second resin layer (uppermost layer) 5 are stacked stepwise, and electrically between each layer on the exposed surface of one surface 2a and the surface in the thickness direction of the resin layer 4. An insulating metal layer (conductive layer) 6 is disposed.

  The substrate 2 is a glass substrate and has such a thickness that the strength of the electroforming mold 1 can be maintained, for example, about 100 μm to 10 mm. On one surface 2a of the substrate 2, a gold (Au) layer 8 having conductivity is formed on an anchor metal layer (not shown) made of chromium (Cr), for example, with a thickness of 0.01 μm to 1 μm. ing. When the substrate material is a metal, such a layer is not always necessary.

  The first resin layer 3 and the second resin layer 5 have a thickness in the thickness direction of the substrate 2 of, for example, 100 μm to 200 μm, and both are made of a negative photoresist (negative photosensitive material). The negative photoresist is desirably a chemically amplified type based on an epoxy resin, and is preferably insoluble in a developer.

  The metal layer 6 is made of copper, and has a thickness that allows a sufficient current to flow, for example, 0.01 μm to 10 μm. In addition, the Au layer 8 and the metal layer 6 are electrically connected to one surface 2 a of the substrate 2.

  Next, a method for manufacturing the electroforming mold 1 according to this embodiment will be described.

  As shown in FIGS. 2 to 11, the manufacturing method of the electroforming mold 1 includes a step (S01) of disposing a negative photoresist 10 on one surface 2a of the substrate 2, and a first photomask on the surface of the negative photoresist 10. And exposing the cured first resin layer 3 and the uncured first uncured layer 12 (S02), and disposing the negative photoresist 10 on the first resin layer 3 (S03). And a step of forming a second photomask on the surface of the negative photoresist 10 and exposing to form a cured second resin layer 5 and an uncured second uncured layer 15 (S04) and development And removing the first uncured layer 12 and the second uncured layer 15 (S05), and the one surface 2a of the exposed substrate 2 and the surfaces of the first resin layer 3 and the second resin layer 5, Forming the metal layer 6 by vapor deposition (S06); Only the second one surface 2a and the first resin layer 3 and the second thickness direction of the surface of the resin layer 5 while leaving the metal layer 6 from the other side and a step (S07) of removing.

  First, in the step of disposing the negative photoresist 10 (S01), as shown in FIG. 3, a glass substrate 2 is prepared in which an anchor metal layer (not shown) and an Au layer 8 are sequentially arranged on one surface 2a by sputtering or the like in advance. To do.

  Then, in a dark room (not shown), as shown in FIG. 4, a negative photoresist 10 is applied to one surface 2a of the substrate 2 to a predetermined thickness.

  Next, the process proceeds to the step of forming the first resin layer 3 and the first uncured layer 12 (S02).

  Here, a first photomask formed so as to cover the uncured portion of the negative photoresist 10 is disposed on the surface of the negative photoresist 10 and exposed from above the first photomask. At this time, as shown in FIG. 5, the portion not covered with the first photomask is cured to form the first resin layer 3. On the other hand, the portion covered with the first photomask becomes the first uncured layer 12 without being cured.

  Subsequently, the process proceeds to the step of disposing the negative photoresist 10 on the surface of the first resin layer 3 (S03).

  Here, the same thing as the negative photoresist 10 used when forming the 1st resin layer 3 is used. Then, in the dark room, as shown in FIG. 6, a negative photoresist 10 is applied to one surface 2 a of the substrate 2 to a predetermined thickness.

  Next, the process proceeds to the step of forming the cured second resin layer 5 and the uncured second uncured layer 15 (S04).

  Here, a second photomask formed so as to cover the uncured portion of the negative photoresist 10 is disposed on the surface of the negative photoresist 10 and exposed from above the second photomask. At this time, as shown in FIG. 7, the portion not covered with the second photomask is cured to form the second resin layer 5. On the other hand, the portion covered with the second photomask becomes the second uncured layer 15 without being cured.

  Then, the process proceeds to a step of developing and removing the first uncured layer 12 and the second uncured layer 15 (S05).

  That is, the product manufactured through the above-described steps is immersed in a developer, and the first uncured layer 12 and the second uncured layer 15 are removed as shown in FIG. After removal, the developed product is thoroughly washed.

  Next, the process proceeds to the step of forming the metal layer 6 by a vapor deposition method (S06).

  Here, the above-described state is placed in a vacuum chamber (not shown), and the exposed Au layer 8 of the substrate 2 and the surfaces of the first resin layer 3 and the second resin layer 5 are coated with copper by vacuum deposition. As shown in FIG. 9, the metal layer 6 is formed.

  And it transfers to the process (S07) which leaves the metal layer 6 only on the one surface 2a of the board | substrate 2, and the surface of the thickness direction of the 1st resin layer 3 and the 2nd resin layer 5, and removes it from another surface. At this time, since copper adheres to the surface from the thickness direction of the substrate 2, as shown in FIG. 9, the metal layer 6 formed on the surface in the cross-sectional direction of the first resin layer 3 and the second resin layer 5. Is thinner than the metal layer 6 formed on the surface in the thickness direction. Accordingly, by removing the metal layer 6 from the substrate 2, the first resin layer 3 and the second resin layer 5, and the entire surface, for example, by chemical etching, as shown in FIG. The metal layer 6 remains only on the surface of the first resin layer 3 and the second resin layer 5 in the thickness direction, while the metal layer 6 on the other surface is removed. In addition, as shown in FIG. 11, you may remove the metal layer 6 formed in the surface of the thickness direction of the 2nd resin layer 5 depending on the case. Further, the metal layer 6 may be removed by a mechanical method.

  In this way, the electroforming mold 1 shown in FIG. 1 is obtained.

  A method of manufacturing the electroformed part 16 using the obtained electroforming mold 1 will be described.

  As shown in FIG. 12, the method of manufacturing the electroformed part 16 includes a step of immersing the electroforming mold 1 in an electroforming liquid 17 having metal ions (S11), and applying a voltage to the metal layer 6 of the electroforming mold 1 And a step (S13) of depositing a metal ion metal on the metal layer 6. In this embodiment, the electroformed part 16 is manufactured by nickel (Ni) electroforming. Therefore, the metal is Ni.

  As shown in FIG. 13, an apparatus 18 for manufacturing the electroformed part 16 includes an electroforming tank 20 filled with an electroforming liquid 17, an electrode 21 disposed soaked in the electroforming liquid 17, A power source 23 connected to the Au layer 8 of the electroforming mold 1 and the electrode 21 through the wiring 22 is provided.

  The electroforming liquid 17 varies depending on the metal to be deposited, but when performing Ni electroforming, an aqueous solution containing nickel sulfamate hydrate is used. The electrode 21 is a Ni plate for depositing Ni.

  First, as shown in FIG. 13, a step (S11) of connecting the electric wiring 22 to the Au layer 8 of the electroforming mold 1 and immersing the electroforming mold 1 in the electroforming liquid 17 is performed.

  Subsequently, the process proceeds to a step of supplying electrons by applying a voltage to the metal layer 6 of the electroforming mold 1 (S12). At this time, the Au layer 8 connected to the power source 23 and the metal layer 6 on the substrate 2 are in an electrically connected state. Therefore, when a predetermined voltage is applied from the power source 23 for a predetermined time, electrons are supplied to the metal layer 6 of the substrate 2.

  Then, the process (S13) which deposits the metal of a metal ion on the metal layer 6 is performed.

  That is, Ni ions eluted from the electrode 21 move toward the electroforming mold 1 by applying a voltage. Then, Ni is gradually deposited from the metal layer 6 formed on the substrate 2 in the thickness direction of the substrate 2 to form the electroformed product 25. On the other hand, since no current flows through the metal layer 6 formed on the first resin layer 3, the electroformed product 25 does not precipitate on the metal layer 6.

  When the electroformed product 25 grows up to the position of the metal layer 6 disposed on the first resin layer 3, both of them come into contact with each other, so that the metal layer 6 disposed on the first resin layer 3 through the electroformed product 25 also has a current. Flows. Therefore, Ni begins to be deposited on the metal layer 6. Thus, Ni is deposited until the thickness of the second resin layer 5 is reached as shown in FIG.

  Next, as shown in FIG. 15, the first resin layer 3 and the second resin layer 5 of the electroforming mold 1 are removed by melting with an organic solvent. At this time, the surface of the electroformed product 25 may be polished in advance.

  Then, as shown in FIG. 16, after the Au layer 8 exposed on the substrate 2 of the electroforming mold 1 is removed by etching, the electroformed product 25 is physically peeled off from the substrate by applying a force to separate the electroformed product 25 from the substrate 2. At this time, when the metal layer 6 and the Au layer 8 are attached to the electroformed product 25 and are not necessary, they are removed by wet etching, polishing, or the like.

  In this way, an electroformed part 16 as shown in FIG. 17 is obtained.

  According to this electroforming mold 1 and its manufacturing method, the first resin layer 3 and the second resin layer 5 are stepped in advance, so that each time each step of the electroformed part is formed as in the prior art, There is no need to alternately and repeatedly perform mold forming for electroforming, and the electroformed part 16 having a desired shape can be manufactured by one-time electroforming. Moreover, since the metal layer 6 is formed only on the surface in the thickness direction of the first surface 2a of the substrate 2 and the first resin layer 3 and the second resin layer 5, when performing electroforming, the thickness direction of the substrate 2 Thus, the electroformed product 25 can be deposited only on the surface, and the formation of voids inside the electroformed component 16 can be suitably suppressed.

  In addition, the first resin layer 3 and the second resin layer 5 are formed by curing the negative photoresist 10 without using different methods of curing such as positive negative photoresist. Therefore, the exposure process can be simplified and the process in the dark room can be reduced as compared with the case where a positive photoresist is also used.

  Furthermore, since the metal layer 6 is copper, it is excellent in etching property, and even if the metal layer 6 adheres to an unnecessary place, it can be easily removed and the process before electroforming is easy. Casting can be performed easily and with high adhesion.

Further, according to the method for manufacturing the electroformed part 16, since the Ni electroforming is performed by using the electroforming mold 1 according to the present invention, the electroformed part 16 having a multistage structure can be manufactured by a single electroforming. At this time, as described above, the electroformed part 16 having no voids therein can be manufactured.
The technical scope of the present invention is not limited to the above embodiment, and various modifications can be made without departing from the spirit of the present invention.

  For example, one surface of the substrate of the electroforming mold may be provided with conductivity by arranging an aluminum (Al) vapor deposition layer without an anchor metal layer instead of the Au layer 8. In this case, when the electroformed part is taken out from the electroforming mold, it is possible to easily remove the electroforming from the electroforming mold by melting the Al deposited layer without giving the electroforming product a force to separate from the substrate and physically peeling it from the substrate. Cast parts can be removed. Further, copper or silver may be used instead of the Au layer 8, and the anchor metal layer may be titanium.

  Moreover, in the said embodiment, although the glass substrate is used as a board | substrate, a silicon substrate may be sufficient and metal substrates, such as stainless steel and aluminum, may be sufficient.

  Further, not only the first resin layer 3 and the second resin layer 5 are formed only on the one surface 2a side of the substrate 2, but also the other surface opposite to the one surface 2a of the substrate 2 by the same process. The first resin layer 3 and the second resin layer 5 may be formed. In the case of this electroforming mold, the warpage of the substrate 2 can be suppressed, and the electroformed components 16 can be manufactured in both directions of the substrate 2, and many electroformed components can be manufactured at one time.

  Moreover, although the resin layer 4 shall consist of 2 steps | paragraphs of the 1st resin layer 3 and the 2nd resin layer 5, even if comprised by 3 steps | paragraphs or more, the same effect | action and effect can be show | played.

It is sectional drawing which shows the electroforming mold which concerns on one Embodiment of this invention. It is a flowchart which shows the manufacturing method of the electroforming mold which concerns on one Embodiment of this invention. It is explanatory drawing which shows the manufacturing method of the electroforming mold which concerns on one Embodiment of this invention. It is explanatory drawing which shows the manufacturing method of the electroforming mold which concerns on one Embodiment of this invention. It is explanatory drawing which shows the manufacturing method of the electroforming mold which concerns on one Embodiment of this invention. It is explanatory drawing which shows the manufacturing method of the electroforming mold which concerns on one Embodiment of this invention. It is explanatory drawing which shows the manufacturing method of the electroforming mold which concerns on one Embodiment of this invention. It is explanatory drawing which shows the manufacturing method of the electroforming mold which concerns on one Embodiment of this invention. It is explanatory drawing which shows the manufacturing method of the electroforming mold which concerns on one Embodiment of this invention. It is explanatory drawing which shows the manufacturing method of the electroforming mold which concerns on one Embodiment of this invention. It is explanatory drawing which shows the manufacturing method of the electroforming mold which concerns on one Embodiment of this invention. It is a flowchart which shows the method of manufacturing the electroformed component which concerns on one Embodiment of this invention. It is a schematic diagram which shows the structure of the apparatus used for the method of manufacturing the electroformed part which concerns on one Embodiment of this invention. It is explanatory drawing which shows the method of manufacturing the electroformed component which concerns on one Embodiment of this invention. It is explanatory drawing which shows the method of manufacturing the electroformed component which concerns on one Embodiment of this invention. It is explanatory drawing which shows the method of manufacturing the electroformed component which concerns on one Embodiment of this invention. It is sectional drawing which shows the electroformed part obtained by the method of manufacturing the electroformed part which concerns on one Embodiment of this invention. It is explanatory drawing which shows the manufacturing method of the conventional electroforming mold. It is sectional drawing which shows the conventional electroforming mold. It is explanatory drawing which shows the state which manufactures an electroformed component using the conventional electroforming mold. It is sectional drawing which shows the electroformed part obtained by the manufacturing method of the conventional electroformed part. It is explanatory drawing which shows the manufacturing method of the conventional electroformed component.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Electroforming 2 Board | substrate 2a One surface 3 1st resin layer 4 Resin layer 5 2nd resin layer 6 Metal layer (conductive layer)
10 Negative photoresist (negative photosensitive material)
12 First uncured layer 15 Second uncured layer 16 Electroformed part

Claims (8)

A substrate having at least one surface conductive;
A resin layer laminated stepwise on the substrate with a portion of the one surface of the substrate exposed;
An electroforming mold characterized in that a conductive layer electrically insulated between the respective layers is disposed on the exposed surface of the one surface and the surface in the thickness direction of the resin layer.   2. The electroforming mold according to claim 1, wherein the conductive layer disposed on the resin layer is disposed only on a surface in a thickness direction of another layer excluding the uppermost layer of the resin layer.   The electroforming mold according to claim 1, wherein the resin layer is made of a negative photosensitive material.   The electroforming mold according to any one of claims 1 to 3, wherein the conductive layer is made of copper. Disposing a photosensitive material on the one surface of the substrate having one conductive surface;
Providing a photomask on the surface of the photosensitive material and exposing to form a cured layer and an uncured layer;
Developing and removing the uncured layer to leave a staircase-shaped cured layer;
Forming a conductive layer on the exposed one surface of the substrate and the surface of the cured layer by a vapor deposition method;
And a step of leaving the conductive layer only on one surface of the substrate and a part or all of the surface of the cured layer in the thickness direction and removing the conductive layer from the other surface. Manufacturing method.   6. The method for producing an electroforming mold according to claim 5, wherein the photosensitive material is a negative photosensitive material.   The method for producing an electroforming mold according to claim 6 or 7, wherein the conductive layer is made of copper. Immersing the electroforming mold produced by the method according to any one of claims 5 to 7 in an electroforming liquid having metal ions;
Supplying a voltage by applying a voltage to the conductive layer;
And a step of depositing a metal of the metal ions on the conductive layer.

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