JP2003224345A - Method for manufacturing transfer molding die, transfer molding die and method for forming wiring pattern - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a die for transfer-molding wiring grooves and through holes collectively in a substrate. <P>SOLUTION: A first resist layer is formed in a die basic material (step S1), and then first grooves are made in the die basic material by etching (step S3) and filled with filling ink which is eventually cured (step S5). Subsequently, a second resist layer is formed partially on the surface of the groove filling ink and the die basic material (step S7) and second grooves shallower than the first grooves are made by etching (step S9). In this regard, the die basic material is provided with protrusions in accordance with the depths of the wiring grooves formed in the substrate in wiring pattern and the lengths of the through holes, thus manufacturing a die capable of transfer-molding the wiring grooves and the through holes collectively. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a transfer molding die, and more particularly to a method for manufacturing a transfer molding die for transfer molding wiring grooves and through-holes on a printed wiring board.

[0002]

2. Description of the Related Art In the manufacture of a laminated wiring board, the wiring grooves are transfer-molded on the board by pressing each board to be laminated with a transfer molding die having a convex portion corresponding to the position of the wiring groove. . The transfer mold used here is conventionally
In the manufacturing process, etching processing for forming a plurality of steps could not be performed on the mold base material forming the transfer molding die, and therefore only the convex portion corresponding to the position of the wiring groove could be formed. Therefore, in the case of forming a through hole that conducts electricity between the respective substrates, it is necessary to form a through hole in the substrate after forming the wiring groove by the transfer molding die. Then, a wiring material and holes for through holes formed on the substrate are filled with a metal material, and the respective substrates are laminated and pressure-bonded to each other to form a laminated wiring substrate.

[0003]

However, as in the conventional case, the wiring groove is transfer-molded on the substrate by the transfer molding die in which only the convex portion corresponding to the position of the wiring groove is formed, and in the subsequent step, When a through hole is drilled in the board, there are problems that the working process for manufacturing the printed wiring board becomes long and the cost increases.

Further, by performing the formation of the wiring groove and the through hole drilling process in separate steps, the deviation of the relative position between the wiring groove formed on the substrate and the through hole hole becomes large. There is a possibility.

The present invention has been made in view of the above circumstances, and is a transfer molding for collectively transfer-molding a wiring groove corresponding to a wiring pattern and a through-hole for conduction onto a substrate. An object is to provide a method for manufacturing a mold.

[0006]

According to the present invention, there is provided a method of manufacturing a transfer molding die for transfer molding a wiring groove corresponding to a wiring pattern and a hole corresponding to a through hole for conduction on a substrate. A first resist layer is formed on the surface of the mold base, the mold base is etched to form a first groove, and the formed first groove is filled with a groove filling ink. And a second resist layer is formed on the surface of the cured groove-filling ink and a part of the surface of the mold base.
Transfer molding, characterized in that the mold base material is subjected to the etching process to form a second groove shallower than the first groove, and the second resist layer and the groove filling ink are removed. A method of manufacturing a mold is provided.

According to the above construction, the die base material of the transfer molding die is subjected to the etching process to form the first groove, and the groove filling ink is filled and hardened therein, and then the groove filling ink surface is formed. And, a part of the surface of the mold base material is again etched to form a second groove that is shallower than the first groove, so that two different types of stepped protrusions are formed on the mold base material. It

In this case, in consideration of the depth of the wiring groove formed in the substrate and the length of the hole for the through hole, the wiring groove forming convex portion formed corresponding to the position of the wiring groove and the through hole are formed. A transfer molding die having a hole-forming convex portion formed corresponding to a position is used. By pressing the substrate with such a transfer molding die, the wiring groove corresponding to the wiring groove forming convex portion and the hole corresponding to the hole forming convex portion are collectively transferred and molded on the substrate.

[0009]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings. FIG. 2 is a schematic cross-sectional view of the transfer molding die according to the embodiment of the present invention.

The transfer molding die 10 of this embodiment corresponds to the wiring groove forming projections 11a and 11b formed corresponding to the wiring grooves of the wiring pattern formed on the substrate and the through holes for conduction. And the hole-forming convex portion 12 formed in this manner.

Here, the substrate on which the transfer molding die 10 is to be subjected to wiring pattern formation and through hole formation is
For example, in the case of a sheet-shaped resin sheet material made of a thermoplastic resin and having a thickness of about 100 μm, the transfer molding die 1
The height of the wiring groove forming protrusions 11a and 11b of 0 is
For example, it is formed to have a thickness of 40 μm to 50 μm, and the hole forming protrusion 12 is formed so that the height thereof is further 50 μm to 60 μm from the surface of the wiring groove forming protrusions 11 a and 11 b.

By pressing the substrate with such a transfer molding die 10, the wiring groove forming protrusions 11 are formed on the substrate.
A wiring groove corresponding to the wiring pattern is formed at a position corresponding to a and 11b, and a hole corresponding to a through hole for conduction is formed at a position corresponding to the hole forming convex portion 12. As a result, the wiring groove of the wiring pattern and the hole for the through hole can be collectively transfer-molded on the substrate by one press. Therefore, it is possible to shorten the time required for the substrate processing process for forming the wiring pattern.

Furthermore, since the wiring groove of the wiring pattern and the hole for the through hole can be transfer-molded by one press, even if a large number of substrates are transfer-molded, the wiring between the substrates can be improved. The relative position between the wiring groove of the pattern and the hole for the through hole will not be displaced.

The manufacturing method of the transfer molding die 10 shown in FIG. 2 will be described below with reference to FIGS. 1 and 3 to 12. FIG. 1 is a flow chart of a manufacturing process of a transfer molding die. 3 to 12 are schematic cross-sectional views of the transfer molding die in each manufacturing process. FIG. 3 is a first resist layer forming step, FIG. 4 is a first resist pattern forming step, and FIG. First groove forming step, FIG. 6 is first resist layer removing step, FIG. 7 is groove filling ink filling / curing step, FIG.
9 is a groove filling ink polishing step, FIG. 9 is a second resist layer forming step, FIG. 10 is a second resist pattern forming step, FIG. 11 is a second groove forming step, and FIG. 12 is a second resist layer removing step. 2 is a schematic cross-sectional view of the transfer molding die in FIG.

In the manufacture of the transfer molding die 10, first, as shown in FIG. 3, a first resist layer 2a is formed on the surface of the mold base material 1 to be the transfer molding die 10 (step S1).

In this embodiment, a commercially available heat-resistant glass plate is used as the mold base 1. This heat-resistant glass plate has hardness and heat resistance capable of withstanding a pressing pressure and a pressing temperature when the transfer molding die 10 is pressed later. Further, as the material of the mold base 1, in addition to heat-resistant glass, metal such as stainless steel or ceramic can be used.

As the first resist layer 2a formed on the mold base 1, a photosensitive film such as a diazo type etching resist ink or a dry film resist is used, and is coated or laminated on the surface of the mold base 1, respectively. To form.

The first resist layer 2a formed on the mold base 1 is exposed and developed to form a first resist pattern of the transfer molding mold 10 as shown in FIG. 4 (step). S2).

Next, using the formed first resist pattern as a mask, the mold base 1 is etched to remove unnecessary portions of the mold base 1 as shown in FIG. Forming the first groove 3a (step S3),
Further, as shown in FIG. 6, the first resist layer 2a is peeled and removed (step S4).

In step S3, the wet etching method or the dry etching method may be used as the etching process performed on the mold base material 1 of the heat-resistant glass plate. However, from the viewpoint of environmental load, it is preferable to apply the dry etching method. By this etching process, unnecessary portions of the die base material 1 are removed to form the first grooves 3a.

In addition to the etching process, the sandblasting process can be used to form the first groove 3a. In this case, carborundum is used as the propellant, and this is sprayed at high speed from the ultrafine nozzle corresponding to the width of the wiring groove corresponding to the wiring pattern to be formed onto the surface of the die base material 1 to crush and remove the sprayed portion. When a metal or ceramic is used for the mold base 1, a propellant suitable for the material is used and the processing conditions are appropriately selected.

The depth of the first groove 3a formed by such an etching process or sandblasting process is the desired height of the hole forming projection 12 shown in FIG. 2 from the bottom surface of the first groove 3a. Is formed so that the depth is obtained. That is, the first groove 3a is formed according to the length of the through hole to be formed.

Then, as shown in FIG. 7, the groove-filling ink 4 made of a thermosetting resin is applied to the surface of the mold base 1 on which the first grooves 3a are formed and cured at a predetermined temperature. After that (step S5), as shown in FIG. 8, the groove filling ink 4 protruding from the first groove 3a is polished until the surface of the mold base 1 is exposed (step S6).

Next, as shown in FIG. 9, the first resist layer 2a used in step S1 is formed on the surface of the mold base 1 in which the groove filling ink 4 is filled only in the first groove 3a.
A second resist layer 2b made of the same material as the above is formed (step S7), and a second resist pattern is formed as shown in FIG. 10 (step S8). At this time, the second resist pattern is formed so as to protect the surface of the region filled with the groove filling ink 4, and at the same time, the surface of the region where the hole forming protrusion 12 shown in FIG. 2 is formed. Is formed to protect the.

With the second resist pattern thus formed, the unnecessary portion of the mold substrate 1 is removed by the same method as in step S3, as shown in FIG.
The groove 3b is formed (step S9), and the second resist layer 2b is peeled off as shown in FIG. 12 by the same method as step S4 (step S10). At this time, the depth of the second groove 3b is from the bottom surface of the filled groove filling ink 4, that is, from the bottom surface of the first groove 3a shown in FIG. 5, to the wiring groove shown in FIG. Forming convex portion 11
It is formed so that the desired height of a and 11b can be obtained. That is, the bottom surface of the second groove 3b serves as the upper end surface of the wiring groove forming protrusions 11a and 11b, and therefore, in FIG. 12, a portion between the bottom surface of the first groove 3a and the bottom surface of the second groove 3b is formed. The height is such that the wiring groove forming protrusions 11a and 11b are formed.
It will correspond to the height of.

Finally, the groove filling ink 4 remaining on the mold base 1 is removed by a method such as peeling or melting (step S11), and the wiring groove forming convex portion 11 shown in FIG.
A transfer molding die 10 having a and 11b and hole forming protrusions 12 is obtained.

Further, after that, if necessary, the mold base 1
The surface of the may be roughened. This makes it possible to more clearly recognize the shapes of the wiring groove forming protrusions 11a and 11b and the hole forming protrusion 12 formed on the die base material 1, and to inspect the subsequent transfer molding die. It becomes easy to judge the quality in the process.

According to the above-described manufacturing method, it is possible to form two kinds of convex portions having different steps on the mold base 1, and to match the depth of the wiring groove of the wiring pattern and the length of the hole for the through hole. By forming the convex portion, it is possible to manufacture the transfer molding die 10 for transferring and molding the wiring groove and the through hole on the substrate by one press.

In the production of this transfer molding die 10,
By combining the photolithography technology and the etching processing technology or the sandblasting technology, fine processing of the die base material 1 is realized, and it is possible to deal with the high density of the wiring pattern and the through holes of the wiring board.

Further, in the above manufacturing method, step S
2, the first resist layer 2a described in step S8, the second
It is possible to perform the steps except the exposure / development treatment of the resist layer 2b in the dry process, and it is possible to suppress the outflow of wastewater having a high environmental load.

In the above description, the transfer molding die 10 is used.
The wiring groove forming protrusions 11a, 1 are formed only on one surface of the die base material 1 of FIG.
Although the method of forming the convex portion 1b and the hole forming convex portion 12 has been described, it is also possible to form these on both surfaces of the mold base 1.

In the above description, the transfer molding die 10 having two kinds of steps, that is, the wiring groove forming convex portions 11a and 11b and the hole forming convex portion 12, is described as an example.
After the series of steps from 1 to step S10, the series of steps from step S5 to step S10 is repeated a plurality of times, and finally the step of step S11 is performed, so that transfer molding having a step shape of two or more steps is performed. A mold can also be formed.

[0033]

As described above, according to the present invention, the die base material of the transfer molding die is subjected to the etching process to form the first groove, and the groove-filling ink is filled therein and hardened. A part of the groove-filling ink surface and the surface of the mold base material were again etched to form a second groove shallower than the first groove. Thereby, it is possible to form two different step shapes on the die base material, and to manufacture a transfer molding die capable of collectively transfer molding the wiring groove and the through hole on the substrate. You can

By using such a transfer molding die, the wiring groove and the hole for the through hole are collectively transfer-molded so that the wiring substrate can be formed more easily than in the case where they are formed in separate steps. It is possible to shorten the processing process and reduce the cost.

Further, the transfer groove and the through hole hole are collectively transferred and molded on the substrate, so that the relative position shift between the wiring groove and the through hole hole occurs between the substrates. Will be able to prevent.

[Brief description of drawings]

FIG. 1 is a flow chart of a manufacturing process of a transfer molding die.

FIG. 2 is a schematic sectional view of a transfer molding die according to an embodiment of the present invention.

FIG. 3 is a schematic sectional view of a transfer molding die in the first resist layer forming step.

FIG. 4 is a schematic sectional view of a transfer molding die in a first resist pattern forming step.

FIG. 5 is a schematic sectional view of a transfer molding die in the first groove forming step.

FIG. 6 is a schematic cross-sectional view of a transfer molding die in the first resist layer removing step.

FIG. 7 is a schematic cross-sectional view of a transfer molding die in a groove filling ink filling / curing step.

FIG. 8 is a schematic sectional view of a transfer molding die in a groove filling ink polishing step.

FIG. 9 is a schematic sectional view of a transfer molding die in a second resist layer forming step.

FIG. 10 is a schematic sectional view of a transfer molding die in a second resist pattern forming step.

FIG. 11 is a schematic sectional view of a transfer molding die in a second groove forming step.

FIG. 12 is a schematic sectional view of a transfer molding die in a second resist layer removing step.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Type | mold base material, 2a ... 1st resist layer, 2b ... 2nd resist layer, 3a ... 1st groove | channel, 3b ... 2nd groove | channel, 4 ... Groove filling ink, 10 ... Transfer molds, 1
1a, 11b ... Wiring groove forming projections, 12 ... Hole forming projections.

Claims (9)

[Claims] 1. A method of manufacturing a transfer molding die, comprising forming a wiring groove corresponding to a wiring pattern and a hole corresponding to a through hole for conduction on a substrate by transfer molding, wherein a first resist is formed on a surface of a mold base material. Forming a layer, etching the mold base to form a first groove, filling the formed first groove with a groove filling ink, and curing the cured groove; A second resist layer is formed on the surface of the ink and a part of the surface of the mold base, and the mold base is subjected to the etching process to form a second groove shallower than the first groove. A method for manufacturing a transfer molding die, comprising removing the second resist layer and the groove filling ink. 2. The method for manufacturing a transfer molding die according to claim 1, wherein the substrate is a resin sheet material. 3. The method for producing a transfer molding die according to claim 1, wherein the material of the die base material is glass. 4. The method for manufacturing a transfer molding die according to claim 1, wherein the material of the die base material is ceramic. 5. When filling the groove filling ink into the first groove and curing the same, the groove filling ink is applied to the entire surface of the mold base material and cured to form the groove filling ink. The method for producing a transfer molding die according to claim 1, wherein the ink is polished until the surface of the die substrate is exposed. 6. The method for producing a transfer molding die according to claim 1, wherein the surface of the die base material is subjected to a roughening treatment after the resist layer and the groove filling ink are removed. 7. A method of manufacturing a transfer molding die, comprising forming a wiring groove corresponding to a wiring pattern and a hole corresponding to a through hole for conduction on a substrate by transfer molding, wherein a first resist is formed on a surface of a mold base material. A layer is formed, the mold base material is subjected to sandblasting to form a first groove, and the formed first groove is filled with a groove filling ink and hardened; A second resist layer is formed on the surface of the ink and a part of the surface of the mold base, and the sandblasting is applied to the mold base to form the first resist layer.
Forming a second groove that is shallower than the groove, and removing the second resist layer and the groove filling ink. 8. A transfer molding die for transfer-molding a wiring groove corresponding to a wiring pattern and a hole corresponding to a through hole for conduction, which is formed corresponding to a wiring pattern transferred to a substrate. A transfer molding die, comprising: a wiring groove forming convex portion; and a hole forming convex portion formed corresponding to a through hole transferred to the substrate. 9. A method for forming a wiring pattern, wherein the wiring groove and the hole are collectively transferred and molded on the substrate by pressing the transfer molding die according to claim 8 on a resin sheet material. .