KR20090065896A - Film substrate formed with fine circuit thereon and manufacturing method thereof - Google Patents

Film substrate formed with fine circuit thereon and manufacturing method thereof Download PDF

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Publication number
KR20090065896A
KR20090065896A KR1020070133438A KR20070133438A KR20090065896A KR 20090065896 A KR20090065896 A KR 20090065896A KR 1020070133438 A KR1020070133438 A KR 1020070133438A KR 20070133438 A KR20070133438 A KR 20070133438A KR 20090065896 A KR20090065896 A KR 20090065896A
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KR
South Korea
Prior art keywords
film substrate
master
conductive ink
electrodeposition
plate
Prior art date
Application number
KR1020070133438A
Other languages
Korean (ko)
Inventor
성낙훈
Original Assignee
성낙훈
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 성낙훈 filed Critical 성낙훈
Priority to KR1020070133438A priority Critical patent/KR20090065896A/en
Publication of KR20090065896A publication Critical patent/KR20090065896A/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1258—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by using a substrate provided with a shape pattern, e.g. grooves, banks, resist pattern

Abstract

A film substrate including fine circuits and a manufacturing method thereof are provided to form stably fine circuits on a thin and soft film substrate without causing thermal deformation on the substrate. A film substrate includes a plurality of fine circuits. The film substrate includes a fine circuit pattern(12) and conductive ink(13). A depressed fine circuit pattern is formed at least on one surface of the film substrate. The depressed fine circuit pattern is filled with the conductive ink. The conductive ink is hardened to form the fine circuits. The conductive ink is used for forming the fine circuits. The film substrate is made of a polyimide material or a polyester material.

Description

Film substrate on which a fine circuit is formed and a manufacturing method therefor {FILM SUBSTRATE FORMED WITH FINE CIRCUIT THEREON AND MANUFACTURING METHOD THEREOF}

The present invention relates to a film substrate on which a fine circuit is formed and a method of manufacturing the same, and to a film substrate and a method of manufacturing the same, which can easily and reliably manufacture a fine circuit on a thin and soft film rather than a rigid substrate.

In general, a circuit is formed on a substrate by applying a photosensitive material to the surface of the copper plate laminated on the insulating substrate, and then printing and developing the positive circuit thereon, and then put it in a chemical etchant to remove the copper plate other than the circuit part. A photolithography method of manufacturing a circuit board, and an intaglio and an embossment for forming a circuit on the surface of the printing master, and filling the intaglio and the embossed conductive ink by transferring the conductive ink filled in the intaglio and the embossed to the screen Screen printing methods for manufacturing substrates are widely used.

However, the photolithography method has a high loss of expensive metal materials and consequently consumes a large amount of etchant, which inevitably involves chemical pollution in the etching process, and equipment devices used for manufacturing the circuit board are expensive. Due to the increase in manufacturing cost and the complexity of the work, it is difficult to mass-produce the circuit board.However, the screen printing method does not involve the corrosion process in the method of manufacturing the circuit board, so there is no loss of metal materials and chemicals. There are almost no pollution problems, but there is a problem that the circuit board's range of use is very limited because the electrical resistance of the circuit is not constant according to the screen printing condition of the printing master, and the method of using the circuit board is very limited. It was practically impossible to implement a circuit having a line width of μm.

The way to overcome this is to form a microcircuit on the substrate through imprinting, which can be divided into thermal transfer method and ultraviolet method.

The thermal transfer method is a stamp in which a nano-sized pattern is formed in a relief (uneven) form, as shown in FIG. The separation of the resist material and the anisotropic etching process completely remove the resist material remaining in the pressed part on the surface of the resistor, which has a problem that the multilayer alignment is difficult due to thermal deformation.

In addition, the UV method is spin-coated on the silicon substrate as shown in Figure 6, and then the UV-transparent stamp is filled with a low-viscosity UV curable resin by the surface tension in a state in which a constant distance from the transfer layer, and then the stamp After contact with the transfer layer, UV irradiation to cure the UV curable resin, the stamp is separated and the nanostructures are imprinted on the substrate through the etching process and the lift-off process. there was.

In addition, these methods were difficult to apply when the substrate was thin and soft material such as film.

The present invention has been made to solve the above-mentioned problems of the prior art, the problem of the present invention is to provide a film substrate and a method of manufacturing a fine circuit formed with a simple process without causing thermal deformation on the substrate.

The present invention, in order to achieve the above object of the present invention, the present invention includes at least one intaglio fine circuit pattern formed on one surface, and the conductive ink filled in the intaglio fine circuit pattern, the filled conductive ink is a fine circuit It provides a film substrate with a fine circuit, characterized in that forming.

In the present invention, the film substrate is characterized in that made of polyimide or polyester material.

The present invention also provides a step of preparing a master having an embossed microcircuit pattern formed on at least one surface (S110), and stamping the master on the film substrate to form an intaglio microcircuit pattern corresponding to the embossed microcircuit pattern (S120). ), Removing the master from the film substrate (S130), applying a conductive ink to the film substrate to be filled in the intaglio fine circuit pattern (S140), except the conductive ink filled in the intaglio fine circuit pattern Removing the remaining conductive ink (S150) and the step of curing the conductive ink filled in the intaglio fine circuit pattern (S160) provides a film substrate manufacturing method characterized in that it comprises a fine circuit.

In the method of manufacturing a film substrate of the present invention, the step S120 may be performed in a softened state in which the film substrate is not completely hardened, or after the film substrate is hardened by applying heat in a hardened state, or the film substrate is Characterized in that it is made in a state of curing at room temperature.

Wherein step (S110) is (a) forming the base electrodeposition plate by forming the insulating portion and the receiving groove on one surface of the metal plate, and (b) electroplating the base electrodeposition plate to the electrodeposited metal layer on the surface of the metal plate formed receiving groove Forming, and (c) growing the electrodeposited metal layer in the receiving groove from the edge of the insulating portion through the continuous electroplating process, and (d) the space between the electrodeposited metal layers through the continuous electroplating process. And a step of making a master electrodeposition plate, and (e) applying a release material to the master electrodeposition plate and forming a master by embossing the master electrodeposition plate to form an embossed circuit pattern corresponding to the space.

In contrast, (a ') forming an electrodeposition plate by forming an insulating portion and a receiving groove on one surface of the metal plate, and (b') forming an electrodeposition metal layer on the surface of the metal plate on which the receiving groove is formed by electroforming the base electrodeposition plate. And (c ') growing the electrodeposited metal layer in the receiving groove from the edge of the insulating portion to the center through continuous electroplating, and (d') the space between the electrodeposited metal layers through the continuous electroplating. And forming a master electrodeposition plate, and (e ') forming a master on which an embossed circuit pattern corresponding to the space is formed by applying and curing a liquid resin on the master electrodeposition plate to be filled in the space. . The step (e ') is also characterized by comprising the step of applying a release material between the master electrodeposition plate and the liquid resin.

The film substrate manufacturing method of the present invention is characterized in that the curing of the conductive ink is carried out in an air at room temperature in step S160.

According to the film substrate on which the microcircuit of the present invention is formed and the manufacturing method thereof, the microcircuit can be formed relatively simply and stably even on a thin and soft film substrate.

Hereinafter, with reference to the accompanying drawings will be described in detail with respect to the film substrate with a fine circuit formed in accordance with a preferred embodiment of the present invention and a method of manufacturing the same.

As shown in FIG. 1, in the film substrate 10 in which the microcircuit is formed according to the present embodiment, negative circuit patterns 12 are formed on a film substrate 11 made of polyimide or polyester, The conductive ink 13 is filled in the circuit patterns 12.

A method of forming the film substrate 10 having such a fine circuit is illustrated in FIGS. 2 and 3.

As shown in FIG. 2, the method of manufacturing a film substrate having a fine circuit according to the present embodiment includes a master preparation step (S110), a master stamping step (S120), a master removal step (S130), and a conductive ink application step (S140). , Conductive ink removing step (S150), and conductive ink curing step (S160). This will be described in more detail with reference to FIG. 3.

As shown in FIG. 3, in the master preparation step S110, the master 20 having the circuit pattern 21 embossed on one or both surfaces thereof is prepared. The method of preparing the master 20 will be described in detail later.

In the master stamping step (S120), the master 20 is stamped onto the film substrate 11 by applying a force uniformly to the upper surface of the master 20. This stamping operation may be performed after the film substrate 11 is softened in a semi-finished softened state that is not completely hardened, or after being made softened by applying heat to the cured film substrate 11 which is a finished product. It may be made directly or directly to the cured film substrate 11 which is a finished product at room temperature.

In the master removing step (S130), the circuit pattern 12 of the intaglio is formed on the film substrate 11.

In the conductive ink application step (S140), the conductive ink 13 is evenly spread on the upper surface of the film substrate 11 so that the ink is filled in the intaglio circuit pattern 12 formed on the film substrate 11. The method of applying the ink 13 can be selectively applied according to working conditions among known ink application methods, and is not specifically limited.

In the conductive ink removing step S150, all of the conductive ink 13 applied to the upper surface of the film substrate 11 is removed except for the circuit pattern 12. The method of removing the ink 13 can be selectively applied according to working conditions among the known ink removing methods, and is not specifically limited.

In the conductive ink curing step S160, the film substrate 11 is sufficiently exposed to the atmosphere until the conductive ink 13 filled in the circuit pattern 12 is cured.

Next, a method of manufacturing the master 20 described above will be described with reference to FIG. 4.

First, as shown in (a), after the photosensitive material is applied to the upper portion of the metal plate 31, the exposure operation is performed through a pattern film composed of lines of various shapes to be configured on the photosensitive material, the insulating portion 32 ) And the receiving groove 33 to form a base electrodeposition plate (30a).

Next, as shown in (b), electroplating is performed on the base electrodeposition plate 30a to form an electrodeposition metal layer 34 on the surface of the metal plate 31 on which the accommodation grooves 33 are formed.

Next, as shown in (c), the electrodeposition processing is continued, and the electrodeposition metal layer 34 in the receiving groove 33 grows laterally through the top growth, so that the electrodeposition metal layer 34 is insulated from the edge of the insulation portion 32. Grow to the center of 32.

Next, as shown in (d), if the electroplating is continuously performed, the space 25 between the adjacent electrodeposited metal layers 34 is gradually narrowed by the continuous growth of the electrodeposited metal layer 34. When the space 35 reaches the desired size, the electroplating stops. Thus formed is called a master electrodeposition plate 30.

Next, as shown in (e), by applying a release material to assist the release to the master electrodeposition plate 30 through the electroplating method, the master electroplated again on the master electrodeposition plate 30 to form an embossed circuit pattern 21 20, or alternatively, through a liquid resin method, a liquid resin is applied to a surface of the master electrodeposition plate 30 at a predetermined thickness to be filled in all the spaces 35, and then hardened to form an embossed circuit pattern 21. The master 20 is formed. At this time, a release material may be applied to facilitate demolding.

In this way, the master 20 may be made of a hard material by the pole casting method, or may be made of a soft material by the liquid resin method.

1 is a schematic cross-sectional view of a film substrate on which a fine circuit is formed according to a preferred embodiment of the present invention;

2 is a flow chart showing a method of manufacturing the film substrate of FIG.

3 is schematic diagrams illustratively showing the flow chart of FIG. 2;

4 illustratively illustrates a method of manufacturing the master of FIG. 3;

5 exemplarily shows a method of manufacturing a master of the conventional thermal transfer method; And

6 is a diagram exemplarily illustrating a method of manufacturing a master using a conventional ultraviolet method.

<Explanation of symbols for main parts of drawing>

10 film substrate formed with fine circuit 11 film substrate

12 intaglio circuit pattern 13 conductive ink

20: master 21: embossed circuit pattern

30: master electrodeposition plate 31: metal plate (31)

32: insulation 33: receiving groove

30a: base electrodeposition plate 34: electrodeposition metal layer

Claims (10)

An intaglio fine circuit pattern formed on at least one surface; And Conductive ink filled in the intaglio fine circuit pattern, And the filled conductive ink forms a fine circuit. The film substrate of claim 1, wherein the film substrate is made of polyimide or polyester. (A) preparing a master having an embossed microcircuit pattern formed on at least one surface thereof; (B) stamping the master onto a film substrate such that an intaglio microcircuit pattern corresponding to the embossed microcircuit pattern is formed; (C) removing the master from the film substrate; (D) applying conductive ink to the film substrate to fill the negative microcircuit pattern; (E) removing all of the conductive ink except the conductive ink filled in the negative fine circuit pattern; And (F) a method of manufacturing a film substrate with a fine circuit, comprising the step of curing the conductive ink filled in the intaglio fine circuit pattern. The method of claim 3, wherein the step (B) is performed in a softened state in which the film substrate is not completely hardened. The method of claim 3, wherein the step (B) is performed after the film substrate is cured to make it softened by applying heat. The method of claim 3, wherein the step (B) is performed in a state where the film substrate is cured at room temperature. The method according to any one of claims 3 to 6, wherein step (A) (A) forming a base electrodeposition plate by forming an insulating portion and a receiving groove on one surface of the metal plate; (b) electroforming the base electrodeposition plate to form an electrodeposition metal layer on the surface of the metal plate where the receiving groove is formed; (c) growing the electrodeposited metal layer in the receiving groove from the edge of the insulator to the center through continuous electroplating; (d) forming a master electrodeposition plate by making the space between the electrodeposited metal layers to a desired size through continuous electroplating; And (e) applying a release material to the master electrodeposition plate and subjecting the master electrodeposition plate to form the master on which the embossed circuit pattern is formed corresponding to the space. The method according to any one of claims 3 to 6, wherein step (A) (a ') forming a base electrodeposition plate by forming an insulating part and a receiving groove on one surface of the metal plate; (b ') electroforming the base electrodeposition plate to form an electrodeposition metal layer on a surface of the metal plate on which the receiving groove is formed; (c ') growing the electrodeposition metal layer in the receiving groove from the edge of the insulator to the center through continuous electroplating; (d ') forming a master electrodeposition plate by making a space between the electrodeposited metal layers to a desired size through continuous electroplating; And (e ') a method of manufacturing a film substrate, comprising the step of applying a liquid resin to the master electrodeposition plate to be filled in the space and hardening to form the master with an embossed circuit pattern corresponding to the space. The method of claim 8, wherein the step (e ') comprises the step of applying a release material between the master electrodeposition plate and the liquid resin. The method of manufacturing a film substrate according to any one of claims 3 to 6, wherein the curing of the conductive ink in the step (F) is performed in an air at room temperature.
KR1020070133438A 2007-12-18 2007-12-18 Film substrate formed with fine circuit thereon and manufacturing method thereof KR20090065896A (en)

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KR20090065896A true KR20090065896A (en) 2009-06-23

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101221122B1 (en) * 2010-12-30 2013-01-21 주식회사 트레이스 Method for manufacturing touch screen panel of electric capacity type
KR101295034B1 (en) * 2013-01-17 2013-08-16 미래나노텍(주) Wired electrode of touch screen panel
US9395830B2 (en) 2011-06-15 2016-07-19 Mirae Nano Technologies Co., Ltd. Wired electrode of touch screen panel

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101221122B1 (en) * 2010-12-30 2013-01-21 주식회사 트레이스 Method for manufacturing touch screen panel of electric capacity type
US9395830B2 (en) 2011-06-15 2016-07-19 Mirae Nano Technologies Co., Ltd. Wired electrode of touch screen panel
KR101295034B1 (en) * 2013-01-17 2013-08-16 미래나노텍(주) Wired electrode of touch screen panel

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