KR20090065899A

KR20090065899A - Film substrate formed with fine circuit thereon and manufacturing method thereof

Info

Publication number: KR20090065899A
Application number: KR1020070133443A
Authority: KR
Inventors: 성낙훈
Original assignee: 성낙훈
Priority date: 2007-12-18
Filing date: 2007-12-18
Publication date: 2009-06-23

Abstract

A film substrate including fine circuits and a manufacturing method thereof are provided to form stably fine circuits on a thin and soft film substrate by preventing thermal deformation of the substrate. A master including embossed fine circuit patterns is prepared(S110). The embossed fine circuit patterns are formed on at least one surface of the master. The master is stamped on the film substrate in order to form depressed fine circuit patterns corresponding to the embossed fine circuit patterns(S120). The master is removed from the film substrate(S130). A metal sputtering process is performed to fill up the depressed fine circuit patterns with a metal(S140). The sputtered metal is removed from a surface of the film except for the depressed fine circuit pattern(S150).

Description

Film substrate on which a fine circuit is formed and a manufacturing method therefor {FILM SUBSTRATE FORMED WITH FINE CIRCUIT THEREON AND MANUFACTURING METHOD THEREOF}

The present invention relates to a film substrate on which a fine circuit is formed and a method of manufacturing the same, and to a film substrate and a method of manufacturing the same, which can easily and reliably manufacture a fine circuit on a thin and soft film rather than a rigid substrate.

In general, a circuit is formed on a substrate by applying a photosensitive material to the surface of the copper plate laminated on the insulating substrate, and then printing and developing the positive circuit thereon, and then put it in a chemical etchant to remove the copper plate other than the circuit part. A photolithography method of manufacturing a circuit board, and an intaglio and an embossment for forming a circuit on the surface of the printing master, and filling the intaglio and the embossed conductive ink by transferring the conductive ink filled in the intaglio and the embossed to the screen Screen printing methods for manufacturing substrates are widely used.

However, the photolithography method has a high loss of expensive metal materials and consequently consumes a large amount of etchant, which inevitably involves chemical pollution in the etching process, and equipment devices used for manufacturing the circuit board are expensive. Due to the increase in manufacturing cost and the complexity of the work, it is difficult to mass-produce the circuit board.However, the screen printing method does not involve the corrosion process in the method of manufacturing the circuit board, so there is no loss of metal materials and chemicals. There are almost no pollution problems, but there is a problem that the circuit board's range of use is very limited because the electrical resistance of the circuit is not constant according to the screen printing condition of the printing master, and the method of using the circuit board is very limited. It was practically impossible to implement a circuit having a line width of μm.

The way to overcome this is to form a microcircuit on the substrate through imprinting, which can be divided into thermal transfer method and ultraviolet method.

The thermal transfer method is a stamp in which a nano-sized pattern is formed in the form of relief (unevenness) as shown in FIG. 4, and a cooling process is performed after pressing a surface of a substrate coated with a polymethylmethacrylate (PMMA) resist under high temperature conditions. The separation of the resist material and the anisotropic etching process completely remove the resist material remaining in the pressed part on the surface of the resistor, which has a problem that the multilayer alignment is difficult due to thermal deformation.

In addition, the UV method is spin-coated on the silicon substrate as shown in Figure 5, then the UV-transparent stamp is filled with a low-viscosity UV curable resin in the surface tension in the state maintained a constant distance from the transfer layer, and then the stamp After contact with the transfer layer, UV irradiation to cure the UV curable resin, the stamp is separated and the nanostructures are imprinted on the substrate through the etching process and the lift-off process. there was.

In addition, these methods were difficult to apply when the substrate was thin and soft material such as film.

The present invention has been made to solve the above-mentioned problems of the prior art, the problem of the present invention is to provide a film substrate and a method of manufacturing a fine circuit formed with a simple process without causing thermal deformation on the substrate.

According to the present invention, in order to achieve the above object of the present invention, the present invention comprises the step of preparing a master having an embossed microcircuit pattern on at least one surface (S110), and the intaglio microcircuit pattern corresponding to the embossed microcircuit pattern Stamping the master to the film substrate to form the step (S120), removing the master from the film substrate (S130), and sputtering the metal onto the film substrate so that the metal is filled in the intaglio fine circuit pattern (S140). And removing the sputtered metal on the surface of the film substrate so that the metal filled in the intaglio microcircuit pattern remains (S150).

In the method of manufacturing a film substrate of the present invention, the step S120 may be performed in a softened state in which the film substrate is not completely hardened, or after the film substrate is hardened by applying heat in a hardened state, or the film substrate is Characterized in that it is made in a state of curing at room temperature.

The film substrate manufacturing method of the present invention is characterized in that the sputtered metal removal of step S150 is performed by grinding metal using a grinding tool.

Wherein step (S110) is (a) forming the base electrodeposition plate by forming the insulating portion and the receiving groove on one surface of the metal plate, and (b) electroplating the base electrodeposition plate to the electrodeposited metal layer on the surface of the metal plate formed receiving groove Forming, (c) growing the electrodeposited metal layer in the receiving groove from the edge of the insulating portion to the center through continuous electroplating, and (d) spacing the electrodeposited metal layers to the desired size through continuous electroplating. And a step of making a master electrodeposition plate, and (e) applying a release material to the master electrodeposition plate and forming a master by embossing the master electrodeposition plate to form an embossed circuit pattern corresponding to the space.

In contrast, (a ') forming an electrodeposition plate by forming an insulating portion and a receiving groove on one surface of the metal plate, and (b') forming an electrodeposition metal layer on the surface of the metal plate on which the receiving groove is formed by electroforming the base electrodeposition plate. And (c ') growing the electrodeposited metal layer in the receiving groove from the edge of the insulating portion to the center through continuous electroplating, and (d') the space between the electrodeposited metal layers through the continuous electroplating. And forming a master electrodeposition plate, and (e ') forming a master on which an embossed circuit pattern corresponding to the space is formed by applying and curing a liquid resin on the master electrodeposition plate to be filled in the space. . The step (e ') is also characterized by comprising the step of applying a release material between the master electrodeposition plate and the liquid resin.

The present invention also provides a film substrate with a fine circuit is characterized in that it is produced by the above method.

According to the method of manufacturing a film substrate having a fine circuit of the present invention, it is possible to form a fine circuit relatively simply and stably even on a thin and soft film substrate.

Hereinafter, a method of manufacturing a film substrate on which a fine circuit is formed according to a preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings.

As shown in FIG. 1, the method of manufacturing a film substrate having a fine circuit according to the present embodiment includes a master preparation step (S110), a master stamping step (S120), a master removal step (S130), a metal sputtering step (S140), And sputtering metal removing step S150. This will be described in more detail with reference to FIG. 2.

As shown in FIG. 2, in the master preparation step (S110), the master 20 having the circuit pattern 21 embossed on one or both surfaces thereof is prepared. The method of preparing the master 20 will be described in detail later.

In the master stamping step (S120), the master 20 is stamped onto the film substrate 11 by applying a force uniformly to the upper surface of the master 20. This stamping operation may be performed after the film substrate 11 is softened in a semi-finished softened state that is not completely hardened, or after being made softened by applying heat to the cured film substrate 11 which is a finished product. It may be made directly or directly to the cured film substrate 11 which is a finished product at room temperature.

In the master removing step (S130), the circuit pattern 12 of the intaglio is formed on the film substrate 11.

In the metal sputtering step (S140), the metal 13 is evenly sputtered on the upper surface of the film substrate 11 so that metal is filled in the intaglio circuit pattern 12 formed on the film substrate 11. The method of sputtering can be selectively applied according to working conditions among known methods, and is not specifically limited.

In the sputtered metal removal step (S150), all of the sputtered metal on the surface of the film substrate 11 is removed using a known grinding tool 41. At this time, the metal filled in the intaglio circuit pattern 12 is left without being removed to form a fine circuit.

Next, a method of manufacturing the master 20 described above will be described with reference to FIG. 3.

First, as shown in (a), after the photosensitive material is applied to the upper portion of the metal plate 31, the exposure operation is performed through a pattern film composed of lines of various shapes to be configured on the photosensitive material, the insulating portion 32 ) And the receiving groove 33 to form a base electrodeposition plate (30a).

Next, as shown in (b), electroplating is performed on the base electrodeposition plate 30a to form an electrodeposition metal layer 34 on the surface of the metal plate 31 on which the accommodation grooves 33 are formed.

Next, as shown in (c), the electrodeposition processing is continued, and the electrodeposition metal layer 34 in the receiving groove 33 grows laterally through the top growth, so that the electrodeposition metal layer 34 is insulated from the edge of the insulation portion 32. Grow to the center of 32.

Next, as shown in (d), if the electroplating is continuously performed, the space 25 between the adjacent electrodeposited metal layers 34 is gradually narrowed by the continuous growth of the electrodeposited metal layer 34. When the space 35 reaches the desired size, the electroplating stops. This formed is called the master electrodeposition plate (30).

Next, as shown in (e), by applying a release material to assist the release to the master electrodeposition plate 30 through the electroplating method, the master electroplated again on the master electrodeposition plate 30 to form an embossed circuit pattern 21 20, or alternatively, through the liquid resin method, a liquid resin is applied to one surface of the master electrodeposition plate 30 to a predetermined thickness so as to be filled in all the spaces 35 and the embossed circuit pattern 21. This formed master 20 is made. At this time, a release material may be applied to facilitate demolding.

In this way, the master 20 may be made of a hard material by the pole casting method, or may be made of a soft material by the liquid resin method.

1 is a flow chart showing a method for manufacturing a film substrate with a fine circuit according to a preferred embodiment of the present invention;

2 is schematic diagrams illustratively showing the flow chart of FIG. 1;

3 illustratively illustrates a method of manufacturing the master of FIG. 2;

4 exemplarily illustrates a method of manufacturing a master of the conventional thermal transfer method; And

FIG. 5 is a diagram exemplarily illustrating a method of manufacturing a master according to a conventional UV method.

11 film substrate 12 intaglio circuit pattern

13: metal 20: master

21: embossed circuit pattern 30: master electrodeposition plate

31 metal plate 31 32 insulation part

33: receiving groove 30a: base electrodeposition plate

34: electrodeposition metal layer 41: grinding tool

Claims

(A) preparing a master having an embossed microcircuit pattern formed on at least one surface thereof;

(B) stamping the master on a film substrate such that an intaglio microcircuit pattern corresponding to the embossed microcircuit pattern is formed;

(C) removing the master from the film substrate;

(D) sputtering the metal onto the film substrate so that the metal is filled in the negative microcircuit pattern; And

(E) removing the sputtered metal on the surface of the film substrate so that the metal filled in the intaglio fine circuit pattern remains.

The method of claim 1, wherein the step (B) is performed in a softened state in which the film substrate is not completely hardened.

The method of claim 1, wherein the step (B) is performed after the film substrate is hardened by applying heat in a cured state.

The method of claim 1, wherein the step (B) is performed in a state where the film substrate is cured at room temperature.

The method of claim 1, wherein step (E) is performed by removing the sputtered metal by grinding the metal using a grinding tool.

The method according to any one of claims 1 to 5, wherein step (A)

(A) forming a base electrodeposition plate by forming an insulating portion and a receiving groove on one surface of the metal plate;

(b) electroforming the base electrodeposition plate to form an electrodeposition metal layer on the surface of the metal plate where the receiving groove is formed;

(c) growing the electrodeposited metal layer in the receiving groove from the edge of the insulator to the center through continuous electroplating;

(d) forming a master electrodeposition plate by making the space between the electrodeposited metal layers to a desired size through continuous electroplating; And

(e) applying a release material to the master electrodeposition plate and subjecting the master electrodeposition plate to form the master on which the embossed circuit pattern is formed corresponding to the space.

The method according to any one of claims 1 to 5, wherein step (A)

(a ') forming a base electrodeposition plate by forming an insulating part and a receiving groove on one surface of the metal plate;

(b ') electroforming the base electrodeposition plate to form an electrodeposition metal layer on a surface of the metal plate on which the receiving groove is formed;

(c ') growing the electrodeposition metal layer in the receiving groove from the edge of the insulator to the center through continuous electroplating;

(d ') forming a master electrodeposition plate by making a space between the electrodeposited metal layers to a desired size through continuous electroplating; And

(e ') a method of manufacturing a film substrate, comprising the step of applying a liquid resin to the master electrodeposition plate to be filled in the space and hardening to form the master with an embossed circuit pattern corresponding to the space.

The method of claim 7, wherein the step (e ') comprises the step of applying a release material between the master electrodeposition plate and the liquid resin.

A film substrate with a fine circuit, characterized in that it is produced by the method as claimed in any one of claims 1 to 5.