JP5073868B1 - Method of manufacturing transfer mold and transfer mold - Google Patents

Abstract

Provided is a transfer mold having good workability and high durability for forming parts by electroforming. Forming a resist reinforcing groove on a metal substrate; and forming a reverse resist pattern having a part shape on the resist reinforcing groove, covering the groove and having a height exceeding the depth of the groove, and having a side wall having a desired angle α. Forming a reverse resist pattern, and thermally curing the reverse resist pattern. The edges of the reverse resist pattern are prevented from being peeled off by reinforcing the edges of the reverse resist pattern with resist reinforcing grooves.
[Selection] Figure 3

Description

  The present invention relates to a transfer mold manufacturing method and the transfer mold, and more particularly, a transfer mold manufacturing method having good workability and high durability for forming a part by electroforming. It relates to the transfer mold.

  The electroforming method is less subject to area restrictions and can form thick film conductors, so display parts such as wristwatch display letters and hands, small gears, springs, pipes, and mechanical parts such as diagrams (pressure sensors) It is widely used for electronic parts such as wiring of semiconductor devices and coils.

  In Patent Document 1, when manufacturing a nest, first, a cutting master having a fine pattern formed in advance is formed, and then a transfer master is formed from the cutting master by hot pressing, and then a transfer master using electroforming. There is a description to form a nesting from.

  In Patent Document 2, a step of forming a mask pattern having an opening on a silicon wafer surface, a step of performing anisotropic etching, a step of forming a common electrode film, and an electroformed film grown from the common electrode film are disclosed. There is a description that the timepiece dial is formed by the step of forming, the step of etching the silicon wafer, and the step of forming a resin-made timepiece dial having convex portions using the electroformed film as a transfer mask.

  FIG. 4 is a structural view of a part formed by a conventional electroforming process. In FIG. 4a, in order to form the component 50, the component shape is patterned on the photoresist 20 by the photowork on the metal substrate 10. A predetermined metal (Ag, Cu, Ni, etc.) is electrodeposited on the metal substrate 10 on which the resist pattern is formed by electroforming (hereinafter referred to as electroforming), and the component 50 is formed.

  In FIG. 4 b, the component 50 transferred and formed by electroforming is transplanted to the component substrate 70 through an adhesive 60. In this way, a component having an arbitrary shape according to the application is formed by electroforming and transplanted to the component substrate 70 and used.

  In this case, the angle β of the side wall of the photoresist 20 is set to a gentle side wall inclination angle β of 45 ° or less in order to facilitate removal of the component 50 and implantation. By the way, when creating electronic parts such as wirings and coils formed on a semiconductor substrate, the wiring patterns and inductive coils are formed because they are formed along the sidewalls of the photoresist 20 by electroforming. When it is long, the contact area between the side walls increases, and the peeling resistance in peeling during transplantation increases. In order to transplant to the component substrate 70, a peeling force against the increased peeling resistance is applied, so that the resist pattern edge of the photoresist 20 in close contact with the metal substrate 10 is easily peeled off. There arises a problem that peeling occurs and the pattern becomes unusable.

  Next, production of display parts such as display characters and hands of a conventional wristwatch by electroforming, and mechanical parts such as small gears, springs, pipes, and diagrams (pressure sensors) will be described. Similarly, each conventional component is manufactured in the process of FIG. Also in this case, depending on the type of components such as gears, the contact area between the metal substrate 10 and the component 50 increases, the peeling resistance in peeling when the component 50 is transplanted increases, and the transplanting operation becomes difficult. Further, in the case of a spring or the like, since the contact between the side walls becomes long, the peeling resistance with the side wall of the photoresist 20 increases, and the resist pattern edge of the photoresist 20 is easily peeled off at the time of peeling at the time of implantation. Become.

JP 2004-1535 A JP 2004-257861 A

  The present invention has been made to solve such a problem, and an object of the present invention is to produce a transfer mold having good workability and high durability for forming parts by electroforming, and It is to provide the transfer mold.

  The manufacturing method of the first embodiment of the transfer mold according to the present invention includes a step of forming a reverse resist pattern having a part shape having a desired angle α on a metal substrate, and a step of thermally curing the reverse resist pattern. And forming a resist reinforcing portion for preventing peeling of the edge of the reverse resist pattern by electrodepositing metal at a place excluding the reverse resist pattern of the metal substrate by electroforming to reinforce the edge of the reverse resist pattern; , Including.

  The manufacturing method of the second embodiment of the transfer mold according to the present invention includes a step of forming a rough surface layer for enhancing adhesion to an adherend on an upper surface of a metal substrate, and a side wall of the metal substrate having a desired side wall Patterning a reverse resist pattern having a shape of a part having an angle α, a step of thermally curing the reverse resist pattern, and electrodeposition of a metal to a place excluding the reverse resist pattern of a metal substrate by electroforming, thereby Forming a resist reinforcing portion for preventing edge peeling of the reverse resist pattern by reinforcing the edge.

  The manufacturing method of the third embodiment of the transfer mold of the present invention has a step of forming a resist reinforcing groove on the metal substrate, and a height that covers the groove and exceeds the depth of the groove on the resist reinforcing groove, Forming a reverse resist pattern of a part shape whose side wall has a desired angle α, and thermosetting the reverse resist pattern, and reinforcing the edges of the reverse resist pattern by resist reinforcing grooves. It is characterized by preventing peeling of the edge of the pattern.

  In the manufacturing method of the first or second embodiment of the transfer mold according to the present invention, the method further includes a step of forming an insulating layer on the resist reinforcing portion excluding a place where the part is formed.

  In the manufacturing method of the third embodiment of the transfer mold according to the present invention, the method further includes the step of forming an insulating layer on the metal substrate excluding the place where the component is formed and the reverse resist pattern.

  The transfer mold of the present invention is produced by the above-described transfer mold manufacturing method.

  The component of the present invention is characterized by being transferred and manufactured by electroforming using the transfer mold described above.

  According to the present invention, it is possible to provide a transfer mold having good workability and high durability for forming a part by electroforming.

1 is a structural diagram of a transfer mold according to a first embodiment of the present invention. FIG. 6 is a structural diagram of a transfer mold according to a second embodiment of the present invention. FIG. 6 is a structural diagram of a transfer mold according to a third embodiment of the present invention. The component structure figure formed in the process by the conventional electroforming method.

  The manufacturing process of the transfer mold according to the present invention will be described with reference to the drawings. FIG. 1 is a structural diagram of a transfer mold according to the first embodiment. In FIG. 1, in order to form the component 50, a reverse pattern of the component shape is formed on the metal substrate 10 with a desired inclination angle α on the side wall of the photoresist 20 by photowork. Next, heat treatment is performed to heat cure the photoresist 20 to obtain a solid insulating layer. The inclination angle α of both side walls can be arbitrarily determined depending on the material of the applied photoresist 20, the film thickness, and the exposure conditions irradiated through a photomask (not shown).

Subsequently, in order to form the resist reinforcing portion 30, a metal is electrodeposited on the metal substrate 10 by electroforming. Next, an insulating layer treatment for forming an insulating layer 35 such as SiO ₂ is performed on the resist reinforcing portion 30 excluding the place where the component is formed, and the portions other than the component pattern are electrically insulated, and the transfer mold Is completed. This transfer mold is formed with a resist reinforcing portion 30 for preventing the peeling of the photoresist 20 constituting the part shape, so that the edge of the photoresist 20 is prevented from peeling off, the workability is good, and the durability is high. A rich transfer mold can be provided.

  FIG. 2 is a structural diagram of a transfer mold according to the second embodiment of the present invention. In FIG. 2, a roughening process for forming a rough surface layer 40 on the upper surface of the metal substrate 10 is performed before forming a reversal pattern of the component shape by the photoresist 20. The rough surface layer 40 may be formed by roughening the surface of the metal substrate 10 to a degree having conductivity by direct hydrochloric acid treatment or the like, or the surface of the metal substrate 10 is made conductive by photowork. It may be formed as a photo pattern layer suitable for roughening such as a stripe shape or a lattice shape capable of maintaining the above.

Next, in order to form the component 50, a reverse pattern of the component shape is patterned on the photoresist 20 by photowork on the metal substrate 10 as in FIG. Next, heat treatment is performed to thermally cure the photoresist 20 to obtain a solid insulating layer. Subsequently, in order to form the resist reinforcing portion 30, a metal is electrodeposited on the metal substrate 10 by electroforming. Next, an insulating layer treatment for forming an insulating layer 35 such as SiO ₂ is performed on the resist reinforcing portion 30 excluding the place where the component is formed, and the portions other than the component pattern are electrically insulated, and the transfer mold Is completed. This transfer mold has a rough surface layer 40 that reinforces the adhesion between the photoresist 20 and the resist reinforcing portion 30 constituting the part shape, and the resist reinforcing portion 30 for preventing the photoresist 20 from peeling off. Therefore, a transfer mold having good workability and high durability can be provided.

  FIG. 3 is a manufacturing process diagram of a transfer mold according to a third embodiment of the present invention. In FIG. 3, a reinforcing groove forming process for forming the resist reinforcing groove 15 is performed on the metal substrate 10. In this reinforcing groove forming process, a reversal pattern of the resist reinforcing groove 15 is formed of a photoresist with a photowork, and using this reversal pattern as a mask, chemically by chemical etching or the like, or physically processed by beam etching or the like. And the resist reinforcing groove 15 may be formed, or may be formed directly by operating a cutting means with an electric beam or a mechanical cutting tool.

  Next, as in FIG. 1, an inverted pattern of the shape of the part 50 whose side wall has a desired inclination angle α is formed on the resist reinforcing groove 15 by a photowork, and the patterned photoresist 20 is heated. Curing completes the transfer mold. Since this resist mold is provided with a resist reinforcing groove 15 for preventing the photoresist 20 from peeling off, the edge of the photoresist 20 is prevented from being peeled off, and the transfer mold has good workability and high durability. A mold can be provided. As in the first and second embodiments, an insulating layer may be formed on the surface of the metal substrate 10 excluding the place where components are formed and on the photoresist 20.

  Thus, in any of the above transfer molds, a transfer mold having good workability and high durability can be provided. In addition, since it is strong against peeling, the inclination angle α of the side wall can be made steeper than the conventional 45 °, and a higher density pattern can be formed.

The metal substrate 10 may be a metal plate such as SUS, Ni, or Cu. The insulating layer 35 may be an organic or inorganic resist in addition to an inorganic oxide film such as SiO ₂ . The electroforming material of the component 50 may be Ag, Cu, Ni, Au, Sn, Pb, Fe, Cr, Pt, Pd, and alloys thereof.

  1 to 3, the component 50 produced by electroforming may be transplanted to the component substrate 70 via the adhesive 60 as in FIG. 4b, or may be transplanted by a green sheet (not shown). May be. In this case, the green sheet is heat-treated and cured after transplanting, but the adhesive 60 is not necessary since the green sheet is soft enough to be embedded in the component 50 before curing.

DESCRIPTION OF SYMBOLS 10 Metal substrate 15 Resist reinforcement groove | channel 20 Patterned photoresist 30 Resist reinforcement part 35 Insulating layer 40 Rough surface layer 50 Component 60 Adhesive 70 Component substrate
α Side wall inclination angle
β Side wall inclination angle

Claims (4)

Forming a resist reinforcing groove on the metal substrate;
On the resist reinforcing groove, forming a reverse resist pattern having a part shape that covers the groove and has a height that exceeds the depth of the groove, and whose side wall has a desired angle α;
Heat-curing the reverse resist pattern, and reinforcing the edge of the reverse resist pattern by the resist reinforcing groove to prevent peeling of the edge of the reverse resist pattern. Production method. In the manufacturing method of the transfer metallic mold according to claim 1,
A method of manufacturing a transfer mold, further comprising the step of forming an insulating layer on the metal substrate excluding a place where a component is formed and the reverse resist pattern.   A transfer mold produced by the method for manufacturing a transfer mold according to claim 1.   A part produced by electrocasting using the transfer mold according to claim 3.

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