JP2006305786A - Mold manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a mold manufacturing method which enables the shortening of the manufacturing time of the mold while reducing the production cost of the mold. <P>SOLUTION: The mold 7 is obtained by applying metallurgical treatment, which uses a fine powder 6 comprising a metal or ceramic powder, to a substrate 1, which has a predetermined formed pattern 4, on the side of the formed pattern 4. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a method for manufacturing a mold, and more particularly to a method for manufacturing a mold used for obtaining a molded product having a precision structure.

As a method of manufacturing a mold for forming a precision dimension product such as a resin product, there is one disclosed in Patent Document 1. In such a mold manufacturing method, a predetermined shape (formation pattern) is formed by anisotropic etching on a single crystal substrate such as silicon or quartz, and sputtering and electroforming are performed on the formation surface side of the shape of the single crystal substrate. And a method of forming the mold by transferring the shape is known.
Japanese Patent Laid-Open No. 5-4232

  However, in such a mold manufacturing method, it takes time to manufacture the mold by electroforming, which increases the manufacturing cost of the mold, and there is room for improvement in the manufacturing method.

  Accordingly, the present invention has been made in view of this problem, and in a manufacturing method for obtaining a mold by transferring the shape after obtaining a predetermined shape by etching on a substrate, the manufacturing time of the mold is shortened. An object of the present invention is to provide a mold manufacturing method that can reduce the manufacturing cost of the mold.

  As in the method for manufacturing a mold according to claim 1, the present invention performs metallurgy processing using a fine powder made of metal or ceramic on the side of the formation pattern of a substrate having a predetermined formation pattern. Is what you get.

  The mold manufacturing method according to claim 2 is the mold manufacturing method according to claim 1, wherein a plating layer is formed on a surface of the substrate on which the formation pattern is formed, and after the plating layer is formed. The metallurgical treatment is performed.

  The mold manufacturing method described in claim 3 is the mold manufacturing method described in claim 2, wherein the plating layer is made of nickel or chromium.

  The mold manufacturing method described in claim 4 is the mold manufacturing method described in claim 1, wherein the substrate is made of silicon.

  The present invention relates to a manufacturing method for obtaining a mold by obtaining a predetermined shape by etching on a substrate and then transferring the shape to reduce the manufacturing time of the mold and reduce the manufacturing cost of the mold. it can.

  Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings.

  FIG. 1 illustrates a first embodiment showing a mold manufacturing method. In the mold manufacturing method, a flat substrate 1 made of glass, quartz or silicon is prepared (FIG. 1A), and a photosensitive resin material is applied onto the substrate 1 by spin coating or printing. A resist layer 2 is formed (FIG. 1B).

  Next, the resist layer 2 is baked to obtain a predetermined resist pattern 3. Then, by using this resist pattern 3 as a mask, a dry etching process using SF6CF4 or the like, or a wet etching process using KOH aqueous solution, TMAH, hydrofluoric acid, or the like is used to form a formation pattern (a gold pattern to be described later) on the substrate 1. The pattern 4 transferred to the mold is etched (FIG. 1C).

  Next, the resist layer 2 remaining on the substrate 1 is removed using a resist removing solution to obtain an original plate 5 having a formation pattern 4 having a predetermined shape (FIG. 1D).

  Then, the original plate 5 is placed upward on a jig (not shown) (the formation pattern 4 is upward), and a fine powder 6 made of a metal material such as nickel, chromium, super steel, or ceramic is formed on the original plate 5. A predetermined amount is disposed (FIG. 1 (e)), and then a metallurgical process is performed to bake and harden the fine powder 6 by HIP (hot isostatic pressing) or SPS (plasma sintering), thereby forming the pattern 4 of the original 5 1 is obtained (FIGS. 1 (f) and 1 (g)).

  The manufacturing method of this metal mold | die 7 is the manufacturing method which obtains a metal mold | die by the conventional electroforming by performing the metallurgical process using the fine powders 6, such as a metal powder or a ceramic powder, and employ | adopting the metal mold | die 7 manufacturing method Compared to, the mold can be manufactured in a short time. In addition, since the manufacturing time can be shortened, the manufacturing cost of the mold can be reduced.

  Next, a second embodiment showing a method for manufacturing a mold will be described with reference to FIG. 2. The same reference numerals are used for the same or corresponding parts as in the first embodiment described above, and the detailed description thereof will be given. Omit.

  The metal mold manufacturing method shown in the second embodiment is different from the metal mold manufacturing method in the first embodiment in the metallurgical process after the master 5 is formed. That is, after obtaining the original 5, the plating layer 8 is formed on the formation surface 4 side of the formation pattern 4 of the original 5, and a predetermined amount of fine powder 6 is disposed on the formation surface side of the plating layer 8 (FIG. 2E). Thereafter, metal mold processing for baking and solidifying the fine powder 6 by the HIP method or the SPS method is performed to obtain the mold 9 (FIGS. 2 (f) and 2 (g)). The plating layer 8 is formed of, for example, a nickel plating layer or a chromium plating layer by an electroless plating method, and is formed to have a predetermined thickness. In the case where the substrate 1 is made of silicon, the plating layer 8 can also be obtained by electrolytic plating.

  The manufacturing method of the mold 9 in the second embodiment can obtain the same effects as those of the first embodiment described above. Further, since the formation pattern 4 can be molded by the plating layer 8, the formation pattern 4 can be accurately transferred to the mold 9.

  In the manufacturing method of the molds 7 and 9 described above, the metallization process using the fine powder 6 made of metal powder or ceramic powder is performed on the formation pattern 4 side of the substrate 1 having the predetermined formation pattern 4 to obtain the molds 7 and 9. 9, the molds 7 and 9 can be obtained in a shorter time than before, and the manufacturing cost can be reduced.

  In the mold manufacturing method according to the second embodiment, a plating layer 8 made of nickel or chromium is formed on the surface of the formation pattern 4 of the substrate 1, and the metallurgical treatment is performed after the formation of the plating layer 8. In addition, since the formation pattern 4 can be molded by the plating layer 8, the formation pattern 4 can be transferred to the mold 9 more accurately.

  In addition, by using silicon for the substrate 1, it is possible to use an electrolytic plating method in addition to the electroless plating method when forming the plating layer 8, and the degree of freedom of the manufacturing process can be increased.

It is a figure which shows the manufacturing method of the metal mold | die of the 1st Embodiment of this invention. It is a figure which shows the manufacturing method of the metal mold | die of the 2nd Embodiment of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Substrate 2 Resist layer 3 Resist pattern 4 Formation pattern 5 Original plate 6 Fine powder 7,9 Mold 8 Plating layer

Claims (4)

  A metal mold manufacturing method, wherein a metal mold is obtained by performing metallurgical processing using a fine powder made of metal or ceramic on a side of the substrate having a predetermined pattern.   The method for producing a mold according to claim 1, wherein a plating layer is formed on a side of the substrate on which the formation pattern is formed, and the metallurgical treatment is performed after the formation of the plating layer.   The mold manufacturing method according to claim 2, wherein the plating layer is made of nickel or chromium.   The method for manufacturing a mold according to claim 1, wherein the substrate is made of silicon.

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