JPWO2013072953A1 - Method for manufacturing transfer mold, transfer mold manufactured by the method, and parts manufactured by the transfer mold - Google Patents

Abstract

Provided are a transfer mold having a high durability and a high aspect ratio for forming a part by electroforming, and a part manufactured thereby. A step of forming a part-shaped resist pattern having a desired aspect ratio and a side wall having a desired angle α on the metal substrate 10, and the part-shaped resist pattern having a predetermined thickness by electroforming The process includes a step of producing a transfer mold by being filled up to reach a position, and a step of producing a master mold 20 by separating the transfer mold from the metal substrate.

Description

  The present invention relates to a method for manufacturing a transfer mold, a transfer mold manufactured by the transfer mold, and a component manufactured by the transfer mold, and more particularly, for durability for forming a part by electroforming. The present invention relates to a method for producing a transfer die by electroforming, which is rich and has an aspect ratio, a transfer die using the method, and parts thereof.

  The electroforming method is less subject to area restrictions and can form thick film conductors, so display parts such as wristwatch display letters and hands, small gears, springs, pipes, and mechanical parts such as diagrams (pressure sensors) It is widely used for electronic parts such as wiring of semiconductor devices and coils.

  In Patent Document 1, when manufacturing a nest, first, a cutting master having a fine pattern formed in advance is formed, and then a transfer master is formed from the cutting master by hot pressing, and then a transfer master using electroforming. There is a description to form a nesting from.

  In Patent Document 2, a step of forming a mask pattern having an opening on a silicon wafer surface, a step of performing anisotropic etching, a step of forming a common electrode film, and an electroformed film grown from the common electrode film are disclosed. There is a description that the timepiece dial is formed by the step of forming, the step of etching the silicon wafer, and the step of forming a resin-made timepiece dial having convex portions using the electroformed film as a transfer mask.

  FIG. 6 is a structural view of a part formed by a conventional transfer mold. In FIG. 6a, in order to form the component 95, a component shape is patterned on the photoresist 30 by a photowork on the metal substrate 90. Using the metal substrate 90 on which the resist pattern is formed as a transfer mold, a predetermined metal (Ag, Cu, Ni, etc.) is electrodeposited by electroforming (hereinafter referred to as electroforming), and a component 95 is formed.

  In FIG. 6 b, the component 95 transferred and formed by electroforming is transplanted to the component substrate 97 through the adhesive 85. In this way, a component having an arbitrary shape according to the application has been used by being formed by electroforming and transplanted to the component substrate 97.

  In this case, the angle β of the side wall of the photoresist 30 is set to a gentle angle of less than 45 ° in order to facilitate removal of the component 95 and implantation. By the way, when creating electronic parts such as wirings and coils formed on a semiconductor substrate, an aspect ratio in which the thickness of the line is larger than the line width is required to reduce electrical resistance. A thickness of about 10 μm is required.

  Since the component 95 is formed in a state of being embedded by electroforming along the side wall of the photoresist 30 of about 10 μm, when the wiring pattern or the inductive coil is long, the contact area between the side walls is This increases the peeling resistance in peeling during transplantation. In the case of using a transfer mold using a patterned photoresist in this manner, in order to transfer to the component substrate 97, a peeling force against the increased peeling resistance is applied, so that the metal substrate 90 is in close contact. The resist pattern edge of the photoresist 30 is easily peeled off, and the resist is peeled off after 2 to 3 uses, resulting in a problem that the transfer mold cannot be used.

JP 2004-1535 A JP 2004-257861 A

  The present invention has been made to solve such a problem, and is produced by a transfer mold having a high durability and a high aspect ratio for forming a part by electroforming, and the transfer mold. The purpose is to provide spare parts. There are four types of transfer molds: a master mold, a mother mold, a sun mold, and a transfer mold. The master mold is a mold that is the basis for manufacturing parts, and is usually not used directly for manufacturing parts. The mother mold is a mold that is manufactured by inverting the irregularities of the master mold using the master mold. This mother mold is also not directly used for manufacturing parts. The sun mold is a mold manufactured by inverting the irregularities of the mother mold using the mother mold. Therefore, the sun mold has the same shape as the master mold. Usually, this sun mold is subjected to insulation layer treatment, release layer treatment, etc. to produce a transfer mold, and parts are manufactured using this, and when the transfer mold is worn out, the master mold is again used as the mother mold, A new transfer mold is produced through the sun mold.

  The method for producing a transfer mold of the present invention comprises a step of forming a resist pattern having a desired shape on a metal substrate and having a desired angle α on its side wall, and a resist having a desired shape. Filling the pattern until it reaches a predetermined thickness by electroforming and producing a transfer mold; and separating the transfer mold from the metal substrate to produce a master mold. .

  The method for producing a transfer mold of the present invention comprises a step of forming a resist pattern having a desired shape on a metal substrate and having a desired angle α on its side wall, and a resist having a desired shape. A pattern is filled up to a predetermined thickness by electroforming to produce a transfer mold, a transfer mold is separated from a metal substrate to produce a master mold, and a master mold to a mother mold Through the step of transferring and producing the sun mold, the peeling layer treatment for facilitating the peeling of the parts formed by electroforming on the sun mold, and the insulating layer treatment for forming an insulating layer in a portion other than the part formation And producing a transfer mold.

  The method for producing a transfer mold of the present invention is characterized in that it includes a step of forming a roughened layer on the surface of a metal substrate first.

  The method for producing a transfer mold of the present invention comprises a step of forming a resist pattern having a desired shape ratio on a metal substrate and a resist pattern having a part shape having a side wall angle of approximately 90 °. Filling the resist pattern until it reaches a predetermined thickness by electroforming, producing a transfer mold, separating the transfer mold from the metal substrate, and parts to be transferred on the separated transfer mold The step of performing the photoresist work so that the resist pattern layer remains in the portion excluding, and the resist pattern layer as a protective layer so that the angle of the side wall of the component shape is approximately 90 ° to less than 90 °, And beam processing to produce a master mold.

  The method for producing a transfer mold of the present invention comprises a step of forming a component-shaped resist pattern having a desired aspect ratio and a side wall angle of approximately 90 ° on a metal substrate; Filling the resist pattern until it reaches a predetermined thickness by electroforming, producing a transfer mold, separating the transfer mold from the metal substrate, and parts to be transferred on the separated transfer mold The step of performing the photoresist work so that the resist pattern layer remains in the portion excluding, and the resist pattern layer as a protective layer so that the angle of the side wall of the component shape is approximately 90 ° to less than 90 °, Beam processing to produce a master mold, transfer from the master mold to the mother mold, transfer the sun mold, and electroforming the sun mold. Performing a peeling layer process for facilitating the peeling of the part formed by the step of forming a transfer mold by performing an insulating layer process for forming an insulating layer in a part other than the part formation. .

  The method for producing a transfer mold of the present invention is characterized in that it includes a step of forming a roughened layer on the surface of a metal substrate first.

  The master mold of the present invention is manufactured by the above-described transfer mold manufacturing method, and has a cross-section having a desired aspect ratio and a side wall angle of 45 ° to 88 °.

  The transfer mold of the present invention is characterized in that the sun mold manufactured using the master mold described above is manufactured by performing only the insulating layer treatment or the insulating layer treatment and the release layer treatment. .

  A component manufactured by electrocasting according to the present invention, wherein the component is transferred and manufactured by electrocasting using the transfer mold described above.

  ADVANTAGE OF THE INVENTION According to this invention, in manufacture of the display component by electroforming, a mechanical component, and an electronic component, the component by electroforming which is rich in durability and can take an aspect-ratio can be provided.

The manufacturing process figure of the master metal mold | die by the electrocasting of this invention. The manufacturing process figure of the master metal mold | die by the beam processing of this invention. The manufacturing process figure of the sun metal mold | die by this invention. The manufacturing process figure of the transfer metal mold | die by this invention. The manufacturing process figure of the components by this invention. FIG. 6 is a structural diagram of a part formed by a conventional transfer mold.

  The form of the first embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a manufacturing process diagram of a master mold by electroforming according to the present invention. In FIG. 1a, the upper surface of the metal substrate 10 has a roughened layer 15 for roughening the contact surface of a master mold formed by electroforming. The roughened layer 15 may be formed by directly roughening the surface of the metal substrate 10 by hydrochloric acid treatment or the like, or a photowork suitable for roughening such as a stripe shape or a lattice shape. The pattern layer may be formed as the roughened layer 15. Further, when an insulating layer or the like is formed on a sun mold 60 described later in FIG. 3, the roughened layer 15 may be omitted if there is no problem with the mutual adhesion strength.

  In FIG. 1b, the shape of the part is obtained on the roughened layer 15 of the metal substrate 10 in order to obtain the part shape having the desired aspect ratio and the side wall having the desired angle α. In the case where the photoresist 30 for patterning is a predetermined thickness, for example, a wiring of a semiconductor electronic component or a coil, it is applied at a thickness of 10 μm to obtain a thickness of 10 μm for a line width of 5 μm, for example. Next, exposure is performed from the direction of the arrow through a photomask 40 having a desired component pattern. FIG. 1c shows a resist pattern formed by developing the pattern of the part exposed in FIG. 1b. The angle α of both side walls of the resist pattern of the component can be arbitrarily determined according to the material and film thickness of the photoresist 30 applied in FIG. 1B and the exposure conditions irradiated through the photomask 40. . When using laser light, the irradiation intensity on both side walls of the resist pattern may be changed by a 3D lens. Moreover, you may change the irradiation intensity of both side walls using a gray mask.

  In FIG. 1d, a desired metal, for example, Ni is electrodeposited by a predetermined thickness so as to cover the resist pattern 30 of FIG. 1c by electroforming, and the master mold 20 is formed. In FIG. 1e, the master mold 20 formed by electroforming in FIG. 1d is pulled away from the metal substrate 10. FIG. The rough surface shape of the roughened layer 15 is transferred to the master mold rough surface layer 17. Moreover, the angle α of both side walls is preserved at the angle α shown in FIG.

  The master mold rough surface layer 17 is transferred to a sun mold 60 described in FIG. 3 which is finally used as a transfer mold, and is intended to increase the adhesion strength of an insulating layer formed thereon. It is not necessarily necessary. Moreover, the pattern density of a desired device can be improved by setting the angle α to a steep angle of 45 ° to 88 °. Further, the thickness 10 μm of the photoresist 30 in FIG. 1C is stored by being transferred to the inverted master mold 20.

  FIG. 2 is a manufacturing process diagram of a master mold by beam irradiation according to the second embodiment of the present invention. FIG. 2A shows a master mold 20 manufactured by the method described in FIG. 1, and the angle α is approximately 90 °. In FIG. 2b, a photoresist 30 for patterning a reversal pattern of the part shape is applied to a predetermined thickness, and exposure is performed from the direction of the arrow through a photomask 40 having a reversal pattern of the part. Therefore, in this case, the resist of the part portion is developed and removed, and the photoresist 30 remains only on the flat master mold rough surface layer 17.

  In FIG. 2c, the irradiation pattern is adjusted by beam irradiation so that the resist pattern formed in FIG. 2b is a protective film, and the angle α is a predetermined angle, and both side walls of the part pattern are processed. The arrow indicates the direction of the beam. The processed master mold 20 in FIG. 2d has the same shape as the master mold 20 in FIG. 1d, and has similar functions and features. The irradiation beam may be an electron beam, an ion beam, or an FIB (Focused Ion Bean) that can change the irradiation intensity by narrowing the lens.

  FIG. 3 is a manufacturing process diagram of a sun mold according to the present invention. 3A, a desired metal, for example, Ni, is electrodeposited to a predetermined thickness on the pattern surface of the part of the master mold 20 manufactured in FIG. 1 or FIG. 2, and the mother mold 50 is formed. Separated. In FIG. 3b, a desired metal, for example, Ni, is electrodeposited by a predetermined thickness on the component pattern surface of the mother mold 50, and the sun mold 60 is similarly formed. The sun mold 60 electroformed in FIG. 3 c is pulled away from the mother mold 50.

  Thus, since the sun mold 60 is further transferred from the mother mold 50 transferred from the master mold 20 and manufactured, the same functions and features as those of the master mold 20 are taken over as they are. Further, since the sun mold 60 is integrally formed of the same metal material, a desired aspect ratio can be obtained by performing a desired release layer treatment and insulating layer treatment on the sun mold rough surface layer 19 described below. And an angle α, and it is possible to obtain a transfer mold having high mass productivity that is not damaged even when used repeatedly.

  FIG. 4 is a manufacturing process diagram of the transfer mold of the present invention. FIG. 4a shows the sun mold 60 created in FIG. 3c. The sun mold 60 in FIG. 4b is heat-treated under a predetermined condition in order to peel off a part to be manufactured and facilitate implantation, and a release layer process for generating a NiOx film 70 having a predetermined film thickness is performed on the surface. Is called. Since this NiOx film 70 has conductivity, it does not hinder electrodeposition by electroforming, and also has a weak adhesive force with the parts to be electroformed, thus facilitating peeling.

Subsequently, an insulating layer is formed so as to prevent electrodeposition other than the surface on which the component is formed. Therefore, on the surface, chemically by CVD, or physical or generating a SiO ₂ film 80 by Suppata or polysilazane is applied to generate a SiO ₂ film 80 by heat treatment, an insulating layer processing Do. In FIG. 4c, in order to remove the SiO ₂ film 80 generated on the part pattern, a photoresist 30 for patterning in a predetermined shape is applied on the SiO ₂ film 80 to a predetermined thickness, Photoresist work is performed through the photomask 40 having a reverse pattern, which is exposed from the direction of the arrow. In FIG. 4d, using the patterned photoresist 30 as a mask, the SiO ₂ film 80 is removed physically by irradiation with a beam from the direction of the arrow or chemically by hydrofluoric acid or the like.

Or shape of the patterned photoresist 30, and, from the removal conditions of the SiO ₂ film 80, SiO ₂ film 80, As shown in FIG. 4e, leaving the side walls, only the portion of the bottom is removed, FIG. 4f As shown in FIG. 2, both side walls and the bottom part are removed together to complete the transfer mold. In the case of using polysilazane, after the NiOx film 70 is generated in FIG. 4b in the same process as the screen printing, the polysilazane is subsequently printed on the surface of the NiOx film 70 excluding the part pattern forming the part. By performing heat treatment, the same shape as in FIG. 4f can be obtained.

As shown in FIG. 4 b, the release layer treatment is performed on the sun mold 60 with a metal oxide (AlOx, TiOx, etc.), nitride, or organic substance having a thickness of 1 to 1000 mm that can maintain conductivity with respect to the thickness surface. This is done by depositing a resist. Insulating layer treatment may use an insulator such as a resist instead of SiO ₂ . Note that the treatment process of the peeling layer treatment and the insulating layer treatment may be reversed.

  Next, parts by electroforming produced using the transfer mold of the present invention will be described. FIG. 5 is a manufacturing process diagram of parts using the transfer mold of the present invention. In FIG. 5 a, a desired metal (Ag, Cu, Ni, etc.) is electrodeposited on the transfer mold 60 by electroforming, and a component 95 is formed. In FIG. 5b, the component 95 transferred and formed by electroforming is transplanted to the component substrate 97 through the adhesive 85 or transplanted by the green sheet 98 as in the case of FIG. 6b. 98 is cured by heat treatment. In the case of transplantation using the green sheet 98, the adhesive 85 is not necessary because the component 95 is soft enough to be embedded before curing. In this way, a component 95 having a desired aspect ratio and an angle α having an arbitrary shape is formed by electroforming and repeatedly implanted in the device substrate 97 or the green sheet 98, and used for each application. Can do.

  As described above, according to the present invention, display parts such as display characters and hands of electroformed watches, mechanical parts such as small gears, springs, pipes, and diagrams (pressure sensors), wiring of semiconductor devices, coils, etc. In the manufacture of electronic parts, it is possible to provide a part having a high durability and a high aspect ratio.

DESCRIPTION OF SYMBOLS 10 Metal substrate 15 Master mold roughening layer 17 Master mold rough surface layer 18 Mother mold rough surface layer 19 Sun mold rough surface layer 20 Master mold 30 Photoresist 40 Photomask 50 Mother mold 60 Sun mold 70 NiOx
75 Peeling treatment layer 80 SiO ₂ / Polysilazane 85 Adhesive 90 Metal substrate 95 Component 97 Component substrate 98 Green sheet
α Side wall angle
β Side wall angle

The method for producing a transfer mold according to the present invention comprises a resist pattern having a desired shape on a metal substrate , and having a desired angle α (α <90 °) on the side wall on the metal substrate side. And filling a part-shaped resist pattern until reaching a predetermined thickness by electroforming , and then separating the metal substrate and the resist pattern from the metal substrate to produce a master mold It is characterized by including these.

The method for producing a transfer mold according to the present invention comprises a resist pattern having a desired shape on a metal substrate , and having a desired angle α (α <90 °) on the side wall on the metal substrate side. And filling a part-shaped resist pattern until reaching a predetermined thickness by electroforming , and then separating the metal substrate and the resist pattern from the metal substrate to produce a master mold And a step of transferring and producing the sun mold from the master mold through the mother mold, a peeling layer treatment for facilitating the peeling of the part formed by electroforming on the sun mold, and parts other than the part formation And an insulating layer treatment for forming an insulating layer to produce a transfer mold.

The method for producing a transfer mold according to the present invention includes a step of forming a resist pattern having a desired shape on a metal substrate and a component-shaped resist pattern having a side wall angle of approximately 90 ° on the metal substrate side. the resist pattern component shape, after fills until a predetermined thickness by electroforming, the steps of separating from the metal substrate while leaving the metal substrate and the resist pattern is transferred on disassociated mold A step of performing a photoresist work so that the resist pattern layer remains in a portion excluding the component portion, and a resist pattern layer so that the side wall angle of the component shape is approximately 90 ° to a desired angle α (α <90 °). And a step of beam processing as a protective layer to produce a master mold.

The method for manufacturing a transfer mold according to the present invention includes a step of forming a resist pattern having a desired shape on a metal substrate and a component-shaped resist pattern having a side wall angle of approximately 90 ° on the metal substrate side. the resist pattern component shape, after fills until a predetermined thickness by electroforming, the steps of separating from the metal substrate while leaving the metal substrate and the resist pattern is transferred on disassociated mold A step of performing a photoresist work so that the resist pattern layer remains in a portion excluding the component portion, and a resist pattern layer so that the side wall angle of the component shape is approximately 90 ° to a desired angle α (α <90 °). And forming a master mold, a step of transferring a sun mold from the master mold through a mother mold, Performing a peeling layer process for facilitating peeling of a part formed by electroforming on the mold, and an insulating layer process for forming an insulating layer in a part other than the part formation to produce a transfer mold, It is characterized by including.

The method for producing a transfer mold according to the present invention includes a resist pattern having a desired shape on a metal substrate and having a desired angle α (α <90 °) on the side wall on the metal substrate side. forming a resist pattern of the part shape, after fills until a predetermined thickness by electroforming, to include a step away off from the metal substrate while leaving the metal substrate and the resist pattern It is characterized by.

The method for producing a transfer mold according to the present invention includes a step of forming a resist pattern having a desired shape on a metal substrate and a component-shaped resist pattern having a side wall angle of approximately 90 ° on the metal substrate side. Then, after filling the resist pattern of the part shape until reaching a predetermined thickness by electroforming, the step of separating from the metal substrate while leaving the metal substrate and the resist pattern, and the transfer onto the separated mold A step of performing a photoresist work so that the resist pattern layer remains in a portion excluding the component portion, and a resist pattern layer so that the side wall angle of the component shape is approximately 90 ° to a desired angle α (α <90 °). as the protective layer, characterized in that it comprises the steps of beam processing, the.

The transfer mold of the present invention is manufactured by the above-described transfer mold manufacturing method, and has a cross-section having a desired aspect ratio and a side wall angle of 45 ° to 88 °.

Claims (9)

Forming a resist pattern in a component shape having a desired aspect ratio on a metal substrate and having a side wall having a desired angle α;
Filling the resist pattern of the part shape by electrocasting until a predetermined thickness is reached, and producing a transfer mold;
And a step of producing a master mold by separating the transfer mold from the metal substrate. Forming a resist pattern in a component shape having a desired aspect ratio on a metal substrate and having a side wall having a desired angle α;
Filling the resist pattern of the part shape by electrocasting until a predetermined thickness is reached, and producing a transfer mold;
Separating the transfer mold from the metal substrate to produce a master mold;
A step of transferring and producing a sun mold from the master mold through a mother mold;
The sun mold is subjected to a release layer process for facilitating the peeling of the part formed by electroforming, and an insulating layer process for forming an insulating layer in a portion other than the part formation to produce a transfer mold. And a step for producing a transfer mold.   The method for producing a transfer mold according to claim 1, further comprising a step of forming a roughened layer on a surface of the metal substrate. Forming a resist pattern in a component shape having a desired aspect ratio and having a side wall angle of approximately 90 ° on a metal substrate;
Filling the resist pattern of the part shape by electrocasting until a predetermined thickness is reached, and producing a transfer mold;
Pulling the transfer mold away from the metal substrate;
Performing a photoresist work so that a resist pattern layer remains in a portion excluding a part to be transferred on the separated transfer mold;
Forming a master die by beam processing using the resist pattern layer as a protective layer so that the angle of the side wall of the component shape is approximately 90 ° to less than 90 °. A method for producing a transfer mold. Forming a resist pattern in a component shape having a desired aspect ratio and having a side wall angle of approximately 90 ° on a metal substrate;
Filling the resist pattern of the part shape by electrocasting until a predetermined thickness is reached, and producing a transfer mold;
Pulling the transfer mold away from the metal substrate;
Performing a photoresist work so that a resist pattern layer remains in a portion excluding a part to be transferred on the separated transfer mold;
The resist pattern layer is used as a protective layer to perform beam processing so that the angle of the side wall of the component shape is approximately 90 ° to less than 90 °, and a master mold is produced;
A step of transferring and producing a sun mold from the master mold through a mother mold;
A transfer mold is manufactured by performing a release layer process for facilitating the peeling of the part formed by electroforming and an insulating layer process for forming an insulating layer on a part other than the part formation on the sun mold. And a step for producing a transfer mold.   6. The method for manufacturing a transfer mold according to claim 4, further comprising a step of first forming a roughened layer on the surface of the metal substrate.   It is manufactured by the method for manufacturing a transfer mold according to any one of claims 1, 3, 4, and 6, characterized in that a cross section has a desired aspect ratio and a side wall has an angle of 45 ° to 88 °. Master mold to be.   A transfer mold manufactured by the transfer mold manufacturing method according to claim 2. A part made by electroforming,
A part transferred and manufactured by the electroforming using the transfer mold according to claim 8.

Images