TW201302041A - 散熱器扣具 - Google Patents
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4093—Snap-on arrangements, e.g. clips
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T24/00—Buckles, buttons, clasps, etc.
- Y10T24/44—Clasp, clip, support-clamp, or required component thereof
- Y10T24/44291—Clasp, clip, support-clamp, or required component thereof including pivoted gripping member
- Y10T24/44376—Spring or resiliently biased about pivot
- Y10T24/44385—Distinct spring
- Y10T24/44462—Coil spring
- Y10T24/4447—Coil spring having coil portion coaxial or parallel with pivotal axis
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T24/00—Buckles, buttons, clasps, etc.
- Y10T24/44—Clasp, clip, support-clamp, or required component thereof
- Y10T24/44641—Clasp, clip, support-clamp, or required component thereof having gripping member formed from, biased by, or mounted on resilient member
- Y10T24/44769—Opposed engaging faces on gripping member formed from single piece of resilient material
- Y10T24/44778—Piece totally forms clasp, clip, or support-clamp and has shaped, wirelike, or bandlike configuration with uniform cross section throughout its length
- Y10T24/44795—Resilient gripping member having tightly twisted portion
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49348—Burner, torch or metallurgical lance making
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/4935—Heat exchanger or boiler making
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
本發明提供一種散熱器扣具,用於固定一個散熱器至一個電路板。該散熱器包括一個設置在該電路板上的導熱座及多個自該導熱座背向該電路板一側延伸出且沿遠離該電路板的方向延伸的散熱鰭片。該散熱器扣具包括兩個倒扣勾及一個採用彈性線材製成且設置於該多個散熱鰭片之間的線扣。該兩個倒扣勾固定在該電路板上且位於該導熱座兩側。該線扣包括一個設置在該導熱座上的抵壓部、兩個自該抵壓部延伸出且向該抵壓部平行於該導熱座的徑向兩側及遠離該導熱座的方向延伸的形變部及兩個分別形成於該兩個形變部遠離該抵壓部一端的抵扣部。該兩個抵扣部在朝該導熱座下壓後分別扣入該兩個倒扣勾。本發明的散熱器扣具結構簡單,且操作簡易。
Description
本發明涉及散熱技術,特別涉及一種散熱器扣具。
隨著集成度的提高,集成晶片在工作過程中產生的熱量越來越高,需配備散熱器進行散熱,而散熱器通常通過散熱器扣具固定在集成晶片上。但是,目前的散熱器扣具的結構都比較複雜且操作困難。
有鑒於此,有必要提供一種結構簡單且易於操作的散熱器扣具。
一種散熱器扣具,用於固定一個散熱器至一個電路板。該散熱器包括一個設置在該電路板上的導熱座及多個自該導熱座背向該電路板一側延伸出且沿遠離該電路板的方向延伸的散熱鰭片。該散熱器扣具包括兩個倒扣勾及一個採用彈性線材製成且設置於該多個散熱鰭片之間的線扣。該兩個倒扣勾固定在該電路板上且位於該導熱座兩側。該線扣包括一個設置在該導熱座上的抵壓部、兩個自該抵壓部延伸出且向該抵壓部平行於該導熱座的徑向兩側及遠離該導熱座的方向延伸的形變部及兩個分別形成於該兩個形變部遠離該抵壓部一端的抵扣部。該兩個抵扣部在朝該導熱座下壓後分別扣入該兩個倒扣勾。
本發明的散熱器扣具結構簡單,且操作簡易。
請參閱圖1-3,本發明較佳實施方式的散熱器扣具10,用於固定一個散熱器20至一個電路板30上,該散熱器20包括一個設置在該電路板30上的導熱座22及多個自該導熱座22背向該電路板30一側延伸出且沿遠離該電路板30的方向延伸的散熱鰭片24。該散熱器扣具10包括兩個倒扣勾12及一個採用彈性線材製成且設置於該多個散熱鰭片24之間的線扣14。該兩個倒扣勾12固定在該電路板30上且位於該導熱座22兩側。該線扣14包括一個設置在該導熱座22上的抵壓部142、兩個自該抵壓部142延伸出且向平行於該導熱座22的該抵壓部142的徑向兩側及遠離該導熱座22的方向延伸的形變部144及兩個分別形成於該兩個形變部144遠離該抵壓部142一端的抵扣部146。該兩個抵扣部146在朝該導熱座22下壓後分別扣入該兩個倒扣勾12。
具體的,該電路板30(例如電腦主板)包括一個晶片座32(例如中央處理器(central processing unit, CPU)晶片座)及設置在該晶片座32上的晶片34(例如CPU晶片)。該導熱座22設置在該晶片34上,並與該晶片34緊密接觸,以利於將該晶片34工作過程中產生的熱量傳導到該散熱鰭片24進行散發。一般地,該晶片34為矩形。對應該晶片34的形狀,該導熱座22也為矩形。該多個散熱鰭片24成陣列排布。
每個倒扣勾12包括一個固定至該電路板30的固定座122、一個自該固定座122與該電路板30相背一側延伸出且沿遠離該電路板30的方向延伸的連接部124及一個形成於該連接部124遠離該固定座122一端的扣勾部126。
每個固定座122呈矩形,其與對應一個連接部124相背一側延伸有四個固定柱1222。該電路板30在該晶片座32兩側分別形成有四個固定孔36。每個固定座122通過對應四個固定柱1222插入對應四個固定孔36固定至該電路板30。具體的,每個倒扣勾12可以通過塑膠射出一體成型獲得。每個固定座122對應的四個固定柱1222插入對應四個固定孔36後再進行熔融及固化以將每個固定座122固定到該電路板30。
每個連接部124呈板材狀,並可平行於該晶片34與其相對的側面延伸。
每個扣勾部126也呈板材狀,自對應一個連接部124遠離對應一個固定座122一端沿遠離另一個倒扣勾12及朝對應一個固定座122的方向彎曲延伸形成。即是說,本實施方式中,該兩個倒扣勾12相背設置。
當然,該兩個倒扣勾12的形狀及位置並不限於本實施方式,例如,該兩個固定座122可採用其他形狀,並通過其他數目的固定柱1222或者其他方式(例如鉚接)固定到該電路板30。該兩個連接部124也可以採用其他形狀。該兩個扣勾部126可相向延伸,即使說,該兩個倒扣勾12相向設置。
該抵壓部142為一段線材,並沿平行於該兩個倒扣勾12的中心對稱線的方向設置在該導熱座22上。該抵壓部142的長度可以與該導熱座22沿平行於該抵壓部142的方向的寬度大致相同,如此,該抵壓部142可更加均勻地施加抵壓力給該導熱座22。每個形變部144包括兩段相互平行且垂直於該抵壓部142的線材。每個抵扣部146也為一段線材,其與該抵壓部142平行並連接對應一個形變部144的兩段線材。
每個連接部124沿垂直於該電路板30的方向的高度等於或者略高於該晶片34及該導熱座22沿垂直於該電路板30的方向的高度之和,如此,無需折彎每個形變部144的線材便可下壓該兩個抵扣部146並扣入該兩個扣勾部126。
當然,該線扣14的形狀也不限於本實施方式。例如,每個形變部144的每段線材可以形成一個朝該導熱座22的折彎1442。如此,下壓該兩個抵扣部146並扣入該兩個扣勾部126也抵壓在該導熱座22上,可以增加該線扣14對該導熱座22的施力點,使該導熱座22的整體受力更加平均。當然,在此情況下,每個連接部124沿垂直於該電路板30的方向的高度可設置成等於或者略高於該晶片34、該導熱座22及該折彎1442沿垂直於該電路板30的方向的高度之和,如此,無需折彎每個形變部144的線材便可下壓該兩個抵扣部146並扣入該兩個扣勾部126。
綜上所述,本發明確已符合發明專利之要件,遂依法提出專利申請。惟,以上所述者僅為本發明之較佳實施方式,自不能以此限制本案之申請專利範圍。舉凡熟悉本案技藝之人士援依本發明之精神所作之等效修飾或變化,皆應涵蓋於以下申請專利範圍內。
10...散熱器扣具
12...倒扣勾
122...固定座
1222...固定柱
124...連接部
126...扣勾部
14...線扣
142...抵壓部
144...形變部
1442...折彎
146...抵扣部
20...散熱器
22...導熱座
24...散熱鰭片
30...電路板
32...晶片座
34...晶片
36...固定孔
圖1為本發明較佳實施方式的散熱器扣具將一個散熱器固定到一個電路板的立體分解示意圖。
圖2為圖1的散熱器扣具將該散熱器固定到該電路板前的組裝示意圖。
圖3為圖1的散熱器扣具將該散熱器固定到該電路板後的組裝示意圖。
12...倒扣勾
14...線扣
20...散熱器
30...電路板
Claims (10)
- 一種散熱器扣具,用於固定一個散熱器至一個電路板,該散熱器包括一個設置在該電路板上的導熱座及多個自該導熱座背向該電路板一側延伸出且沿遠離該電路板的方向延伸的散熱鰭片,該散熱器扣具包括:
兩個固定在該電路板上且位於該導熱座兩側的倒扣勾;
一個採用彈性線材製成且設置於該多個散熱鰭片之間的線扣,其包括一個設置在該導熱座上的抵壓部、兩個自該抵壓部延伸出且向平行於該導熱座的該抵壓部的徑向兩側延伸的形變部及兩個分別形成於該兩個形變部遠離該抵壓部一端的抵扣部,該兩個抵扣部用於在朝該導熱座下壓該兩個彈性部後分別扣入該兩個倒扣勾。 - 如申請權利範圍第1項所述的散熱器扣具,其中,每個倒扣勾包括一個固定至該電路板的固定座、一個自該固定座與該電路板相背一側延伸出且沿遠離該電路板的方向延伸的連接部及一個形成於該連接部遠離該固定座一端的扣勾部。
- 如申請權利範圍第2項所述的散熱器扣具,其中,每個固定座與對應一個連接部相背一側延伸有多個固定柱;該電路板在該導熱座兩側分別形成有多個固定孔;每個固定座通過對應多個固定柱插入對應多個固定孔固定至該電路板。
- 如申請權利範圍第3項所述的散熱器扣具,其中,每個倒扣勾通過塑膠射出一體成型獲得;每個固定座對應多個固定柱插入對應四個固定孔後再進行熔融及固化以將每個固定座固定到該電路板。
- 如申請權利範圍第2項所述的散熱器扣具,其中,每個扣勾部自對應一個連接部遠離對應一個固定座一端沿遠離另一個倒扣勾及朝對應一個固定座的方向彎曲延伸形成。
- 如申請權利範圍第1項所述的散熱器扣具,其中,該抵壓部為一段線材,並沿平行於該兩個倒扣勾的中心對稱線的方向設置在該導熱座上;每個形變部包括兩段相互平行且垂直於該抵壓部的線材;每個抵扣部也為一段線材,其與該抵壓部平行並連接對應一個形變部的兩段線材。
- 如申請權利範圍第6項所述的散熱器扣具,其中,該抵壓部的長度與該導熱座沿平行於該抵壓部的方向的寬度相同。
- 如申請權利範圍第6項所述的散熱器扣具,其中,該電路板包括一個晶片,該導熱座設置在該晶片上,每個連接部沿垂直於該電路板的方向的高度等於或者高於該晶片及該導熱座沿垂直於該電路板方向的高度之和。
- 如申請權利範圍第6項所述的散熱器扣具,其中,每個形變部的每段線材可以形成一個朝該導熱座的折彎。
- 如申請權利範圍第6項所述的散熱器扣具,其中,該電路板包括一個晶片,該導熱座設置在該晶片上,每個連接部沿垂直於該電路板的方向的高度等於或者略高於該晶片、該導熱座及該折彎沿垂直於該電路板的方向的高度之和。
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CN2011101815133A CN102856274A (zh) | 2011-06-30 | 2011-06-30 | 散热器扣具 |
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TW201302041A true TW201302041A (zh) | 2013-01-01 |
TWI466627B TWI466627B (zh) | 2014-12-21 |
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TWM434427U (en) * | 2011-10-12 | 2012-07-21 | Cooler Master Co Ltd | Heat dissipation device |
US20130105112A1 (en) * | 2011-10-31 | 2013-05-02 | Cooler Master Co., Ltd. | Heat sink |
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2011
- 2011-06-30 CN CN2011101815133A patent/CN102856274A/zh active Pending
- 2011-07-04 TW TW100123448A patent/TWI466627B/zh not_active IP Right Cessation
- 2011-08-11 US US13/207,466 patent/US8482923B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
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CN102856274A (zh) | 2013-01-02 |
TWI466627B (zh) | 2014-12-21 |
US20130003302A1 (en) | 2013-01-03 |
US8482923B2 (en) | 2013-07-09 |
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