CN102856274A - 散热器扣具 - Google Patents

散热器扣具 Download PDF

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CN102856274A
CN102856274A CN2011101815133A CN201110181513A CN102856274A CN 102856274 A CN102856274 A CN 102856274A CN 2011101815133 A CN2011101815133 A CN 2011101815133A CN 201110181513 A CN201110181513 A CN 201110181513A CN 102856274 A CN102856274 A CN 102856274A
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heat
circuit board
conducting seat
fastener
heat sink
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谭亮
马小峰
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Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Priority to CN2011101815133A priority Critical patent/CN102856274A/zh
Priority to TW100123448A priority patent/TWI466627B/zh
Priority to US13/207,466 priority patent/US8482923B2/en
Publication of CN102856274A publication Critical patent/CN102856274A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093—Snap-on arrangements, e.g. clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T24/00—Buckles, buttons, clasps, etc.
    • Y10T24/44—Clasp, clip, support-clamp, or required component thereof
    • Y10T24/44291—Clasp, clip, support-clamp, or required component thereof including pivoted gripping member
    • Y10T24/44376—Spring or resiliently biased about pivot
    • Y10T24/44385—Distinct spring
    • Y10T24/44462—Coil spring
    • Y10T24/4447—Coil spring having coil portion coaxial or parallel with pivotal axis
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T24/00—Buckles, buttons, clasps, etc.
    • Y10T24/44—Clasp, clip, support-clamp, or required component thereof
    • Y10T24/44641—Clasp, clip, support-clamp, or required component thereof having gripping member formed from, biased by, or mounted on resilient member
    • Y10T24/44769—Opposed engaging faces on gripping member formed from single piece of resilient material
    • Y10T24/44778—Piece totally forms clasp, clip, or support-clamp and has shaped, wirelike, or bandlike configuration with uniform cross section throughout its length
    • Y10T24/44795—Resilient gripping member having tightly twisted portion
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49348—Burner, torch or metallurgical lance making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

本发明提供一种散热器扣具，用于固定一个散热器至一个电路板。该散热器包括一个设置在该电路板上的导热座及多个自该导热座背向该电路板一侧延伸出且沿远离该电路板的方向延伸的散热鳍片。该散热器扣具包括两个倒扣勾及一个采用弹性线材制成且设置于该多个散热鳍片之间的线扣。该两个倒扣勾固定在该电路板上且位于该导热座两侧。该线扣包括一个设置在该导热座上的抵压部、两个自该抵压部延伸出且向该抵压部平行于该导热座的径向两侧及远离该导热座的方向延伸的形变部及两个分别形成于该两个形变部远离该抵压部一端的抵扣部。该两个抵扣部在朝该导热座下压后分别扣入该两个倒扣勾。本发明的散热器扣具结构简单，且操作简易。

Description

散热器扣具
技术领域
本发明涉及散热技术，特别涉及一种散热器扣具。
背景技术
随着集成度的提高，集成芯片在工作过程中产生的热量越来越高，需配备散热器进行散热，而散热器通常通过散热器扣具固定在集成芯片上。但是，目前的散热器扣具的结构都比较复杂且操作困难。
发明内容
有鉴于此，有必要提供一种结构简单且易于操作的散热器扣具。
一种散热器扣具，用于固定一个散热器至一个电路板。该散热器包括一个设置在该电路板上的导热座及多个自该导热座背向该电路板一侧延伸出且沿远离该电路板的方向延伸的散热鳍片。该散热器扣具包括两个倒扣勾及一个采用弹性线材制成且设置于该多个散热鳍片之间的线扣。该两个倒扣勾固定在该电路板上且位于该导热座两侧。该线扣包括一个设置在该导热座上的抵压部、两个自该抵压部延伸出且向该抵压部平行于该导热座的径向两侧及远离该导热座的方向延伸的形变部及两个分别形成于该两个形变部远离该抵压部一端的抵扣部。该两个抵扣部在朝该导热座下压后分别扣入该两个倒扣勾。
本发明的散热器扣具结构简单，且操作简易。
附图说明
图1为本发明较佳实施方式的散热器扣具将一个散热器固定到一个电路板的立体分解示意图。
图2为图1的散热器扣具将该散热器固定到该电路板前的组装示意图。
图3为图1的散热器扣具将该散热器固定到该电路板后的组装示意图。
主要元件符号说明
散热器扣具 10
倒扣勾 12
固定座 122
固定柱 1222
连接部 124
扣勾部 126
线扣 14
抵压部 142
形变部 144
折弯 1442
抵扣部 146
散热器 20
导热座 22
散热鳍片 24
电路板 30
芯片座 32
芯片 34
固定孔 36
如下具体实施方式将结合上述附图进一步说明本发明。
具体实施方式
请参阅图1-3，本发明较佳实施方式的散热器扣具10，用于固定一个散热器20至一个电路板30上，该散热器20包括一个设置在该电路板30上的导热座22及多个自该导热座22背向该电路板30一侧延伸出且沿远离该电路板30的方向延伸的散热鳍片24。该散热器扣具10包括两个倒扣勾12及一个采用弹性线材制成且设置于该多个散热鳍片24之间的线扣14。该两个倒扣勾12固定在该电路板30上且位于该导热座22两侧。该线扣14包括一个设置在该导热座22上的抵压部142、两个自该抵压部142延伸出且向平行于该导热座22的该抵压部142的径向两侧及远离该导热座22的方向延伸的形变部144及两个分别形成于该两个形变部144远离该抵压部142一端的抵扣部146。该两个抵扣部146在朝该导热座22下压后分别扣入该两个倒扣勾12。
具体的，该电路板30(例如计算机主板)包括一个芯片座32(例如中央处理器(central processing unit, CPU)芯片座)及设置在该芯片座32上的芯片34(例如CPU芯片)。该导热座22设置在该芯片34上，并与该芯片34紧密接触，以利于将该芯片34工作过程中产生的热量传导到该散热鳍片24进行散发。一般地，该芯片34为矩形。对应该芯片34的形状，该导热座22也为矩形。该多个散热鳍片24成阵列排布。
每个倒扣勾12包括一个固定至该电路板30的固定座122、一个自该固定座122与该电路板30相背一侧延伸出且沿远离该电路板30的方向延伸的连接部124及一个形成于该连接部124远离该固定座122一端的扣勾部126。
每个固定座122呈矩形，其与对应一个连接部124相背一侧延伸有四个固定柱1222。该电路板30在该芯片座32两侧分别形成有四个固定孔36。每个固定座122通过对应四个固定柱1222插入对应四个固定孔36固定至该电路板30。具体的，每个倒扣勾12可以通过塑料射出一体成型获得。每个固定座122对应的四个固定柱1222插入对应四个固定孔36后再进行熔融及固化以将每个固定座122固定到该电路板30。
每个连接部124呈板材状，并可平行于该芯片34与其相对的侧面延伸。
每个扣勾部126也呈板材状，自对应一个连接部124远离对应一个固定座122一端沿远离另一个倒扣勾12及朝对应一个固定座122的方向弯曲延伸形成。即是说，本实施方式中，该两个倒扣勾12相背设置。
当然，该两个倒扣勾12的形状及位置并不限于本实施方式，例如，该两个固定座122可采用其他形状，并通过其他数目的固定柱1222或者其他方式(例如铆接)固定到该电路板30。该两个连接部124也可以采用其他形状。该两个扣勾部126可相向延伸，即使说，该两个倒扣勾12相向设置。
该抵压部142为一段线材，并沿平行于该两个倒扣勾12的中心对称线的方向设置在该导热座22上。该抵压部142的长度可以与该导热座22沿平行于该抵压部142的方向的宽度大致相同，如此，该抵压部142可更加均匀地施加抵压力给该导热座22。每个形变部144包括两段相互平行且垂直于该抵压部142的线材。每个抵扣部146也为一段线材，其与该抵压部142平行并连接对应一个形变部144的两段线材。
每个连接部124沿垂直于该电路板30的方向的高度等于或者略高于该芯片34及该导热座22沿垂直于该电路板30的方向的高度之和，如此，无需折弯每个形变部144的线材便可下压该两个抵扣部146并扣入该两个扣勾部126。
当然，该线扣14的形状也不限于本实施方式。例如，每个形变部144的每段线材可以形成一个朝该导热座22的折弯1442。如此，下压该两个抵扣部146并扣入该两个扣勾部126也抵压在该导热座22上，可以增加该线扣14对该导热座22的施力点，使该导热座22的整体受力更加平均。当然，在此情况下，每个连接部124沿垂直于该电路板30的方向的高度可设置成等于或者略高于该芯片34、该导热座22及该折弯1442沿垂直于该电路板30的方向的高度之和，如此，无需折弯每个形变部144的线材便可下压该两个抵扣部146并扣入该两个扣勾部126。
总之，本技术领域的普通技术人员应当认识到，以上的实施方式仅是用来说明本发明，而并非用作为对本发明的限定，只要在本发明的实质精神范围之内，对以上实施例所作的适当改变和变化都落在本发明要求保护的范围之内。

Claims (10)

1.一种散热器扣具，用于固定一个散热器至一个电路板，该散热器包括一个设置在该电路板上的导热座及多个自该导热座背向该电路板一侧延伸出且沿远离该电路板的方向延伸的散热鳍片，该散热器扣具包括：
两个固定在该电路板上且位于该导热座两侧的倒扣勾；
一个采用弹性线材制成且设置于该多个散热鳍片之间的线扣，其包括一个设置在该导热座上的抵压部、两个自该抵压部延伸出且向平行于该导热座的该抵压部的径向两侧延伸的形变部及两个分别形成于该两个形变部远离该抵压部一端的抵扣部，该两个抵扣部用于在朝该导热座下压该两个弹性部后分别扣入该两个倒扣勾。
2.如权利要求1所述的散热器扣具，其特征在于，每个倒扣勾包括一个固定至该电路板的固定座、一个自该固定座与该电路板相背一侧延伸出且沿远离该电路板的方向延伸的连接部及一个形成于该连接部远离该固定座一端的扣勾部。
3.如权利要求2所述的散热器扣具，其特征在于，每个固定座与对应一个连接部相背一侧延伸有多个固定柱；该电路板在该导热座两侧分别形成有多个固定孔；每个固定座通过对应多个固定柱插入对应多个固定孔固定至该电路板。
4.如权利要求3所述的散热器扣具，其特征在于，每个倒扣勾通过塑料射出一体成型获得；每个固定座对应多个固定柱插入对应四个固定孔后再进行熔融及固化以将每个固定座固定到该电路板。
5.如权利要求2所述的散热器扣具，其特征在于，每个扣勾部自对应一个连接部远离对应一个固定座一端沿远离另一个倒扣勾及朝对应一个固定座的方向弯曲延伸形成。
6.如权利要求1所述的散热器扣具，其特征在于，该抵压部为一段线材，并沿平行于该两个倒扣勾的中心对称线的方向设置在该导热座上；每个形变部包括两段相互平行且垂直于该抵压部的线材；每个抵扣部也为一段线材，其与该抵压部平行并连接对应一个形变部的两段线材。
7.如权利要求6所述的散热器扣具，其特征在于，该抵压部的长度与该导热座沿平行于该抵压部的方向的宽度相同。
8.如权利要求6所述的散热器扣具，其特征在于，该电路板包括一个芯片，该导热座设置在该芯片上，每个连接部沿垂直于该电路板的方向的高度等于或者高于该芯片及该导热座沿垂直于该电路板方向的高度之和。
9.如权利要求6所述的散热器扣具，其特征在于，每个形变部的每段线材可以形成一个朝该导热座的折弯。
10.如权利要求6所述的散热器扣具，其特征在于，该电路板包括一个芯片，该导热座设置在该芯片上，每个连接部沿垂直于该电路板的方向的高度等于或者略高于该芯片、该导热座及该折弯沿垂直于该电路板的方向的高度之和。
CN2011101815133A 2011-06-30 2011-06-30 散热器扣具 Pending CN102856274A (zh)

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CN2011101815133A CN102856274A (zh) 2011-06-30 2011-06-30 散热器扣具
TW100123448A TWI466627B (zh) 2011-06-30 2011-07-04 散熱器扣具
US13/207,466 US8482923B2 (en) 2011-06-30 2011-08-11 Heat sink clip with wire clip

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CN2011101815133A CN102856274A (zh) 2011-06-30 2011-06-30 散热器扣具

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112004372A (zh) * 2019-05-27 2020-11-27 酷码科技股份有限公司 散热装置

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWM434427U (en) * 2011-10-12 2012-07-21 Cooler Master Co Ltd Heat dissipation device
US20130105112A1 (en) * 2011-10-31 2013-05-02 Cooler Master Co., Ltd. Heat sink
CN103116389A (zh) * 2011-11-16 2013-05-22 鸿富锦精密工业（深圳）有限公司 散热器组合
TWM444607U (zh) * 2012-06-25 2013-01-01 Hon Hai Prec Ind Co Ltd 電連接器組合及其固持裝置
TW201417414A (zh) * 2012-10-16 2014-05-01 Hon Hai Prec Ind Co Ltd 電連接器組合及其壓接裝置
CN103337484A (zh) * 2013-07-10 2013-10-02 吴江市三元精密电子有限公司 一种散热装置
US9022627B2 (en) 2013-08-27 2015-05-05 Osram Sylvania Inc. Lens and retainer combination
US9258881B2 (en) * 2014-01-22 2016-02-09 Foxconn Interconnect Technology Limited SMT heat sink anchor
US10064287B2 (en) 2014-11-05 2018-08-28 Infineon Technologies Austria Ag System and method of providing a semiconductor carrier and redistribution structure
US10192846B2 (en) 2014-11-05 2019-01-29 Infineon Technologies Austria Ag Method of inserting an electronic component into a slot in a circuit board
US10553557B2 (en) * 2014-11-05 2020-02-04 Infineon Technologies Austria Ag Electronic component, system and method
US9560736B2 (en) 2014-11-18 2017-01-31 Cisco Technology, Inc. Printed circuit board clip

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2423614Y (zh) * 1999-12-14 2001-03-14 宏桦国际股份有限公司 用以组合散热片、cpu与匣座的扣具
WO2001048817A1 (en) * 1999-12-28 2001-07-05 Motorola, Inc. Electronics circuit board assembly apparatus and method
US6788538B1 (en) * 2003-03-17 2004-09-07 Unisys Corporation Retention of heat sinks on electronic packages

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4716494A (en) * 1986-11-07 1987-12-29 Amp Incorporated Retention system for removable heat sink
US5241453A (en) * 1991-11-18 1993-08-31 The Whitaker Corporation EMI shielding device
TW477515U (en) * 2000-05-19 2002-02-21 Yau-Huei Lai Improved heat sink holding device
US6803652B2 (en) * 2001-05-30 2004-10-12 Intel Corporation Heat dissipation device having a load centering mechanism
US6600652B2 (en) * 2001-09-28 2003-07-29 Intel Corporation Package retention module coupled directly to a socket
TWM246960U (en) * 2003-07-16 2004-10-11 Hon Hai Prec Ind Co Ltd Heat sink fastener
TWM246689U (en) * 2003-10-31 2004-10-11 Hon Hai Prec Ind Co Ltd Heat dissipation assembly
CN2812091Y (zh) * 2005-06-10 2006-08-30 英业达股份有限公司 扣合件
TWM302246U (en) * 2006-05-29 2006-12-01 Malico Inc Heat dissipating module
CN101460043A (zh) * 2007-12-14 2009-06-17 鸿富锦精密工业（深圳）有限公司 散热器组合
CN101616563B (zh) * 2008-06-27 2012-06-13 富准精密工业(深圳)有限公司 散热装置组合
US7885077B2 (en) * 2009-01-07 2011-02-08 International Business Machines Corporation Solderless heatsink anchor
CN101848618A (zh) * 2009-03-24 2010-09-29 鸿富锦精密工业（深圳）有限公司 散热器及其卡扣装置
CN102105036A (zh) * 2009-12-21 2011-06-22 富准精密工业(深圳)有限公司 散热装置
TWM379978U (en) * 2009-12-31 2010-05-01 Quanta Comp Inc Heat sink assembly

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2423614Y (zh) * 1999-12-14 2001-03-14 宏桦国际股份有限公司 用以组合散热片、cpu与匣座的扣具
WO2001048817A1 (en) * 1999-12-28 2001-07-05 Motorola, Inc. Electronics circuit board assembly apparatus and method
US6788538B1 (en) * 2003-03-17 2004-09-07 Unisys Corporation Retention of heat sinks on electronic packages

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112004372A (zh) * 2019-05-27 2020-11-27 酷码科技股份有限公司 散热装置
CN112004372B (zh) * 2019-05-27 2023-03-17 酷码科技股份有限公司 散热装置

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