CN103796490A - 手持电子装置之散热装置 - Google Patents

手持电子装置之散热装置 Download PDF

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CN103796490A
CN103796490A CN201410034217.4A CN201410034217A CN103796490A CN 103796490 A CN103796490 A CN 103796490A CN 201410034217 A CN201410034217 A CN 201410034217A CN 103796490 A CN103796490 A CN 103796490A
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heat
heat pipe
electronic device
sheet metal
hand
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黄崇贤
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Dongguan Hanxu Hardware Plastic Technology Co Ltd
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Dongguan Hanxu Hardware Plastic Technology Co Ltd
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Priority to CN201410034217.4A priority Critical patent/CN103796490A/zh
Priority to TW103112812A priority patent/TW201531215A/zh
Priority to TW103205995U priority patent/TWM484901U/zh
Priority to US14/252,561 priority patent/US20150216082A1/en
Priority to JP2014083586A priority patent/JP2015138969A/ja
Priority to KR1020140049496A priority patent/KR20150088695A/ko
Publication of CN103796490A publication Critical patent/CN103796490A/zh
Priority to DE102014108000.9A priority patent/DE102014108000A1/de
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20254Cold plates transferring heat from heat source to coolant
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336Heat pipes, e.g. wicks or capillary pumps
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2275/00Fastening; Joining
    • F28F2275/08Fastening; Joining by clamping or clipping

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

本发明公开一种手持电子装置之散热装置,包括一金属薄板及一个以上的热导管所结合组成,主要是在金属薄板一体冲压成型而具有复数个间隔分布的扣夹片,各扣夹片与热导管的位置系匹配对应,故可将热导管嵌入扣夹片,再针对扣夹片的一侧或两侧施以加压变形,使各扣夹片的一侧或两侧可于弯折变形后将热导管紧紧包覆结合,并通过热导管与发热组件的贴置接触,可将热温快速传递至金属薄板,迅速完成散热任务,故能有效防止热量累积,而提升散热效率,避免手持电子装置发生当机或组件受损等情况。

Description

手持电子装置之散热装置
技术领域
本发明系涉及一种散热装置,尤指一种手持电子装置之散热装置,其系包括一金属薄板及一个以上的热导管所结合组成。
背景技术
已知的各种手持电子装置,例如:手机、笔电、平板计算机、iPad、PDA、GPS等携带型的手持电子装置,由于科技的日新月异而进步神速,因此,体积与外观都变得更扁薄轻巧,但运算功能却变得愈来愈强大,以致其内部的中央处理器(CPU)及集成电路(IC)等组件,于运作时都会产生相当的高热,故必须设法排除高热,始能确保该发热组件的正常运作,及维持使用寿命。
习知手持电子装置的散热装置,由于受制于体积扁薄轻巧的特性,故常见散热装置系使用一金属薄板直接贴置接触于中央处理器或集成电路等发热组件,使各发热组件的高热可传导至金属薄板,再通过金属薄板完成散热任务,但此种技术因散热效率相当缓慢,无法迅速排除高热,仍容易累积热量而发生当机或组件受损。
发明内容
有鉴于此,本发明针对现有技术存在之缺失,其主要目的是提供一种手持电子装置之散热装置,其能有效解决现有之手持电子装置的散热装置的散热效率慢的问题。
为实现上述目的,本发明采用如下之技术方案:
一种手持电子装置之散热装置,系包括一金属薄板及一个以上的热导管所结合组成,
金属薄板,系一体冲压成型而具有复数个间隔分布的扣夹片,且各扣夹片与热导管的位置系匹配对应;
热导管,系匹配嵌入各扣夹片;
藉上述金属薄板及热导管,系于热导管嵌入各扣夹片后,再针对扣夹片的一侧或两侧施以加压变形,使各扣夹片的一侧或两侧系于弯折变形后将热导管紧紧包覆结合。
作为一种优选方案,所述热导管的吸热端系直接贴置接触于手持电子装置之发热组件。
作为一种优选方案,所述金属薄板的扣夹片系冲压为U型的扣夹片。
作为一种优选方案,所述热导管系呈一字型的热导管。
作为一种优选方案,所述热导管系呈L型的热导管。
作为一种优选方案,所述热导管系呈U型的热导管。
作为一种优选方案,所述热导管系呈扁薄形状。
本发明与现有技术相比具有明显的优点和有益效果,具体而言,由上述技术方案可知:
一、散热装置系包括一金属薄板及一个以上的热导管所结合组成,特别是在金属薄板一体冲压成型而具有复数个间隔分布的扣夹片,且各扣夹片与热导管的位置系匹配对应,故可将热导管嵌入扣夹片,再针对扣夹片的一侧或两侧施以加压变形,以使各扣夹片的一侧或两侧可于弯折变形后将热导管紧紧包覆结合,并通过热导管与发热组件的贴置接触,可将热温快速传递至金属薄板,迅速完成散热任务,故能有效防止热量累积,而提升散热效率,避免手持电子装置发生当机或组件受损等情事。
二、该金属薄板的复数个扣夹片,因系通过快速一体冲压成型,且于热导管嵌入扣夹片后,只需再通过一次冲压,即可将扣夹片的一侧或两侧加压变形,使各扣夹片于弯折变形后立即将热导管紧紧包覆结合,不仅极容易制造实施,且成本很低廉,亦完全不需使用焊接技术,就能达到紧密结合效果。
三、该金属薄板的扣夹片,系可冲压为U型的扣夹片,该扣夹片的U型空间恰可容纳一扁薄形状的热导管,并于加压变形后与热导管形成紧密包覆结合。
四、该热导管系可为一字型或L型或U形或任意形状,而与金属薄板的复数个扣夹片形成包覆结合。
为更清楚地阐述本发明的结构特征和功效,下面结合附图与具体实施例来对本发明进行详细说明。
附图说明
图1为本发明于结合前的分解立体图;
图2为本发明于结合前呈嵌入状态的立体图;
图3为本发明于结合前呈嵌入状态的断面图;
图4为本发明于扣夹片加压变形后的组合立体图;
图5为本发明于扣夹片加压变形后的组合断面图;
图6为本发明应用于手机的分解立体图;
图7为本发明第二实施例的组合上视图;
图8为本发明第三实施例的组合上视图;
图9为本发明第四实施例的组合上视图;
图10为本发明第五实施例的组合上视图。
附图标识说明:
1、金属薄板                   2、热导管
11、扣夹片                    31、上盖
32、底盖                      331、发热组件
33、电路板                    2a、L型热导管
2b 、U型热导管。
具体实施方式
请参照如图1至图5所示,系本发明所为手持电子装置之散热装置的第一实施例,主要系包括一金属薄板1及一个以上的热导管2所结合组成,而其中:
金属薄板1,如图1,其系选用具有较佳导热效果的金属板,并在该金属薄板1一体冲压成型而具有复数个间隔分布的扣夹片11,且各扣夹片11与热导管2的位置系匹配对应;热导管2,系呈扁薄形状,并匹配嵌入各扣夹片11(如图2)。
藉上述金属薄板1及热导管2,系于热导管2嵌入各扣夹片11后,再针对扣夹片11的一侧或两侧施以加压变形(如图3箭号所示之施力方向),使各扣夹片11的一侧或两侧系于弯折变形后可将热导管2紧紧包覆结合(如图4和图5所示)。
如图6所示,系本发明散热装置于手机之应用实例,该手机系包含一上盖31、一底盖32及一附有中央处理器(及集成电路等)等发热组件331之电路板33,本发明之散热装置系包括一金属薄板1及一个以上的热导管2所结合组成,系将热导管2的吸热端直接贴置接触于发热组件331,使其热温可快速传递至金属薄板1,并迅速散热,故能有效防止热量累积,提升散热效率,避免手持电子装置发生当机或组件受损等情事。
如上述金属薄板1的扣夹片11,其系可冲压为U型的扣夹片11,而该扣夹片11的U型空间恰可容纳一扁薄形状的热导管2,并于一侧或两侧加压变形后与热导管2形成紧密的包覆结合,以达到扣合稳固而不会脱落的目的。
本发明所配置的热导管2,除可采用单支的一字型热导管2以外,亦可采用复数支的一字型热导管2分别配置结合于金属薄板1(如图7)。
同理,本发明所配置的热导管2,除可采用一字型热导管2以外,亦可采用L型热导管2a,以单支的L型热导管2a(如图8)或复数支的L型热导管2a(如图9),配置结合于金属薄板1。
依本发明之金属薄板1及热导管2的配置组成,所述的热导管2形状系可任意改变,而金属薄板1所一体冲压成型的复数个扣夹片11,则是视各热导管2的分布位置而呈匹配对应,例如图10所揭示之U型热导管2b,其与金属薄板1的扣夹片11配置组成,均为同理应用。
有关本发明扣夹片11的弯折形状、大小或其分布位置的排列形态,均可依各种热导管2、2a、2b的不同需要而做匹配变化,故附图实施例仅系揭露本发明的主要技术特征,但并非用以限定本案的技术范围,如有涉及等效应用或简易的增减变更,自仍不脱本案的技术范围。

Claims (7)

1.一种手持电子装置之散热装置,系包括一金属薄板及一个以上的热导管所结合组成,而其特征在于:
金属薄板,系一体冲压成型而具有复数个间隔分布的扣夹片,且各扣夹片与热导管的位置系匹配对应;
热导管,系匹配嵌入各扣夹片;
藉上述金属薄板及热导管,系于热导管嵌入各扣夹片后,再针对扣夹片的一侧或两侧施以加压变形,使各扣夹片的一侧或两侧系于弯折变形后将热导管紧紧包覆结合。
2.根据权利要求1所述的手持电子装置之散热装置,其特征在于:所述热导管的吸热端系直接贴置接触于手持电子装置之发热组件。
3.根据权利要求1所述的手持电子装置之散热装置,其特征在于:所述金属薄板的扣夹片系冲压为U型的扣夹片。
4.根据权利要求1所述的手持电子装置之散热装置,其特征在于:所述热导管系呈一字型的热导管。
5.根据权利要求1所述的手持电子装置之散热装置,其特征在于:所述热导管系呈L型的热导管。
6.根据权利要求1所述的手持电子装置之散热装置,其特征在于:所述热导管系呈U型的热导管。
7.根据权利要求1所述的手持电子装置之散热装置,其特征在于:所述热导管系呈扁薄形状。
CN201410034217.4A 2014-01-24 2014-01-24 手持电子装置之散热装置 Pending CN103796490A (zh)

Priority Applications (7)

Application Number Priority Date Filing Date Title
CN201410034217.4A CN103796490A (zh) 2014-01-24 2014-01-24 手持电子装置之散热装置
TW103112812A TW201531215A (zh) 2014-01-24 2014-04-08 手持電子裝置之散熱裝置
TW103205995U TWM484901U (zh) 2014-01-24 2014-04-08 手持電子裝置之散熱裝置
US14/252,561 US20150216082A1 (en) 2014-01-24 2014-04-14 Heat dissipation mechanism for handheld electronic apparatus
JP2014083586A JP2015138969A (ja) 2014-01-24 2014-04-15 ハンドヘルド電子装置の放熱装置
KR1020140049496A KR20150088695A (ko) 2014-01-24 2014-04-24 휴대식 전자장치용 방열 장치
DE102014108000.9A DE102014108000A1 (de) 2014-01-24 2014-06-06 Wärmeableitmechanismen für elektronische Handgeräte

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CN203748177U (zh) * 2014-01-24 2014-07-30 东莞汉旭五金塑胶科技有限公司 手持电子装置之散热装置

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CN104981133A (zh) * 2015-07-14 2015-10-14 广东欧珀移动通信有限公司 一种散热装置和手机
CN108716790A (zh) * 2018-04-24 2018-10-30 安徽春辉仪表线缆集团有限公司 一种传热效率高的蒸发器
CN108716790B (zh) * 2018-04-24 2020-09-15 安徽春辉仪表线缆集团有限公司 一种传热效率高的蒸发器

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