TWM302246U - Heat dissipating module - Google Patents

Heat dissipating module Download PDF

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Publication number
TWM302246U
TWM302246U TW95209288U TW95209288U TWM302246U TW M302246 U TWM302246 U TW M302246U TW 95209288 U TW95209288 U TW 95209288U TW 95209288 U TW95209288 U TW 95209288U TW M302246 U TWM302246 U TW M302246U
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Taiwan
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frame
heat dissipation
disposed
sides
parallel
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TW95209288U
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Chinese (zh)
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Guo-En Liang
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Malico Inc
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Priority to TW95209288U priority Critical patent/TWM302246U/en
Publication of TWM302246U publication Critical patent/TWM302246U/en

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Description

M302246 八、新型說明: 【新型所屬之技術領域】 ,本創作係、涉及-種散熱模組的設計,尤指一種藉由彈性扣件_ • 掣’使晶片與散熱板能夠緊密貼合者。 【先前技術】 玉我國專利公告第44925(m與第505264 f虎為本創作人先前所提出 之散熱裝置©定座改良,兩案之原理結構相似,均是取—具有一對側 壁之框體作翻定座,該繼末端具有扣鉤,另在框_面從框邊向 中蚨伸出複數彈性臂,在彈性臂自由端設—向下垂直的凸耳;欲與 固定座配合的散熱板上,空出適合雜伽狀之貼覆位置。組設時, 先使散_片通過框體中央,使框至預留的位置,再藉由該扣釣 扣住晶片的相對兩邊’並配合該些彈性臂之凸耳塵擎於散熱板面,使 散熱板與晶片之間可緊密地貼合。 由於固定座雜娜製成,因此若需要足觸壓力,相對材質就 必須夠硬’但是硬的材質往往使固定座缺乏彈性,故無辆時滿足一 般晶片的不同厚度封裝尺寸需求,所以為了兼具固定座的材質硬 ^及贿雜叙雜郎與抵龍力,聰分難作三種適合上述 曰=厚度之©定座,其差別在於所述凸耳或彈關長度不同,以配合 組裝不同厚度之晶片可做為㈣散熱板之用。 ^由於母種固定座的高度僅差距約lm/m左右,肉眼不易識別尺 別’於庫存管辦容料淆或拿錯,之後雖已改良管理方式,以 M302246 三種不_色區分每麵定座的尺寸,但够可聽庫存成本所帶來 的壓力。 - 【新型内容】 - 《所欲解決之技術問題》 有4α於先别的固疋座所存在的問題,本創作欲設計一種能夠同時 適用各種晶>;厚度的固定座,並且在任何情況也能提供晶片與散熱板 • 之間的貼合力。 《解決問題之技術手段》 本創作欲達成目的的技術手段,係設計一種散熱模組,該散熱模 組包含一座體、一彈性扣件與一散熱板。 該座體具有一鏤空的框體,框體的其中一雙對邊向下垂直延伸各 設有一侧壁,側壁底緣突出一扣鉤,另一雙對邊向下垂直延伸各設有 柱體。最主要特徵係於框體的其中一邊設一個樞接道,其對邊相對 應樞接道位置的兩侧,設一相互對稱之通道。 該彈性扣件,係由一 U形桿體彎折而成型,桿體的一雙長邊其首、 末兩端分別設有隆起部,且射間段形成—高度差,長邊的兩自由端 分別彎折形成兩相反方向的扣耳。 彈性扣件與座體組設時,係先使彈性扣件的一長邊繞行穿設通過 樞接道,使兩長邊相結合的垂直段設於樞接道内,且兩長邊相互平行 且橫跨兩趣邊,再使扣耳與通道接設。再將—具有散賴片或散熱 M302246 柱的散熱板,卡人座_兩麵之間,同時使雜扣件的兩長邊通過 該散熱板之相_片之__,如此即完成散細組的組震。 關於座體的結構尚有另一實施例,係於一對稱框邊上各開設一缺 口’缺π深度深及所述柱體之頂面,其中—缺叫突設該樞接道,另 一缺口相對稱之内側端面各設—向内延伸之孔穴,形成所述對稱之通 道。彈性扣件之兩長邊結合處,同樣穿設於樞接道内,兩扣耳則 輿孔穴接势。 x -固設於電路板上的晶片與補作散熱额接設,絲使散熱模 的川勾卡扣於曰曰片一侧底緣,再藉由另一扣勾卡設於該底緣的 對稱邊,使晶片被設於賴下方並與散熱板底_合,由於迫入晶片 使散熱板向上移’彈性扣件中間的直桿段部㈣掣於散熱板上,且位 於複數散熱柱之間的通道。 《對於先前技術的效果》 本創作所設計的彈性扣件配合固定座,能_時容納各種不同厚 度的晶片’並提供相當_力使散熱域W雜好_合效果,如 此不但節省了庫存成本,另—方面,由於雜扣件的線徑很小,只須 佔用散熱㈣(散熱柱)之間的_,相對地也增加散熱面積。不像 習式的固定座由於設有彈性臂,為了在散熱板上空出彈性臂的位置, 須犧牲—些散熱則(散熱柱)來放置彈性臂,如此則降低了散熱效 M302246 【實施方式】 以下配合®式及元件符賴糊狀實施方式做更詳細的說 使熟習該項技藝者在研讀本說明書後能據以實施。 以達到絕佳的散熱效果 為了避免電子元件如電路板晶片或中央處理器…等因過執而焊 壞’因此需要較好的扣具將散熱板(連同風扇)與電子元件緊密:合 請參閱第-圖所示,本卿之散熱模組主要包含—鋪卜 性扣件2與一散熱板4。 該座體1具有-鏤空的矩形框體u,框體U的其中—雙對邊向 下垂直延伸各設有-較框邊長度短的側壁12、17,沿侧壁12底緣: 座體1内側突出-垂直的扣鉤m、m。框體u另_雙對邊中間位 置,向下垂直延伸各設有-端面成橢圓形的柱體13、18,兩柱體、 18與兩侧壁12、17之間所圍成的範圍與框體u鏤空的形狀相同。柱 體13的框邊端面設有-樞接道14,柱體18的框邊端面設有一雙通道 15、16,樞接道14與通道15、16係自框體u端面向上突伸,為端面 近似圓形的管體’亦可設計為半圓形或單邊開口之凹形管體,通道 15、16係設於樞接道14對邊相對應位置的兩侧,通道15、16、柩接 道14與座體1為一體成型。 該彈性扣件2包含兩平行的長邊2卜22,兩長邊21、&的首、 末兩端分別彎折形成兩組對稱的三角峰22卜222、211、212,受彎折 後的長邊2卜22相互對稱,其中三角峰222、212末端不間斷地彎折, 使兩者之間形成-垂直段23,此垂直段23造成兩長邊2卜22之間具 M302246 有間’並使整體桿件狀似u 側彎折料i心 牌221 211的自由端分別向兩 娜成-扣耳24、25,扣耳24、25㈣峰22i、21 近似垂直_ ’且兩扣耳24、25所__ ^ 使兩長邊21、22之間具有彈性,可相互靠近與嘛狀,又 角峰恕弥211、212與長邊22、21之間具有高度差使長邊= 22具有可向下壓或向上頂的彈性空間。 彈性扣件2除了可製成如第—騎示之態樣外,亦可設計如同. 圖所示’將原本三神221、222、211、212的部分,設計為弧形或^ 他幾何形體;而彈性構件所使用的桿體亦可為矩形端面(圖未示)的 板狀體或其他幾何形體。、 組裝方式請配合參閱第一至三圖,係將彈性扣件2的長邊泣穿設 通過樞接道14,並使垂直段23對齊設於樞接道内14,此時兩長邊^ 22將位於樞接道14兩侧,並相互平行地橫跨座體丨的兩框邊,再將 扣耳24、25分別與通道15、16扣合’待彈性扣件2與座體丨結合後, •再從座體1下裝設散熱板4並使散熱板4活動卡設於兩侧壁17、12 之間’由於有扣勾12卜171的抵擋使散熱板4不會掉出座體1外,同 時使彈性扣件2的兩長邊22直接通過散熱板4之相鄰韓片間的間隙, 如此即完成散熱模組組裝。 請配合參閱第二圖,本創作散熱模組與固設於一電路板6上之晶 片3組設方式’係先將一側扣勾121扣合於晶片3其中一底緣31,再 將扣勾171扣合於底緣31的對稱邊緣(圖未揭示),使散熱板4下表 面與晶片3貼合。當座體1迫入晶片3的同時,會使散熱板4往上移 M3 02246 動,散熱板4表面會與彈性扣件2之兩長邊21、22貼合。又,由於彈 性扣件2的線徑很小,目此兩長邊2卜22係落於散絲41之間的間 隙’而每-個三角峰22卜222、21 i、212之其中一斜邊搭接於框邊上曰, 另一斜邊則橫跨於散熱板4面。 由於考量到-般的晶#封裝有各種不同厚度的封裝尺寸,因此本 創作的彈性扣件2可適合不同厚度的晶片3來使用。請參閱第五圖所 示,係表現當散熱模組配合較厚之晶片3,散熱板4會被上推至較高 處’且其表面將高過框體U表面,此時所扣合的彈性扣件2兩長又^ 21、22,由於與三角峰221、222、211、212之間具有高度差使兩長 邊21、22因此形成有可被抵頂之彈性距離,不但兩長邊21、22的水 平高度比使用較薄之晶片所呈現之長邊高外,由於兩長邊Μ、&的提 南,使三角峰22卜222、211、212的角度也變大。M302246 VIII. New description: [New technical field], the design of the system, the design of the heat dissipation module, especially the one that makes the wafer and the heat sink close together by the elastic fastener _ • 掣'. [Prior Art] Jade China Patent Announcement No. 44925 (m and 505264 f Tiger-based creators previously proposed heat sinks © fixed seat improvement, the principle of the two cases is similar in structure, both take - a frame with a pair of side walls The utility model has a buckle seat, and has a hook at the end, and a plurality of elastic arms protrude from the frame edge toward the middle of the frame, and a downwardly perpendicular lug is arranged at the free end of the elastic arm; the heat dissipation to be matched with the fixing seat On the board, the attachment position suitable for the gamma-like shape is vacated. When assembling, the scatter piece is first passed through the center of the frame to make the frame to the reserved position, and then the opposite sides of the wafer are buckled by the buckle fishing. The lug of the elastic arms is matched with the surface of the heat dissipating plate so that the heat dissipating plate and the wafer can be closely fitted together. Since the fixing seat is made of Nana, if the foot contact pressure is required, the relative material must be hard enough. However, the hard material often makes the fixing seat lack of elasticity, so it can meet the different thickness package size requirements of the general wafer when there is no vehicle. Therefore, in order to have the material of the fixed seat and the bribe and the dragon force, it is difficult to make it. Three kinds of fixings suitable for the above 曰=thickness, In addition, the lugs or the lengths of the latches are different, so as to fit the wafers of different thicknesses, and can be used as (4) heat sinks. ^Because the height of the mother-type mounts is only about lm/m, it is difficult for the naked eye to identify the ruler' After the inventory management office is confused or mistaken, the management method has been improved, and the size of each seat is different by M302246. However, it is enough to listen to the pressure brought by the inventory cost. - [New content] - "Technical Problems to Be Solved" There are problems with 4α in the first solid foundation. This creation is intended to design a fixed seat that can simultaneously apply various crystal thicknesses, and in any case can provide wafer and heat dissipation. The bonding force between the boards and the “Technical means to solve the problem” The technical means for achieving the purpose of the creation is to design a heat dissipation module comprising a body, an elastic fastener and a heat dissipation plate. The body has a hollow frame body, one of the pair of sides of the frame body is vertically extended downwardly and each has a side wall, the bottom edge of the side wall protrudes from a buckle hook, and the other pair of sides are vertically extended downwardly and each has a column body. the Lord The feature is that a pivoting channel is disposed on one side of the frame body, and a pair of mutually symmetric channels are disposed on opposite sides of the opposite side of the pivotal track. The elastic fastener is formed by bending a U-shaped bar body. A pair of long sides of the rod body are respectively provided with a bulging portion at the first and second ends thereof, and the inter-segment portion is formed with a height difference, and the two free ends of the long side are respectively bent to form two oppositely facing lugs. When the seat body is assembled, a long side of the elastic fastener member is firstly passed through the pivoting path, so that the vertical section combining the two long sides is disposed in the pivotal path, and the two long sides are parallel to each other and span the two The fun side, then the buckle ear and the channel are connected. Then - the heat sink with the loose sheet or the heat dissipation M302246 column, between the two sides of the card holder, while the two long sides of the miscellaneous fastener pass through the heat sink Phase____, this completes the group vibration of the fine group. There is another embodiment of the structure of the seat, which is formed on a side of a symmetrical frame, each having a gap, a depth of π deep and the cylinder The top surface of the top surface, wherein the missing portion protrudes from the pivoting channel, and the other notch is symmetrical with respect to the inner end surface thereof - extending inwardly Hole, the symmetry of the passage are formed. The two long side joints of the elastic fastener are also placed in the pivotal path, and the two buckle ears are connected to the cavity. x - The chip fixed on the circuit board is connected with the heat dissipation amount, and the wire is used to fasten the hook of the heat dissipation die to the bottom edge of the side of the blade, and then the symmetry of the bottom edge is clamped by the other hook The wafer is placed under the lap and is placed in contact with the bottom of the heat sink. The heat sink is moved upward by the forced insertion of the wafer. The straight section (4) in the middle of the elastic fastener is placed on the heat sink and is located between the plurality of heat sinks. Channel. "Effects on the Prior Art" The elastic fasteners designed in this creation are matched with the fixing seat, which can accommodate various wafers of different thicknesses, and provide considerable force to make the heat dissipation domain have a good effect, thus saving inventory costs. On the other hand, since the wire diameter of the miscellaneous fasteners is small, it is only necessary to occupy _ between the heat dissipation (four) (heat dissipation columns), and the heat dissipation area is relatively increased. Unlike the fixed seat of the conventional model, because the elastic arm is provided, in order to vacate the position of the elastic arm on the heat dissipation plate, it is necessary to sacrifice the heat dissipation (heat dissipation column) to place the elastic arm, thus reducing the heat dissipation effect M302246 [Embodiment] The following formulas and combinations of components and pastes are described in more detail so that those skilled in the art can implement them after studying the present specification. In order to achieve excellent heat dissipation, in order to avoid electronic components such as circuit board wafers or central processing unit, etc., it is necessary to solder the heat sinks. Therefore, better fasteners are needed to close the heat sink (along with the fan) to the electronic components: see As shown in the figure, the cooling module of the present invention mainly comprises a cloth-like fastener 2 and a heat-dissipating plate 4. The base body 1 has a hollow frame u which is hollowed out, and the double-edges of the frame body U are vertically extended downwardly and respectively provided with side walls 12 and 17 having a shorter length than the frame edge, along the bottom edge of the side wall 12: the seat body 1 inside protruding - vertical clasp m, m. The frame u is further _ the middle position of the double opposite sides, and the columns 13 and 18 respectively provided with the end faces are elliptically extending downward, and the range between the two columns, 18 and the two side walls 12, 17 is The frame u is the same shape. The frame end surface of the column body 13 is provided with a pivotal path 14 , and the frame end surface of the column body 18 is provided with a double channel 15 , 16 , and the pivot channel 14 and the channel 15 and 16 protrude upward from the end surface of the frame body u. The tube body with an approximately circular end surface can also be designed as a semi-circular or single-sided open concave tube body, and the passages 15 and 16 are disposed on opposite sides of the opposite sides of the pivotal passage 14 , the passages 15 , 16 , The splicing path 14 is integrally formed with the seat body 1. The elastic fastener 2 comprises two parallel long sides 2b22, and the first and last ends of the two long sides 21, & respectively, are bent to form two sets of symmetrical triangular peaks 22 222, 211, 212, after being bent The long sides 2b 22 are mutually symmetrical, wherein the ends of the triangular peaks 222, 212 are uninterruptedly bent, so that a vertical section 23 is formed between the two, and the vertical section 23 causes two long sides 2 and 22 between M22246. 'And the integral rod-like u-side bending material i the free end of the heart card 221 211 to the two Nacheng-button ears 24, 25, the lugs 24, 25 (four) peaks 22i, 21 approximately vertical _ ' and two buckle ears 24, 25 __ ^ Make the two long sides 21, 22 between the elastic, can be close to each other, and the peaks between the 211, 212 and the long sides 22, 21 have a height difference so that the long side = 22 has An elastic space that can be pressed down or up. The elastic fastener 2 can be made into a curved body or a geometric shape as shown in the figure as shown in the figure. The rod body used for the elastic member may also be a plate-like body or other geometric body of a rectangular end face (not shown). For the assembly method, please refer to the first to third figures. The long side of the elastic fastener 2 is pierced through the pivoting path 14, and the vertical section 23 is aligned in the pivoting path 14, and the two long sides are 22 Will be located on both sides of the pivotal path 14, and parallel to the two frame sides of the seat body, and then the buckles 24, 25 are respectively engaged with the channels 15, 16 'after the elastic fastener 2 and the seat body are combined , and then the heat sink 4 is mounted from the base 1 and the heat sink 4 is movably clamped between the two side walls 17 and 12. The heat sink 4 does not fall out of the seat due to the resistance of the buckle 12 171 In addition, at the same time, the two long sides 22 of the elastic fastener 2 directly pass through the gap between the adjacent Korean sheets of the heat dissipation plate 4, thus completing the assembly of the heat dissipation module. Referring to the second figure, the heat dissipation module of the present invention and the wafer 3 fixed on a circuit board 6 are assembled in a manner that the one side buckle 121 is fastened to one of the bottom edges 31 of the wafer 3, and then the buckle is buckled. The hook 171 is fastened to the symmetrical edge of the bottom edge 31 (not shown) so that the lower surface of the heat sink 4 is attached to the wafer 3. When the base 1 is forced into the wafer 3, the heat sink 4 is moved upward by M3 02246, and the surface of the heat sink 4 is attached to the two long sides 21, 22 of the elastic fastener 2. Moreover, since the wire diameter of the elastic fastener 2 is small, the two long sides 2b 22 are in the gap between the loose wires 41, and each of the triangular peaks 22 222, 21 i, 212 is inclined. The other side of the frame overlaps the surface of the heat sink 4 while being overlapped on the edge of the frame. The elastic fastener 2 of the present invention can be used for wafers 3 of different thicknesses since it is considered that the package has various package thicknesses of various thicknesses. Referring to the fifth figure, it is shown that when the heat dissipation module is matched with the thicker wafer 3, the heat dissipation plate 4 will be pushed up to a higher position' and the surface thereof will be higher than the surface of the frame U, at this time The elastic fasteners 2 are two long and 21, 22, and because of the height difference between the triangular peaks 221, 222, 211, and 212, the two long sides 21, 22 are thus formed with an elastic distance that can be abutted, not only the two long sides 21 The horizontal height of 22 is higher than that of the long side which is formed by using a thinner wafer. The angles of the triangular peaks 22, 222, 211, and 212 are also increased due to the two long sides and the south of the &

關於樞接道與通道的設計尚有另一實施例,請參閱第四圖所示 係練體11的兩對稱邊上各挖設—缺口 m、U2,該缺口⑴、n 的冰度延伸至柱體13、18頂面,缺口⑴内設置所述樞接道Μ,索 區接道14可為端面近似_、半_管體或為單邊開口之凹形管體 ^ 112相對%之_端面各設—向内延伸之孔穴,作為通道ιι^、 4,以取代第—種加狀猶ΐ5、Μ,且通請 =梅件2與細的接蝴鮮—糊 = 僅在於兩扣科、25物版购13、_。 ^作即是藉轉性扣件2具有彈性的特性,使任何厚度㈣ 或月U、板均_,且彈性扣件㉘掣於散熱㈣上的力量足以使晶片 M3 02246 3與散熱板4緊密貼合,且由於彈性扣件2為桿體, 是採散熱柱或散熱‘鰭片,桿體只會佔用到散熱柱(散埶^上不响 =:須為了使桿體貼合於散熱板4面,而“ 本創解釋本創作之較佳實施例’並非企圖據以對 關本創作之任何修以,凡有在相同之創作精神下所作有 ^ 皆仍應包括在本創作意圖保護之範轉。 M302246 【圖式簡單說明】 第一圖為本創作分解圖。 第二圖為本創作與散熱板、晶片之組合實施例。 -第三圖為本創作組合圖。 - 第四圖為本創作另一實施例組合圖。 第五圖為本創作在使用不同厚度之晶片下,彈性扣件所產生的差異比 較。 • 第六圖為本創作彈性扣件另一實施例。 【元件符號說明】 I. 座體 II. 框體 111·缺口 112·缺口 • 113.通道 114.通道 12. 側壁 121.扣鉤 13. 柱體 14. 樞接道 15. 通道 16. 通道 12 M302246 17. 侧壁 171.扣鉤 18. 柱體 - 2.彈性扣件 21.長邊 211. 三角峰 212. 三角峰 • 22.長邊 221. 三角峰 222. 三角峰 23. 垂直段 24. 扣耳 25. 扣耳 3.晶片 • 4.散熱板 41.散熱柱 5.座體There is another embodiment for the design of the pivoting channel and the channel. Please refer to the two symmetrical sides of the cultivating body 11 shown in the fourth figure - the gaps m, U2, and the ice of the notches (1), n extends to The top surface of the cylinders 13, 18, the pivoting ballast is disposed in the notch (1), and the cable channel 14 can be an end surface approximation _, a half pipe body or a concave pipe body having a single side opening ^ 112 relative % Each end face is provided with a hole extending inwardly as a channel ιι^, 4, in place of the first type, and the shape is added to the ΐ5, Μ, and the 请 梅 梅 梅 与 与 与 与 与 与 与 与 = = = = = = = = = = = , 25 material version purchase 13, _. ^There is the elastic property of the fastener 2, so that any thickness (four) or month U, the board is _, and the strength of the elastic fastener 28 on the heat dissipation (four) is sufficient to make the wafer M3 02246 3 close to the heat sink 4 Fit, and because the elastic fastener 2 is a rod body, it is a heat-dissipating column or a heat-dissipating fin, and the rod body only occupies the heat-dissipating column (the sound is not sounded on the surface): the rod body should be attached to the heat-dissipating plate 4 No, "Ben Chuang explains the preferred embodiment of this creation" is not intended to be based on any revision of the creation of the book, and all that is done under the same creative spirit should still be included in the protection of this creative intention. M302246 [Simple description of the diagram] The first diagram is an exploded view of the creation. The second diagram is a combination of the creation and the heat sink and the wafer. - The third diagram is a combination of the creations. Another embodiment is shown in combination. The fifth figure is a comparison of the differences produced by the elastic fasteners under the use of wafers of different thicknesses. • The sixth figure is another embodiment of the creative elastic fastener. 】 I. Seat II. Frame 111 · Notch 112 · Notch • 113 Channel 114. Channel 12. Side wall 121. Clasp 13. Column 14. Pivot channel 15. Channel 16. Channel 12 M302246 17. Side wall 171. Buckle 18. Column - 2. Elastic fastener 21. Long Side 211. Triangle peak 212. Triangle peak • 22. Long side 221. Triangle peak 222. Triangle peak 23. Vertical section 24. Buckle ear 25. Buckle 3. Wafer • 4. Heat sink 41. Heat sink 5. Seat

Claims (1)

M3 02246 九、申請專利範圍: 1· 一種散熱模組,包含一座體,該座體具有一鏤空的框體,框體的其 中一雙對邊向下垂直延伸各設有一側壁,該侧壁底緣突出一扣鉤, 另一雙對邊向下垂直延伸各設有一柱體,其特徵在於: 所述框體的其中-邊設有-樞接道,其對邊相對應該拖接道位置的 兩側,另設有一相互對稱之通道; -彈性扣件’包含-U轉體’該桿體具有—雙對稱的長邊,該長 • 邊之首、末兩端分別設有隆起部,且與中間段形成-高度差’其中 -組對稱的隆起部之間設有-垂直段,所述桿體的兩自由端垂直設 有一扣耳; 口 該扣耳設於該通道内,所述兩長邊橫 該垂直段設於所述樞接道内, 跨於所述框體之對稱邊; -具有散熱献或散熱柱之散熱板,卡設於所述側壁之間,且哪 性扣件的兩長邊通過相鄰的所述散_片之間的間隙。M3 02246 IX. Patent application scope: 1. A heat dissipation module comprising a body having a hollow frame body, wherein one of the pair of sides of the frame body extends vertically downwards and each has a side wall, the side wall bottom The rim protrudes from the shackle, and the other pair of sides are vertically extended downwardly and each has a column body, wherein: the middle side of the frame body is provided with a pivotal path, and the opposite side of the frame is corresponding to the position of the towed track. On both sides, a mutually symmetrical channel is provided; - the elastic fastener 'includes -U-turned body', the rod body has a double-symmetric long side, and the first and the last ends of the long side are respectively provided with ridges, and Forming a height difference with the middle section, wherein a vertical section is provided between the symmetry ridges, and two free ends of the shank are vertically disposed with a buckle; the buckle is disposed in the passage, the two The vertical section of the long side is disposed in the pivoting path and spans the symmetrical edge of the frame; the heat dissipation plate having the heat dissipation or heat dissipation column is disposed between the sidewalls, and the fastener is The two long sides pass through the gap between the adjacent sheets. 2. 依據申請專利範圍第1項所述之散熱模組,其中,所述樞接道j 道為固形端面管體,突設於所馳狀上表面並與框邊平行。 3. 依據申請專利範圍第〗項 道為半圓形端晴,突所細^ 4依據f ^ ° 叙上表面並與框邊平行。 •㈣申4利域則項所述之模 道為單邊開口之凹形端面營靜,〜 ^所祕接運與 平行。 _犬叹於所述框邊之上表面並與框 5·依據申請專利範圍第1 項所述之散熱模組,其中, 延伸設有該枝體 142. The heat dissipation module according to claim 1, wherein the pivot channel j is a solid end face tube protruding from the upper surface and parallel to the frame edge. 3. According to the scope of the patent application, the road is semi-circular, and the protrusion is fine. 4 According to f ^ °, the upper surface is parallel to the frame edge. • (4) The mode described in the application of the 4th domain is a concave end face of a single-sided opening, and the secret is parallel and parallel. _ The dog sighs on the upper surface of the frame and is in accordance with the heat dissipation module according to the first aspect of the patent application, wherein the branch body is extended. M302246 之兩側框邊各設有〆相對稱之缺口,該缺口的深度延伸至所述柱體 頂面,其中一缺口内設置所述樞接道,該樞接道為管體,平行框邊 地設於該缺口底面;另一缺口相對稱之内側端面各設一向内延伸之 孔穴,形成所述通道’該孔穴平行於框邊。 6.依射請專__ 5撕叙麟歡,射,所馳接道 形端面之凹形管體。 •又w專利麵圍弟5項所述之散熱模組,其^ 圓形端面之凹形管體。 8·=據申請專利範圍第5項所述之散熱模組,其中 发 邊開口之凹形端面管體。 过^運為單 9. ::咖範圍第〗項所述之散熱模 ” :,且桿體隆起部為三角形輪廓。職面為圓 10. 依據申請專利 為矩形,且桿體隆。員所述之散熱核組,其中,該桿體端面 t4為圓弧形。Each of the two sides of the frame of the M302246 is provided with a nickname, and the depth of the notch extends to the top surface of the column. The pivoting channel is disposed in a notch, and the pivoting path is a pipe body, and the parallel frame side The hole is disposed on the bottom surface of the notch; the other end of the notch is provided with an inwardly extending hole, and the hole is formed to be parallel to the frame edge. 6. According to the shot, please __ 5 tear the Syrian Huan, shoot, and take the road to the concave end of the shape of the tube. • The thermal module described in the five patents of the patented face, the concave tube of the circular end face. 8·= The heat-dissipating module according to item 5 of the patent application scope, wherein the concave end-face tube body with the opening of the edge is provided. The heat dissipation mode described in the item 9.: café range 〗 〖:, and the ridge of the ridge is a triangular outline. The face is a circle 10. According to the patent application, the rectangle is rectangular and the body is long. In the heat dissipation core group, the rod end surface t4 is a circular arc shape.
TW95209288U 2006-05-29 2006-05-29 Heat dissipating module TWM302246U (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI466627B (en) * 2011-06-30 2014-12-21 Hon Hai Prec Ind Co Ltd Clip

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI466627B (en) * 2011-06-30 2014-12-21 Hon Hai Prec Ind Co Ltd Clip

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