1308683 七、指定代表圖： ㈠本案指定代表H為：第（10)圖。 1004 :第四散熱區塊； 1005 :第一散熱鰭片； 1006 :第二散熱鰭片； 1007 :第三散熱鰭片； 1008 :第四散熱·鳍片； 1009 :電子元件。 (二)本代表®之元件符賴單說明: 12 :顯示卡； 51 :導熱管； 511 :固定柱； 散熱裝置； 以及 1001 :第一散熱區塊 1002 :第二散熱區塊 1003 :第三散熱區塊 八、 本案若有化學柄，請齡最能顯科_徵的化學式 九、 發明說明： 【發明所屬之技術領域】 本發明係關於一種散熱裝置，特別有關於散熱鰭片可選擇 性分佈於顯示卡之各個區域的技術領域。 、 【先前技術】 隨著多媒體時代的來臨，相關的多媒體資訊已被運用在各 項電腦或消費性等電子產品上。對此，顯示卡如何能圓滿的將 這些電腦或消費性等電子產品所運算的成果，再以其高速運算 展現於螢幕或其他顯示裝置上，已為市場上的必備要求。也正 4 1308683 如大眾所期待的，目前市面 、^ ^ 趕上了市場的要求。事實上，、卡:處理速度已確實逐步 其所需的處理速度，其實在顯為能達成 =中=器可謂具備相同之：二=， 5而=，顯不卡上的處理器勢必也遭 于 :^來不斷雄= 遂揭:=中用於顯示卡上較為常用的散熱裝置如后； 明參考第1難為習知技藝巾顯示卡上的 思圖。在第1圖中，散埶1詈】勺入女”、、聚置之不1308683 VII. Designated representative map: (1) The designated representative H of this case is: (10). 1004: fourth heat dissipation block; 1005: first heat dissipation fin; 1006: second heat dissipation fin; 1007: third heat dissipation fin; 1008: fourth heat dissipation fin; 1009: electronic component. (2) The components of this representative® are indicated by: 12: display card; 51: heat pipe; 511: fixed column; heat sink; and 1001: first heat block 1002: second heat block 1003: third Heat-dissipating block VIII. If there is a chemical handle in this case, please be the most suitable for the age of the chemistry. IX. The technical description of the invention: [Technical field of the invention] The present invention relates to a heat-dissipating device, particularly for the heat-dissipating fins. Distributed in the technical field of each area of the display card. [Prior Art] With the advent of the multimedia era, related multimedia information has been applied to various computer or consumer electronic products. In this regard, how the display card can satisfactorily display the results of these computer or consumer electronic products on the screen or other display devices with high-speed computing has become an essential requirement in the market. Also 4 1308683 As the public expects, the current market, ^ ^ caught up with the market requirements. In fact, the card: processing speed has indeed gradually reduced the processing speed required, in fact, it can be achieved = medium = can be said to have the same: two =, 5 and =, the processor on the card is bound to suffer In: ^ Come to the continually male = 遂 reveal: = used in the display card is more commonly used in the heat sink such as the back; Ming reference to the first difficult to learn the art on the display card on the card. In the first picture, the divergence 1詈] is scooped into the female, and the gathering is not
IhJLt ϋ 3有—散熱底座1G及複數個 鰭片11。其中’散熱底座1〇具有一頂面ι〇ι及一底面⑽， 合於一顯示卡12之發熱源121，而頂面101則 通常另，—熱源⑵ 土請參考第2圖係為習知技藝中顯示卡上的一散敎裝 =缺在第2圖中，散熱裝置2包含有—散齡 個 一導細及—導熱片21。其中，散熱广= ^有頂面101用以直立延伸複數個散熱鰭片u。導熱管2〇 2具有兩端緣’―端緣可連接至導熱片21，另—端則可貫穿 政，、、、底座10。此外’導熱片21通常可用於貼合於顯示卡12上 =熱源12卜藉此’發熱源121賴源遂經由導熱片21傳孰 予導熱管20，導熱管20㈣以其管内之毛細現象將熱源傳導、 最後，散熱麵1㈣可藉由絲則11進行 °月參考第3圖為習知技藝中顯示卡的—散孰裝置之音 圖。在第_，散熱裝置3包含有一第—散熱底座3以數 個第—散熱鰭片301、一第二散熱底座31、複數個第二散熱鰭 片311以及一導熱管2〇。其中’第一散熱底座3〇具有—底面s 1308683 :===^合於齡卡12上具 二散朗請。此外’第==直亦立具延有伸—上底= ，，導熱管 ==== 且二穿第一产熱底座30及第二散熱底座3卜當發熱源 此；一Ϊ熱底座3°之底面3〇2傳導其熱源Ϊ: =分散至第二散熱底座31上’遂由第二 圖意 個第-散熱韓片30卜-第-導熱管4〇、一導熱片21、一=數 ^底fj、複數個第二散熱鱗片311以及一第二導熱管^ 一散_謝°第一導熱管_可具有 接至導熱片2卜另―端則可貫f第_散熱底導連 21則通常可用於貼合於顯示卡12上之發熱源121。=熱片二 散熱底座31亦具有-底面312及—頂面（圖未示），且利用g 面312貼合於顯示卡12的另外一平面（圖来 /、- 311 則可直接繞於顯示卡12之兩對應平面上且貫='、s 41 30及第二散熱底座31。當發舰121的親遂軸 的吸熱予第-導熱管40，第-導齡4㈣再叫管内 現象將熱源傳導至第-散熱底座30。最後，第一散孰底座加 則可藉由其散熱鰭片301進行其散熱動作。再者，當熱源傳導 1308683 =第:散熱底座3G的同時，上述熱 ==進 =散至第二散熱細上，遂由第: 端看上述習知聽之散絲置，至少包含有下列缺 ίίίίΙΓ賴鰭片㈣絲絲熱底絲作為其延伸 有相且卡的大部分*積，致使顯上 (2) 熱管於貫穿散熱底座時，其熱源遂經由導 底座的内辟卢二Ϊ 導熱官的外壁處及上述散熱 未能緊密接觸，致使導熱管與散熱底 源傳微小的熱源傳導面積’因而影響其熱 (3) ΐί裝置中之散熱鰭片因需依靠散熱底座來加以延伸及其 (4) ,’、、員不卡上必須要有足夠的扣合或卡合力量’方能使散 ^置得j緊密卡合或扣合於顯示卡上，而不至於當顯示 裝二置因;晃動導致散熱 *卡上的發熱源無法有效藉由其散:裝：進二使= ，造成顯示卡上的電子元件因散熱3=損且 1308683 ^述習知技藝來看，散熱裝置大都對於顯示卡上之-發 =面進行其熱傳導及其散熱動作，像是顯示卡上的處理 上之發細、。殊不知齡卡的熱源亦會從顯示卡上 如㈣部分熱源’像是上述處理器焊接處’對此’ 11肩除此熱源亦為一待解決的問題。 【發明内容】 係提:口知之第1項缺失，本發明散熱裝置 龐大且重量 平面，可免除習知技藝中之體積 且較為輕盈使其散熱裝置具有較小體積 鰭片及-導㈣雛峨的散絲置包含有複數個散熱 ㈣熱=其;;=== 鰭片所具有的一邊端，固由這些散熱 成‘二使;= 以固接穿這些散熱鰭片，使這些散熱鰭片得 述導第—平面或第二平面上，且可透過上 來作為這些散朗⑽支撐及導熱齡。職兩十面間’ *»、曰片使導熱官與散熱鰭片的貫穿處能更加緊密貼合， 8 1308683 鰭片之可具有—定程度大小的貼合面積，使導熱管與散熱 ϊ導之保有一定程度大小的導熱面積，因而可提升其熱源 上述第1 。此外，在這裡所提的第二種結構改良更可結合於 片時，邋结構改良上’致使其導熱管於貫穿或固接於散熱鰭 f空♦+、、、、音與散熱縫片貫穿處或固接處可更緊密貼合。此舉， 固接4可具有—定程度大小_合面積，使導熱管與 埶ϋ道之間可保有一定程度大小的導熱面積，因而可提升其 ’片及一道之ί果。在這裡所提的散熱裝置包含有複數個散熱鰭 各且有一熱官。當導熱管可貫穿其散熱鰭片時，這些散熱鰭片 之二、軎:孔洞a這些孔洞因瞻所訂的孔片仍連接於其孔洞 上。而當導熱管貫穿散熱鰭片之孔洞時，這些孔洞所 =孔片遂可貼合於導熱管上所貫穿的外壁處上。或是，當斤 置、，可f接於散熱鰭片的一邊端時，此邊端可再延伸一彎 的外翼可使這些散熱鰭片的邊端貼合於導熱管所需固接 麓：^於上述習知技藝之第3項缺失，本發明散熱裝置提供 另構改良’適祕—顯示卡且此顯示卡具有—第一平面 .平面之第二平面，可免除習知技藝中之散熱底座， II由上述第-種結構改良將散熱轉片依設計者之實際需求 刀、紐對顯示卡之兩對應平面進行分區。此舉，得使這些 之分佈做-有效分配。這裡所提的散熱裝置至少包^ … 散熱區塊、一第二散熱區塊及複數個導熱管。其中， 散熱區塊可設於第-平面或第二平面上且此區塊上^設 複，個第-散熱鰭片。而第二散熱區塊則可^於第一平面或 t平面上且此^塊上可設有複數轉二散熱鰭片。在此，這 二第一散熱鰭片及第二散熱韓片皆不需形成於任何散熱底座 上而如同上述第一結構改良，意即改由上述複數個導熱管或 1308683 •散熱 可配合至少一固定柱來選擇性加以貫穿或固接這些第— 鰭片及第二散熱鰭片。 _IhJLt ϋ 3 has a heat sink base 1G and a plurality of fins 11. The heat sink base 1 has a top surface ι〇ι and a bottom surface (10), which is combined with a heat source 121 of a display card 12, and the top surface 101 is usually another heat source (2). Please refer to FIG. In the art, a splicing device on the display card is missing. In FIG. 2, the heat dissipating device 2 includes a thin guide piece and a heat conducting sheet 21. Among them, the heat dissipation is wide = ^ There is a top surface 101 for extending a plurality of heat dissipation fins u upright. The heat pipe 2 〇 2 has two end edges ‘the end edge can be connected to the heat conducting sheet 21, and the other end can penetrate the government, the, and the base 10. In addition, the 'thermal sheet 21 can be used to be attached to the display card 12=the heat source 12, whereby the heat source 121 is passed through the heat conducting sheet 21 to the heat pipe 20, and the heat pipe 20(4) uses the capillary phenomenon in the tube to heat the heat source. Conduction, and finally, the heat dissipating surface 1 (4) can be performed by the wire 11 to refer to Fig. 3 as a sound map of the display card-diffusion device in the prior art. In the first embodiment, the heat sink 3 includes a first heat sink base 3 with a plurality of first heat sink fins 301, a second heat sink base 31, a plurality of second heat sink fins 311, and a heat transfer tube 2''. Wherein the first heat sink base 3 has a bottom surface s 1308683: ===^ combined with the age card 12 has two divergent requests. In addition, 'the == straight is also extended with extension - upper bottom =,, the heat pipe ==== and the second wear heat generating base 30 and the second heat sink base 3 as a heat source; a hot base 3 The bottom surface of the °3〇2 conducts its heat sourceΪ: = is dispersed to the second heat sink base 31'遂 by the second figure, the first heat-dissipating piece 30b-the first heat pipe 4〇, a heat conducting piece 21, a = The number of bottoms fj, the plurality of second heat-dissipating scales 311, and a second heat-conducting tube _ a _ _ ° the first heat-conducting tube _ can have connected to the heat-conducting sheet 2 and the other end can be consistent with the _ cooling bottom lead 21 is generally used for the heat source 121 attached to the display card 12. The heat sink 2 heat sink base 31 also has a bottom surface 312 and a top surface (not shown), and is attached to the other plane of the display card 12 by the g surface 312 (Fig. /, - 311 can be directly wrapped around the display) The two sides of the card 12 correspond to the plane and pass through '', s 41 30 and the second heat dissipation base 31. When the heat absorption of the relative axis of the ship 121 is applied to the first heat pipe 40, the first guide age 4 (four) is called the heat phenomenon inside the pipe. Conducted to the first heat sink base 30. Finally, the first heat sink base can be heat-dissipated by the heat sink fins 301. Further, when the heat source conducts 1308683 = the heat sink base 3G, the heat == Into the second heat sinking fine, 遂 from the first: see the above-mentioned conventional listening to the loose wire, including at least the following ί ί ί ί ί ( 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四*Production, so that (2) when the heat pipe runs through the heat sink base, the heat source is not in close contact with the heat dissipation of the outer wall of the heat-conducting officer through the guide base, so that the heat pipe and the heat-dissipating source pass through The heat source conduction area' thus affects its heat (3) The heat-dissipating base is extended and (4), ', and the card must have sufficient fastening or snapping force on the card to enable the loose-fitting j to be tightly engaged or fastened to the display card. It does not cause the display to be installed. The swaying causes the heat to be dissipated. The heat source on the card cannot be effectively dissipated by it: loading: entering the second =, causing the electronic components on the display card to be dissipated due to heat dissipation 3 = 1308683 In terms of technology, most of the heat sinks perform heat transfer and heat dissipation on the display card, such as the processing on the display card. The heat source of the unknown card will also be on the display card (4). A part of the heat source 'like the above-mentioned processor soldering place' is a problem to be solved by the heat source of the above. [Abstract] The first item of the invention is missing, and the heat sink of the present invention is bulky and flat. It can eliminate the volume and lightness of the prior art, so that the heat sink has a smaller volume of fins and the guide wire of the four guides contains a plurality of heat dissipation (four) heat = its;; === the fin has One side, solid by these heat into a 'two make; = to securely wear this The fins are arranged so that the fins are on the plane-plane or the second plane, and can be used as the sturdy (10) support and the heat-conducting age. The two sides of the '*», the cymbals make the heat-conducting officer The fins of the fins can be more closely adhered to each other. The 8 1308683 fins can have a certain degree of bonding area, so that the heat conducting tube and the heat dissipating guide have a certain degree of heat conduction area, thereby improving the heat source thereof. In addition, the second structural improvement mentioned here can be combined with the sheet, and the structure of the crucible is improved so that the heat pipe is penetrated or fixed to the heat dissipating fin f ♦+, ,,, sound and heat The seam can be more closely adhered to the through hole or the fixed joint. In this way, the fixing 4 can have a certain degree of _ joint area, so that a certain degree of heat conduction area can be maintained between the heat pipe and the channel, so Enhance its 'slices and one's fruit. The heat sink described herein includes a plurality of heat sink fins and a heat officer. When the heat pipe can penetrate the heat sink fins, the holes of the heat sink fins, the holes a, the holes are still connected to the holes. When the heat pipe runs through the hole of the heat sink fin, the hole hole 遂 can be attached to the outer wall through which the heat pipe runs. Or, when the pin is placed, it can be connected to one end of the heat dissipating fin, and the outer end of the fin can be extended to make the edge of the heat dissipating fin adhere to the heat pipe. : ^ In the third item of the above-mentioned prior art, the heat dissipating device of the present invention provides an alternative structure to improve the 'stationary-display card and the display card has a second plane of the first plane and the plane, which can be dispensed with in the prior art. The heat-dissipating base, II is modified by the above-mentioned first-type structure, and the heat-dissipating fins are partitioned according to the actual requirements of the designer and the two corresponding planes of the pair of display cards. This move has to make these distributions - effective allocation. The heat dissipating device mentioned here comprises at least a heat dissipating block, a second heat dissipating block and a plurality of heat pipes. The heat dissipation block may be disposed on the first plane or the second plane, and the first heat dissipation fins are disposed on the block. The second heat dissipation block may be disposed on the first plane or the t plane, and the plurality of heat dissipation fins may be disposed on the block. Here, the two first heat dissipating fins and the second heat dissipating fins are not required to be formed on any heat dissipating base, and are improved as the above first structure, that is, the plurality of heat pipes or 1308683 are replaced by the heat sink. The post is fixed to selectively penetrate or secure the first fin and the second fin. _
有蓥於上述習知技藝之第4項缺失，本發明散熱裳置提供 第四種結構改良，適用於一顯示卡且此顯示卡具有一第一 及對應第一平面之第二平面，可提供一足夠鎖合及一_^人 量’使散齡置得以緊龍合且卡合於顯示卡上。^ 熱裝置至少包含有複數個散細片、—她結構及其。 其中’這些散熱鰭片可没於第-平面上。*背板結構則可設於 第二平面上且具有至少-螺柱自第二平面貫穿第—平面背 板結構預先鎖合於顯示卡的第二平面上。另，導熱 二 第-平面上且貫穿這些散熱鰭片。此外，背板結構更可包=有 -扣合構件，此扣合構件可自結觀伸出來，藉此鱼散献 鰭片所延伸的-扣合板進行其扣合動作。在這 结^ 可適賴.技對«絲之散鮮置或是tit 第-結構改良巾不需散熱底座之散熱裝置。#散齡置具 熱底座時’ Ϊ板結構則可直接透過上賴柱自第二平面 一平面’續藉由對應上述螺柱之螺帽將散熱底座鎖合於第 面上。另外，纽絲料賤賴 結卿及其對應之螺帽將其背板結構鎖固於板 亡此ίϊί?由上述扣合構件及扣合板’致使背板結構可扣合 ί °請注意’在這裡的f板結構亦可作為一散献面 i觸合板則可為—導熱體。對此，透過上述螺柱 置的部份熱轉5丨至雜結構來進行散熱。 第五種結構之c，本發明散熱裝置提供 及對應第-卡且此齡卡具有—第一平面 Μ千面之第—平面’可同時提供第—平面上及第二平 1308683In view of the fourth item missing from the above-mentioned prior art, the heat dissipation device of the present invention provides a fourth structural improvement, which is suitable for a display card and has a first plane and a second plane corresponding to the first plane, which is provided A sufficient lock and a _ ^ person's amount to make the age of the tight fit and snap to the display card. ^ The thermal device contains at least a plurality of loose pieces, her structure and its. Wherein these heat sink fins may not be on the first plane. The backplane structure can be disposed on the second plane and has at least a stud extending from the second plane through the first planar backplane structure to the second plane of the display card. In addition, the heat conduction is on the first plane and runs through the heat dissipation fins. In addition, the back plate structure can further include a --fastening member, and the fastening member can be extended from the knot, whereby the fish disperses the --fastening plate extended by the fin to perform the fastening action. In this case, it can be appropriate. The technical pair «Silk's fresh-keeping or tit-first-structured modified towel does not need a heat sink for the heat sink. #散龄置具 When the hot base is used, the Ϊ 结构 structure can be directly connected to the first surface by the nut corresponding to the stud from the second plane. In addition, the new silk material 贱 结 结 结 结 结 结 结 结 结 结 结 结 结 结 结 结 结 结 锁 由 由 由 由 由 由 由 由 由 由 由 由 由 由 由 由 由 由 由 由 由 由 由 由 由 由 ° The f-plate structure can also be used as a diffusing surface i-contact plate to be a heat conductor. In this regard, a portion of the stud is thermally transferred to the hybrid structure for heat dissipation. In the fifth structure c, the heat dissipating device of the present invention provides and corresponds to the first card and the card of the age has a first plane - the first plane of the thousand faces can simultaneously provide the first plane and the second plane 1308683
面上電子元件或其焊接處的熱源散發處理。這裡所提的散熱裝 置至少包含有複數個散熱鰭片及一背板結構。其中，複數個散 熱鰭片可設於第一平面上且可藉由一導熱管來貫穿這些散熱 鰭片。而背板結構則可設於第二平面上且具有至少一凸緣貼合 於第二平面上之一發熱源。另外，背板結構可具有一螺柱貫穿 第一平面及第一平面，供背板結構鎖合於第二平面上。再者， 背板結構更包含延伸一扣合構件自第二平面繞至第一平面扣 合廷些散熱鰭片所對應延伸的一扣合板。在這裡的背板結構亦 可適用於如習知技藝中具備散熱底座之散熱裝置，此時，背板 結構則可直接透過上述螺柱自第二平面貫穿第一平面，續藉由 對應上述螺柱之螺帽將散熱底座鎖合於第一平面上，供背^結 構及散熱底座鎖合於顯示卡上。 ’、 為使貴審查委員對於本發明能有更進一步的了解與認 同，茲配合圖式詳述本發明的實施方式如后。 【實施方式】 ，考第，，本發明針對上述第一種結構改良所提散 個散熱則5〇、-導熱管51及至少—固定柱511。1中有H ，鰭片50可設於-顯示卡12之_第_平面上52 =51並可配合固定柱511來貫穿這些散熱讀片5〇，導 政熱鰭片50間之支撐固定用途。此外，Α 馮 5。及發熱源m間則可透過：：導=3在來弟值中’散熱鰭片 籍片50遂將來自於導熱板53之熱源敎总之。班而散， ^^50 ^ 50^f 顯示卡的第 仏&些散熱鰭片50選擇性 1308683 設於第一平面52及第二平面（圖未示）上。 第一種結構改良所提散 5卜_51及至少,_。在這Ϊ =散=片50則可具有-邊端5()1固接於導熱管5ι之一外 上。其中，這些散熱鰭片50與導熱管51之外壁 直立延伸狀。再者，固定柱511則可貫穿這地^ 熱·鰭片5G之間的連結關係更具穩固。—…Β 0使散 請參考第7圖係為本發明針對上述第二種纟 熱裝置之—立體示意圖。在第7圖中 提散 個散朗〇〇、-導鮮51及至少—固定有複數 ，片7G上可設有-孔洞7G1且此孔洞7()1的緣二= =一孔片702。導熱管51遂可貫穿這些孔洞7〇1且使 Μ貼合於導熱管51所貫穿的外壁處7〇3±。 ^ 置7則可利用一導熱板53貼合於顯示 。=”、、裝 熱，上。另外，導熱管Η更可選擇性J顯二面22: :平，及第二平面，供這些散熱縫片 = 面52及第二平面71上。再者，固社训更可貫穿^ 些政$片7G，使散熱則7G之間更加翻其連 敎震置ίΗΓ系^發^對上述第二種結構改良所提散 另體不思圖。在第8圖中，散熱裝置8包含有-散熱底座80、複數個散熱鰭片7G及—導熱f 5卜 J座8。可依據設計者之設計需求，將其設於顯示卡、1月二 ^面52上或第二平面上7丨。而這些散熱鰭 於 =。上且形成一直立延伸狀。另外’這些散熱=散如熱 =第7圖所述，可各自開有一孔洞7〇1且這些孔洞7〇ι的一邊 緣可留有-孔片702。導熱管51則可貫穿這些孔洞加致使這 12 1308683 些孔片702可貼合於導熱管51的外壁處7〇3上。 f參考第9 ®係為本發明針對上述第二種結構 散熱裝置的-立體示意圖。在第9圖巾 數個散熱則70、-導熱管51及 9包3有複 鰭片刊可設於顯示卡12的第一平至面這些散熱 各具有，可延伸出，9G。導熱管用^^ 翼90貼合於導熱管51所連接的外壁處91上且形成^直立^ :另^ ’導熱管51更可選擇性繞於顯示卡12的第 ^The heat source of the electronic component or its soldering surface is dissipated. The heat dissipating device mentioned here comprises at least a plurality of heat dissipating fins and a back plate structure. The plurality of heat dissipating fins may be disposed on the first plane and may pass through the heat dissipating fins through a heat pipe. The backing plate structure can be disposed on the second plane and has at least one flange attached to one of the heat sources on the second plane. In addition, the back plate structure may have a stud extending through the first plane and the first plane for the back plate structure to be locked to the second plane. Furthermore, the backing plate structure further comprises a fastening plate extending from the second plane to the first plane for fastening the corresponding fins. The back plate structure here can also be applied to a heat dissipating device having a heat dissipating base in the prior art. In this case, the back plate structure can directly penetrate the first plane through the stud from the second plane, and the snail corresponding to the snail is continued. The nut of the column locks the heat dissipation base on the first plane, and the back structure and the heat dissipation base are locked on the display card. In order to enable the reviewing committee to have a better understanding and recognition of the present invention, the embodiments of the present invention will be described in detail with reference to the drawings. [Embodiment], the present invention, the present invention is directed to the above-mentioned first structural improvement, the heat dissipation is 5 〇, the heat pipe 51 and at least the fixed column 511. 1 has H, and the fin 50 can be set at - 52 = 51 on the _th plane of the display card 12 and can cooperate with the fixing post 511 to penetrate the heat-dissipating reading sheets 5, and support the fixing between the heat-insulating fins 50. In addition, Α von 5. And between the heat source m can pass:: guide = 3 in the value of the brothers' heat sink fins 50 遂 will be from the heat source plate 53 heat source 敎 total.班散散, ^^50 ^ 50^f The first 仏 of the display card & some of the heat sink fins 50 selectivity 1308683 is set on the first plane 52 and the second plane (not shown). The first structural improvement is to provide 5 _51 and at least, _. Here, the 散 = 散 = sheet 50 may have - the edge 5 () 1 is fixed to one of the heat pipes 5 ι. The heat dissipating fins 50 extend upward from the outer wall of the heat transfer pipe 51. Furthermore, the fixing post 511 can be more stable through the connection relationship between the heat fins 5G. - Β 使 0 散 散 Please refer to Figure 7 for a perspective view of the present invention for the second type of thermal device. In Fig. 7, the divergence, the fresh guide 51 and at least the fixed number are fixed, and the hole 7G1 can be provided on the piece 7G and the edge 2 of the hole 7 () 1 = a hole piece 702. The heat pipe 51A can penetrate through the holes 7〇1 and conform to the outer wall of the heat pipe 51 through 7〇3±. ^ 7 can be attached to the display using a heat conducting plate 53. =",, heat, upper. In addition, the heat pipe 可 can selectively display two sides 22: : flat, and the second plane for these heat sinking seams = face 52 and second plane 71. Again, The solid social training can be used to run through the government's 7G, so that the heat dissipation is even more difficult to change between the 7G and the ΗΓ ΗΓ ^ ^ 对 对 对 对 对 对 对 对 对 对 对 对 对 对 对 对 对 对 对 对 对 上述 上述 上述In the figure, the heat dissipating device 8 includes a heat dissipating base 80, a plurality of heat dissipating fins 7G, and a heat conducting f 5 b J seat 8. According to the designer's design requirements, it is arranged on the display card, and the January 2 surface 52 7上 on the upper or second plane. These heat-dissipating fins are formed on the vertical and extended. In addition, these heat dissipations are as described in Fig. 7. Each hole can be opened with a hole 7〇1 and these holes An edge of the 7 inch may be left with a hole plate 702. The heat pipe 51 may be inserted through the holes to make the 12 1308683 holes 702 conform to the outer wall 7〇3 of the heat pipe 51. f Reference 9 ® is a three-dimensional schematic diagram of the above-mentioned second structure heat dissipating device of the present invention. In the ninth drawing, a plurality of heat dissipating 70, - the heat pipe 51 and the 9 bag 3 have a composite fin The first flat surface of the display card 12 has heat dissipation, and can be extended, 9G. The heat pipe is attached to the outer wall 91 of the heat pipe 51 and formed by the flange 90. The heat pipe 51 can be selectively wound around the display card 12
w及弟一千面71上。此外，固定柱5η則可 片7〇使散熱鰭片70之間更加穩固其連結關係、。—月…·、 請參考㈣帛15 _林發 改良所提散熱裝置的-立體示意圖。在第㈣中 100 ^含有-第-散熱區塊_、一第二散熱區塊職、一第 j區塊^)03、-第四散熱區塊刪、複數個散熱管51以 固固疋柱511。其中，上述散熱區塊ι〇〇1、1〇〇2、ι〇〇3 及10=可設於顯示卡12的第一平面52或其第二平面（圖未示） 上且母一散熱區塊圓、臟、及麵則可分別具有複 ，個第-散熱鰭片祕、複數個第二散触片讓、複數個第 二，熱鰭片1’以及複數個第四散熱鰭片丨_。在這裡的散 熱管51及固定柱511則可選擇性連接上述散熱區塊麵、 1002^1003 及 1〇〇4 之散熱鰭片 1〇〇5、1〇〇6、1〇〇7 及 1〇〇8。另 外’這裡所述的散熱區塊1001、1002、1003及1004更可依據 汉计，的需求來進行任何分組或分區，像是設計者的分區可依 據顯示卡12上像是電容等電子元件1009的擺設位置來進行迴 避。此外，散熱區塊視需要可外凸於顯示卡12，如第15圖所 示之散熱區塊1002。 13 I3〇8683 散埶第11圖係為本發明針對上述第四種結構改良所提 ==片_、-背板結構魔及-導熱管= 级可設於顯示卡12的第—平面（示)上。背板 11021 11022〇 杜511貫穿這錄熱續片 10^另外’为板結構1102可設於顯示卡12的第二平 上且猎由螺柱11G21貫穿顯示卡12之第二平面71及第 (圖未示），供背板結構魔可預先鎖合於第二平面^面 板結構1102的扣合構件11022與散熱鰭片1101所延 電子1合板ml1進行扣合。再者，料者更可依其通風或 H讀獨所需，在背板賴⑽2上設有至少—個開口飞 料ΐ參考第12圖係為本發明針對上述第_結構改良所提 ϋ置的另—立體示意圖。在第12圖中，散餘置包含有 ^底座80、複數個散熱鰭片·、一背板結構腹及一 導…官51其中’這些散熱鳍片11〇1可設於顯示卡12的第一 平面（圖未示）上且可自散鍾座8G切成—直立延伸狀。背 f結構112則可包含有至少-螺柱11021及一扣合構件麵。而 ¥熱管51可配合至少-固定柱511貫穿這些散熱籍片篇。 另=，背板結構1102則可設於顯示卡12的第二平面71上並 可藉由螺柱11021貫穿顯示卡12之第二平面71及第一平面（圖 未不），遂藉由對應上述螺柱11021之螺帽（圖未示）將散熱底 座80鎖合於第-平面上（圖未示）。此外，背板結構11〇2的扣 合構件11022更可與散熱底板8〇所延伸的一扣合板11〇11進 行扣合。再者，設計者更可在背板結構1102上設有至少一個 開口 11023滿足設計者韻:計可能通風處或可能迴避電子元件之所需。 14 1308683 上述第11圖及第12圖所提的背板結構11〇2亦可作 散熱面板，而扣合構件11022及扣合板11〇11則可為_導熱 對此，透過螺柱11021之路徑接觸散熱底座1或透過扣 ，合板1UG相互接觸時，則可將散_置的部 伤熱/原導引至兔板結構11〇2來進行散熱。w and his brother a thousand faces 71. Further, the fixing post 5n can make the fins 70 more stable and connected to each other. - month...·, please refer to (4) 帛 15 _ Lin Fa Improve the heat sink - stereo view. In the fourth (4), the 100^ contains the -th heat-dissipating block_, the second heat-dissipating block, the first j-block ^)03, the fourth heat-dissipating block, and the plurality of heat-dissipating pipes 51 for fixing the mast 511. The heat dissipation blocks ι〇〇1, 1〇〇2, ι〇〇3, and 10= can be disposed on the first plane 52 of the display card 12 or the second plane thereof (not shown) and the heat dissipation area of the mother The block circle, the dirty surface, and the surface may respectively have a complex, a first heat sink fin secret, a plurality of second contact strips, a plurality of second, a heat fin 1' and a plurality of fourth heat sink fins _ . Here, the heat dissipating tube 51 and the fixing post 511 are selectively connectable to the heat dissipating block surface, the heat sink fins 1002, 1003 and 1〇〇4, 1〇〇6, 1〇〇7 and 1〇. 〇 8. In addition, the heat-dissipating blocks 1001, 1002, 1003, and 1004 described herein can perform any grouping or partitioning according to the requirements of the Chinese meter. For example, the designer's partition can be based on the electronic component 1009 such as a capacitor on the display card 12. The position of the display is to avoid. In addition, the heat dissipating block may be convexly protruded from the display card 12 as needed, as shown in Fig. 15 of the heat dissipating block 1002. 13 I3〇8683 散埶11 is the first plane of the present invention for the fourth structural improvement mentioned above == sheet _, - back panel structure magic and - heat pipe = level can be set on the first plane of the display card 12 (show )on. The back plate 11021 11022 〇 511 extends through the recording continuation film 10 ^ another 'the board structure 1102 can be set on the second level of the display card 12 and the second plane 71 and the first plane 71 of the display card 12 are studed by the stud 11G21. The fastening member 11022 for the backplane structure to be pre-locked to the second plane panel structure 1102 is fastened to the electronic panel 1 ml1 of the heat dissipation fin 1101. Furthermore, the material can be provided with at least one open fly material on the back plate (10) 2 according to the ventilation or H reading requirement. Referring to FIG. 12, the present invention is directed to the above-mentioned first structural improvement. Another three-dimensional schematic. In Fig. 12, the residual portion includes a base 80, a plurality of heat radiating fins, a back plate structure belly, and a guide 51. wherein the heat sink fins 11〇1 can be disposed on the display card 12 A plane (not shown) can be cut from the bell seat 8G into an upright extension. The back f structure 112 can include at least a stud 11021 and a snap member surface. The heat pipe 51 can be coupled with at least the fixed post 511 to penetrate the heat sink sheets. In addition, the backplane structure 1102 can be disposed on the second plane 71 of the display card 12 and can penetrate the second plane 71 of the display card 12 and the first plane (not shown) by the stud 11021. The nut (not shown) of the stud 11021 locks the heat sink base 80 to the first plane (not shown). In addition, the fastening member 11022 of the backing plate structure 11〇2 can be further engaged with a fastening plate 11〇11 extending from the heat dissipation base plate 8〇. Furthermore, the designer can provide at least one opening 11023 on the backplane structure 1102 to satisfy the designer's rhyme: the need to ventilate or possibly avoid electronic components. 14 1308683 The back plate structure 11〇2 mentioned in the above FIGS. 11 and 12 can also be used as a heat dissipation panel, and the fastening member 11022 and the fastening plate 11〇11 can be used for heat conduction and the path through the stud 11021. When the heat-dissipating base 1 or the through-buckle is contacted, and the plywood 1UG is in contact with each other, the heat-dissipating portion can be guided to the rabbit-plate structure 11〇2 for heat dissipation.
請參考第13圖係為本發明針對上述第五種結構改良所提 散熱裝置的-域示賴。在f 13圖巾，散絲置包含 ^個散熱鯖片麗、-導熱管51及―背板結構13()1。其中， 這些散熱鰭片1101設於第一平面52上且透過導熱管51來貫 穿固接。而背板結構1301則設於第二平面上71且且有至少一 凸緣1期可貼合於第二平面71上之至少一發熱源7ιι。此 外，背板結構1301，如同第π圖所述之背板結構，可具有一 螺柱（圖未不）貫穿第二平面71及第一平面52，供背板結構 1301鎖合於第二平面71上。再者，背板結構蘭，如同第“ 圖所述之背板結構，更可包含延伸—扣合構件（圖未示）自第二 平面71繞至第-平面52扣合這些散熱鰭片11〇1所對應延伸 的一扣合板（圖未示）。 請參考第14圖係為本發明針對上述第五種結構改良所提 政熱裝置的另一立體示意圖。在第14圖中，散熱裝置包含有 一散熱底座80、複數個散熱鰭片11〇1、一導熱管51及一背板 結構1301。其中，散熱底座8〇可依據設計者之設計需求，將 其設於顯示卡12的第一平面52上。而這些散熱鰭片7〇則可 设於散熱底座80上且形成一直立延伸狀。此外，這些散熱鰭 片1101更可透過導熱管51來貫穿導熱。另外，背板結構131 則設於第二平面上71且具有至少一凸緣13〇11貼合於第二平 面71上之至少一發熱源7Π。此外，背板結構13〇1，如同第 第12圖所述之背板結構，可具有一螺柱（圖未示）貫穿第二平 15 1308683 面71及第一平面52 ’供背板結構131鎖合於第二平面7i上。 =者’背板結構體’如同第12圖所述之背板結構，更可包 1延伸-扣合構件（圖未示）自第二平面71繞至第 合散熱底座80所對應延伸的一扣合板（圖未示）十 才 以上所述侧雜佳魏懈細朗本㈣，° 《明之範圍。大凡熟知此類技藝人士皆能 := 的改變及調整’仍將不失本發明之要義'、、虽而作t微 之精神和範圍。 月之要義所在，亦不脫離本發明 【圖式簡單說明】 第1圖至第4圖係為習知技藝中顯示卡的 第5圖係為本發明第一種結構改良所提散熱裳ir立Γ意圖； 第6圖係為本發明第-種結構改良所提散_置體示意圖； 第7圖係為本發明第二種結構改良所提散熱裝置之—立體示意圖； 第8圖係為本發明第二種結構改良所提散立體示意圖； =圖係為本發明第二種結構改良再提—散_二=體示意圖； 们〇圖係為本發明第三種結構改良所提散執置的一立體示意圖； 们1圖係為本㈣細_構改請提散 續*意圖； 糾圖係為本發明第_結構改良所提執、裝、—續示意圖； 第13圓係為本發明第五種結構改良所提散_的另-立體示意圖； 第14圖第五種結構改_散熱裝置ΙΓΓ意圖； til ’以及 W另一立體示意 第15圖係為本發明第三種結構改良所提散熱 的—立體示意圖。 16 1308683 * 【主要元件符號說明】 1:散熱裝置； 10 :散熱底座； 11 :散熱鰭片； 101 :頂面； 102 :底面； 12 :顯示卡； ’ 121 :發熱源； 2:散熱裝置； 20 :導熱管； 21 :導熱片； 3:散熱裝置； 30 :第一散熱底座； _ 301 :第一散熱鰭片； 302 :底面； 303 :頂面； 31 :第二散熱底座； 311 :第二散熱鰭片； 312 :底面； 4:散熱裝置； 4〇 :第一導熱管； 41 :第二導熱管； 5:散熱裝置； 50 :散熱鰭片； 51 :導熱管； 511 :固定柱； 52 :第一平面； 53 :導熱板； 6:散熱裝置； 7:散熱裝置； 70 :散熱鰭片； 701 :孔洞； 702 :孔片； 703 :外壁處； 71 :第二平面； 711 :發熱源； 8:散熱裝置； 80 :散熱底座； 9:散熱裝置； 90 :彎翼； 91 :外壁處； 17 1308683 • 100:散熱裝置； • 1001:第一散熱區塊； 1002 :第二散熱區塊； 1003 :第三散熱區塊； 1004 :第四散熱區塊； 1005 :第一散熱鰭片； 1006 :第二散熱鰭片； > 1007:第三散熱鰭片； 1008 :第四散熱鰭片； 1009 :電子元件； 1101 :散熱鰭片； 11011 :扣合板 1102 :背板結構； 11021 :螺柱； 11022 :扣合構件； 11023 :開口； 1301 :背板結構；以及 13011 :凸緣。 18Please refer to Fig. 13 for the disclosure of the heat dissipation device of the fifth structural improvement of the present invention. In the f 13 towel, the loose wire contains a heat-dissipating film, a heat-transfer tube 51, and a back-plate structure 13 ()1. The heat dissipation fins 1101 are disposed on the first plane 52 and penetrate through the heat pipe 51 for fixing. The back plate structure 1301 is disposed on the second plane 71 and has at least one flange 1 for adhering to the at least one heat source 7 ιι on the second plane 71. In addition, the backplane structure 1301, like the backplane structure described in FIG. π, may have a stud (not shown) extending through the second plane 71 and the first plane 52 for the backplane structure 1301 to be locked to the second plane. 71. Furthermore, the back plate structure blue, like the back plate structure described in the figure, may further include an extension-fastening member (not shown) that is fastened from the second plane 71 to the first plane 52 to engage the heat dissipation fins 11扣1 corresponds to a stretched plate (not shown). Please refer to Fig. 14 is another perspective view of the fifth embodiment of the present invention for improving the thermal device. In Fig. 14, the heat sink The heat dissipation base 80 includes a plurality of heat dissipation fins 11 and a heat dissipation tube 51 and a back plate structure 1301. The heat dissipation base 8 can be disposed on the first display card 12 according to the design requirements of the designer. The heat dissipating fins 1101 can be disposed on the heat dissipating base 80 and form an upright extension. Further, the heat dissipating fins 1101 can penetrate the heat conducting tube 51 to conduct heat. Further, the backing plate structure 131 The at least one heat source 7 is disposed on the second plane 71 and has at least one flange 13〇11 attached to the second plane 71. Further, the back plate structure 13〇1 is like the back plate described in FIG. The structure may have a stud (not shown) extending through the second flat 15 130 8683 face 71 and first plane 52' for the back plate structure 131 to be locked on the second plane 7i. The 'back plate structure' is like the back plate structure described in Fig. 12, and can be extended/closed. A member (not shown) is wound from the second plane 71 to a corresponding fastening plate of the first heat-dissipating base 80 (not shown), and the above-mentioned side is well-informed (four), ° "the scope of the Ming. Anyone who is familiar with such a skilled person can: = change and adjustment 'still will not lose the essence of the invention', and although the spirit and scope of the t micro. The essence of the month, does not leave the invention [simple The first picture to the fourth figure are the fifth picture of the display card in the prior art, which is the first structural improvement of the present invention. The sixth figure is the first structure of the present invention. Figure 7 is a perspective view of the heat dissipation device of the second structural improvement of the present invention; Figure 8 is a schematic perspective view of the second structural improvement of the present invention; The second structural improvement of the present invention is further described as a schematic diagram of the second embodiment of the invention; A three-dimensional schematic diagram of the three structural improvements; the 1 diagram is based on (4) the fine_construction, please extend the * intention; the correction diagram is the implementation of the _ structural improvement of the invention; The 13th circle is another three-dimensional schematic diagram of the fifth structural improvement of the present invention; the fourth structural modification of the fourth embodiment _ heat sink device ; intention; til 'and W another stereoscopic diagram 15 is A third perspective view of the heat dissipation of the third structural improvement is invented. 16 1308683 * [Description of main component symbols] 1: heat sink; 10: heat sink base; 11: heat sink fin; 101: top surface; 102: bottom surface; Display card; '121: heat source; 2: heat sink; 20: heat pipe; 21: heat transfer plate; 3: heat sink; 30: first heat sink base; _ 301: first heat sink fin; 302: bottom surface; : top surface; 31: second heat sink base; 311: second heat sink fin; 312: bottom surface; 4: heat sink; 4: first heat pipe; 41: second heat pipe; 5: heat sink; 50: Heat sink fins; 51: heat pipe; 511: fixed column; 52: first plane; 53: guide 6; heat sink; 7: heat sink; 70: heat sink fin; 701: hole; 702: hole sheet; 703: outer wall; 71: second plane; 711: heat source; 8: heat sink; 80: Cooling base; 9: heat sink; 90: curved wing; 91: outer wall; 17 1308683 • 100: heat sink; • 1001: first heat block; 1002: second heat block; 1003: third heat block 1004: fourth heat dissipation block; 1005: first heat dissipation fin; 1006: second heat dissipation fin; > 1007: third heat dissipation fin; 1008: fourth heat dissipation fin; 1009: electronic component; Heat sink fins; 11011: Folding plate 1102: Back plate structure; 11021: Stud; 11022: Fastening member; 11023: Opening; 1301: Backing plate structure; and 13011: Flange. 18