TWM317607U - Heat dissipation device - Google Patents

Heat dissipation device Download PDF

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Publication number
TWM317607U
TWM317607U TW96203836U TW96203836U TWM317607U TW M317607 U TWM317607 U TW M317607U TW 96203836 U TW96203836 U TW 96203836U TW 96203836 U TW96203836 U TW 96203836U TW M317607 U TWM317607 U TW M317607U
Authority
TW
Taiwan
Prior art keywords
heat
heat sink
dissipating
hole
base
Prior art date
Application number
TW96203836U
Other languages
Chinese (zh)
Inventor
Shau-Dung Fan
Original Assignee
Cooler Master Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cooler Master Co Ltd filed Critical Cooler Master Co Ltd
Priority to TW96203836U priority Critical patent/TWM317607U/en
Publication of TWM317607U publication Critical patent/TWM317607U/en

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Description

M317607 VIII. New description: [New technical field] This creation is about a heat sink, especially a heat sink that can be applied to two different system architectures. [Prior Art] In the electronic device of see 5, such as a central processing unit CPU in a computer, it generates heat in the state of the Guard, and as the technology evolves, the speed of the central processing unit increases, and the heat is dissipated. At the same time, the heat is usually 'added to the central processing unit to install a heat sink for heat dissipation. The heat dissipating device is generally composed of a radiator and a buckle, and is assembled to achieve the desired purpose, such as the Chinese People's No. (Announcement No.: 573...), which is disclosed in the 政^2, the political heat member buckle group The buckle is fastened to the loose by the screw. When the buckle is used, it will not adversely affect the dispersion of the heat sink, and can achieve good heat dissipation effect. Temple wide: need to use the buckle With a corresponding installation on the back of the motherboard, you can set the Lai (four) to the motherboard, this structure is set; plus the Intel (four) system architecture and the existing AMD system - ± Γ system design standard is in the cpu ' Week = a solid support bracket, the two ends of the fixed bracket protruded out: 2 2, so that the structural design of the heat sink can be adapted to two types of CPUs that are not in the specification system structure, and the second is for the researchers to pursue The direction of the ring. The purpose of the singer is that the creator feels that the above-mentioned deficiencies can be improved, and the use of the esthetic research M317607 and the use of the theory finally proposes a design that is reasonably lacking. Another improvement [New content] Fujitsu provides a heat sink that can be applied to two different specification line architectures for common purposes. For the above purpose, the present invention provides a heat sink for a heat sink comprising a base, a buckle, a basin: the heat sink, and a plurality of foot pieces that are movablely grouped === The foot piece can be movably protruded from the outer part of the heat sink. In the embodiment of the present invention, the above-mentioned foot piece can dissipate heat 11 ' or the foot piece is slidably combined with the heat sink, and the 曰α is out. Outside the heat sink, or in the radiator. The benefits of t-creation: by means of the clips and the pieces of the feet, the strips can be movably extended outside the heat sink, or the pieces of the clips can be attached to the amd line, or By making the hunting locks take care of the Intel system, the creation of the cooling device can be applied to the architecture of two different specification systems. In order to further understand the characteristics and technical content of this creation, please refer to γ= for detailed description and drawings of this creation. However, the drawings are only for reference and explanation, and are not used to limit this creation. By. [Comprehensive mode] With the first picture, the present invention provides a heat dissipating device, which includes #可: the heater 10, the buckle member 20 and the plurality of legs 30, and J further A cooling fan 40 is included. 6

M317607 "Haizheng Heat 1 is made of high thermal conductivity metal material, which can include a base 1 1, a plurality of fins 12' and a plurality of fins disposed side by side on the base 丄i The sheet 12 is oppositely disposed on the heat absorbing block 13 at the other end of the base. The heat dissipating fins i 2 are integrally formed of metal, and the heat dissipating fins 2 are formed by extending from the top end of the pedestal 1 1 , or the dispersing fins 1 2 are formed by welding. The heat dissipating fins 12 are formed by being soldered to the top surface of the pedestal. Next, the heat absorbing block 13 is integrally formed of metal, and the heat absorbing block 13 is formed by the bottom end surface of the pedestal 1 1 , or the heat absorbing block i 3 is formed by inserting the heat absorbing block. ! Part of the stagnation of 3 is set in the pedestal worker, and the other part protrudes beyond the bottom end surface of the pedestal. The fastener member 20 can be made of a metal material, and includes two spaced apart panels 2 1 and a first-locking device 22 respectively coupled to the ends of the panels. - a second locking device 23. The first locking device 22 has a branch arm 2 2!, a first buckle portion 2 2 2 and a hammer portion 2 2 3 ; the second locking device 2 3 has a 3 1 and a The second fastening portion 2 3 2 . f" The support arm 2 2 1 is formed in a U-shape by being bent and bent at one end of the two pieces, and the first fastening portion 2 2 2 is movably assembled to the support arm 2 2 1 towel and having at least one snap hole 2 2 4 . The operating portion 2 2 3 is pivotally coupled to the first latching portion 2 2 2 for the operator to move the first latching portion 2 2 2 by the operator operating portion 2 2 3 . The arm 2 3 1 is formed by extending and bending the other end of the plate 2 i. The second fastening portion 2 3 2 is metal-formed and joined to the end of the arm 231 of the M317607, and has At least one snap hole 233. The three (three) thin pieces each have at least a through-hole portion 3 1, and a limit portion 32 is further protruded from the side edge. The heat dissipating fan 40 is an axial flow fan, and the overall structure of the heat dissipating fan 4 , is well known to those skilled in the art, and no further description is provided herein.茶Please refer to the first to third figures. When assembled, the fasteners 2 are detachably assembled to the heat sink i 〇 so that the two hot fins 12 are parallel. And insert the gap between the ',, and the slabs 1 2 (ie, the plate 2 work system is perpendicular to the heat sink process; ^) 'The brother-and brother's two locking devices 2 2 2 3 each protruded outside the edge of the opposite side of the divergence = 1 〇. Then, each foot piece 3 〇 key, the ground is assembled in a movable manner on the bottom of the base U ^ : the through hole part 3 1 of the mother foot piece 3 可供 is available - fixing element (such as screw, ,,糸) 5 0 a through the 'each foot 3 〇 each fixed at the four ends.丄丄底邻2 2, in the first and third figures of the present creation, the through hole 1 is set to two steps, wherein - can be a pivot hole, and the other can be iL'r The hole system provides the fixing member 5Qa through the screw lock with the base 1 1 and rotatably pivots each of the chat pieces 3 to the bottom of the base i 1 := the foot piece 30 can be rotated inward and outward respectively Let each of the fins 30 be f the heat sink 10 or can be stored in the heat sink 1 〇. For the second part to be set to a 'the system is a long slot, the long slot: the two legs can reach the front of the main ^, the mother foot 30 0 outward rotation, thus the limit part 3 2 1 M317607 active After the end edge of the heat sink block i 3 of the heat sink i 抵 is used, it can be used to limit the rotation angle of the mother foot piece 30 and position each foot piece 3 〇. The heat dissipating fan 40 is coupled to the heat sink 10, and can be passed through another fixing component 50b, thereby screwing the heat dissipating fan 4 to the upper portion of the heat dissipating fin 12, thereby increasing the heat sink i The effect of hollowing out the heat. Secondly, the plate member 2 1 of the fastener member 2 and the heat dissipation fin i 2 are parallel to each other to avoid interference with the wind direction generated by the heat dissipation fan 40. In addition, as shown in the fourth figure, the through hole portion 31 can be designed as one and is a long groove, and the base ii and the heat absorbing block i 3 are formed with four oblique designs. The groove 110 is accommodated, and each of the legs 30 is slidably located in the corresponding receiving groove 14 respectively, and the design of the long groove can provide a fixing member .5 〇a through, thereby A foot piece 3 〇 is fixed to the bottom of the base 1 1 to achieve the above-mentioned equal purpose. Through the above description, as shown in the fifth and sixth figures, when the heat sink of the present invention is to be assembled in the AMD system, the AMD system 7 has a motherboard 7 1 and a motherboard. The CPU 7 2 on γ 1 and a fixing bracket 7 3 disposed on the periphery of the CPU 7 2 are formed with a plurality of protruding hooks 7 31 at both ends thereof. In the above, the user can first collect each of the fins 30 in the heat sink i ,, then assemble/contact the heat sink i 于 on the CPU 7.2, and then use the first and second 扣The snap holes 224, 233 of the locking devices 22, 23 can be fastened to the protruding hooks 731 of the fixing bracket j 3 so that the heat sink can be combined on the AMD system 2, and the heat absorbing block i 3 can be contacted Cpu7 2, thereby conducting heat to the heat sink fins 12 for air cooling and heat dissipation. As shown in the seventh and eighth figures, when the heat sink of the present invention is to be assembled with the M317607 in the Intel system 80, the Inte! system 80 has a motherboard 8 1 and is disposed on the motherboard 8 1 . CPU8 2, and a base 8 3 . The motherboard 8 1 has a plurality of holes 8 1 1 , and the base 8 3 has a plurality of studs 8 3 1 'the base 8 3 and the CPU 8 2 are oppositely disposed on the back of the motherboard 8 1 , so that the studs 8 3 1 can be Pass through the corresponding hole 8 ii to protrude from the periphery of the CPU 8 2 . Through the foregoing, the user can extend each leg piece 30 first out of the heat sink 110. At this time, the buckle piece 2 is required according to actual needs, and may not be installed in the heat sink 1 。. When each of the legs 3 ^ hole: | 3 1 is set to two, the above-mentioned locking hole can provide a locking member 60 such as a screw to pass through to lock the base 8 3 The stud 8 3 丄; or the through hole portion 3 1 is a long groove, which can simultaneously provide the locking member 6 〇 through, and then locks to the stud 8 3 i, so that the heat sink of the present invention can be = On the system 8 ,, the endothermic W 3 is contacted (10) 8 2 to conduct heat to achieve the purpose of air cooling. Use = t this creation to make the factory with the fasteners 2 〇 and the foot pieces 3 0; '1 〇, then through the foot 3 〇 can live in the radiator 1 可选择, and optionally use the buckle; The system, or the use of the design of the foot piece 30, the CPU7 2 heat sink of different specifications system can be applied to two heat sinks with commonality. In order to meet the requirements of the two different specifications, the above-mentioned patents are only limited to the scope of the creation of the creation. The "example" is not the equivalent structural change of the content, and the use of this creation specification and schema. It is also included in the scope of this creation. 10 M317607 [Simple description of the drawing] The first picture is an exploded view of the heat sink of the creation. ^The second figure is the heat sink and the foot piece of the heat sink. Combining the previous view. f The three figures are the bottom view of the heat sink and the foot piece of the heat sink of the present invention. The heat sink and the foot piece of the heat sink of the present invention are the fifth embodiment of the heat sink assembled. The stereoscopic exploded view of the AMD system is 0. The figure is a three-dimensional combination of the creation of the heat dissipating device assembled in the amd system and the system: the stereoscopic decomposition of the original heat dissipating device assembled in the ^^丨 system =. Assembled in (3) system stereo combination [main component symbol description] heat sink 1 〇 heat sink fin 12 accommodating groove 14 first locking device 22 first snap portion 222 snap hole 2 2 4 arm 2 3 1 card Buckle hole 233 base 1 1 Heat absorbing block 3 Fastener 2 〇 plate 2 1 Support arm 221 Operating part 223 Brother one locking device 23 Brother one buckle part 2 3 2 11 M317607 Limiting part 3 2 Leg 3 0 Through hole part 3 1 Heat dissipation Fan 4 0 Fixing element 5 0 a, 5 0 b Locking 6 0 AMD system 7 0 Motherboard 7 1 CPU mounting bracket 7 3 Hooking Intel system 8 0 Motherboard 8 1 Hole cpu 8 2 Base 7 2 7 3 1 8 11 8 3 studs 8 3 1 12

Claims (1)

  1. M317607 Nine, the scope of application for patents·· 1. A heat sink comprising: a heat sink; a detachable component that is detachably mounted to the heat sink, and a plurality of legs that are movably assembled The bottom of the radiator, and = Temple (four) can be moved out of the radiator or stored in the dispersion. The heat dissipating device according to the first item of claim 1, wherein the two=including a susceptor, a plurality of scattered, side, side, side, side, side, side, side, side, side, side, side, side, side, side, side, side, side, side, side, side, side, side, side, side, side, side, side, side, side, side, side, side, side, side a heat absorbing block disposed on the other end of the susceptor opposite to the heat dissipating fins. The heat-dissipating device according to the second aspect of the patent application, wherein: the cymbal: the cymbal is formed integrally with the metal, and the heat-dissipating fins are formed by extending upward from the end surface of the base. The heat dissipating device of the second aspect of the invention, wherein the 散热f疋 is formed by welding, and each of the soldering fins is formed on the end surface of the base to form the heat dissipating fins. 5. The heat dissipating device according to claim 2, wherein the U-Mulberry integrally formed is formed by the end surface of the base protruding downward to form the heat absorbing block. The heat dissipating device of claim 2, wherein the suction block is formed by molding, the portion of the heat absorption block is embedded in the base, and the other portion protrudes from the base. Outside the seat end. 7: The heat dissipating device of claim 1, wherein the mouthpiece comprises two adjacent sheets, and a first locking member respectively connected to the two sheets of the sheet M317607 The device and a second locking device. 8. The heat sink according to claim 7, wherein the reverse film is inserted into the heat sink in a direction perpendicular to the heat sink, and the first and second locking devices are respectively And a heat dissipating device according to claim 7, wherein the solid-sense system has a support for the ground by the extension of the plates And a first latching portion disposed in the support arm, and an operating portion pivotally connected to the first latching portion to move the first latching portion, the latching portion having at least one latching hole. 1 〇 如 如 如 如 如 如 如 如 如 如 如 如 如 弟 弟 弟 弟 弟 弟 弟 弟 弟 弟 弟 弟 弟 弟 弟 弟 弟 弟 弟 弟 弟 弟 弟 弟 弟 弟 弟 弟 弟 弟 弟 弟 弟 弟The two-clamp portion of the i-piece r=the heat-dissipating device according to the first aspect of the patent, wherein the component is inserted into the through-hole portion, and the through-hole portions are respectively provided by a fixing member. The foot piece is fixed to the heat sink. In the middle of the heat sink, as claimed in claim 11, the element is further provided as two 'one of the through holes for the fixed cow's gums, so that the foot piece can be rotated The ground is connected to the radiator.丄3, as described in the scope of the patent application, the through-hole portion is a long slot, which is rotatably dragged to the = the firmware teeth to thereby pass the object 14 The through hole material is - money, and the loose-shaped scale receiving groove ^ ί 14 M317607 is slidably located in the accommodating groove for the fixing component. Passing through to secure the foot piece to the heat sink. The heat dissipating device of claim 1, wherein the side edges of the legs further protrude from the side edges, and the limiting portions are movable to the heat sink.
    = *16, as in the heat-dissipating device described in claim 1, in i, the four-legged film is set to four, and the tablets are disposed at the four sides of the heat sink, and further include . Applying the heat dissipation device described in Patent Formula #1, the heat dissipation fan is the same as the heat dissipation device described in the heat sink, and the heat dissipation device is the same as the heat dissipation device of the heat sink. The fan is an axial fan. 15
TW96203836U 2007-03-09 2007-03-09 Heat dissipation device TWM317607U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW96203836U TWM317607U (en) 2007-03-09 2007-03-09 Heat dissipation device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW96203836U TWM317607U (en) 2007-03-09 2007-03-09 Heat dissipation device

Publications (1)

Publication Number Publication Date
TWM317607U true TWM317607U (en) 2007-08-21

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TW96203836U TWM317607U (en) 2007-03-09 2007-03-09 Heat dissipation device

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI492035B (en) * 2012-11-30 2015-07-11 Foxconn Tech Co Ltd Base and heat dissipating module having the same
TWI632843B (en) * 2017-12-01 2018-08-11 微星科技股份有限公司 Profile and identity recognizing device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI492035B (en) * 2012-11-30 2015-07-11 Foxconn Tech Co Ltd Base and heat dissipating module having the same
US9449894B2 (en) 2012-11-30 2016-09-20 Furui Precise Component (Kunshan) Co., Ltd. Base with heat absorber and heat dissipating module having the base
TWI632843B (en) * 2017-12-01 2018-08-11 微星科技股份有限公司 Profile and identity recognizing device

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