五、發明說明（1) 【發明所屬之技術領域j 本發明係有關一種二埶 於豎立於電路板上的直is 構及其組裝方法，係應用 式電子零組件散熱需求之ς計子零組件，特別是針對直立 【先前技術】 隨著科技技術的進步發 來越高，而電腦系統效能的-腦系統的運算效率也越 電，零組件的散熱需求也越i::相：的構成電腦系統的 ，言:計’方能維持電腦系統的正；此邀唯有良好的散 能的提昇不僅只有中央j理器=仃散熱，然而電腦系統效 效能也必需相對的提昇才能夠=备=他相關的處理晶片 廷些處理晶片亦同樣必須進行=最佳的效能，因此針對 中央處理器的散熱方式多半是二霜、丄以中央處理器而言， 器，散熱器-面貼覆於中央處理·鋁製或是銅製之散熱 片散熱鰭片，為達到良好的埶 东另一面則設有複數 理器或處理晶片間塗覆有散執膏散熱器與中央處 配置中央處理器的主機板上還：；散=，除此此外，於 器係設置於散熱器固定座上，二，一放熱器固定座，散熱 性扣件，用以將散熱器壓扣於散；=定座上還具有彈 —定的組扣麼力，藉以使得散ϊ 座上，並且提供 定的緊迫力量，而獲得良好的處理器間具有-;器的散熱需求較高，通常還；另外’中央處 裝一散熱風扇，以導引外界，，、，、器的散熱鰭片上安 7空氣進入散熱鰭片進行熱 五、發明說明（2) 交換。 而以其他的處理晶片而言， 2熱需求來設計，部分散熱需求不高半會根 貼覆一尺寸較小的鋁製或鋼製散埶 处理日日片會直接 高的處理晶片仍會設置一固定座’:、、；彈需求較 上述的散熱方式已普遍應用 ^牛來扣合。 記型電腦，而隨著小型化的需求，、： =桌上型電腦或筆 小型化的設計，為有效利用空二二J腦系統都朝向 直立方式設計而豎立於主機板」，=處理晶片已改採 T元件開發完成，亦必須針對有散孰’隨著直立式電 片提出相關之散熱設計。 散’，、、需求之直立式處理晶 針對直立式處理晶片仍可接田、，〜 於直立式處理晶片的一側，以在的散熱方式，譬如 熱器結合於直立式處理晶^ ^固疋座，利用固定座來將散 熱膠貼覆於直立式處理又或者將散熱器直接以散 晶片設計之目的即；行散熱；然而直立式處理 求，若再於直立式處理晶片M達到小型化之需 佔據了部分空間，並不、商A處旁叹叶—固定座，無疑又 將散熱器直接以散埶职於^在直立式處理晶片上；而 器與直立式處理直立式處理晶片上，因散熱 與直立式處理晶片之門 向與重力方向垂直，散熱器 量，將影響散熱器與；立；處而：任何的緊迫力 若散熱器未有適告之古# ^ 日日片間之熱傳效率，而真 器與處理晶片脫：。# ’文熱器之重力亦有可能使散熱 1304927 五、發明說明（3) 【發明内容 電子Ϊ ί立式電子元件開發完成後，尚益任fr古 疋件的散熱設計提*，而採用習知;：：有關直立式 熱方式，並不適合於直立式電子元i理器或處理 ;出了一種應用於直立式電子元件之散：：及：此本發 电 双热及其組裝方 、根據本發明所揭露之散熱器結 及複數片設置於彈性扣座上之^ 其匕括一彈性扣座 係以具有高熱傳效率之金屬^二制片，其中，彈性扣座 貼覆板及-由貼覆板延===彈性扣座係由一 J間具有一間距而形成一頸口，口略X:性臂與貼覆 件的厚度，彈性臂可略為外小於直立式電子元 性扣座可以直接跨置於直立式電‘：：：的J離，以使彈 $電子元件一緊迫力量式予 產生之熱能傳導至彈性扣座上式於運作狀態下所 元件散之冷空氣進行熱交換，達到對直立式電； 子元= 广“式電 式電子元件上，组妒的方々★ ^扣座可以直接夾扣於直立 熱器與直立式電子= =且能夠使散 佳之連接關係，並有效地進行熱=緊迫力量’以獲得最 五、發明說明（4) 【實施方式】 如厂第1、2圖」所示， _ 例，根據本發明所揭露2斟f中所示係為本發明第一實施 11及複數片散熱鰭片12。=器10，其包括有一彈性扣座 金屬材質製成，链如是处*性扣座11係以高熱傳遞效率之 呈一U字型，並包°含有^呂貼或銅等金屬材質，彈性扣座U略 之彈性臂112，貼覆板U1 一由貼覆板111延伸 1 U，並且於近開口處具有、f # 11 2間構成一夾置空間 1 Η，而於彈性臂U 2的末端:略Λ於Λ置/間11 3之頸口 115 J ^ Π 5 . ： ： ： ^ '，J ^ 複數片散埶鰭片1 2亦；^ m 見又略為放大。 ^ M # f ^ ϋμ亦知用如鋁或銅等高熱傳遞效率之 金屬材質製成’一片片的散熱韓片㈣設二之 的外侧，原則上散埶_片i 、覆板111 積’將有助於散ϋ 的數s越多將可增加散熱面 發明閱：ΓΑ、3β圖」所示，圖中所示係為本 用於-直立式電子元㈣，以對運作：態ΐ:直 電路w η二：： 式電子70件2 0係設置於- 藉由直立式的设計將可以縮小佔用雷路杯q η沾 ，積；將散熱器1〇對應於直立式電子元件2〇，其中彈性扣 =之頸口114的寬度略小於直立式電子元件⑼的厚度’ ，為施力於推制部115使頸口 114的寬度略為放大，使 =f 11進入直立式電子元件20，並使貼覆板lu平貼於直 立式電子元件20的一面，鬆開推制部115即可使得彈性臂 1304927 五、發明說明（5) lj 2壓制於直立式電子元件2〇並施予一定的緊迫力量，使 得貼覆板11 1與直立式電子元件2 〇緊密貼覆，以有效地將 直立式電子元件20於運作狀態下所產生之熱能傳導至彈性 扣座11上，進而傳導至複數片散熱鰭片12上，以與外界之 冷空氣進行熱交換。 虽’、、：’在貼覆板111與直立式電子元件20間亦可塗佈 散熱膠（或散熱膏）4〇(如第3C圖所示），提高貼覆板 111與^立式電子元件20間之熱傳效率。 凊參閱「第4圖」所示，圖中所示係為本發明第二實 施例，於第一實施例中，複數片散熱鰭片12係直接設置於 貼覆板111的外侧，而根據本發明所揭露之第二實施例， 散熱縛片12可以設置於彈性扣座丨丨適當的位置處，以增加 $熱鰭片12设置的數量，冑而增加散熱面積，藉以提高散 睛參閱「第5A、5B圖 三實施例，於第一及第二 直接設置於彈性扣座11上 施例，散熱鰭片1 2設置於 131，而於貼覆板ui的外 轨道1111，使得座體13可 自彈性扣座11上拆離，如 數量或不同材質或不同厚 不同散熱需求之直立式電 組合。 」尸叮不 ， 實施例中 ’而根據 一座體13 側上設有 以選擇地 此的設計 薄之散熱 子元件20 圖中所 ，複數 本發明 上，座 一對對 結合於 將可製 鰭片12 選擇不 示係為本發明第 片散熱鰭片1 2係 所揭露之第三實 體1 3兩侧為導軌 應於導軌131之 彈性扣座11上或 作多個匹配不同 ’因而可以根據 同的散熱鰭片12 1304927 5*、發明說明（6) 四實2閱「第6A、6B圖」所示，圖中所示係為本發明第 人，J，於第三實施例中係可選擇不同的散熱鰭片Μ組 ^ .配不同散熱需求之直立式電子元件20。於第四實 丨J5T穿U °又叶一小風扇50，小風扇50兩側設有導執51， 距貼覆板111之軌道1111上（軌道1111 Xf # 1 —兩度），藉以利用小風扇5 〇來直接導入外 | 、二軋進行熱交換，因而提供另一種散熱模式。 非用ϊ ΐ:述者，僅為本發明其中的較佳實施例而已，並 圍所作^ i發明的實施範圍；即凡依本發明申請專利範 、二 變化與修飾，皆為本發明專利範圍所涵蓋。V. INSTRUCTION DESCRIPTION OF THE INVENTION (1) Technical Field According to the Invention The present invention relates to a straight structure and an assembly method thereof, which are erected on a circuit board, and is a sub-component of an application-type electronic component for heat dissipation. Especially for erect [previous technology] With the advancement of technology and technology, the efficiency of computer system performance - the efficiency of the brain system is also higher, the heat dissipation requirements of components are also more i:: phase: the composition of the computer Systematic, words: "can only maintain the integrity of the computer system; this invitation only has a good ability to improve the energy not only the central j processor = heat, but the computer system efficiency must also be relatively improved to be able to = His related processing of the wafers must also be carried out = the best performance, so the cooling method for the central processor is mostly the second frost, the central processor, the radiator, the surface is attached to the center Disposal of aluminum or copper heat sink fins, in order to achieve good on the other side of the East, there is a multi-processor or processing wafer coated with a loose cream radiator and central processing central processing The motherboard is also:: scatter =, in addition, the device is set on the radiator mount, two, a radiator holder, heat-dissipating fasteners, used to press the radiator to the bulk; The seat also has a bullet-fixed combination of force, so as to make the divergence seat, and provide a certain pressing force, and get a good processor-to-processor; the heat dissipation requirements of the device are higher, usually also; A heat-dissipating fan is installed to guide the outside air, and the heat-dissipating fins of the device enter the heat-dissipating fins for heat 5. The invention (2) is exchanged. In the case of other processing wafers, 2 heat demand is designed, and part of the heat dissipation requirement is not higher than half. The smaller the size of the aluminum or steel dilute processing, the higher the processing wafer will be set. A fixed seat ':,,; the need for the bomb is more commonly used than the above heat dissipation method ^ cattle to buckle. Recording computer, and with the demand for miniaturization, : = desktop computer or pen miniaturized design, in order to effectively use the empty two-two J brain system are oriented to the upright design and erected on the motherboard" The development of the T component has been completed, and it is necessary to propose a related heat dissipation design for the vertical type. The vertical processing of the crystals for the ',, and demand, can still be used for the vertical processing of the wafer, ~ on the side of the vertical processing of the wafer, in the way of heat dissipation, such as a heat exchanger combined with vertical processing crystal The pedestal uses a fixing seat to attach the heat-dissipating adhesive to the vertical processing or the heat sink is directly designed as a discrete wafer; the heat is dissipated; however, the vertical processing requires the miniaturization of the wafer M in the vertical processing. It needs to occupy part of the space. It is not the sigh of the singer-station. It is undoubtedly the direct use of the heat sink on the vertical processing wafer; and the vertical processing of the wafer on the vertical processing. Because the heat dissipation and vertical processing of the wafer door is perpendicular to the direction of gravity, the amount of the radiator will affect the radiator and the vertical; and: any urgency if the radiator is not suitable for the ancient #^日日片Heat transfer efficiency, while the real device and the processing wafer are off: # 'The heat of the heat device may also make the heat dissipation 1304927 V. Invention description (3) [Inventive content Electronic Ϊ ί After the development of the vertical electronic components, the benefits of the heat dissipation design of the fr Know;:: Regarding the vertical heat mode, it is not suitable for the vertical electronic device or processing; a kind of dispersion applied to the vertical electronic components:: and: the power generation double heat and its assembly side, according to The heat sink knot and the plurality of sheets disclosed in the present invention are disposed on the elastic buckle seat, and the elastic buckle seat is formed by the metal buckle piece having high heat transfer efficiency, wherein the elastic buckle seat cover plate and the Sticking plate extension ===The elastic buckle seat is formed by a spacing between a J and a neck, the mouth is slightly X: the thickness of the sexual arm and the applicator, the elastic arm can be slightly smaller than the vertical electronic meta-seat It can be directly placed across the vertical electric '::: J, so that the thermal energy generated by the elastic component of the electronic component is transmitted to the elastic buckle seat and the cold air of the component is exchanged under the operating condition for heat exchange. , reaching upright type of electricity; sub-element = wide "style" On the sub-element, the square of the group 々 ★ ^ buckle seat can be directly clipped to the vertical heater with the vertical electronic = = and can make the connection relationship, and effectively carry out the heat = pressing force 'to get the most five, invention description (4) [Embodiment] As shown in the first and second figures of the factory, the first embodiment 11 and the plurality of heat dissipation fins 12 are shown in Fig. 2 according to the present invention. = 10, which comprises a resilient buckle metal material, the chain is a * buckle seat 11 series with a high heat transfer efficiency in a U-shaped, and contains a metal material such as ^ Lu paste or copper, elastic buckle The elastic arm 112 of the seat U is slightly extended by 1 U from the covering plate 111, and has a clamping space 1 Η between the near opening and f # 11 2 , and the end of the elastic arm U 2 : Slightly Λ Λ / 间 间 3 3 3 3 3 3 3 3 J . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ^ M # f ^ ϋμ also knows to use a metal material with high heat transfer efficiency such as aluminum or copper to make a piece of heat-dissipating Korean film (four) set the outer side of the two, in principle, the divergence _ piece i, the cover plate 111 product 'will The more the number of s that contributes to the divergence, the more the heat dissipation surface can be increased. The invention is shown in the figure: ΓΑ, 3β 图”, which is shown in the figure for the - upright electronic element (4), to operate: state: straight Circuit w η 2:: 70 pieces of electronic type 2 0 set in - With the vertical design, it can reduce the occupation of the lightning cup q η, and the heat sink 1 〇 corresponds to the vertical electronic component 2〇, Wherein the width of the neck opening 114 is slightly smaller than the thickness of the upright electronic component (9), so that the width of the neck opening 114 is slightly enlarged to apply force to the pushing portion 115, so that =f 11 enters the vertical electronic component 20, and The flattening plate lu is flatly attached to one side of the vertical electronic component 20, and the pusher 115 is released to make the elastic arm 1304927 5. The invention description (5) lj 2 is pressed on the vertical electronic component 2〇 and given a certain The pressing force makes the applicator board 11 1 and the upright electronic component 2 〇 closely attached to effectively put the vertical electric 20 into the operating state at the heat generating element is conducted to the resilient retaining seat 11, and further transmitted to a plurality of heat dissipating fins on the sheet 12, to exchange heat with the outside of the cold air. Although ',,:' can also be coated with a heat-dissipating glue (or heat-dissipating paste) between the affixing plate 111 and the vertical electronic component 20 (as shown in FIG. 3C) to improve the affixing plate 111 and the vertical electronic device. The heat transfer efficiency between the components 20. Referring to FIG. 4, the second embodiment of the present invention is shown in the figure. In the first embodiment, a plurality of fins 12 are directly disposed on the outer side of the covering board 111, and according to the present invention. According to the second embodiment of the invention, the heat dissipation tab 12 can be disposed at an appropriate position of the elastic buckle seat to increase the number of the heat fins 12, thereby increasing the heat dissipation area, thereby improving the distraction. 5A, 5B, and the third embodiment, the first and the second are directly disposed on the elastic buckle seat 11. The heat dissipation fins 12 are disposed at 131, and the outer rails 1111 of the slab ui are disposed so that the base 13 can be Detachable from the elastic buckle seat 11, such as the number or different materials or different vertical heat combinations of different heat dissipation requirements. "The corpse is not, in the embodiment, and the design is selected according to the side of the body 13 Thin heat sink sub-element 20 In the present invention, in the present invention, a pair of seats is coupled to the third entity 1 3 which is disclosed in the first heat sink fin 12 of the present invention. The guide rails on both sides should be on the elastic buckle seat 11 of the guide rail 131 According to the same heat sink fin 12 1304927 5*, invention description (6) Si Shi 2 read "6A, 6B map", the figure is the first person of the invention, J In the third embodiment, different heat dissipation fin sets can be selected, and the vertical electronic components 20 with different heat dissipation requirements can be selected. In the fourth real J5T wear U ° and a small fan 50, the small fan 50 is provided with a guide 51 on both sides, from the track 1111 of the appending plate 111 (track 1111 Xf # 1 - two degrees), thereby utilizing small The fan 5 is directly introduced into the outer and second rolls for heat exchange, thus providing another heat dissipation mode. 。 ΐ ΐ ΐ 述 述 述 ΐ ΐ ΐ ΐ 仅为 仅为 仅为 仅为 仅为 仅为 仅为 述 述 述 述 述 述 述 ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; Covered.
第10頁 1304927 圖式簡單說明 第1圖，係為本發明第一實施例之構造立體示意圖； 第2圖，係為本發明第一實施例之構造平面示意圖； 第3 A、3B圖，係為本發明第一實施例之組裝動作示意圖 第4圖，係為本發明第二實施例之結構組成示意圖； 第5A、5B圖，係為本發明第三實施例之構造示意圖；及 第6 A、6B圖，係為本發明第三實施例之構造示意圖。 【圖式符號說明】 10 散熱器 11 彈性扣座 111 貼覆板 1111 軌道 112 彈性臂 113 夾置空間 114 頸口 115 推制部 12 散熱鰭片 13 座體 131 ' 導軌 20 直立式電子元件 30 電路板 40 散熱膠 50 小風扇 51 導執BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view showing a configuration of a first embodiment of the present invention; FIG. 2 is a schematic plan view showing a first embodiment of the present invention; FIG. 3A and 3B are drawings. 4 is a schematic structural view of a second embodiment of the present invention; FIG. 5A and 5B are schematic views showing a configuration of a third embodiment of the present invention; and 6A 6B is a schematic structural view of a third embodiment of the present invention. [Description of Symbols] 10 Heatsink 11 Elastic Buckle 111 Sticker Plate 1111 Track 112 Elastic Arm 113 Clamping Space 114 Neck Port 115 Pushing Port 12 Heat Sink 13 Seat 131 ' Guide Rail 20 Vertical Electronic Components 30 Circuit Board 40 heat sink 50 small fan 51 guide
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