M265692 八、新型說明： 【新型所屬之技術領域】 本創作係關於一種散熱模組，特別是一種電子裝置之 散熱模組。 【先前技術】 現今電子裝置（如··筆記型電腦）内之電子元件（如 :晶片）於工作狀態下常產生大量熱能，而造成該電子元 件/里度之上升，如果沒有適當的散熱，將使該電子元件發 生過熱現象，造成其運作不穩定，甚至導致整個電子裝置 發生工作停止或當機的現象，而隨著各種電子元件的速度 =斷提升，其所產生之熱量亦不斷提高，因此應用於各種 私子裝置之散熱模組即日漸重要。請參照第一 Α圖，第一 Α圖所不係一習知晶片散熱模組，該晶片散熱模組係一具 有複數個散熱鰭片之散熱器u，使該晶片12產生之熱能藉 由該等散熱鰭片散播於空氣中，達到降低該晶片12溫度^ 目的，該散熱器11藉由螺接方式設置於該晶片12之上，由 於該晶片12之高度有其公差且不同晶片之高度亦有所不同 ，此種螺接方式該散熱器n所設置之高度係固定不變，因 此该政熱态11與該晶片12表面常不能緊密貼合，以致降低 該散熱器11之散熱效能，請參照第一B圖，第一 B圖所示 係另一習知晶片散熱模組，該晶片散熱模組包含一散熱器 U、一固定彈片η，該散熱器13藉由該固定彈片14設置於 一晶片15之上，藉由該固定彈片14之彈性，使該散熱器13 可應用於不同高度之晶片，並使該散熱器13與該晶片15表 M265692 面緊密貼合，t隹由於該固定彈片14之二端必須勾扣於一晶 片連接座16上之勾持部17，因此該散熱器13必須配合特= 之晶片連接座’降低了該散熱器13之使用便利性。 上述之散熱器通常採用禱造方式製作，因此其散献缺 片係：心片^體，需使用較多之製作材料，且-般鑄造之“ 八/、可中車乂短不若採用沖壓之製作方式，其模具有較吾 之使用壽命，因此採用習知鎊造方式製作之成本i易降^ 〇 綜合以上之先前技術，目前電子裝置之散熱模組具有 口疋方式不it及製作成本不易降低之缺點。 【新型内容】 糊作之主要目的在於解決目前電子裂置之散熱模組 其固定方式不佳及由於採用鑄造元件，其製作成本不易降 低之問題。 為達上述目的，本創作揭露一種新型之電子裝置之散 熱模=，該散熱模組包含—基板、至少-散熱n片組及1 夕4彈片’ δ玄基板具有至少一固定孔，該散熱轉片組設置 於該基板之上並具有複數個散熱鰭片，該彈片設置於該基 板，上’並具有至少—安I孔’該等安裝孔配合該基板之 «亥專固疋孔係用以將該基板設置於該電子裝置内之一電子 元件之上’藉由該等彈片，該基板可緊密貼合於該電子元 件表面，且本創作之該基板與該散熱鰭片組係以沖壓方式 製作，因此可降低製作成本。 本創作之電子裝置之散熱模組，其藉由至少一彈片使 M265692 —電子元件表面，並且該 沖堡方式製作，更具有成 该散熱模組之基板可緊密貼合於 基板與其上之散熱鰭片組係使用 本較低之優點。 將參容及具體可行之實施方式，兹 【實施方式】 3二、第—圖’第-圖所不係本創作之具體實施例結 構圖，其係-電腦晶片（如北橋晶片）之散熱模組，其主 要包含-基板20、-第—散熱鰭片組41、―第二散熱^ 組42、-第一彈片31及一第二彈片％，該 4!及該第二散熱鰭片組42係以焊接方式設置於該基板如之 上’該第-彈片及該第二彈片32係以鉚⑽、幻柳接於 該基板2G之上，當該基板2〇以螺針71、72、73螺接於該晶 片（圖中未示）之上，該晶片產生之熱能將經由該基板 傳導至該弟-散熱_片組41及該第二散熱_片㈣，並藉 由該第-散熱鰭片組4i及該第二散熱鰭片組42之散埶心 散播於空氣中，達到降低該晶片溫度之目的。 …曰 請參照第三圖，第三圖所示係本創作之具體實施例社 構分解圖’ -t腦晶片係設置於一電路板6〇之上，該; 路板60更設置有至少-安裝座62，該基板如係—沖壓件屯 其可利用一傳熱較佳之金屬（如銅或鋁）製作，該^板2〇 具有至少一固定孔21及至少一鉚釘孔22，該第一散熱鰭片 組41亦係一沖壓件，其材料可採用一傳熱較佳之金屬γ如 M265692 銅或銘）’其具有複數個散熱鰭片，用以增加其散熱面積 ’增進其散熱效率，該第一散熱鰭片組41係以焊接方式設 置於該基板20之上，為進一步增加散熱面積及散熱效率， 本實施例更包含一第二散熱鰭片組42，該第二散熱鰭片組 42亦係以焊接方式設置於該基板2〇之上。 該第一彈片31係一金屬彈片，於本實施例，該第一彈 片31於、力中央位置$又置有至少一鉚釘孔％，並以鉚釘82穿 過該鉚釘孔33及該基板20之該鉚釘孔22而鉚接於該基板％ 之上，其亦可利用焊接或螺接方式設置於該基板2〇之上， 由於該第一彈片31鉚接於該基板2〇之上，因此安裝人員於 作業日寸不須拿取該第一彈片31，僅須將該第一彈片3丨之安 裝孔34對準該基板20之固定孔21及該安裝座62之螺孔，即 可以螺釘72進行安裝，其另一端亦同，如此可增進安裝作 業之效率，此外，本實施例更包含一第二彈片32，該第二 32於一端設置有至少一鉚釘孔％而於另一端設置有一 ，裝孔36，該安裝孔36係對應於該基板20之一固定孔23， 该基板20之該等固定孔21、23、％於該基板2〇之分佈位置 幵v成二角形，使該基板20可更穩固的設置於該晶片61之 上。 於本實施例，一絕緣片5〇貼設於該基板20與該晶片61 用以防止°亥基板20造成其他電子元件相互電性連接 =路而損壞，該絕緣片5G具有—晶片孔51，使該晶片Μ 牙過该晶片孔51與該基板2〇相互接觸貼合。 螺釘73牙過该第二彈片32之該安裝孔％、該基板％ M265692 ，该固疋孔23、該絕緣片5〇之一開孔幻後螺 6〇之一安裝座63，請參照第四圖，第四圖所示係本 具體貫施例結構剖面圖，藉由該第一彈片31及該第 該基板2〇可於垂直方向之-定範圍内彈：活動 ’因此本創作可應用於不同高度之晶片，且上述垂直方向 之㈣彈性亦可㈣安裝及製造過程之公差，確保該基板 2〇契，亥晶片61之表面緊密貼合，使本創作具有較高之散熱 效率。 相較於習知技術，藉由該等彈片31、32，該基板料 更緊密貼合於晶片表面且其使用彈性更佳，並且，本創作 之各元件均非以鎊造方式製作’因此可降低製作成本。 ^以上所述僅為本創作之較佳實施例而已，並非用以限 定本創作之實施範圍。熟悉本技術之人士應明白各種不同 ,實施例與變化得在不脫離本創作之概括精神與範圍之下 施行’本創作之範圍乃由隨附之申請專利範圍所限定，與 本創作之申請專利範圍意義相等及在申請專利範圍之内所 i文之σ種修改均被視為包含於本創作之專利範圍内。 【圖式簡單說明】 圖式簡單說明 弟 Α圖係一習知晶片散熱模組。 第一 B圖係另一習知晶片散熱模組。 第二圖係本創作之具體實施例結構圖。 第三圖係本創作之具體實施例結構分解圖。 M265692 第四圖係本創作之具體實施例結構剖面圖。 【主要元件符號說明】 〔習知〕 11散熱器 12晶片 13散熱器 14固定彈片 15晶片 16晶片連接座 17勾持部 〔本創作〕 20基板 21、23、24固定孔 22鉚釘孔 31第一彈片 32第二彈片 33、 35鉚釘孔 34、 36安裝孔 41第一散熱鰭片組 42第二散熱鰭片組 50絕緣片 51晶片孔 52開孔 10 M265692 60電路板 61晶片 62、63安裝座 71、72、73 螺釘 82、83鉚釘M265692 8. Description of the new type: [Technical field to which the new type belongs] This creation is about a heat dissipation module, especially a heat dissipation module for electronic devices. [Previous technology] Electronic components (such as chips) in today's electronic devices (such as notebook computers) often generate a large amount of thermal energy in the working state, which causes the increase of the electronic components / littleness. If there is no proper heat dissipation, It will cause the electronic component to overheat, cause its operation to be unstable, and even cause the entire electronic device to stop working or crash. As the speed of various electronic components increases, the heat generated by it will continue to increase. Therefore, heat dissipation modules applied to various private devices are becoming increasingly important. Please refer to FIG. 1A, which is not a conventional chip heat sink module. The chip heat sink module is a heat sink u having a plurality of heat sink fins, so that the heat energy generated by the chip 12 passes through the heat sink u. After the cooling fins are spread in the air, the temperature of the chip 12 is reduced. The heat sink 11 is arranged on the chip 12 by screwing. Since the height of the chip 12 has its tolerance and the height of different chips is also Differently, the height set by the heat sink n in this type of screw connection is fixed, so the surface of the thermal state 11 and the surface of the chip 12 often cannot closely fit, so that the heat dissipation efficiency of the heat sink 11 is reduced, please Referring to FIG. 1B, FIG. 1B shows another conventional chip heat sink module. The chip heat sink module includes a heat sink U and a fixed spring η. The heat sink 13 is disposed on the fixed spring 14 Above a chip 15, the elasticity of the fixed elastic sheet 14 enables the heat sink 13 to be applied to chips of different heights, and the heat sink 13 is closely attached to the surface of the chip 15 on the surface of M265692. The two ends of the shrapnel 14 must be hooked on a crystal Hooking the upper portion connecting base 1617, so the heat sink 13 to be connected with the base wafer of Unexamined = 'reduces the heat sink 13 of the convenience of use. The above-mentioned radiators are usually made by prayer method, so its missing pieces are: heart piece ^ body, which requires more production materials, and the general casting "//, can be used in the car is short, if not stamping In the manufacturing method, the mold has a longer service life, so the cost of manufacturing using the conventional pound manufacturing method is easy to reduce ^ ○ Based on the previous technology above, the current cooling module of electronic devices has a mouth-to-mouth method and manufacturing costs. Disadvantages that are not easy to reduce. [New content] The main purpose of paste is to solve the problem of the poor fixing method of the current electronic splitting heat dissipation module and the difficulty of reducing the production cost due to the use of casting components. To achieve the above purpose, this creation Exposing a new type of heat sink for electronic devices =, the heat sink module includes-a substrate, at least-a heat sink n chip set and a spring dome sheet. The delta base board has at least one fixing hole, and the heat sink turning sheet group is disposed on the substrate. There are a plurality of heat dissipation fins on the board, and the elastic sheet is arranged on the substrate, and the mounting holes are provided with at least -an I hole, and the mounting holes of the substrate are matched with The substrate is disposed on an electronic component in the electronic device. With the elastic pieces, the substrate can be closely adhered to the surface of the electronic component, and the substrate and the heat dissipation fin set created in this creation are stamped. Therefore, the production cost can be reduced. The heat dissipation module of the electronic device in this creation uses at least one spring to make M265692-the surface of the electronic component, and the punching method is manufactured, and the substrate of the heat dissipation module can be closely attached to the heat dissipation module. The base plate and the heat dissipation fin set thereon have the advantage of using the lower cost. For the detailed description and specific feasible implementation methods, [Embodiment] 32. The "Figure" and "Figure" are not the specific embodiments of this creation. Structure diagram, which is a heat sink module of a computer chip (such as a Northbridge chip), which mainly includes a substrate 20, a first heat sink fin group 41, a second heat sink ^ group 42, a first spring piece 31 and a first The second spring piece%, the 4! And the second heat dissipation fin group 42 are arranged on the substrate by welding as above. The first spring piece and the second spring piece 32 are connected to the substrate 2G by riveting and magic willow. Above, when the substrate 20 is with a screw 7 1, 72, 73 are screwed onto the chip (not shown), and the thermal energy generated by the chip will be conducted to the brother-radiating_sheet group 41 and the second cooling_sheet through the substrate, and by The first and second heat dissipation fin group 4i and the second heat dissipation fin group 42 are scattered in the air to reduce the temperature of the chip. ... Please refer to the third figure, which is shown in the third figure The specific embodiment of the social structure exploded view '-t brain chip is set on a circuit board 60, the road board 60 is further provided with at least-the mounting base 62, such as the system-stamping parts can be used Made of a metal (such as copper or aluminum) with better heat transfer, the plate 20 has at least one fixing hole 21 and at least one rivet hole 22, and the first heat dissipation fin group 41 is also a stamped part. A metal with better heat transfer, such as M265692 (copper or inscription), "has a plurality of heat dissipation fins to increase its heat dissipation area" to improve its heat dissipation efficiency, the first heat dissipation fin group 41 is arranged on the substrate 20 by welding. Above, in order to further increase the heat dissipation area and heat dissipation efficiency, this embodiment further includes a first Fin assembly 42, the second fin assembly by welding lines 42 are also disposed on the substrate 2〇. The first spring piece 31 is a metal spring piece. In this embodiment, the first spring piece 31 is provided with at least one rivet hole% at the center of the force. The rivet 82 passes through the rivet hole 33 and the base plate 20. The rivet hole 22 is riveted on the substrate%, and it can also be set on the substrate 20 by welding or screwing. Since the first spring piece 31 is riveted on the substrate 20, the installer It is not necessary to take the first spring piece 31 on the working day, but only need to align the mounting hole 34 of the first spring piece 3 丨 with the fixing hole 21 of the base plate 20 and the screw hole of the mounting base 62, and the screw 72 can be used for installation. The other end is the same, so that the efficiency of the installation operation can be improved. In addition, this embodiment further includes a second spring piece 32, which is provided with at least one rivet hole% at one end and one mounting hole at the other end. 36, the mounting hole 36 corresponds to one of the fixing holes 23 of the substrate 20, and the fixing holes 21, 23,% of the substrate 20 are distributed in a 幵 v shape in the substrate 20, so that the substrate 20 can be More securely disposed on the wafer 61. In this embodiment, an insulating sheet 50 is attached to the substrate 20 and the wafer 61 to prevent other electronic components from being electrically connected to each other due to the substrate 20 being damaged. The insulating sheet 5G has-a wafer hole 51, The wafer M is brought into contact with the substrate 20 through the wafer hole 51 and bonded. The screw 73 passes through the mounting hole% and the base plate% of the second spring piece 32, M265692, the fixing hole 23, and one of the insulating piece 50. The rear mounting screw 63 is one of the mounting seat 63. Please refer to the fourth The figure, the fourth figure is a cross-sectional view of the structure of the specific embodiment. With the first elastic piece 31 and the second substrate 20, they can be played within a certain range in the vertical direction: activity. Therefore, this creation can be applied to Wafers of different heights, and the above-mentioned ㈣elasticity in the vertical direction can also accommodate the tolerances of the mounting and manufacturing processes, to ensure that the substrate is 20-inch, and the surface of the Hai-wafer 61 is closely fitted, so that this creation has a high heat dissipation efficiency. Compared with the conventional technology, with the elastic pieces 31 and 32, the substrate material is more closely adhered to the surface of the wafer and its use flexibility is better. Moreover, the components of this creation are not made in pounds. Reduce production costs. ^ The above is only a preferred embodiment of this creation and is not intended to limit the scope of implementation of this creation. Those familiar with the technology should understand the various differences. The embodiments and changes can be implemented without departing from the general spirit and scope of this creation. The scope of this creation is limited by the scope of the accompanying patent application, and the patent application of this creation. The scope is equal in meaning and the σ modifications in the text within the scope of the patent application are considered to be included in the scope of the patent for this creation. [Brief description of the drawings] Brief description of the drawings Brother A is a conventional chip cooling module. The first diagram B is another conventional chip cooling module. The second figure is a structural diagram of a specific embodiment of this creation. The third figure is an exploded view of the structure of the specific embodiment of this creation. M265692 The fourth figure is a structural cross-sectional view of a specific embodiment of this creation. [Description of symbols of main components] [Knowledge] 11 radiator 12 chip 13 radiator 14 fixed spring 15 chip 16 chip connection base 17 hooking section [this creation] 20 substrate 21, 23, 24 fixing hole 22 rivet hole 31 first Spring 32 Second spring 33, 35 rivet holes 34, 36 mounting holes 41 first heat sink fin group 42 second heat sink fin group 50 insulation sheet 51 chip hole 52 opening hole 10 M265692 60 circuit board 61 chip 62, 63 mounting seat 71, 72, 73 Screw 82, 83 Rivet
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