M295886 八、新型說明： 【新型所屬之技術領域】 一種散熱器結構，特別是一種具有兩個熱傳遞路徑之散熱器 結構。 【先前技術】 按，散熱器的應肖，在電子*置中相當常見，例如桌上型電 腦主機内部的中央處理H、顯示晶片轉，由於此類的電子事置 在運作中’往往需要進行高速的祕演算，故其產生的熱，射遺 之而來，而由於其產生的熱，會在短時間内讓整個電子I置的溫 度快速昇高’故，若無法雜迅速排除，則高溫的作業環境下皿 勢必會影響到電子裝置的正常運作 當機等。 成電子裝置的毁損或 P遺著各種電子裝置之效能逐漸提昇，伴隨而來的散 =嚴重，目前提昇散熱效能的方法不外乎有兩種，第:，辦加M295886 VIII. New description: [New technical field] A heat sink structure, especially a heat sink structure with two heat transfer paths. [Prior Art] Press, the heat sink should be quite common in electronic*, such as central processing inside the desktop computer, display chip transfer, because such electronic affairs are in operation, 'often need to be carried out The high-speed secret calculation, so the heat generated by it, and the heat generated by it will quickly increase the temperature of the whole electron I in a short time. Therefore, if it can not be quickly eliminated, the high temperature The operating environment will inevitably affect the normal operation of the electronic device. The performance of electronic devices is degraded or the performance of various electronic devices is gradually increasing. The accompanying dispersion is serious. There are currently two ways to improve the heat dissipation performance.
，風量’第二’增加散熱器之散熱面積，就 J 扇風1而§，糾賴縣找量勢必得 ^ 後將導致噪音值得二 曰加政熱器之散熱面積而t 部空間有所_， f 電子裝置的内 因而散熱n散祕緣面積勢必增加散熱器之重量， 有馨於此：因f積及加工條件而有所限制。 月滅出散熱鰭片组專利案（台灣公告第 5 M295886 M2函號新型專繼），此—專利案係將散熱以環形排列的 方式--組扣結合，使得在有限面積下，提供了最多之散熱面積， 請參閱「第1圖」所示，圖中所示即為巾請人前所提出之散熱鰭 片組K)，其主要係由複數個散熱籍片1〇1及一散熱風扇搬触 成’此散熱器1〇的散熱鰭片101底部，係裳設有-導孰塊(圖中 未不），係利用此導熱塊貼附於一電子裝置的熱源上，藉由導熱 塊’將熱_產生之熱_導至各散熱則。由於贿散熱的需 求’導熱塊與各散熱鰭片1〇1的材質均為轉熱係數的材質，上 述專利案確實可以有效地增加散熱面積，而在增加散熱面積後， 如何能更有效地祕遞而進行熱交換，仍有改進之空間。 【新型内容】 I3 有馨於上述的問題’本創作係針對組扣式環形散熱器結構， k出更有效地熱傳遞而進行熱交換解決方案。 根據本創伽減之韻雜構，其主要_賴導管快速 導熱特性，搭配複數個鰭片面向性散熱的特性，將兩者结構作— 整^以使兩者間能相互組設，使熱源所產生的熱能，能透過兩 侧專遞路彳㈣迅速料至錢熱鰭片，以翻快速散熱的目的。 本創作係可兼顧快速導熱，以及大面積散熱的雙重優點，可 ^散熱器整體的散熱效率大幅提昇，並且_之熱能快速地被傳 ¥至鰭片之綱’使得無須加大散熱風扇之轉速即可提供熱交換 所需之風量，將可減少f能之雜及降歸音。 、 為使貴審查判能清楚了解本創作之内容，錢本新型的特 M295886 徵與實作，茲配合下列圖示作最佳實施例詳細及說明如下，敬請 • 參閱。 °月 【實施方式】 凊苓閱「第2、3圖」所示，「第2圖」係為本創作散熱器2〇 的立體外觀圖，如圖中所示，本創作散熱器2〇係由一環形散熱鰭 片組201、一散熱風扇2〇2(可附加）、一熱導管2〇3以及—導熱塊 2〇4所組成；「第3圖」係為本創作立體散熱器2〇的組合示意圖 (一）’如圖中所不，散熱鰭片組201係由複數片鰭片2012環接成 型’成型後，散熱鰭片組2〇1的上平面係形成有一環狀凹槽2〇ιι , 此環狀凹槽係可提供熱導管2〇3組設；如圖中所示的熱導管2的， 係成型有一弧狀(或半圓、或圓弧狀)的冷凝端2〇32，其另一端則 為吸熱端2031，其中，冷凝端2032恰可組設於散熱韓片組= 上面的環狀凹槽20H巾，如此，可使冷凝端觀平均接觸於散 熱籍片組2CH的每片鰭片施2上，吸熱端細則是緊密地貼覆 於導熱塊204，由於，熱導管203的特性為快速達到均溫，故， 吸熱端2031受熱後，即可迅速將熱傳導到熱導管的每一點，藉由 均溫的特性’讓熱導管2〇3冷凝端2〇32所接觸的每一片散細 片，亦能快速受熱，並進行熱發散的作用；再請參閱圖中所示， 熱導管2〇3的吸熱端細係彎折成型後，佈設於散熱縛片組2〇ι 的下方’並與一導熱塊撕緊密貼覆，如圖中所示，導熱塊204 係成型有-凹槽狀的組設部綱，以使熱導㈣3的吸熱端卿 可组設於組設部204i之中，兩者之間係可以錫膏，或高熱傳係數 7 M295886 .的黏著劑，作為相互組設的連接介f;又，如圖中所示，本創作 .進一步於導熱塊204的外圍，組設有一固定支架205，此固定支 架205係可使整個散熱器2〇與一熱源％ (如第$圖所示）接觸 而進行熱傳遞，。 立口月㈣帛4圖」’目中所示係為本創作散熱器、的組合示 意圖㈡，如圖中所示，即為熱導管2〇3與散熱鰭片、组201組設完 成之卜觀自圖不可知，熱導管2的係完整的環設於散熱韓片組 • 2—01的每-散熱鰭片上方，亦即，熱導管2〇ι的冷凝端細係與 母-散熱鰭片有接觸’可使熱迅速傳導片每—散熱鰭片，·另，散 熱風扇2〇2則可組設於散熱鰭片組201的上方，當散赦風扇2〇2 作動時，則可輔助散熱鰭片組2〇1迅速散熱。 請參閱「第5圖」，圖中所示’係為本創作的—較佳實施例 ㈠’如圖所示，本創作散熱器，係可與—熱源3()(如中央處理哭、 顯示晶片組)相互組設’此熱源3〇係組設於一載板4〇上方(例如主 機板），為使熱源30所產生的熱可以被迅速發散，故，以本創作 散熱器20組設於熱源30的上方，組設時，係使散熱器2〇下方的 導熱塊204貼合於熱源30的上平面，使兩者緊密貼附，另，兩者 之間可塗覆-導熱膏’以填滿兩者貼附時的空隙，以保持良好的 導熱效果另，散熱器20與载板40之間的固設，係可利用螺絲 2051加以或其他_型_設元件軸，此固設元件為習 知技術之應用，在此不加以贅述。 根據本創作所揭露之散熱器結構，透過熱導管加與導熱塊 8 M295886 204接觸’亚且婉蜒於攀附於韓片2〇i2上並延伸至環形散熱鰭片 、、且201之頂糕，以使得熱源所產生之熱能，可以透過導熱塊2⑽ 及鰭片2012進行熱傳遞，亦可透過導熱塊2〇4、熱導管2〇3及籍 片2012進行熱傳遞’本創作以兩個熱傳遞路徑而迅速的傳導至各 鰭片2〇i2上’使得韓片mu底部之熱能可快速地經由熱導管挪 而傳遞至頂部，如此散熱風扇2〇2即可以較小之轉速提供風量而 與籍月上頂部之熱能進行熱交換，以達到快速散熱的目的 請茶閱「第6圖」，圖中所示係為本創作的另—較佳實施例 ()如®1所7F的放熱$ 5〇’係為—種具有雙散熱鰭片組的散熱 裔’其主要係由一第一散熱鰭片組則、一第二散熱鰭片組502、 -散熱風扇503、-熱導管5〇4所組成，散熱風扇5()3的上、下 兩面刀別與第一散熱鰭片組5〇卜及第二散熱籍片組观相互組 设，熱導管504的兩端則分別組設於第一散熱鰭片組5〇ι及第二 散熱鰭片、組502的-組合部；請參閱「第7圖」，圖中所示係為實 施例㈡的組合示意圖，如圖中所示，第一散熱與第二散 熱轉片組5〇2係為相同態樣，但組設時位置呈相對，其係分別組 設於散熱風扇503的上、下平面，又，熱導管5〇4的兩端，則分 別組設在第-散組5G1的_組設部⑽、)，此組設部 (5〇5、5〇51)係熱導管5〇4可被夾設其中，以達到固定及熱傳導的 作用，組设部(505、5051)與熱導管504組設時，可以一高導熱係 數的接著劑為連接介質，例如錫膏，組設完成後，即如「第$圖、 M295886 如上所述，本創作散熱器主要係利用熱導管均溫、快速傳導 熱的特性，將導熱塊及散熱鰭片組底部的熱，快速的向上傳導， 以使熱能快速的分佈的各散熱鰭片，使熱能被迅速發散，另，亦 可再以輔以麟-散熱風扇，以使散熱㈣表面賴迅速被風帶 走，以提高散熱H整體的散熱效率；又，本創作係於散熱錯片組 的平面上，成财-環狀的溝槽，並賴導管成型合弧狀 弧狀或圓弧狀，喊熱料能與每讀_ 絲 增，傳導熱的效率，提高散熱器整體的散熱:接觸，以 、‘，不5上述，本創作散熱器其據以實施後， 種可快速散熱的散熱ϋ之目的。 f可達到提供— 【圖式簡單說明】 卜 儿瓶斤规圍〇 f2圖，本創作的立體外觀圖。 ，3圖，本創作的組合示意圖(一）。 $ 4圖，本創作的組合示意圖(二）。 f 5圖，本創作的一較實施例(一）。 證圖本創作的一較實施例(二）。 第7圖，士 a 【主要 彳作實施例(二)的組合示意圖 件符號說明】 10 散熱器 1〇1 散熱鰭片 1〇2 散熱風扇 10 M295886The air volume 'second' increases the heat dissipation area of the radiator, and the J fan wind 1 and §, the blame for the county to find the amount is bound to ^ will lead to noise worthy of the heat dissipation area of the politician and t space _ , f The internal heat dissipation of the electronic device will inevitably increase the weight of the heat sink, which is sweet: there are restrictions due to the f accumulation and processing conditions. The patent for the heat-dissipating fin group (Taiwan Announcement No. 5 M295886 M2) is a new type of patent. This patent case combines the heat dissipation in a circular arrangement--the combination of the buckles, which provides the most in a limited area. For the heat dissipation area, please refer to the "Figure 1". The figure shows the heat sink fin group K). It is mainly composed of a plurality of heat sinks 1〇1 and a cooling fan. Touching the bottom of the heat sink fin 101 of the heat sink 1 , the skirt is provided with a guide block (not shown), which is attached to the heat source of an electronic device by the heat conducting block, The heat generated by the heat_ is guided to the heat dissipation. Due to the need for bribery heat dissipation, the materials of the heat-conducting block and the heat-dissipating fins 1〇1 are all materials of heat transfer coefficient. The above patents can effectively increase the heat-dissipating area, and how to be more effective after increasing the heat-dissipating area. There is still room for improvement in the exchange of heat. [New content] I3 has the above problems. 'This creation is for the combination of the ring-type radiator structure, k to more efficient heat transfer and heat exchange solution. According to the rhyme structure of the gamma reduction, the main reason is that the rapid thermal conductivity of the catheter is matched with the characteristics of the plurality of fins facing the heat dissipation, and the two structures are combined so that the two can be combined with each other to make the heat source The generated heat energy can be quickly transferred to the hot fins through the two-way special delivery (4) to quickly dissipate heat. This creation department can take into account both the advantages of rapid heat conduction and large-area heat dissipation. The heat dissipation efficiency of the heat sink can be greatly improved, and the heat of the heat can be quickly transferred to the fins, so that the speed of the cooling fan does not need to be increased. The amount of air required for heat exchange can be provided, which will reduce the miscellaneous and reduced sound of the energy. In order to make the review review clearly understand the content of this creation, the new M295886 sign and implementation of Qianben's new model is detailed and explained below with the following illustrations. Please refer to it. °月 [Embodiment] Read "2nd and 3rd", "2nd" is a three-dimensional appearance of the creation of the radiator 2, as shown in the figure, the creation of the radiator 2 It consists of a ring of heat-dissipating fins 201, a cooling fan 2〇2 (additional), a heat pipe 2〇3, and a heat-conducting block 2〇4; Schematic diagram of the combination (1) 'As shown in the figure, the heat sink fin group 201 is formed by looping a plurality of fins 2012. After forming, the upper plane of the heat sink fin group 2〇1 is formed with an annular groove 2 〇ιι , this annular groove can provide heat pipe 2〇3 assembly; as shown in the heat pipe 2, it has an arc-shaped (or semi-circular or arc-shaped) condensation end 2〇32 The other end is the heat absorbing end 2031, wherein the condensing end 2032 can be assembled on the heat dissipating Korean group = the upper annular groove 20H, so that the condensing end can be evenly contacted with the heat radiating group 2CH. Each of the fins is applied to the fins 2, and the endothermic end is closely attached to the heat conducting block 204. Since the heat pipe 203 is characterized by rapid temperature uniformity, After the end 2031 is heated, the heat can be quickly transferred to each point of the heat pipe, and the uniform temperature characteristic 'allows each piece of the fine film contacted by the condensation end 2〇32 of the heat pipe 2〇3 to be quickly heated, and The function of heat dissipation is carried out; then, as shown in the figure, the heat absorbing end of the heat pipe 2〇3 is bent and formed, and is disposed under the heat-dissipating die set 2〇' and is tightly attached to a heat-conducting block. As shown in the figure, the heat conducting block 204 is formed with a groove-shaped assembly portion so that the heat absorbing end of the heat conduction (4) 3 can be disposed in the assembly portion 204i, and the tin can be tinned therebetween. Paste, or high heat transfer coefficient 7 M295886. Adhesive, as a connection between the assembly f; In addition, as shown in the figure, further on the periphery of the thermal block 204, a fixed bracket 205 is set, this fixed The bracket 205 allows the entire heat sink 2 to be in contact with a heat source (as shown in Fig. $) for heat transfer. Likou month (four) 帛 4 map "" is the combination diagram of the creation of the radiator, (2), as shown in the figure, that is, the heat pipe 2〇3 and the heat sink fins, the group 201 is completed. It is unknown from the picture that the complete loop of the heat pipe 2 is placed on the heat-dissipating Korean group • 2—01 above each of the heat-dissipating fins, that is, the condensation end of the heat pipe 2〇ι and the female-heat-dissipating fin The sheet has contact 'can make the heat quickly conduct the sheet each—the fins, and the other, the cooling fan 2〇2 can be assembled above the fin group 201, and when the diverging fan 2〇2 is actuated, it can assist The heat sink fin group 2〇1 quickly dissipates heat. Please refer to "figure 5", which is shown in the figure - the preferred embodiment (1) is as shown in the figure. The heat sink of this creation can be combined with - heat source 3 () (such as central processing crying, display The heat generating unit 3 is disposed above a carrier board 4 (for example, a motherboard), so that the heat generated by the heat source 30 can be quickly dissipated, so that the heat sink 20 is assembled. Above the heat source 30, when assembled, the heat conducting block 204 under the heat sink 2 is attached to the upper surface of the heat source 30 so that the two are closely attached, and the heat conductive paste can be coated between the two. To fill the gap between the two to maintain a good heat conduction effect, the fixing between the heat sink 20 and the carrier 40 can be made by using the screw 2051 or other _ type _ element shaft, this fixing The components are used in the prior art and will not be described here. According to the heat sink structure disclosed in the present invention, it is in contact with the heat conducting block 8 M295886 204 through the heat pipe, and is attached to the Korean piece 2〇i2 and extends to the annular heat sink fin, and the top cake of 201, The heat generated by the heat source can be transferred through the heat conducting block 2 (10) and the fins 2012, or through the heat conducting block 2〇4, the heat pipe 2〇3, and the piece 2012 for heat transfer. The path is quickly transmitted to the fins 2〇i2' so that the heat of the bottom of the Korean film can be quickly transferred to the top via the heat pipe, so that the cooling fan 2〇2 can provide the air volume at a small speed. The heat exchange at the top of the month for heat exchange for the purpose of rapid heat dissipation. Please read "Picture 6", which is a further example of the creation of the present invention (such as the 1F 7F exotherm $5) 〇 ' is a type of heat sink with a pair of heat sink fins' mainly consists of a first heat sink fin set, a second heat sink fin set 502, a heat sink fan 503, a heat pipe 5 〇 4 Composition, upper and lower sides of the cooling fan 5 () 3 and the first heat sink fin The group 5 and the second heat-dissipating group are arranged to each other, and the two ends of the heat pipe 504 are respectively disposed on the first heat-dissipating fin group 5〇 and the second heat-dissipating fin and the combination portion of the group 502; Please refer to "Fig. 7", which is a combination diagram of the embodiment (2). As shown in the figure, the first heat dissipation and the second heat radiation rotor group 5〇2 are in the same state, but when assembled The positions are opposite to each other, and are respectively disposed on the upper and lower planes of the heat dissipation fan 503. Further, the two ends of the heat pipe 5〇4 are respectively disposed in the _ assembly unit (10) of the first-scatter group 5G1. The assembly portion (5〇5, 5〇51) is a heat pipe 5〇4 which can be interposed to achieve the fixation and heat conduction. When the assembly portion (505, 5051) and the heat pipe 504 are assembled, one can be The high thermal conductivity adhesive is a connecting medium, such as solder paste. After the assembly is completed, as shown in the figure “Figure No., M295886, as described above, the heat sink of the present invention mainly uses the heat pipe to uniformly and rapidly conduct heat. The heat at the bottom of the heat-conducting block and the heat-dissipating fin group is rapidly and upwardly conducted, so that the heat-dissipating fins of the heat energy are quickly distributed, so that the heat energy is quickly Divergence, in addition, can be supplemented by a lining-cooling fan, so that the surface of the heat dissipation (4) is quickly taken away by the wind to improve the overall heat dissipation efficiency of the heat dissipation H. Moreover, the creation is on the plane of the heat dissipation chip group. Chengcai-ring groove, and the catheter is formed into a curved arc or arc shape, shouting hot material can increase with each read _ wire, heat transfer efficiency, improve the overall heat dissipation of the heat sink: contact, to ', not 5 above, the purpose of this creation of the radiator, after the implementation of a kind of heat dissipation can quickly achieve the purpose of heat dissipation. f can be provided - [Simple diagram of the description] Buer bottle gauges f2 map, the creation of this Stereoscopic appearance. 3 diagram, a combination diagram of this creation (1). $4 diagram, a combination diagram of this creation (2). f 5, a comparative example of this creation (1). A comparative example (2) of the creation of the certificate. Figure 7 , Shi a [Main 彳 实施 实施 实施 ( 二 二 件 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10
20 散熱器 201 散熱鰭片組 2011 環狀凹槽 2012 鰭片 202 散熱風扇 203 熱導管 2031 吸熱端 2032 冷凝端 204 導熱塊 2041 組設部 205 固定支架 2051 螺絲 30 熱源 40 載板 50 散熱器 501 第一散熱鰭片組 502 第二散熱鰭片組 503 散熱風扇 504 熱導管 505 組設部 5051 組設部 506 導熱塊 1120 Heatsink 201 Heat sink fins 2011 Ring groove 2012 Fin 202 Cooling fan 203 Heat pipe 2031 Heat sink end 2032 Condensing end 204 Heat block 2041 Assembly part 205 Fixing bracket 2051 Screw 30 Heat source 40 Carrier plate 50 Radiator 501 A heat sink fin group 502 a second heat sink fin group 503 a heat dissipation fan 504 a heat pipe 505 assembly portion 5051 assembly portion 506 a heat conduction block 11