TWM319453U - Heat sink module - Google Patents

Heat sink module Download PDF

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Publication number
TWM319453U
TWM319453U TW96205486U TW96205486U TWM319453U TW M319453 U TWM319453 U TW M319453U TW 96205486 U TW96205486 U TW 96205486U TW 96205486 U TW96205486 U TW 96205486U TW M319453 U TWM319453 U TW M319453U
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TW
Taiwan
Prior art keywords
main body
heat dissipation
card
heat
heat sink
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TW96205486U
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Chinese (zh)
Inventor
Chu-Nan Chen
Fu-Hsiung Huang
Hsuan-Wei Huang
Jing-Wen Huang
Original Assignee
Lian Cherng Entpr Co Ltd
Techluxe Ind Limiied
Kun Shan Chang He Prec Electro
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Application filed by Lian Cherng Entpr Co Ltd, Techluxe Ind Limiied, Kun Shan Chang He Prec Electro filed Critical Lian Cherng Entpr Co Ltd
Priority to TW96205486U priority Critical patent/TWM319453U/en
Publication of TWM319453U publication Critical patent/TWM319453U/en

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Description

M319453 八、新型說明: 【新型所屬之技術領域】 • 本創作係關於一種散熱模組,特別是關於利用在數個散 熱片上衝壓彎折形成一卡掣部及一扣合件,以便該數個散熱 片相互卡扣定位形成一散熱模組之散熱模組。 …、 【先前技術】 • 一種習用散熱模組如中華民國專利第M289490號「厣晶 • 散熱片扣組結構」新型專利所述,其係由數個散熱片構丄二 該散熱片包含一主體、二垂直月及數個連結組件。該主體係 為-板體,其選自—具高導熱能力之金屬材f製成,例如: 銀、銅及其合金等。該主體之相對二側邊係向上衝壓彎折形 成°亥一垂直片,以形成該主體之二側牆。該各連結組件係包 , 含一通孔、一定位槽、一定位凸部、一第一 — .½卡掣塊、-凸柄及—壓抵件,該通孔及龜件形成於該主= 上’而較位槽、定位凸部、凸柄及第―、第二卡掣塊則形 籲 成於雜直片上。該通孔開設於該主體上,且鄰設於該垂直 f之一側。該壓抵件向上衝壓彎·折形成於該通孔之一端。該 一垂直片之頂部係對應向内彎折且向上延伸分別形成該凸 且該二垂直片彎折形成該凸柄之位置亦對應形成該定位 二:日:該定位凸部對應該定位槽凸設於該垂直片之底部。 以弟t塊係凸設於各該凸柄之—側面;該第二卡擎塊則 =於f二垂直片之相對内側面’且該第二卡掣塊係緊鄰該 、以凸柄之背面對應該第二卡擎塊之形狀凹設一卡擎凹 ΙΙ·\η>-1 LmdssPk (,at\f'Kin29fl.d〇(: 6 — M319453 下散賴組組合數個該散㈣時’其步驟係如 熱片該散熱片的凸柄對位通過位於上方之該散 ; 者使該上方之散熱片的第二卡掣塊對位卡 擎於該下方之散熱片的卡掣 Ζ料鬼對位卡 的朝該通孔方向彎折,= 離二 懷任意脱 一 下丰凹。卩,進而提升結合可靠度。 隹^ "V ν習用散熱模組具有下列缺點,例如:該 ir工制^件的設置過讀雜,不但在製作該散敎片 二:衣 難’且增加該散熱片之製作成本。同時, 亦w纽裝過程過於繁瑣,而降低组裂效率。基於上、^ 必要進—步改良上述f用散熱模組。l 藉由在-敎熱片上設置至少/卡^^熱=,點,其係 卡擎部及-扣合件,在將該散熱片^二 經由該下方之散熱片的各扣 L、、、片上犄, 片的夂卡掣牛㈠立扣合於該上方之散熱 == 得本創作確實可增強各該散熱片間之 二效;_ ’ _簡化該散熱模組,進而增進 【新型内容】 散敎本片^之置主至要、目61 係提供一種散熱模組,其係藉由在一 -扣合件:;便^;各rtr件設有—卡擎部及 …各,’使得; Ι'ΛΟΙ-Ι ht\PKin299.docM319453 VIII. New description: [New technical field] • This creation is about a heat dissipation module, especially for forming a snap portion and a snap member by punching and bending on several heat sinks, so that the plurality The heat sinks are snap-fitted to each other to form a heat dissipation module of the heat dissipation module. ..., [Prior Art] • A conventional heat-dissipating module, as described in the new patent of the Republic of China Patent No. M289490 "Silicon + Heatsinks", which consists of several heat sinks. The heat sink contains a main body. , two vertical months and several link components. The main system is a plate body selected from a metal material f having high thermal conductivity, such as silver, copper and alloys thereof. The opposite sides of the main body are stamped and bent upward to form a vertical sheet to form two side walls of the main body. The connecting component kit includes a through hole, a positioning groove, a positioning convex portion, a first - .1⁄2 card block, a convex handle and a pressing member, and the through hole and the turtle are formed on the main = The upper portion, the positioning groove, the positioning convex portion, the convex handle, and the first and second clamping blocks are shaped on the straight piece. The through hole is formed on the main body and adjacent to one side of the vertical f. The pressing member is punched and bent upward at one end of the through hole. The top of the vertical piece is correspondingly bent inwardly and upwardly to form the convex portion, and the position of the two vertical pieces bent to form the convex shank also correspondingly forms the positioning two: day: the positioning convex portion corresponds to the groove convex Located at the bottom of the vertical piece. The second block is protruded from the side of each of the shanks; the second block is ???the opposite inner side of the two vertical pieces and the second block is immediately adjacent to the back of the shank In the shape of the second card block, a card ΙΙ ΙΙ \ \ \ -1 -1 -1 -1 -1 -1 -1 -1 -1 -1 -1 -1 -1 -1 -1 -1 -1 -1 -1 -1 -1 -1 -1 -1 -1 -1 -1 -1 -1 -1 -1 -1 -1 -1 -1 -1 -1 -1 -1 -1 -1 -1 -1 -1 -1 -1 -1 -1 -1 -1 -1 The steps are as follows: the hot slat of the heat sink is aligned with the slanting of the heat sink; the second smashing block of the upper heat sink is aligned with the card of the lower heat sink. The alignment card is bent in the direction of the through hole, and the detachment is removed. The 隹^ "V ν conventional heat dissipation module has the following disadvantages, for example: the ir system ^The setting of the piece is too complicated, not only in the production of the two pieces: the clothing is difficult and increases the manufacturing cost of the heat sink. At the same time, the process of the new button is too cumbersome, and the efficiency of the splitting is reduced. Based on the above, ^ necessary Step-by-step to improve the above-mentioned heat-dissipation module for f. l By setting at least / card ^^ heat=, point on the hot plate, the card-loading part and the - fastening part After the heat sink 2 is passed through the buckles L of the lower heat sink, and the top of the sheet, the 夂 掣 掣 一 一 一 立 = = = = = = = = = = = = = = = = = = = = = = = = The second effect; _ ' _ Simplify the cooling module, and then enhance the [new content] 敎 敎 ^ ^ ^ 目 目 目 目 目 目 目 目 目 61 61 61 61 61 61 61 61 61 61 61 61 61 61 61 61 61 61 61 61 61 61 61 :; will ^; each rtr piece is provided - card engine and ... each, 'made; Ι 'ΛΟΙ-Ι ht\PKin299.doc

η·/ΙΜ/η.)ΊΙ:13 AM ~ 7—— M319453 化卡合構造及增進組裝效率之目的。 本創作之次要目的係提供一種散熱模兔 設有一卡掣孔’該扣合件之一鉤部係彎折其中該卡掣部 ,以避免各該散熱片間任意移動,使得 合於該卡掣孔内 卡合構造及提升組裝效率之功效。仔創作確實具有簡化 很像不剧作(敢熱模組,其η·/ΙΜ/η.)ΊΙ: 13 AM ~ 7—— M319453 The structure of the snap-fit and the purpose of improving assembly efficiency. The secondary purpose of the present invention is to provide a heat-dissipating rabbit with a card hole. The hook portion of the fastening member is bent in the hook portion to avoid any movement between the heat sinks, so that the card is engaged with the card. The function of the snap-fit structure in the pupil and the improvement of assembly efficiency. Aberdeen creation is really simplified. It’s like a drama.

該散熱片包含-主板體、二側牆及至片組合構成: 體具有-第-表面及-第二表面it組件。該主未 成於該主板體之相對二側緣。該各卡 掣部及一扣合件,該卡掣部形成 “刀別具有一寸 牆,該卡掣部設有—卡掣孔;該扣合件近該御 Μ =合:,使該扣合件的釣部對位卡掣:該另:散埶ί ^卡w針觀内,以便鱗散㈣㈣組成該散熱模組 【實施方式】 為4本創作之上述及其他目的、特徵及優減更明顯易 t,下文特舉本創作之較佳實施例,並配合所附圖式, 細說明如下: y H…、第1及2圖所示,本創作較佳實施例之散熱模組 係由數個放熱片組合而成,而各該散熱片均包含—主板體1 古、酋2及至少二卡合組件3。冑主板體1較佳係由一具 力之金屬材質〔例如··銀、銅及其合金等〕製成, 八開叹有至少一穿孔1〇,以供至少一熱管〔未繞示〕對應 hi(\PKin29fi. doc «7/〇4.·〇.1/||;Κ-, —8—— M319453 組裝穿設。該主板體〗之相 〗…第二表面…該第縣-第-表面 ^ , τ 叹弟一表面η、12之配置軔# 係互相平行。該二側牆2係 體1之相對二側緣,且該二_=魅弓折械於5亥主板 二卡合組件3之各構件二:較佳係互相平行。該至少 體!及二側牆2上。刀別對應一體成型設置於該主板 件Λ再入參^第盤1及2圖所示’本創作較佳實施例之卡合组 件3包含一卡掣部31及— r 口、、且 扣a件32,該卡掣部31传开> 成 於該主板體1鄰接該二側腾 料^ 31係也成 端連結於該側牆2之底緣^一:^且該卡擎部31之一 %之位置設有至少-缺跑2較佳係對應該卡掣部 槽構造,該扣合件32亦^ :缺方槽,自一倒三角形缺 2之缺槽21内。〜由舰方式料成形於該二側牆 請再參照第1及2圖所示,太a T!設有一卡擎孔311、—咖實施轉部 鳊面312及一外側面313,卡 ^ 311對蘭設於鄰_σ合件32之位置 % 有-板部奶及-釣部322,該板部321之一:擎 部相連結’· _軸則形成於該板物j -對應鉤扣於該卡掣孑L S11内 對二側面分別為一第-側面切及-第二侧面324之相 請再參照第1及2_示,本_健實關 件3較佳係利用該主板體1亩技俺 口、、’ ns料㈣= 形成’首先在該主板體 弟-表面η朝向该弟二表面12彎折成形該卡寧部且該 M319453 目對該主板體丨之端緣保持-適當距離;接著, 缺槽u及扣合件32,並f折今=立置同時加工形成言亥 該扣合㈣之釣侧4扣合件32之-端’以形成 弯折支點_衝財式向上1!^該卡掣部31之—側緣為 之-側。 ▲…弓折形成該側膽2於該主板體i 請參照第3及4圖所示,者土刳 進行組合時,首先彎折—料= 實闕之散熱片 a4^3?^ 片B之第312及外侧面313分別抵靠於該散熱 画: 扣合件32之第:=2之内壁面;最後’藉由抵壓該 W上告, 細323 ’以將該散熱片B之扣合件32朝 =卡拏部Μ,彎折,使該扣合件32之鉤部322對位障入亨 ΪΪΠ内,,且該扣合件32之第二側面324抵靠於該Ϊ . 側面313。利用上述組裴程序使該散熱片B之 口件32對應卡合於該散熱片a之各卡掣部,該散熱 可勃即士可與該散熱片B緊密結合。同理’該其他散熱片亦 έ士 1α上述組餘序,進而與該散熱片a、b及其他散敎 片—。藉此’本創作僅需同時將該下方之散熱片的扣合件 今=卡口於5玄上方之散熱片的卡掣部31内,即可將該各 月’、’、&速纟从成該散熱模組,進而有效簡化組裝構件及增 装效率’並轉良好之組裝可靠度。 如上所述,相較於習用散熱模組不但在製作該散熱片之The heat sink comprises a main body, two side walls and a combination of sheets: the body has a - surface and a second surface it. The master is not at the opposite side edges of the main body. Each of the latching portions and a latching portion, the latching portion forming a "knife has an inch wall, the latching portion is provided with a latching hole; the latching member is adjacent to the latching The fishing section of the piece is aligned with the card: the other: the 埶 埶 ^ card w pin view inside, so that the scales (4) (four) constitute the cooling module [embodiment] for the above and other purposes, features and advantages of the four creations It is obvious that the following is a preferred embodiment of the present invention, and the following is a detailed description of the following: y H..., 1 and 2, the heat dissipation module of the preferred embodiment of the present invention is A plurality of heat radiating fins are combined, and each of the heat sinks comprises a main body 1 ancient, an Emirates 2 and at least two engaging components 3. The main body 1 is preferably made of a strong metal material (for example, silver) , copper and its alloys, etc., eight sighs have at least one perforation 1 〇, for at least one heat pipe [not shown] corresponds to hi (\PKin29fi. doc «7/〇4.·〇.1/||; Κ-, -8—— M319453 assembly and wear. The body of the board body〗... The second surface... The county-surface-surface ^, τ sigh one surface η, 12 configuration 轫 # system parallel to each other. The two side walls 2 are opposite to the two side edges of the body 1, and the two _= charm bows are disassembled in the components of the 5th motherboard two-engagement assembly 3: the preferred systems are parallel to each other. The at least body! and the two side walls 2, the knife is integrally formed on the main board member, and the re-entry member is shown in the first and second figures. The engaging assembly 3 of the preferred embodiment of the present invention includes a latching portion 31 and a port, And the buckle member 31 is extended, and the card body portion 31 is adjacent to the two sides of the main body 1 to be connected to the bottom edge of the side wall 2: At least one of the positions of the portion 31 is provided with at least a lack of running 2, preferably a corresponding card slot structure, and the fastening member 32 is also: a missing slot, which is missing from the slot 21 of an inverted triangle. The ship material is formed on the two side walls. Please refer to the first and second figures. Too a T! is provided with a card engine hole 311, a coffee implementation turning surface 312 and an outer side surface 313, and the card 311 pair The position of the blue is set at the position of the adjacent _ sigma 32. There is a plate portion milk and a fishing portion 322, and one of the plate portions 321 is connected to the stalk portion '· _ axis is formed on the plate j - the corresponding hook is The opposite sides of the cassette L S11 are respectively a first side And - the second side 324 please refer to the first and second _, the _ healthy contact 3 is preferably using the main body of the motherboard 1 俺 technical mouth, ' ns material (four) = formed 'first in the motherboard The body-surface η is bent toward the second surface 12 to form the canning portion and the M319453 is held at an appropriate distance from the end edge of the main body body; then, the slot u and the fastening member 32 are folded = Stand up and simultaneously form the end of the fishing side 4 fastening piece 32 of the buckle (4) to form the bending fulcrum _ rushing up 1! ^ the side edge of the shank 31 - side . ▲...Bow fold to form the side sill 2 on the main body i. Please refer to the figures 3 and 4, when the bandits are combined, first bend the material = the actual heat sink a4^3? ^ piece B The 312th and the outer side 313 respectively abut against the heat dissipating picture: the inner wall surface of the:=2 of the fastening component 32; and finally 'by pressing the W, the thin 323' to fasten the fastening piece of the heat sink B 32 = = Μ Μ , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , The device 32 of the heat sink B is correspondingly engaged with each of the latch portions of the heat sink a by the above-mentioned grouping process, and the heat dissipation can be tightly coupled with the heat sink B. Similarly, the other heat sinks are also the first order of the above-mentioned group of gentlemen 1α, and further with the heat sinks a, b and other diffusing sheets. By this, it is only necessary to simultaneously insert the lower heat sink fastening member into the latching portion 31 of the heat sink above the top of the 5th, which can be used for the month ', ', & speed From the heat dissipation module, the assembly member and the assembly efficiency are effectively simplified, and the assembly reliability is improved. As described above, not only the heat sink but also the heat sink is fabricated.

Lindn .PK Pflt\PK 10299. doc 〜10—— M319453 加工製程較於_’而導致增加製作成本。 亦過於繁硝,造成降低組裝效率等缺點, 各散熱:上設置該至少二卡合組件3,當該散熱 δ亥另政熱片B上時,經由該散熱u之各扣合件% 部322對位扣合於該散熱片a之各卡擎部31的卡擎孔3i’j 内,進一步組裝形成該散熱模組。藉此,使得本創作確實可 增強各該散熱片間之組裝可靠度,同時亦簡化該散熱模^, 進而增進組裝效率。Lindn .PK Pflt\PK 10299. doc ~10 - M319453 The processing process is more expensive than _'. It is also too versatile, resulting in disadvantages such as reduced assembly efficiency. Each heat dissipation is provided with the at least two engaging components 3, and when the heat is dissipated, the respective fastening parts % 322 via the heat dissipation u The heat dissipation module is further assembled and assembled in the card engine hole 3i'j of each of the card cylinders 31 of the heat sink a. Thereby, the creation can indeed enhance the assembly reliability between the heat sinks, and at the same time, simplify the heat dissipation mold, thereby improving assembly efficiency.

雖二本創作已利用上述較佳實施例揭示,然其並非用以 限定本創作,任何熟習此技藝者在不脫離本創作之精神和範 圍之内’相對上述實施例進行各種更動與修改仍屬本創作所 保護之技術範疇,因此本創作之保護範圍當視後附之申請專 利範圍所界定者為準。 D:\ni-! LindaxPK Pal\PKlfl299.doc —11 — M319453 【圖式簡單說明】 第1圖: 第2圖: 視圖。 第3圖: 意圖。 第4圖: 部放大圖。 本創作較佳實施例之散熱模組之組合立體圖。 本創作較佳實施例之散熱模組之局部放大及透 本創作較佳實施例之散熱模組之組合剖視及示 本創作較佳實施例之散熱模組組之組合後之局 【主要元件符號說明】 1 主板體 10 穿孔 11 第一表面 12 第二表面 2 側牆 21 缺槽 3 卡合組件 31 卡掣部 311 卡掣孔 312 端面 313 外侧面 32 扣合件 321 板部 322 鉤部 323 第一側面 324 第二側面Although the present invention has been disclosed by the above-described preferred embodiments, it is not intended to limit the present invention, and any person skilled in the art can make various changes and modifications relative to the above embodiments without departing from the spirit and scope of the present invention. The technical scope protected by this creation, therefore, the scope of protection of this creation is subject to the definition of the scope of the patent application attached. D:\ni-! LindaxPK Pal\PKlfl299.doc —11 — M319453 [Simple description of the diagram] Figure 1: Figure 2: View. Figure 3: Intention. Figure 4: A magnified view of the section. A combined perspective view of the heat dissipation module of the preferred embodiment of the present invention. The partial expansion of the heat dissipation module of the preferred embodiment of the present invention and the combination of the heat dissipation module of the preferred embodiment and the combination of the heat dissipation module group of the preferred embodiment of the present invention [main components DESCRIPTION OF REFERENCE NUMERALS 1 Main body 10 Perforation 11 First surface 12 Second surface 2 Side wall 21 Notch 3 Engagement assembly 31 Clamping portion 311 Clamping hole 312 End surface 313 Outer side 32 Fastening member 321 Plate portion 322 Hook portion 323 First side 324 second side

LindaNPK Pnt\PKin29i). doc —12 一 η7/〇4/(Μ/ιι:|LindaNPK Pnt\PKin29i). doc —12 a η7/〇4/(Μ/ιι:|

Claims (1)

M319453 九、申請專利範圍: 1、一種散熱模組,其係由數_ 包含: 放熱片結合構成,該散熱片 一主板體,其具有一第〜矣 二侧牆,其係由該主板體//及―第二表面; 該主板體之第-表面;及相對二側緣垂直延伸突出於 至少二卡合組件,其係分別具有人 該卡掣部設置於該主板體 卞I邛及一扣δ件, 設有一卡掣孔,該扣合且接近該侧牆,該卡掣部 上,該扣合件形成有—㈣對應斜掣部設置於該側牆 其中藉由彎折該其中一散埶 在句部對位隱入於該另一散^=^件,使該扣合件的 2、依申請專補圍第掣部的卡掣孔内。 係對應該卡掣部之彳❿相設有 對應形成機簡内。 ㈣该扣合件 =申請專利麵第丨項所述之散熱模組,其中該 之一端連結於該側牆之底緣。 "I 4、 依申請專·圍第i項所述之散熱触,其中該卡擎孔 對應開設於鄰接該扣合件之位置。 5、 依申請專利範圍第1項所述之散熱模組,其中該扣合件 另具有一板部,該板部之一端係與該卡掣部之一端相連 結,該扣合件之鉤部形成於該板部之另一端。 1);\〇]-1 LinrfB\PK Pat\PK10299.doc 一 13 一 ητ/η.ι/〇„/,,.,3 AMM319453 IX. Patent application scope: 1. A heat dissipation module, which is composed of a number _ comprising: a heat radiating film combined, the heat sink is a main body, which has a first to second side wall, which is composed of the main body/ And a second surface; the first surface of the main body; and the opposite side edges extend perpendicularly to the at least two engaging components, each of which has a card portion disposed on the main body and a buckle The δ member is provided with a boring hole which is fastened and close to the side wall, and the fastening member is formed with a (four) corresponding slanting portion disposed on the side wall, wherein the one of the slanting portions is bent埶In the sentence part, the other part is hidden in the other part, so that the 2nd part of the fastening part is filled in the hole of the third part according to the application. It is set up in the corresponding part of the card. (4) The fastening component is the heat dissipation module according to the above aspect of the invention, wherein one end is connected to the bottom edge of the side wall. "I 4, according to the heat dissipation touch described in the application item i, the card hole is correspondingly located adjacent to the fastening member. 5. The heat dissipation module according to claim 1, wherein the fastening component further has a plate portion, one end of the plate portion is coupled to one end of the latch portion, and the hook portion of the fastening member Formed at the other end of the plate portion. 1);\〇]-1 LinrfB\PK Pat\PK10299.doc A 13 ητ/η.ι/〇„/,,.,3 AM
TW96205486U 2007-04-04 2007-04-04 Heat sink module TWM319453U (en)

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TWM319453U true TWM319453U (en) 2007-09-21

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