M384342 五、新型說明： 【新型所屬之技術領域】 本創作係提供-種記鍾較_置，尤指___於容納結 合多數成排記憶體之散熱裝置。 【先前技術】 齡電職肋__料麵料、高鱗展，使得主 •機内部記憶體模組存取的頻寬進化，從早期P C i ◦⑽頻寬為M384342 V. New description: [New technical field] This creation provides a type of clock, such as ___, which is a heat sink that accommodates a large number of stacked memory. [Prior Art] The age of the electric rib __ fabric, high scale exhibition, the bandwidth of the internal memory module access of the main machine evolved from the early P C i ◦ (10) bandwidth
# 8〇〇MB/S，拓展至現今DDR500的頻寬已達4.〇G B/s，甚至是到了雙通道的平臺，财將駐增加至兩倍，無 論是工作雜或傳觀寬’明_都是往高祕展，趙合處理 器高速度的運算狀態。 而為了解決上述錢、體她之整合配置與其熱關題，有業 者研發出記憶體模組散熱裝置，如第i圖所示，其主要包括有兩 •散熱片91、9 2以導熱膠片貼合記憶體模組9 3，再配合兩夾 扣件9 4失住定位兩散熱>5 9 1、9 2與記憶體模組9 3。 准此兩散熱>；9 1、9 2必須以兩夾扣件9 4夾住記憶體模 組9 3、，ϋ此相對增加散絲置鐘製造成本，耗練裝人力與 工時’並且兩夾扣件9 4會影響散熱裝置之外觀型態。因此要如 何改。上述問題與缺失，即為相關業者所亟欲研究發展之方向。 【新型内容】 i作之主要目的暨功效在於前後散熱片彼此以定位卡勾 ί接疋位孔區’能夠迅逮組裝定位，降低製造成本，減少相關構 3 M384342 件種類，並且適合自動化量產，增進產品效益。 為達上揭目的，本創作散熱裝置係由-前散熱片及一後散熱 片彼此前後對稱相接構成，以於前後散熱片之間設 憶體；該前後散熱片各設有-朝向彼此相互#抵之頂折片，於兩 頂折片設有錄相互對接職卡掣固定之定位卡勾與定位孔區； 各定位卡勾包含有-根部，以及其末端伸出橫向擴大之勾部，各 定位孔區包含有-扣孔，以及其末端伸出橫向_之孔開口；各 定位孔區之關Π配合容置相對定位卡勾之根部與其兩側緣，以 及其扣孔配合容置相對勾部形狀。 之定位卡勾與定位孔區彼此 之定位卡勾與定位孔區彼此 於較佳實施例中，該前後散熱片 設為水平相接。 於較佳實施例中，該前後散熱片 設為對應配合之“T”字型。 【實施方式】 有關本創作為達成上述目的，所採用之 兹舉出可行實施例，並且配合圖式說邮下：&托及其功效， 首先，請參閱第2及3圖，本創作散熱技 合錢體模組3，如圖所示中，散熱裝置包 二相對形狀後散熱片2，並且前散熱片U後散敎=== 壓方式成型出金屬材質矩形片體丄丄、 …、 木y 樣設有矩形板3 1(配合參_7及=、响龍模組3同 兩面各設置多數成排間隔之記憶體3 2。 並且電路板31 4 則84342 於第2至㈣所示之較佳實細中’本創作散鮮置將前散 熱片1及後散熱片2設為相同形狀，再彼此前後反向對稱相接構 成，於前後散熱片1、2之片體工工、21内面貼設前膠片4丄、 後膠片4 2 ’以黏合記憶體模植3兩面之多數成排記憶體3 2。 如圖所不中’前後散熱>；i、2各設有__朝向彼此相互靠抵之頂 折片12、2 2 ’並且片體11、21兩側各設有側折邊13、 2 3 ’以相互靠抵定位。 本創作政熱裝置主要在於前後散熱片1、2之卡扣設計，如 第2至6圖所示’兩頂折片12、22設有多數相互對接形成卡 掣固定之定位卡勾14、2 4與定位孔區15、2 5，各定位卡 勾14、24皆包含有-根部18、28，以及其末端伸出橫向 擴大之勾部16、2 6，而各定位孔區15、2 5則包含有-扣 孔17、2 7，以及其末端伸出橫向縮窄之孔開口1g、2 g。 進而各雜孔區1 5、2 5之孔開π 1 9、2 9配合容置相對定 位卡勾14、2 4之根部18、2 8與其兩側緣，並且其扣孔1 7、2 7配合容置相對勾部丄6、2 6形狀定位。 釦續說明本創作散熱裝置之組合結構，如第2至Θ圖所示， 別後政熱片1、2之定位卡勾14、2 4與定位孔區15、2 5 彼此設為同一水平相接，以方便製作組接，並且確實卡掣固定。 於較佳實施結構中，前後散熱片1、2之定位卡勾14、2 4與 疋位孔區1 5、2 5彼此設為對應配合之“τ”字型，以提高卡 掣定位力。 於實際組合散熱裝置時’前後散熱片1、2之相對面先黏貼 5 前膠片4 1、後膠片4 2 (參閱第3圖），將後散熱片2平放 黏合記憶體模組3 (參閱第7圖），隨即將前散熱片i之定位卡勾 14及定位孔區15帛下傾斜對接後散熱片2之相對定位卡; :;==(參閱第8及9圖），與往下扣她(參 二解決習知技術之不足與缺失，其關鍵技術 ^於别後散熱Μ、2設計，蚊位孔區15、25之孔 =29配合容置相對定位卡勾14、24之根部18、28盘 一兩侧緣’並且其扣孔1 7、2 7配合容置相對勾部i 6 '、 速喊定位，降健造縣，減少相_件種類，並 自動化量產’增進產品效益，爰依法提出新型專利申請。 在不2所舉實關侧為枝謂梢作，而轉加以限制， 離本·精神㈣，熟悉此—行賴藝人士所可作之各 變化與修飾，均減含括於以下憎專 θ f圖式簡單說明】 r 第1圖係制記髓餘散練置之立體圖； | =圖係本創作健實施舰_職缝置之立翻； 苐3圖係第2圖散熱裝置之剖視圖； 第4圖係第2圖散熱裝置之局部放大圖； 第5圖係第2圖前後散熱片之分解圖； 第6圖係第5圖前後散熱片之局部放大圖； 苐7圖係本創作較佳實施例記憶體用散熱裝置進行 作圖； ^ 6 M384342 第8圖係接續第7圖進行組裝動作圖； 第9圖係第8圖散熱裝置進行組裝之局部放大圖。 【主要元件符號說明】 1前散熱片 1 1片體 1 2頂折片 1 3側折邊 14定位卡勾 15定位孔區 1 6勾部 1 7扣孔 1 8根部 1 9孔開口 2後散熱片 2 1片體 2 2頂折片 2 3側折邊 2 4定位卡勾 2 5定位孔區 2 6勾部 2 7扣孔 2 8根部 2 9孔開口 3記憶體模組 3 1電路板 3 2記憶體 4 1前膠片 4 2後膠片# 8〇〇MB/S, expanding to the current DDR500 bandwidth has reached 4. 〇 GB / s, even to the dual-channel platform, the financial will be doubled, whether it is work or pass wide _ are all high-profile exhibitions, Zhaohe processor high-speed computing state. In order to solve the above-mentioned money, her integrated configuration and its thermal issues, some people have developed a memory module heat sink, as shown in Figure i, which mainly includes two heat sinks 91, 9 2 with thermal film stickers The memory module 9 3 is combined with the two clip members 94 to dislocate the two heat sinks > 5 9 1 , 9 2 and the memory module 9 3 . The two heat dissipations; 9 1 and 9 2 must clamp the memory module 9 3 with the two clip members 94, thereby increasing the manufacturing cost of the loose filament clock, and consuming the manpower and working hours' The two clip members 94 affect the appearance of the heat sink. So how do you change it? The above problems and lacks are the direction that the relevant industry is eager to study and develop. [New content] The main purpose and effect of i is that the front and rear heat sinks are positioned to each other with a positioning hook. The position of the hole can be quickly assembled and assembled, the manufacturing cost is reduced, the related structure is reduced, and the mass production is suitable. To enhance product efficiency. In order to achieve the above, the heat dissipating device of the present invention is composed of a front heat sink and a rear heat sink which are symmetrically connected to each other to form a memory between the front and rear heat sinks; the front and rear heat sinks are respectively arranged to face each other #抵的顶折片, the two top flaps are provided with a positioning hook and a positioning hole area which are fixed to each other; the positioning hooks include a root portion, and a hook portion extending at the end thereof to extend laterally. Each of the positioning hole regions includes a button hole, and a hole extending from the end thereof to the lateral hole; the positioning hole of each positioning hole portion is matched with the root portion of the relative positioning hook and the two side edges thereof, and the fastening hole of the corresponding hole is relatively Hook shape. The positioning hook and the positioning hole area are positioned with each other and the positioning hole area. In the preferred embodiment, the front and rear heat sinks are horizontally connected. In the preferred embodiment, the front and rear fins are arranged in a corresponding "T" shape. [Embodiment] In order to achieve the above objectives, the present invention adopts a feasible embodiment, and cooperates with the drawings to describe the following: & and its function, first, please refer to the 2nd and 3rd drawings, the heat dissipation of the creation The technology module 3, as shown in the figure, the heat sink package 2 has a relatively shaped rear fin 2, and the front fin U is diverged === pressure forming a rectangular sheet of metal material, ..., The wooden y sample is provided with a rectangular plate 3 1 (with the reference _7 and =, the gonglong module 3 is provided with a plurality of memory blocks 3 2 in the same row on both sides. And the circuit board 31 4 is 84342 shown in the second to the fourth In the preferred embodiment, the front heat sink 1 and the rear heat sink 2 are set to the same shape, and then formed in reverse symmetrical relationship with each other, and the front and rear heat sinks 1 and 2 are 21 inner surface is attached with front film 4丄, and rear film 4 2′ is adhered to the memory module to form a plurality of rows of memory 3 2 in two rows. As shown in the figure, 'front and rear heat dissipation>; i, 2 are provided with __ The top flaps 12, 2 2 ' are abutted against each other and the side flaps 13, 2 3 ' are respectively provided on both sides of the sheets 11 and 21 to abut each other The creation of the political heating device mainly lies in the buckle design of the front and rear fins 1, 2, as shown in Figures 2 to 6 'the two top flaps 12, 22 are provided with a plurality of positioning hooks 14 which are mutually butted to form a cassette. And the positioning hole regions 15, 25, each of the positioning hooks 14, 24 includes a root portion 18, 28, and a distal end of the hook portion 16, 26, and the positioning hole region 15, 2 5 includes a - button hole 17, 27, and a hole opening 1g, 2 g whose end is extended laterally narrowed. Further, the hole of each of the hole area 1 5, 2 5 is opened by π 1 9 and 2 9 The root portions 18 and 28 of the relative positioning hooks 14 and 24 are disposed on both sides of the hooks 14 and 24, and the fastening holes 17 and 27 are matched to the shape of the hook portions 、6 and 26, respectively. The combined structure, as shown in the second to the second figure, the positioning hooks 14, 24 of the post-politics 1 and 2 and the positioning hole areas 15, 25 are placed at the same level to facilitate the assembly. And in the preferred embodiment, the positioning hooks 14 and 24 of the front and rear fins 1, 2 and the clamping hole regions 15 and 25 are mutually matched with the "τ" shape. Improve the positioning force of the cassette. When the heat sink is actually combined, the front surface of the front and rear heat sinks 1 and 2 is pasted with 5 front film 4 1 and rear film 4 2 (see Fig. 3), and the rear heat sink 2 is flat and bonded. The body module 3 (refer to FIG. 7), and then the positioning hook 14 of the front heat sink i and the positioning hole area 15 are slanted and docked to the relative positioning card of the heat sink 2; :;== (refer to the 8th and 9th Figure), and deducting her down (the second solution to the shortcomings and lack of the conventional technology, its key technology ^ after the heat dissipation, 2 design, mosquito bit hole area 15, 25 holes = 29 with the relative positioning card The roots 18, 28 of the hooks 14 and 24 have a side edge ' and the button holes 17 and 27 fit together with the hook i 6 ', and the position of the hook is lowered, the Jianxian County is reduced, the phase is reduced, and the type is automatically automated. Mass production 'improves product efficiency, and proposes new patent applications according to law. In the case of not being on the real side of the road, the branch is said to be a tip, and the restrictions are imposed, and the spirit and spirit (4) are familiar with this. The changes and modifications that can be made by the people who are in the industry are all included in the following. a simple description of f schema] r Figure 1 is a three-dimensional diagram of the recording of the residual muscles; | = Figure is the vertical implementation of the creation of the ship _ _ _ _ _ _ _ _ _ _ 3 Fig. 4 is a partial enlarged view of the heat dissipating device of Fig. 2; Fig. 5 is an exploded view of the heat sink before and after Fig. 2; Fig. 6 is a partial enlarged view of the front and rear fins of Fig. 5; The memory of the preferred embodiment is patterned with a heat sink; ^ 6 M384342 Fig. 8 is a diagram showing the assembly operation of Fig. 7; Fig. 9 is a partial enlarged view of the assembly of the heat sink of Fig. 8. [Main component symbol description] 1 front heat sink 1 1 body 1 2 top flap 1 3 side flange 14 positioning hook 15 positioning hole area 1 hook part 1 7 button hole 1 8 root 1 9 hole opening 2 after heat dissipation Sheet 2 1 sheet 2 2 top flap 2 3 side flap 2 4 positioning hook 2 5 positioning hole area 2 6 hook 2 7 button hole 2 8 root 2 9 hole opening 3 memory module 3 1 circuit board 3 2 memory 4 1 front film 4 2 rear film