TWI232721B - Method for manufacturing thin heat-dissipater - Google Patents

Abstract

The present invention relates to a method for manufacturing a thin heat-dissipater, which generally mounts a heat conduction pipe on a base and attaches a plurality of dissipation fins to the heat conduction pipe. The dissipation fins are manufactured by pressing a metal sheet in the form of a roll, making each dissipation fin in the form of an inverted-U shape. The dissipation fins are attached to the heat conduction pipe with a suitable distance between adjacent dissipation fins. Further, the dissipation fins are stamped to form stamped holes and stamped slots. A specific stamped slot is provided for the extension of the heat conduction pipe. Projected tabs are formed along upper and lower edges of the stamped slot for increase of the contact area between the heat conduction pipe and the dissipation fins, which together with heat dissipation routes set by other stamped holes and stamped slots, effectively enhance heat dissipation efficiency of the heat dissipater.

Description

1232721 A7 'I ---------____ 5. Description of the Invention (/) The present invention relates to a method for manufacturing a thin heat sink, especially a thin heat sink that has a smaller volume but can effectively improve heat dissipation efficiency. Manufacturing method Thanks to the ever-changing gift of computer technology, modern people can buy a well-equipped personal computer with a reasonable low price. But the same is a personal computer. The value of a notebook computer is very different from the general PC. The main reason is of course that the cost of a pen-type computer is higher. It must integrate all necessary components of the computer into a small-sized notebook computer case. For this reason, many computer-related components must be specially made to reduce their volume. In this situation, it is not difficult to imagine that their cost is relatively high. From the above, it can be known that under the requirements of the use characteristics of existing notebook computers, the requirements for the use of space and the reduction in the size of related equipment are quite strict, even the radiator for the central processing unit is no exception. As is known to those equipped with thermal W personal computers, the central processing unit is provided with a set of independent heat sinks, which consists of a heat sink and a fan. When the central processing unit's working frequency is higher, the efficiency of the heat sink is required. That is to say, one of the methods to improve the thermal efficiency of the door is to increase the volume of the heat sink to increase the N heat radiation area. This is not difficult for a heat sink used in a personal computer. However, for notebook computers, it is not feasible to increase the volume of the heat sink. Therefore, the improvement of heat dissipation efficiency must be solved separately. For example, the structure of the heat sink itself or Starting with material changes, no matter what the method is, the premise is not to expand the volume. Therefore, under this premise, how to provide an ideal cooling device for products such as notebook computers that are severely restricted in space use? , Is the research and development of the present invention. L _—__ 3 This paper is suitable for the financial country standard (CNS) A4 specification) -------

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1232721

1232721 A7 V. Description of the invention (3) The aforementioned heat conducting member is oblong. The aforesaid contact bottom plate is adjacent to the buckle to cover the money box, and the penetrating ==: the material is formed into a u for your reviewing committee who is another-a heat dissipation channel. Special technical works, further understanding of the foregoing objectives and technical features of the present invention, are attached with detailed illustrations as follows. (1) Schematic part: The first picture is the first embodiment of the present invention, which is a good practice Decomposition of the finished product-Figure. It is a schematic diagram of the manufacturing process of the present invention. The third figures A and B are schematic diagrams of the manufacturing process of the heat sink of the present invention. The fourth figure The fifth figure The sixth figure The seventh figure The external view of a preferred embodiment of the present invention The cross-sectional view of a preferred embodiment of the present invention. It is an exploded view of another preferred embodiment of the present invention. It is a sectional view of another preferred embodiment of the present invention. The figure number part: Figure (two (1 0) contacting the base plate (2 0) base (3 0) heat sink (3) 2) (3 3) Punching slot (3 4) Punching is shown in the first figure, which is one of the tenth embodiment of the heat sink manufactured by the present invention, which includes:, ° _-contacting the bottom plate (10), It is a plate body made of copper or other ideal heat-conducting material for contacting the surface of the central processing unit; a base (20), which is fixed to the aforementioned contact base plate (1〇) "(11) buckle (21) ) Heat conducting element (3 1) Folding edge (320) (330) Protrusion sheet 1 This paper size is applicable to China National Standard (CNS) A4 specification (210 X 297 mm) (Please read the precautions on the back before filling this page)

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1232721 A7 B7 V. Description of the invention (P) There are ―plate-shaped heat-conducting parts (21); a plurality of political-heating pieces (3〇) are arranged in series on the aforementioned heat-conducting parts (2i); of which: The contact base plate (10), the heat sink (30), and the heat conducting member (2 1) are made of pins or other materials with good thermal conductivity; the hot member (2 1) is oblong. For the manufacturing method of Benmeming, please refer to the second figure. First, the first method is to manufacture the aforementioned contact base plate (work 0), and the heat sink (30). Ben U Gan 2; 2). Technique: 'Joint: the bottom plate (10) and the base (the content is not praised here. Technology, and is not the main object of the present invention, ^ the manufacturing method of the loose (3Q) includes the following steps. Cutting, will For example, the coiled metal of the copper sheet is cut into a metal sheet of an appropriate size; (not shown in Figure A), the edges are cut, and the two ends of the metal sheet are folded to form the folded edge B) to form a U shape; Punching, forming a plurality of r and punching holes (3 4) on the metal sheet, and each of the punching grooves (3 2; the edge of the slot is extended to form two convex pieces (3 2 ◦) J d) into a heat sink (3 〇) In this embodiment, 丄 3 0), so that a punching groove (3 2) μ heat sink (3 0) is formed near the central part of the Shen, and has a proper groove height and groove width, and its upper and lower sides, The slot (32) 〇) (3 3 0) is also relatively wide, and this :: The thermally conductive member (2 1) on the extended tab (3 2 (2 〇)) corresponds to J. (3 2). Base 'and heat As the first

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This paper size applies the Zhongguanjia Standard (CNS) A4 specification (21G 0 1232721 A7 B7 V. Description of the invention (factory)) Two grooves (3) are formed on the opposite sides respectively and are formed on the opposite outer groove edges. Convex two grooves (3 3 After completing the aforementioned manufacturing steps, 7 pieces (3 3 0) are added. As shown in the first figure, the main task is to make the base (2) work called the surface of the mating reference (10), and then Plural heat dissipation: Junction: Put on the contact base plate (2 1) so that the complex heat sink is a flat heat sink. To ensure heat dissipation, the bonding between the two sheets (0) (= composition-1) is stable. Degree, then the aforementioned heat sink piece (2 (3 2 0) slot width and slot length is slightly smaller than the guide slot two ", and the guide piece (2 1) has a wide output and a high degree, and the interference principle is used to cooperate with the step. Into the motor, X thick-press into the heat conducting member (2 i) on the second: (3 0) by 2 丄). ㈣ ~ The stable sleeve is controlled by the heat-conducting element (the aforementioned cymbal sheet (30) is pressed into the heat-conducting element, and can be further one-by-one between each of the grooves 20) and the heat-conducting element (21) to perform 3-in-stability. Ding called, to strengthen the relationship between the two. After the aforementioned heat dissipation device is assembled, it is shown in the fourth figure. Two: The heat sink (30) is sequentially passed through the time-side fold (31) on the heat conductive member (21) and the adjacent heat sink (30) to form: (° shown in the fifth figure), respectively The heat dissipation channel, and each of the punching grooves and (33) protruding tabs extending from the edge of the groove (320) (330) can increase the heat dissipation area, so the working efficiency of the device can be improved without increasing the volume. As for the specific working method of the aforementioned heat dissipation, contact the bottom plate ((Please read the precautions on the back before filling this page).

7 1232721 A7 B7 V. Description of the invention (έ 1 0) is in contact with the central processing unit, and is transmitted from the base (W to the heat conducting member (21)) to the heat sinks (30). The upper edge of the punching groove (32) ⑴) extends the heat radiation from the surface of the surface (2) (33◦), and the fibers flowing between the punching holes (34) and the upper punching holes (34) achieve the ideal heat dissipation purpose. 1 挟 Τ, please refer to Figures 6 and 7, as shown in the figure. This is the best way to implement a heat dissipation device. The difference from the previous embodiment is the airfoil). 'The length of the buckle (1 1) is equal to each fan. The width of the radiator composed of the cymbal sheet (30) is to cover each of the fins with one end ⑴) connected to the buckle ⑴): (: two other heat dissipation channels to enhance heat dissipation efficiency. As can be seen from the above, the present invention The main purpose is to provide a thin type of radiator. The method of manufacturing heat sinks manufactured by Xiangcai Law, without providing a sufficient volume, provides a large heat dissipation area, in order to meet the requirements of the central processing unit operating frequency to improve the heat dissipation efficiency. As these designs do have significant practicality and advancement, and meet the requirements of invention patents, they are filed according to law = Chinese paper standard (CNS) A4 specification (210 x 297 mm) is applied for the paper size

Claims (1)

1232721 A8 B8 C8 D8 'Application for patent scope 1. A method of manufacturing a thin heat sink, first of all, a contact base plate, a base on the contact base plate, and a heat conduction combined with the base (please read the note on the back first) Please fill in this page again) and most of the heat sinks arranged in series on the heat-conducting parts; the heat sinks are made through the following steps: "" Cut "to cut a roll of metal sheet into a metal sheet of appropriate size 'Blanking' bends the two ends of the metal sheet to form a hemmed edge, forming a U-shaped y punch, forming a plurality of grooves on the metal sheet, each groove extending along the upper and lower groove edges to form a convex piece; The heat sink formed in the step is combined with the heat conducting member on the base; the heat sink is pierced by a specific punching groove on the heat conducting member, and is formed by the convex sheet formed on the upper and lower groove edges of the punching groove and the heat conducting sheet. A larger contact area, and a gap between the two ends are used to form a gap with an adjacent heat sink to form a heat dissipation channel. Μ 2 · The manufacturing method of the thin heat sink as described in the item (1) of the scope of patent application 'The aforementioned heat sink is punched In the step, punching holes are formed at the same time. Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs. 3 The manufacturing method of the thin heat sink as described in item 1 or 2 of the patent application scope. The slot width and slot length are slightly smaller than the width and thickness of the heat-conducting part, and the interference principle is used in conjunction with the stepper motor to press the heat sinks one by one on the heat-conducting part and securely cover it. 4 The manufacturing method of the thin heat sink is described. After the heat sink is pressed into the heat conducting member, spot welding is further performed between the convex piece on the heat sink and the heat conducting member to enhance the stability of the combination between them. The paper size of the thin heat sink mentioned in this item applies to the Chinese National Standard (CNS) A4 specification (21 × 297 public love) 1232721 A8 B8 C8 D8, the patent scope method, and the heat conducting member is oblong. 6 · Manufacturing the thin heat sink as described in item 5 of the scope of patent application # Method The contact base plate is formed with a shaped buckle extending at one end of an adjacent heat sink to cover each heat sink, To provide another cooling channel. (ΊίΜ first read the note on the back of this page and then fill in} _ · fitted Ministry of Economic Affairs Intellectual Property Office employees consumer cooperatives printed 10