M355002 八 、新型說明： 【新型所屬之技術領域】 本創作係有關於-種記憶體散熱裝置改良，尤指 :==置變形’且_熱*積來提高』 【先前技術】 按，習知直扣式記憶體散熱裝置3 〇，如第4圖所示 由二導熱膠片3Q1、二散刻3Q2及二炎扣件3〇 : 成，其中該導熱膠片3 〇 i分別貼設在散熱片3 〇 2之内、、， 而散刻3 Q 2之上端緣二側分職有扣接釣3 G 2 a與 3 0 2 b及承扣座3 Q 2 C，使二散熱片3 q 2相互扣合令並 内側形成-可供記憶體2容置之空間，該承扣座3 〇 2 c中&二 有向下壓折之定位片3 0 2 d，恰對應散熱片3 〇 2在其片= 侧面下方所設置之u形凸面狀之限位槽3◦4，該限位槽3 〇 上端具有-扣孔3 0 5，且在扣孔3 0 5上部設有-導位孔3 〇 6，供呈n型之夾扣件3 0 3跨置定位片3 0 2 d ,並使二夾扣 件3 0 3之二侧内面所設之倒鉤3 〇 3 a，順應著導位孔3 〇 ^ 下滑嵌入扣孔3 Q 5，使倒鉤3 Q 3 a反扣固定，而將二散熱片 3 0 2與記憶體2緊密貼合包覆著’以使記憶體2在運作時所產 生的熱量可迅速、平均的傳導至散熱片而散發。 ^承上所述，習知記憶體散熱裝置1之組接完成後，雖能達到 散熱之功效，但仍有下列幾點缺失： 1、為使二散熱片3 〇 2與記憶體2緊密貼合包覆著，習知記憶 體散熱裝置3 0在散熱片3 〇 2片上設置限位槽3 0 4、扣孔3 0 5及導位孔3 〇 6，以及配合夾扣件3 0 3之倒鉤3 0 3 a等 5 M355002 形中限制了二散熱片3 ί 2片3 0 2之目的，卻也無 知記憶體散熱袭置3 Q，並無法日有^^的可能性，因此習 3 ； 3 0 現7科技日新月異下，電腦處理 記憶體所產生的溫度越來越高，習知記，相對使得 達到基礎的散熱之功效，但並不具有較熱衣置3 0，雖能 有限，仍容易使記憶翻溫度過高面積’故散熱效果 散熱裳置3 〇的散熱效能已| _顯的習知記憶體 求’所以如何有效的增進習知記,^^階記賴的散熱需 成為當今業界急需解決之難題。…’、、、裝置30的散熱效能， 實務ί::作:有鑑於此’逐利用本身的學理知識及多年的 且應用ί圍試，終於研發出一種更為實用 【新型内容】 雜細價值之本創作。 成及使散熱要共-種可快速簡易組合完 效之記憶體黄域裝置。 θ σ此、、'面積來提高記憶體散熱功 面附著於記憶體之其；體；而兩散熱片内侧 一對折部，士 放先、片上为別向内延伸有至少 該凸扣件上具有撕:==有，卡扣的凸扣件及凹扣件， 有抵罪和猎以，當該凸扣件插入對應之凹扣件 6 M355002 時，該抵靠部抵頂住該凹扣件 置，且鄰近於該對折敎位置處具^;====散熱裝 片’藉柳成-鄰近於該對折部上方之料部 ^之接 引制扣件及凹扣件相互扣合，且能強敎 ==結構設計，提供-種結構簡單及二= 疋成且使散熱片不易變形的記憶體散熱袭置。 、，口 【實施方式】 、為了使審查委員能對本創作之目的、特徵、及 進一步=’兹舉-較佳實施例並配合圖式詳細說明如下： ι先凊先參閱本案所有附圖，如第 記憶體散熱裝置之立體分解干1 目’係為本創作 體也人干咅㈣+ j解μ ®、本_記賴賴裝置之立 所示體散熱裝置之局部放大示意圖，如圖 取狀體上ΐ憶體散熱裝置改良其係夾置於電腦内之隨機存 取錢體上’崎助其晶片進行散熱，該記憶 IZlTi IT^J 3«)； 也、片1内側面附著於記憶體2之兩側；其中該對散埶片 ΐ分別向内延伸有至少-對折部! ！，該對折部== 扣件1 2及凹扣件1 3 (在本實施例中該凸扣件 ;，而該凹扣件13係為-凹孔），且該凸扣件1 扣件^4 -罪^ 1 2 1 ’藉以，當該凸扣件1 2插入對應之凹 該抵靠部1 2 1抵頂住該凹扣件1 3繼，使与 、^ί組成散_置’並且鄰近機騎部1 1之位置處具有 ;=且錯位設置之接片14a、l4b，藉⑽成一鄰近於 /’㈤14，該導引部14係以導引該凸扣件1 13相互扣合’且能強化該對散熱片1使其不易變 /俾社述之結構設計’提供—種結構簡單及可快速簡易組合 7 M355002 完成，且使散熱片不易變形的記憶體散熱裝置。 再者，由於本實施例中，為進一步使散熱片1内側面與記憶 體2之晶片21 (圖未示）表面在接觸時，能具有較佳之平貼效 果，故亦可於二散熱片1内側面上貼附具有導熱效能之導熱介質 15 ’以使記憶體2在運作時所產生的熱量可迅速、平均的傳導 至該對散熱片1而散發，另該散熱片1在其頂端設有一對向内壓 折之防塵片16，用以防止灰塵雜質侵入散熱片1内，以避免記 憶體2及散熱片1之功效受到影響。M355002 VIII, new description: [New technical field] This creation is related to the improvement of a kind of memory heat sink, especially: == set deformation 'and _ heat * product to improve』 [prior art] press, conventional The straight-button memory heat sink 3 〇, as shown in FIG. 4, is composed of two heat-transfer film 3Q1, two-scattered 3Q2, and two-in-one fasteners: ,, wherein the heat-conductive film 3 〇i is respectively attached to the heat sink 3 〇2,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,, The fastening ring is formed on the inner side - a space for the memory 2 to be accommodated, and the retaining seat 3 〇 2 c & 2 has a downwardly folded positioning piece 3 0 2 d, corresponding to the heat sink 3 〇 2 The piece is a u-shaped convex-shaped limiting groove 3◦4 disposed under the side surface, the upper end of the limiting groove 3 has a button hole 3 0 5 , and a guiding hole 3 is arranged at the upper part of the button hole 3 0 5 〇6, for the n-shaped clips 3 0 3 to straddle the positioning piece 3 0 2 d, and the barbs 3 〇 3 a set on the inner sides of the two sides of the two clips 3 0 3, conform to the guide Hole 3 〇^ slides into the buckle hole 3 Q 5, so that it falls 3 Q 3 a is reversely fastened, and the two heat sinks 306 are closely attached to the memory 2 to cover the heat generated by the memory 2 during operation, and can be quickly and evenly transmitted to the heat sink to be distributed. . ^ As mentioned above, after the assembly of the conventional memory heat sink 1 is completed, although the heat dissipation effect can be achieved, the following points are still missing: 1. To make the two heat sinks 3 〇 2 and the memory 2 closely adhere to Covered, the conventional memory heat sink 30 sets a limiting slot 3 0 4 , a button hole 3 0 5 and a guiding hole 3 〇6 on the heat sink 3 〇 2, and a matching clip member 3 0 3 Barbs 3 0 3 a, etc. 5 M355002 The shape limits the two heat sinks 3 ί 2 pieces 3 0 2, but it is also ignorant that the memory heat is set to 3 Q, and there is no possibility of ^^, so Xi 3 3 0 Now 7 technology is changing with each passing day, the temperature generated by the computer processing memory is getting higher and higher, and the familiar knowledge makes the basic heat dissipation effect, but it does not have a hot clothes setting of 30, although it can be limited. It is still easy to make the memory turn over the temperature too high area. Therefore, the heat dissipation effect of the heat dissipation effect is 3 〇. The heat dissipation performance has been _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ The problem that the industry needs to solve urgently. ...',,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,, The creation of this. The combination of heat dissipation and heat dissipation can quickly and easily combine the memory yellow field device. θ σ this, 'area to improve the memory heat sink surface attached to the memory; body; and two fins inside a pair of folds, the first, the upper part of the sheet extends inwardly, at least the convex fastener has Tear: == Yes, the buckled and snap fasteners of the buckle are used for sin and hunting. When the male fastener is inserted into the corresponding female fastener 6 M355002, the abutting portion abuts against the female fastener. And adjacent to the pair of folded positions at the position of;; ==== heat-dissipating piece 'by borrowing Liu Cheng-- adjacent to the upper part of the pair of folding parts, the connecting buckle and the concave fastener are mutually engaged, and can Strong 敎 == structural design, providing a simple structure and two = 疋 且 且 且 且 且 且 且 且 且 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 The three-dimensional decomposition of the first heat sink of the memory is a partial enlargement of the body heat sink of the body of the creator (4) + j solution μ ® The body heat sink is improved on the random access money body of the computer, and the chip is used for heat dissipation. The memory is IZlTi IT^J 3«). Also, the inner side of the film 1 is attached to the memory. 2 on both sides; wherein the pair of diffuser cymbals extend inwardly with at least a half-fold!! , the pair of folds == fasteners 1 2 and female fasteners 1 3 (in the present embodiment, the male fasteners; and the female fasteners 13 are - recessed holes), and the male fasteners 1 fasteners ^ 4 - sin ^ 1 2 1 'By the same, when the male fastener 12 is inserted into the corresponding concave portion, the abutting portion 1 2 1 is pressed against the female fastener 1 3, so that the and the components are dispersed. The tabs 14a, 14b are disposed at the position of the adjacent riding portion 1 1; and the misaligned tabs 14a, 14b are adjacent to /'(f)14, and the guiding portion 14 is for guiding the male fasteners 1 13 to be engaged with each other' Moreover, the heat sink 1 can be strengthened to make it difficult to change. The structure design of the heat sink 1 is simple and can be quickly and easily combined with the 7 M355002, and the heat sink is not easily deformed. In addition, in this embodiment, in order to further make the inner surface of the heat sink 1 in contact with the surface of the wafer 21 (not shown) of the memory 2, the flat surface effect can be better, so that the heat sink 1 can also be used. A heat conducting medium 15 ′ having a heat conducting performance is attached to the inner side surface so that the heat generated by the memory 2 during operation can be quickly and evenly transmitted to the pair of heat sinks 1 , and the heat sink 1 is provided at the top end thereof. The dustproof sheet 16 which is folded inwardly is used to prevent dust impurities from intruding into the heat sink 1 to prevent the effects of the memory 2 and the heat sink 1 from being affected.
請參閱第3圖及配合前圖所示，係為本創作之實施例立體示 意圖，如圖所示，本創作要組接時，首先將讀熱片工之内側朝 向δ己憶體2嵌合’使二接片14 a、14b相互插置以導引二散 熱片1折部1 1上之凸扣件i 2及凹扣件13相互對應卡扣，且 ，凸扣件12之抵靠部i 2 χ抵頂住該凹扣们3側壁而相互扣 :2時=散熱片1上端之防塵片1 6恰能密合，使灰塵雜質 塑法知人散熱片1内，以避免記舰2及散熱片k功效受到影 且乃具有新酿μ雜之價值， 使用，符合新型專俗— 中_未見於刊物亦未公開 予賜准，實感德便。1、進步#要件，爰依法提請專利，懇 神及範鳴下，對上述實施在精 利保護範18，私料纖_=耻，補作之權 8Please refer to FIG. 3 and the front view of the drawing. This is a three-dimensional schematic diagram of the embodiment of the present invention. As shown in the figure, when the creation is to be assembled, the inner side of the reading thermochip is firstly oriented toward the δ-remembered body 2 'The two tabs 14 a, 14 b are inserted into each other to guide the two fasteners 1 and the female fasteners i 2 and the female fasteners 13 on the folded portion 1 1 to be buckled with each other, and the abutting portion of the male fastener 12 i 2 χ 顶 顶 该 该 该 该 3 3 3 3 3 3 凹 凹 凹 凹 凹 凹 凹 凹 凹 凹 凹 凹 凹 凹 凹 凹 凹 凹 = = = = = = = = = = = = = = = = = = = = The heat sink k effect is affected and it has the value of new brewing, use, in line with the new style - _ not seen in the publication is not publicly granted, real sense of virtue. 1. Progress# Essentials, 提 patents are filed according to law, 恳 God and Fan Ming, the above implementation is in the protection of the fine 18, private material _= shame, the right to make up 8
M355002 【圖式簡單說明】 第1圖係為本創作記憶體散熱裝置之立體分解示意圖。 第2圖係為本創作記憶體散熱裝置之立體組合示意圖。 第2A圖係為第2圖之局部放大示意圖。 第3圖係為本創作之實施例立體示意圖。 第4圖係為習知記憶體散熱裝置之立體組接示意圖。 【主要元件符號說明】 散熱片.....1 折部......11 凸扣件.....12 抵靠部.....12 1 凹扣件.....13 導引部.....14 接片......14a、14b 導熱介質....1 5 防塵片.....16 記憶體.....2 晶片......2 1 習知記憶體散熱裝置............3 0 導熱膠片· · · · 3 0 1 散熱片.....3 0 2 扣接鉤.....3 0 2 a 扣接孔.....3 0 2 b 承扣座.....3 0 2 c 定位片.....3 0 2 d 炎扣件.....3 0 3 倒釣......3 0 3 a 限位槽.....3 0 4 扣孔......3 0 5 導位孔.....3 0 6M355002 [Simple description of the drawing] The first figure is a three-dimensional exploded view of the heat sink of the creative memory. The second figure is a three-dimensional combination diagram of the heat sink of the creation memory. Fig. 2A is a partially enlarged schematic view of Fig. 2. Figure 3 is a perspective view of an embodiment of the present invention. Figure 4 is a schematic diagram of a three-dimensional assembly of a conventional memory heat sink. [Main component symbol description] Heat sink.....1 Folding part...11 Convex fasteners.....12 Abutment.....12 1 Concave fasteners..... 13 Guides.....14 tabs...14a, 14b Heat transfer medium....1 5 Dust-proof sheets.....16 Memory.....2 Wafer.... ..2 1 Conventional memory heat sink............3 0 Thermal film · · · · 3 0 1 Heat sink.....3 0 2 Buckle hook.... .3 0 2 a Snap hole.....3 0 2 b Socket.....3 0 2 c locating piece.....3 0 2 d inflammatory fasteners.....3 0 3 Inverted fishing...3 0 3 a Limiting slot.....3 0 4 Buckle hole...3 0 5 Positioning hole.....3 0 6