M321122 八、新型說明： 【新型所屬之技術領域】 本創作係關於一種熱管散熱裝置，尤關於一種熱管# 板散熱裝置。 5 l无w技術】 由於現今高效能顯示介面卡漸成市場主流，顯示介 卡之顯示晶片發熱的問題也隨之成為一待解決之問題。面 是有一風扇散熱裝置，其係於該顯示晶片上裝設散熱件於 並於散熱件上設置風扇之解決方案。但由於介面卡:α妓 裝設散熱件之空間有限’因此只能採用較小之風扇，：： 提局風扇轉速達到可接受之散熱效果；但風扇之^ 使得運轉時產生令人不快的噪音。 一 I7 :解決風扇嚼音，且同時達到充分的散熱效果，於θ 有一熱官跨板散熱裝置，Α 、疋 ,„ ¥_ χ ，、除了在*又有晶片的介面卡正面 面散熱件之外，在介面卡背面另設1 二=熱管連接該正面散熱件與該背面散-件:、、 猎！不使用風扇之條件下，加強散熱效能。 迟。項方案雖立意甚佳，但前述 背面散熱件之熱管折以跨過介 =熱件與 之目的。該等具有f折跨板結構達成連接 折跨板結構亦 …、吕困難，且該彎 才谷易&成熱管故障或損害而減損散熱效果。 【新型内容】 4 M321122 為改善既有熱管跨板散埶雖 — * …、液置的熱管跨板彎折結構所 Τ來的負面影響，本創作之 ^ ^ 3 目的在於棱供一熱管跨板散熱 衣置，其熱官易於製造而不易損壞。 為達成上述創作目的，本創作所採行之技術手段係令 該熱管跨板散熱裝置包括有： 一正面散熱件，係形成Λ 一 τ ^ 风马塊體，具有一接觸面及一 面；^官；該接觸面係供接觸一 咏少 文’得政熱之晶片；該正面熱 官係自該正面散熱件向外延伸而屮 *…a 士 、 1、1甲而出，並形成有一末端； 月面散熱件，係相對 乂 f彳目對於“正面散熱件，其包括有 複數亚列之散熱鰭片及一昔 面…、& ，该为面熱管係自該背 面政熱件向外延伸而出，並 I形成有一末端，且該背面熱管 之末端係與前述正面熱管之末端並列； … -導熱固合件’係同時與前述背面熱管末端與正面孰 官末端接合並構成熱接觸。 使用本創作％ ’係將該熱管跨板散熱裝置設置於一介 上，、中°亥"面卡形成為一板體，具有一正面及一背 \上⑦有4寺散熱之晶該熱管跨板散熱裝置 正：放熱件係設於該晶片上，以其接觸面接觸於該晶 片’其正面熱管末端伸出 7…亥；丨面卡之邊緣；該背面散熱 件係没於該介面卡皆而 # ,^ ’/、月面熱管末端亦伸出於該介面 卡之邊緣且與正面敎管 # “、、s之末知亚列；前述導熱固合件係裝 口又於如述月面執營古山知 ”、、 而人正面-管末端，以熱接觸地接合 ΰ亥月面熱管與正面熱管。 當该介面卡上的曰y τα ^ 曰曰片作而產生熱量時，係藉由該正 5 M321122 面散熱件之接觸面經過該正面散熱件，進而依序傳導到正 面熱s、該導熱固合件之導熱材料、背面熱管及背面散熱 件，以獲致加強之散熱效能，並達成本創作之目的，由於 本創作利用導熱固合件接合正/背面散熱件的正/背面熱 :，故不需要製造困難的跨板熱管，而提供—具有易於製 &而不易損壞的熱管之熱管跨板散熱裝置。 【實施方式】 實施例之 請參閱第一至三目，分別揭露有本創作第 正面立體圖、背面立體圖及分解圖。 本創作第-實施例係一熱管跨板散熱裝置，係配合一 :面卡（8〇)使用，該介面卡（80)具有一正面及_ 月面’於正面上設有_往五冬為 又啕待政熱之晶片（圖中未示）。 本實施例具有一正面散 Μ 1 )㈣η 政，、、、件（1 1 )，該正面散熱件 成為—具有複數並賴狀結構之塊體，呈有 一接觸面及一與正面散埶株Γ ，、有 政…、件（1 1 )熱接觸的正面埶營f ( 2 );該正面散熱件（] “、、S Q 1 1干^ 1 1 )係設於前述介面卡（ 正面之晶片上’且其接觸㈣接觸於該^ ;該 其 (1 2 )係自該正面散埶件 …s 形成有-末端（12 "牛（11)向上方延伸而出，並 〇 )上緣； "末端係凸出於該介面卡（8 丄」，係位於前述介面卡（R n 之背面，且其位置係鈿批 下〖« 0 背面散熱件（2 1 )包^ U C 1 1 )， 匕括有複數並列之散埶鰭κ b , 面散熱件（2 1 )埶桩餘 …9片及—與 “、、接觸的背面熱管（22);該背面 M321122 官（2 2 )係自該背面散熱件（ 並形成有-末端（2 2丄） °上方延伸而出， 女而（2 2 1 )係凸出於該介面 末 正面熱管（12)之末端（12 上緣’而與則述 丄Z 1 )相對且並列·M321122 VIII. New description: [New technical field] This creation is about a heat pipe heat sink, especially a heat pipe # plate heat sink. 5 l No w technology] As the high-performance display interface card has become the mainstream in the market today, the problem of the display chip heating of the display card has become a problem to be solved. The surface has a fan heat sink which is a solution for mounting a heat sink on the display wafer and providing a fan on the heat sink. However, due to the limited space of the interface card: α妓, the heat sink can only be used. Therefore, the fan speed can be reduced to an acceptable temperature. However, the fan can cause unpleasant noise during operation. . I7: Solve the fan chewing sound, and at the same time achieve sufficient heat dissipation effect, there is a heat-span cross-plate heat sink in θ, Α, 疋, „ ¥_ χ , in addition to the * front side of the interface card of the wafer In addition, on the back of the interface card, another 1 = heat pipe is connected to the front heat sink and the back side of the device:, hunting! Without the use of a fan, the heat dissipation performance is enhanced. Although the scheme is satisfactory, the foregoing The heat pipe of the rear heat sink is folded to cross the medium and the hot component. The f-folded cross-slab structure is used to achieve the connection and the cross-panel structure is also difficult, and the bend is difficult and the heat pipe is damaged or damaged. Decrease the heat dissipation effect. [New content] 4 M321122 In order to improve the negative impact of the heat pipe cross-plate divergence of the existing heat pipe, the ^ ^ 3 of the creation is based on the negative impact of the heat pipe cross-plate bending structure. A heat pipe cross-board heat sink is installed, and its heat officer is easy to manufacture and is not easily damaged. In order to achieve the above-mentioned creative purpose, the technical means adopted by the present invention is that the heat pipe cross-plate heat sink includes: a front heat sink, which is formed into a crucible. a τ ^ wind The horse block has a contact surface and a side; the contact surface is for contacting a 咏 文 ' ' 得 得 得 得 得 得 得 得 得 得 得 得 得 得 得 得 得 得 得 得 得 得 得 得 得 得 得 得 得 得 得 得 得 得 得 得 得1, 1 and 1 come out and form an end; the lunar heat sink is relatively "following" for the "front heat sink, which includes a plurality of sub-column fins and a face..., & The heat pipe is extended outward from the back heating member, and an end is formed, and the end of the back heat pipe is juxtaposed with the end of the front heat pipe; the heat conductive fixing member is simultaneously connected with the front heat pipe end Engages with the front of the frontal official and forms a thermal contact. Use this creation% 'system to set the heat pipe cross-board heat sink on one medium, the middle ° Hai" face card is formed into a plate body, with a front and a back \ on the 7th 4 temple heat dissipation crystal heat pipe cross The heat sink is disposed on the wafer, and the contact surface thereof is in contact with the wafer. The front end of the heat pipe extends 7...the edge of the face card; the back heat sink is not in the interface card. And # , ^ ' /, the end of the lunar heat pipe also protrudes from the edge of the interface card and the front side of the tube # ", s, the end of the sub-column; the above-mentioned heat-conducting solid parts are installed as described in the moon The operation of the ancient mountain knows, and the front side of the person - the end of the tube, the hot tube and the front heat pipe are joined by thermal contact. When the heat is generated by the 曰 y τα ^ 曰曰 on the interface card, the contact surface of the positive 5 M321122 surface heat sink passes through the front heat sink, and is sequentially transmitted to the front heat s, the heat conduction solid The heat-conducting material, the back heat pipe and the back heat sink of the piece are used for the purpose of enhancing the heat dissipation performance, and the purpose of the creation is achieved. Since the creation uses the heat-conductive fixing member to join the front/back heat of the front/back heat sink: There is a need to create a difficult cross-plate heat pipe, and to provide a heat pipe cross-plate heat sink having a heat pipe that is easy to manufacture & is not easily damaged. [Embodiment] For the first to third items, the first front perspective view, the rear perspective view and the exploded view of the present invention are respectively disclosed. The first embodiment of the present invention is a heat pipe cross-plate heat dissipating device, which is used in conjunction with a face card (8 〇). The interface card (80) has a front side and a _ moon surface. Also waiting for the political heat of the wafer (not shown). This embodiment has a front divergence 1) (4) η 政 , , , , (1 1 ), the front heat sink becomes a block having a plurality of structures and having a contact surface and a front and a side , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , 'and its contact (4) is in contact with the ^; the (1 2 ) is formed from the front diffuser...s formed with the - end (12 " cattle (11) extending upwards and 〇) upper edge; " The end is protruded from the interface card (8 丄", which is located on the back of the interface card (R n , and its position is « « 0 back heat sink (2 1 ) package ^ UC 1 1 ), 匕It consists of a plurality of parallel fins κ b , a surface heat sink (2 1 ), a pile of 9 pieces and a back heat pipe (22) that is in contact with the ",, and the rear face M321122 (2 2 ) is from the back The heat sink (which is formed with a - end (2 2 丄) ° extending upwards, and the female (2 2 1) protrudes from the end of the front end heat pipe (12) of the interface (12 upper edge 'and丄Z 1 ) Relative and juxtaposed
一導熱固合件（3〇)，盆 卫歹J 成的塊體，該導熱固合件（/〇;成為—由導熱材料所製 …前述背面㈣（22):)上形成有二固合孔（3 r , 0、 （ 2 2 )末端（2 2 1 )與正面埶管 (上2)末端（121)係分別插設於該二固 ^中，進而使該正面熱管（12)與背面熱管（Μ)相 連接’且藉由該導熱固合件（3〇)而得以相互傳導熱量。 睛茶閱弟四至六圖，分別揭露有本創作第二實施例之 正面立體圖、背面立體圖及分解圖。 本創作第二實施例係概同於前述第—實施例，直亦包 括有正面散熱件（41)、正面熱管（42)、背面散熱 件（5 1 )、背面熱管（5 2 )及導熱固合件（6 〇 )， 且本實施例亦設置於一介面卡（8 〇 )上·其中· 該正面散熱件（4 i )與該背面散熱件、(5工）係分 別設於該介面卡（8 0)正面之晶片（圖中未示）上以及 該介面卡（80)之背面；該正面熱管（42)及該背面 熱管（5 2 )係、分別自該正面散熱件（4工）與背面散熱 件（51)向上方延伸’並凸出該介面卡（8〇)上緣而 形成相互並列之末端（421) ( 5 2 1 ) 該導熱固合件（6 〇 )係設於前述正面熱f ( 4 2 ) 的末端（421)及背面熱管（52)的末端（521)， 7 M321122 其包括有一導熱片（61)以及二失固片（62);其中： 該導熱片（6 1 )係以導熱材料製作，其具有兩側及 一中段1中段係設置於前述正面熱管（42)及背面熱 管（5 2 )之間，且於本實施财，其兩側分別形成有一 螺孔（未標號）； 各夾固片（6 2 )係具有兩側及一中段，該中段係對 應於，述正面熱管（42)或背面歸（52)而隆起， 於本實施例中，該兩側上分別形成有一螺孔（未標號）； 又，該二夾固片（6 2 )係分別LV甘山α 、、 了刀別以其中段對應前述前 述正面熱管（42)及背面熱管、，+人 亚夾合於該導 热片（6 1 )，且令該導熱片（6 1 )沾碑^匕 、13丄）的螺孔與該二夾固 片（6 2 )的螺孔相對應，進而分别ιν ^ ^ 疋叩刀別以一螺柱及對應該螺 柱之螺帽螺合於該等螺孔；藉由蟫 一 符田螺緊该寺螺柱，可令前述 ~失固片（62)相互夾緊，使正而挪# 使正面熱官（4 2 )、背面 熱官（52)與設置於其間之導埶 _ ν熱片（61)相互緊迫， 壤正面熱管（42)及背面熱營如 & (52)可藉由該導熱片 (6 1 )相互傳導熱量；除了前 則述螺合方式之外，在其他 可订實施態樣之中，亦可以用扣 力，Λ μ μ , 用扣合、鉚合等方式使二失固 片（62)夾合正面熱管（49、 道i ^ )、背面熱管（5 2 )與 4片（6 1 )，並固定其相對位置。 由上所述可以瞭解本創作之 之具體結構與使用方法。Μ 由該導熱固合件（30)(6π、#人 ^ υ)結合正面熱管（12) (42)的末端（121) (49*1、 ( 21)及背面熱管（22) (52)的末端（221) (59ιλ ，使正面熱管（工 8 M321122 2) (42)與背面熱管（2 2 ) ( 5 2 )可以透過 熱固合件（30)(60)相互傳導熱量，讓來自介面卡 (8〇)晶片之熱量除了藉由正面散熱件（ιι) 散發之外，更可藉由背面散熱件（21) (5ι)協助散 $ ’以加強排除熱量的效果；同時，由於本創作之正面熱 2(12) (42)及背面熱管（22) (52)之間如 前述藉由該導熱固合件（3〇) (6〇)導熱，無需如既 有之熱管跨板散«置形成f折跨板結構，使該等熱管（丄 者、）（22) (42) (52)易於製造而不易損壞，確 貫達到本創作之創作目的。 根據本創作可作之不同修正及變化對於熟悉該項技術 者而言均顯然不會偏離本創作的範圍與精神。雖然本創作 已敘述特定的較佳具體事實’必須瞭解的是本創作不應被 =當地限制於該等特定具體事實上。在實施本創作之已述 式方面董子於所屬領域中具有通常知識者而言顯而易知 之不同修正亦被涵蓋於下列申請專利範圍之内。 【圖式簡單說明】 第圖係本創作第一實施例之正面立體圖。 ^二圖係本創作第一實施例之背面立體圖。 =三圖係本創作第一實施例之局部分解圖。 第四圖係本創作第二實施例之正面立體圖。 第五圖係本創作第二實施例之背面立體圖。 第/、圖係本創作第二實施例之局部分解圖。 M321122 【主要元件符號說明】 (1 1)正面散熱件 (121)末端 (2 2 )背面熱管 (3 0 )導熱固合件 (4 1 )正面散熱件 (4 2 1 )末端 (5 2 )背面熱管 (6 0 )導熱固合件 (6 2 )夾固片 (12)正面熱管 (2 1 )背面散熱件 (2 2 1 )末端 (3 1 )固合孔 (4 2 )正面熱管 (51)背面散熱件 (5 2 1 )末端 (61)導熱片 (8 0 )介面卡a heat-conducting fixing member (3〇), a block formed by the basin, the heat-conducting fixing member (=〇; is made of a heat-conductive material... the foregoing back surface (4) (22):) is formed with two solids The hole (3 r , 0, ( 2 2 ) end (2 2 1 ) and the front side tube (top 2) end (121) are respectively inserted in the two solids, thereby making the front heat pipe (12) and the back side The heat pipe (Μ) is connected to each other and the heat is transmitted to each other by the heat-conductive fixing member (3〇). The tea is read from the fourth to the sixth figures, and the front perspective view, the back perspective view and the decomposition of the second embodiment of the present invention are respectively disclosed. The second embodiment of the present invention is similar to the foregoing first embodiment, and includes a front heat sink (41), a front heat pipe (42), a back heat sink (5 1 ), and a back heat pipe (52). a heat-conducting fixing member (6 〇), and the embodiment is also disposed on an interface card (8 〇), wherein the front surface heat dissipating member (4 i ) and the rear surface heat dissipating member and the (5 working) system are respectively disposed on the The front side of the interface card (800) on the wafer (not shown) and the back side of the interface card (80); the front heat pipe (42) and the back heat pipe (52) And extending from the front heat sink (4 work) and the back heat sink (51) upwards and protruding the upper edge of the interface card (8〇) to form mutually juxtaposed ends (421) (5 2 1 ) The fixing member (6 〇) is disposed at the end (421) of the front heat f ( 4 2 ) and the end (521) of the back heat pipe (52), and the 7 M321122 includes a heat conductive sheet (61) and two de-solid sheets. (62); wherein: the heat conducting sheet (6 1 ) is made of a heat conductive material, and has two sides and a middle section 1 is disposed between the front heat pipe (42) and the back heat pipe (52), and is The utility model has a screw hole (not labeled) formed on both sides thereof; each of the clamping pieces (62) has two sides and a middle section, and the middle section corresponds to the front heat pipe (42) or the back side (52) In the embodiment, a screw hole (not labeled) is formed on each of the two sides; and the two clamping pieces (6 2 ) are respectively LV Ganshan α, and the knife is corresponding to the aforementioned section. The front heat pipe (42) and the back heat pipe, the + person sub-clamped to the heat conducting piece (6 1 ), and the heat conducting piece (6 1 ) is stained. The screw hole of the 13 丄) corresponds to the screw hole of the two clamping piece (6 2 ), and then the screw of the stud and the corresponding stud are screwed to the snail respectively. Hole; by the 蟫一符田螺 tightening the temple stud, the above-mentioned ~-collapsed pieces (62) can be clamped to each other, so that the positive heat (4 2 ), the back heat officer (52) and the setting In the meantime, the _ _ hot film (61) is mutually pressing, and the front heat pipe (42) and the back heat camp (<>>> (52) can conduct heat to each other by the heat conductive sheet (6 1 ); In addition to the combination method, in other customizable implementations, it is also possible to use a fastening force, Λ μ μ , to fasten the two heat-dissipating sheets (62) to the front heat pipe by means of snapping, riveting, etc. (49, i ^), the back heat pipe (5 2 ) and 4 pieces (6 1 ), and fix their relative positions. From the above, you can understand the specific structure and usage of this creation. Μ The end of the front heat pipe (12) (42) (121) (49*1, (21) and the back heat pipe (22) (52) are bonded by the heat conducting fixing member (30) (6π, #人^υ) The end (221) (59ιλ, so that the front heat pipe (Work 8 M321122 2) (42) and the back heat pipe (2 2 ) ( 5 2 ) can conduct heat to each other through the heat-fixing parts (30) (60), allowing the interface card (8〇) The heat of the chip is not only dissipated by the front heat sink (ιι), but also by the back side heat sink (21) (5ι) to enhance the heat removal effect. At the same time, due to the creation of this The front heat 2 (12) (42) and the back heat pipe (22) (52) are thermally conducted by the heat-conductive fixing member (3〇) (6〇) as described above, and there is no need to disperse the heat pipe as the existing heat pipe Forming a f-folded cross-slab structure, so that the heat pipes (22, 42) (52) are easy to manufacture and not easily damaged, and the original purpose of the creation is achieved. Different modifications and changes can be made according to the creation. It is obvious that those who are familiar with the technology will not deviate from the scope and spirit of this creation. Although this creation has described specific better specific facts, it must be understood that this creation does not It is to be limited to the specific specific facts of the present invention. The various modifications that are obvious to those of ordinary skill in the art are also covered by the following claims. BRIEF DESCRIPTION OF THE DRAWINGS The first drawing is a front perspective view of the first embodiment of the present creation. The second drawing is a rear perspective view of the first embodiment of the present creation. = Three drawings are partially exploded views of the first embodiment of the present creation. The front view is a front perspective view of the second embodiment of the present invention. The fifth figure is a rear perspective view of the second embodiment of the present creation. The second embodiment is a partial exploded view of the second embodiment of the present creation. M321122 [Description of main component symbols] 1 1) Front heat sink (121) end (2 2 ) Back heat pipe (3 0) Heat-conducting fixture (4 1 ) Front heat sink (4 2 1 ) End (5 2 ) Back heat pipe (60) Thermally bonded Piece (6 2 ) clamping piece (12) front heat pipe (2 1 ) back heat sink (2 2 1 ) end (3 1 ) fixing hole (4 2 ) front heat pipe (51) back heat sink (5 2 1 ) End (61) thermal pad (80) interface card