200925539 六、發明說明： 【發明所屬之技術領域】 • 本發明係有關於一種「散熱器結構(二）」，其主要涉及散 熱器之結構，尤指散熱器與導熱管組設之結構。 【先前技術】 請參閱第一圖，係為習用之散熱器結構，如圖所示，其主 ❹ 要胁散鮮11上開設接合孔出，其t雜合孔m可供 導熱管12接設。 請繼續參閱第-及二圖，如圖所示，組裝時，祕導鮮 12接設於散熱器U之接合孔ιη内，再將散熱器u與被^ 熱物13(如中央處理器，CPU)相接設。 請再參閱第二圖，如圖所示，當該散熱器u與導熱管η 相接設時，由於該導熱管^為設有彎折處121之曲線管，越 接近f折處121其對應長度逐漸縮短，致使呈固定接合長度之 接合孔111無法接設於近導熱管12平面部12s，使得該導熱 管12與散熱器11之間無法緊密的接合，職是，該導熱管η 之彎折處m與散熱器u之會間_空隙122，’該空陳 122雖屬該習用散熱器結構}加工時無可避免之缺威，並為熟 習該項技藝者所容易輕忽之處，惟，該空隙122卻是致使該散 熱器11與導熱官12散熱效果不彰之重要因素。 3 200925539 再者，當該習用之散熱器結構丨在與被散熱物13相接使 時’係以散熱器u直接接設於被散熱物13的方式來傳導熱， 然而，目前大部份之散熱器11主要係由鋁擠型之散熱器所槔 成’摩’就導熱效果而言’由銘材製成之物件其傳熱效率不如 銅材製成之物件，故，此種由散熱器11直接接設於被散熱物 13的導熱效果礙於其材狀義，以及成本上關題，因此 仍無法將被散熱物13所產生之熱快速的導出，致使習用之敫 熱器結構1對於概熱物13練熱效果無法提升。 故由前述得知，該習用之散熱器結構1具有如下述之炔 點： ~ ⑴無法有效導鮮12之騎處121增幅其散熱政 果，導致其散熱效果難以提升。 ⑵顧用之散熱II結構1以散熱器丨丨直接接設於被散熱 物13之導熱方式無法使被散熱物13所產生之熱快速導出。 緣疋’有鏗於上述習用品所衍生的各項缺點，本案之發明人遂 竭其心智’以從事該行業多年之經驗，潜心研究加以創新改 良，終於成功研發完成本件「散熱器結構(二）」案，實為一具 功效增進之發明。 【發明内容】 本發明之主要目的乃係在提供一種可與導熱管緊密接合 200925539 的散熱器結構。 本發明之次要目的乃係在提供一種可提供較佳散熱效果 的散熱器結構。 【實施方式】 本發明係提供一種「散熱器結構(二）」，請參閱第三、四 及五圖，如圖所示，係為本發明之較佳實施例，如圖所示，其 〇 主要包含有導熱管41及散熱器42，其中該導熱管41係可呈u 型或可呈L型，該散熱器42包含有複數個散熱片422 ;於該散 熱器42與導熱管41相接處設有一個以上之接合部eg，以使 該散熱器42之接合部423與導熱管41之彎折處411緊密的接 合。 於組裝時’將導熱管41經由散熱器42接設於散熱鰭片44 上所開設之接合孔441内，最後再將導熱管41與被散熱物45 相接設。 藉由上述得知，本發明具有如下述之特點： (1)本發明利用散熱器42之接合部423與導熱管41相互 接《又摒除餐用散熱器u與導熱管12間隔有空隙之缺點， 以使得散熱效果得大幅提升。 ⑵本發明可_導熱管41直接接設於被散熱物•以快 速導出被散熱物45所產生之熱。 5 200925539 ，綜上所述，本發明所提供之一種「散熱器結構(二）」，確 符合准予專利之要件，爰依法提出專利申請，祈請惠予專 利，實為感禱。 惟以上所述者，僅係本翻之健可行之實施例而已，舉 凡利用本㈣上述之方法、形狀、構造、裝置所為之變化，皆 應包含於本案之權利範圍内。 【圖式簡單說明】 第一圖為習用之立體分解示意圖； 第二圖為習用之組合剖面示意圖； 第三圖冑本發明較佳實施例之立體分解示意圖； 第四圖林發明較佳實施例之立體組合示意圖； 第五圖為本發明較佳實施例之組合剖面示意圖。 【主要元件符號說明】 1 •••習用散熱器結構 11 •·.散熱器 111 •··&合孔 12 .··導熱管 121 •··彎折處 122 • · ·空隙 123 ...平面部 13 •··被散熱物 41 •··導熱管 411 ...彎折處 42 .··散熱器 422 •..散熱片 423 •..接合部 44 • · *散熱鰭片 441 .··接合孔 45 •··被散熱物200925539 VI. Description of the Invention: [Technical Field of the Invention] The present invention relates to a "heatsink structure (2)", which mainly relates to the structure of a heat sink, and more particularly to a structure in which a heat sink and a heat pipe are assembled. [Prior Art] Please refer to the first figure, which is the conventional radiator structure. As shown in the figure, the main ❹ ❹ 散 11 11 11 11 11 11 11 11 11 11 11 , , , 接合 接合 接合 接合 11 . Please continue to refer to the first and second figures. As shown in the figure, when assembling, the secret guide 12 is placed in the joint hole ιη of the heat sink U, and then the heat sink u and the heat object 13 (such as the central processing unit, CPU) is connected. Please refer to the second figure. As shown in the figure, when the heat sink u is connected to the heat pipe η, since the heat pipe ^ is a curved pipe provided with the bent portion 121, the closer to the f-fold portion 121, the corresponding The length is gradually shortened, so that the joint hole 111 having a fixed joint length cannot be connected to the flat portion 12s of the heat transfer tube 12, so that the heat transfer tube 12 and the heat sink 11 cannot be tightly joined, and the heat transfer tube η bends. Between the fold m and the radiator u _ void 122, 'the empty Chen 122 is the conventional radiator structure} inevitable lack of processing, and is easy for those skilled in the art to neglect, but The gap 122 is an important factor that causes the heat sink 11 and the heat conducting member 12 to have insufficient heat dissipation effect. 3 200925539 Furthermore, when the conventional heat sink structure is connected to the heat sink 13, the heat is transmitted directly to the heat sink 13 by the heat sink u. However, most of the current The heat sink 11 is mainly made of an aluminum-extruded heat sink, and the heat-transfer effect is made. The heat-transfer efficiency of the object made of the material is not as good as that of the copper material. Therefore, the heat sink is made of a heat sink. 11 The heat conduction effect directly connected to the heat sink 13 is hindered by the material shape and the cost, so that the heat generated by the heat sink 13 cannot be quickly derived, so that the conventional heat exchanger structure 1 The heat effect of the hot element 13 cannot be improved. Therefore, it is known from the foregoing that the conventional heat sink structure 1 has an alkyne point as follows: ~ (1) The riding position 121 which cannot effectively guide the 12 is increased in heat dissipation, which makes it difficult to improve the heat dissipation effect. (2) Heat dissipation II structure 1 The heat conduction method in which the heat sink 13 is directly connected to the heat sink 13 cannot quickly derive the heat generated by the heat sink 13. Because of the shortcomings arising from the above-mentioned habits, the inventor of this case exhausted his mind. With years of experience in the industry, he devoted himself to research and innovation, and finally successfully developed this piece of "heat sink structure (two The case is actually an invention with enhanced efficacy. SUMMARY OF THE INVENTION The main object of the present invention is to provide a heat sink structure that can be tightly coupled to a heat pipe. A secondary object of the present invention is to provide a heat sink structure that provides better heat dissipation. [Embodiment] The present invention provides a "heat sink structure (2)", please refer to the third, fourth and fifth figures. As shown in the figure, it is a preferred embodiment of the present invention, as shown in the figure, The heat pipe 41 and the heat sink 42 are mainly included, and the heat pipe 41 can be u-shaped or can be L-shaped. The heat sink 42 includes a plurality of heat sinks 422. The heat sink 42 is connected to the heat pipe 41. More than one joint portion eg is provided to tightly engage the joint portion 423 of the heat sink 42 with the bend portion 411 of the heat pipe 41. At the time of assembly, the heat transfer pipe 41 is connected to the joint hole 441 formed in the heat radiating fin 44 via the heat sink 42, and finally, the heat transfer pipe 41 is connected to the heat sink 45. From the above, the present invention has the following features: (1) The present invention utilizes the joint portion 423 of the heat sink 42 and the heat transfer tube 41 to be connected to each other "to eliminate the disadvantage that the meal heat sink u and the heat transfer tube 12 are spaced apart from each other. , so that the heat dissipation effect is greatly improved. (2) According to the present invention, the heat transfer pipe 41 can be directly connected to the heat dissipated material to quickly derive the heat generated by the heat sink 45. 5 200925539 In summary, the "heatsink structure (2)" provided by the present invention does meet the requirements for granting patents, and the patent application is filed according to law, praying for a patent, which is a pray. However, the above-mentioned embodiments are merely applicable to the present invention. Any changes to the methods, shapes, structures and devices described in the above (4) should be included in the scope of the present application. BRIEF DESCRIPTION OF THE DRAWINGS The first drawing is a schematic exploded view of a conventional one; the second drawing is a schematic sectional view of a conventional combination; the third drawing is a perspective exploded view of a preferred embodiment of the present invention; BRIEF DESCRIPTION OF THE DRAWINGS FIG. 5 is a schematic cross-sectional view of a preferred embodiment of the present invention. [Explanation of main component symbols] 1 •••Used radiator structure 11 •·. Radiator 111 •··& hole 12 .··heat pipe 121 •··bend 122 • · Void 123 ... Flat portion 13 •··heated material 41 •··heat pipe 411 ...bend 42 .··heat sink 422 •. fin 423 •.. joint 44 • · *heat fin 441 .· ·The joint hole 45 ···The radiator