CN208387153U - Radiator and electronic equipment with thermally conductive bend pipe - Google Patents
Radiator and electronic equipment with thermally conductive bend pipe Download PDFInfo
- Publication number
- CN208387153U CN208387153U CN201820528488.9U CN201820528488U CN208387153U CN 208387153 U CN208387153 U CN 208387153U CN 201820528488 U CN201820528488 U CN 201820528488U CN 208387153 U CN208387153 U CN 208387153U
- Authority
- CN
- China
- Prior art keywords
- endothermic section
- bottom plate
- pedestal
- heat absorption
- bend pipe
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a kind of radiators with thermally conductive bend pipe.It is by merging two heat conducting pipes by bending section, and it is seamless applying with fins group and pedestal to make it, to realize the increase of heat conducting pipe and the bottom plate binding face that absorbs heat, endothermic effect more preferably, reduces costs simultaneously, extends the service life of radiator.
Description
Technical field
The utility model relates to a kind of radiator with thermally conductive bend pipe and with the electronic equipment of the radiator.
Background technique
With scientific and technological progress, the performance of electronic device is become stronger day by day, and the heat generated therewith also becomes larger.Effectively guarantee electricity
The operating temperature of sub- equipment directly determines the service life and stability of electronic equipment in reasonable range.
The hot pipe technique of heat conducting device as traditional passive type is by the way that heat to be quickly transferred to put from endotherm section
Hot arc, then radiate by radiator structure, this mode not power consumption does not also generate noise, and capacity of heat transmission is strong, be
It realizes that heat shifts rapidly in limited space, and then increasing heat radiation area, the effective means of passive heat dissipation effect is substantially improved.
But for the electronic equipment that the generation of heat increasingly increases, traditional heat pipe heat radiation technology cannot good meet demand.
Utility model content
In order to solve the problems in the existing technology, the utility model is led by rationally designing heat conducting pipe structure, realization
The area of heat pipe and heat absorption bottom plate binding face increases, and endothermic effect is more preferably.Specifically, the utility model includes the following contents.
The one side of the utility model provides a kind of radiator comprising thermally conductive bend pipe, fins group, pedestal and heat absorption bottom
Plate, in which:
The thermally conductive bend pipe includes the first endothermic section, the second endothermic section, the first radiating part, the second radiating part, the first connection
Portion, second connecting portion and bent portion, wherein first endothermic section is connected with second endothermic section by the bent portion, institute
It states the first endothermic section and is connected with first radiating part by the first connecting portion, second endothermic section and described second dissipates
Hot portion is connected by the second connecting portion；
The fins group includes the multiple sheet metals being vertically disposed on bottom surface, has on the bottom surface and fixes the
The fixed bit of one endothermic section and the second endothermic section is separately provided for making on each sheet metal first radiating part and described
The first through hole and the second through-hole that second radiating part is each passed through；
The pedestal is set to the centre of the fins group, and perpendicular to each the multiple sheet metal, is used to support described
Bent portion；
It is described heat absorption bottom plate be used for conform to the fins group bottom surface and the pedestal.
According to radiator described in the utility model, it is preferable that first endothermic section, second endothermic section and described
Bent portion is respectively provided with the binding face directly fitted with the heat absorption bottom plate, and the bottom surface of the binding face and the fins group is flat
Together.
According to radiator described in the utility model, it is preferable that the fixed bit is groove, so that first heat absorption
The mode seamless applying with the groove is set on the bottom surface respectively for portion and second endothermic section.
According to radiator described in the utility model, it is preferable that the pedestal is provided with pedestal fixed bit, passes through the bottom
Seat fixed bit supports the bent portion directly to contact with the heat absorption bottom plate.
According to radiator described in the utility model, it is preferable that it is described heat absorption bottom plate side by the binding face with
The thermally conductive bend pipe directly contacts, and directly contacts with the bottom surface of the fins group, it is described heat absorption bottom plate the other side be used for
Heater connection.
According to radiator described in the utility model, it is preferable that the openings of sizes of the groove is big with the binding face
It is small to match.
According to radiator described in the utility model, it is preferable that the width of the binding face be the thermally conductive bend pipe most
1/2 to 1 times of major diameter.
According to radiator described in the utility model, it is preferable that the thermally conductive bend pipe is made of copper.
According to radiator described in the utility model, it is preferable that between the heat absorption bottom plate and the binding face and institute
It states and is removably directly contacted between heat absorption bottom plate and the bottom surface of the fins group.
Another aspect according to the present utility model, provides a kind of electronic equipment comprising according to described in the utility model
Radiator and heater, and the radiator is fitted closely with the heater.
The radiator of the utility model merges two heat conducting pipes by bending section, and further makes itself and fins group and bottom
Seat is seamless applying, to realize the increase of heat conducting pipe and the bottom plate binding face that absorbs heat, endothermic effect more preferably, reduces costs simultaneously,
Extend the service life of radiator.
Detailed description of the invention
Fig. 1 is a kind of top view of preferred embodiment of the utility model.
Fig. 2 is the side view of embodiment illustrated in fig. 1.
Description of symbols
Thermally conductive bend pipe 1, fins group 2, pedestal 3, heat absorption bottom plate 4, the first endothermic section 11, the heat dissipation of the second endothermic section 12, first
Portion 13, first connecting portion 15, second connecting portion 16, bent portion 17, first through hole 21, the second through-hole 22, consolidates second radiating part 14
Position 23, bottom surface 24, sheet metal 25.
Specific embodiment
By explaining that the preferred embodiment of following the application, the other objects and advantages of the utility model will become clear
Chu.
In the utility model, the term " connected " refers to the company carried out in such a way that welding etc. not can be carried out disassembly
It connects.The term " detachable " refers to can remove by the progress such as buckle, nut bolt, or can further progress repeat to connect
It connects.The term " heat conducting pipe " refers to through thermally conductive tubular body, preferably solid.
Embodiment 1
Fig. 1 is a kind of top view of preferred embodiment of the utility model.Fig. 2 is the side view of embodiment illustrated in fig. 1.Such as figure
Shown in 1 and Fig. 2, the radiator of the present embodiment includes thermally conductive bend pipe 1, fins group 2, pedestal 3 and heat absorption bottom plate 4.
As shown in Figure 1, thermally conductive bend pipe 1 is dissipated including the first endothermic section 11, the second endothermic section 12, the first radiating part 13, second
Hot portion 14, first connecting portion 15, second connecting portion 16 and bent portion 17, wherein the first endothermic section 11 and the second endothermic section 12 pass through
Bent portion 17 connects, and the first endothermic section 11 and the first radiating part 13 are connected by first connecting portion 15, the second endothermic section 12 and the
Two radiating parts 14 are connected by second connecting portion 16.First endothermic section 11, the second endothermic section 12 and bent portion 17 be respectively provided with
The binding face that heat absorption bottom plate 4 directly fits, and binding face is concordant with the bottom surface 24 of fins group 2.
Preferably, heat conducting pipe of the big material of thermal coefficient by being made, such as the solid being made of copper.In the present embodiment
Thermally conductive bend pipe 1 is integrally formed on the whole, even so, according to the general knowledge of this field, it will be appreciated that thermally conductive bend pipe 1 can also divide
Section molding assembles.
As illustrated in fig. 1 and 2, fins group 2 includes the multiple sheet metals 25 being vertically disposed on bottom surface and bottom surface 24.Gold
Belonging to piece is preferably 5 to 500, such as 10-100.Each sheet metal is vertically installed on bottom surface 24 in spaced and parallel mode.?
There are two fixed bits 23 for fixing the first endothermic section and the second endothermic section respectively on bottom surface 24, be respectively set on each sheet metal
There are the first through hole 21 and the second through-hole 22 for being each passed through the first radiating part 13 and the second radiating part 14.First through hole 21
The side far from heat absorption bottom plate 4 is respectively arranged at the second through-hole 22.Preferably, fixed bit 23 can be groove, so that first
The mode seamless applying with groove is set on bottom surface 24 respectively for endothermic section 11 and the second endothermic section 12.It is further preferred that recessed
The openings of sizes of slot and the size of binding face match.It is further preferred that the width of binding face perpendicular to thermally conductive bend pipe (that is, extend
Direction distance) be 1/2 to 1 times of maximum gauge of thermally conductive bend pipe, the preferably up to half of diameter, i.e., 1/2.Width is got over
Greatly, then the area of binding face is bigger, is more conducive to the transmitting of heat.The cross section of thermally conductive bend pipe 1 vertically can be any
Shape, for example, elliptical shape or flat pattern etc. with notch.
As illustrated in fig. 1 and 2, pedestal 3 is set to the centre of fins group 2, and the length direction of pedestal 2 is perpendicular to the multiple
Sheet metal is used to support bent portion 17.Pedestal 3 is provided with pedestal fixed bit (not shown), passes through pedestal fixed bit support bend pipe
Portion 17 is directly contacted with heat absorption bottom plate 4.The length of pedestal 3 can run through the entire vertical direction of fins group 2.Optionally, pedestal 3
Length is provided only on the lower section of bent portion 17, so that support bend pipe portion 17 is bonded with heat absorption bottom plate 4.Preferably, pedestal is to lead
The high material of hot coefficient is made, preferably metal, such as copper etc..
As illustrated in fig. 1 and 2, heat absorption bottom plate 4 is used to conform to bottom surface 24 and the pedestal 3 of fins group 2.When being bonded,
The side of heat absorption bottom plate 4 is directly contacted by binding face with thermally conductive bend pipe 1, and is directly contacted with the bottom surface of fins group 2 24, is absorbed heat
The other side of bottom plate 4 with heater (not shown) for connecting.Preferably, between heat absorption bottom plate 4 and binding face and heat absorption bottom
It is removably directly contacted between plate 4 and the bottom surface 24 of fins group 2.
Embodiment 2
The present embodiment provides a kind of electronic equipment comprising radiator and heater described in embodiment 1, and radiator with
Heater fits closely.
The device of the application is described in detail with reference to the optimal technical scheme of the application, however, it is necessary to explanation, not
Be detached from spirit herein in the case where, those skilled in the art can be made on the basis of above disclosure it is any transformation,
Modification and variation.The application includes above-mentioned specific embodiment and its any equivalent form.
Claims (6)
1. a kind of radiator, which is characterized in that including thermally conductive bend pipe, fins group, pedestal and heat absorption bottom plate, in which:
The thermally conductive bend pipe includes the first endothermic section, the second endothermic section, the first radiating part, the second radiating part, first connecting portion, the
Two interconnecting pieces and bent portion, wherein first endothermic section is connected with second endothermic section by the bent portion, described
One endothermic section is connected with first radiating part by the first connecting portion, second endothermic section and second radiating part
It is connected by the second connecting portion；
The fins group includes the multiple sheet metals being vertically disposed on bottom surface, has on the bottom surface and fixes the first suction
The fixed bit in hot portion and the second endothermic section is separately provided for making first radiating part and described second on each sheet metal
The first through hole and the second through-hole that radiating part is each passed through；
The pedestal is set to the centre of the fins group, and perpendicular to each the multiple sheet metal, is used to support the bend pipe
Portion；
It is described heat absorption bottom plate be used for conform to the fins group bottom surface and the pedestal.
2. radiator according to claim 1, which is characterized in that first endothermic section, second endothermic section and institute
It states bent portion and is respectively provided with the binding face directly fitted with the heat absorption bottom plate, and the bottom surface of the binding face and the fins group
Concordantly.
3. radiator according to claim 2, which is characterized in that the fixed bit is groove, so that described first inhales
The mode seamless applying with the groove is set on the bottom surface respectively for hot portion and second endothermic section.
4. radiator according to claim 3, which is characterized in that the pedestal is provided with pedestal fixed bit, by described
Pedestal fixed bit supports the bent portion directly to contact with the heat absorption bottom plate.
5. radiator according to claim 3, which is characterized in that it is described heat absorption bottom plate side by the binding face with
The thermally conductive bend pipe directly contacts, and directly contacts with the bottom surface of the fins group, it is described heat absorption bottom plate the other side be used for
Heater connection.
6. radiator according to claim 3, which is characterized in that the openings of sizes of the groove is big with the binding face
It is small to match.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820528488.9U CN208387153U (en) | 2018-04-14 | 2018-04-14 | Radiator and electronic equipment with thermally conductive bend pipe |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820528488.9U CN208387153U (en) | 2018-04-14 | 2018-04-14 | Radiator and electronic equipment with thermally conductive bend pipe |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208387153U true CN208387153U (en) | 2019-01-15 |
Family
ID=64976208
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820528488.9U Expired - Fee Related CN208387153U (en) | 2018-04-14 | 2018-04-14 | Radiator and electronic equipment with thermally conductive bend pipe |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208387153U (en) |
-
2018
- 2018-04-14 CN CN201820528488.9U patent/CN208387153U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190115 Termination date: 20190414 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |