M355001 八、新型說明： 【新型所屬之技術領域】 本創作係有關於一種側扣式年传 簡單及可快速組合完成，且能增加^埶4置丄尤指一種結構 效的側扣式記憶體散熱裝置。 、積來提向S己憶體散熱功 【先前技術】 按，習知直扣式記‘_散熱裝置3〇， 由二導熱膠片301、二散熱片3〇?第4圖所不者’係 1成’其中該導熱膠片3 01分別貼設在散二扣件3 〇 3所組 而散敎片3 0 2之上端绩-相°在政熱片3 0 2之内側面， ‘ 1上為緣—側分別設有扣接鉤3 0 ? a盘i μ 3 0 2 b及承扣座3 〇 2 c，#-魅u 2與扣接孔 u z c使—散熱片3 〇 2相互扣合，八甘 内側形成一可供記憶體2容置之办， 7其 士a 間該承扣座3 02 c中間执 ，向下顯之疋位片3 〇 2 d，恰對應散熱片3 〇 2在其片身= 側面下方所&置之_凸面狀之限_3 〇 4，該限位槽3 上端具有-扣孔3 0 5，且在扣孔3 〇 5上部設有一導位孔^ 6，供呈Π型之夹扣件3 〇 3跨紋位片3 〇 2 d，並使〇 件3 0 3之二側内面所設之倒鉤3 〇 3 a，順應著導位孔3 下滑嵌入扣孔3 0 5，使倒鉤3 〇 3 a反扣固定’而將二散 3 0 2與記憶體2緊密貼合包覆著’以使記憶體2在運作時所產 生的熱量可迅速、平均的傳導至散熱片而散發。 承上所述，習知記憶體散熱裝置丨之組接完成後，雖能達到 散熱之功效，但仍有下列幾點缺失： 1、為使二散熱片3 〇 2與記憶體2緊密貼合包覆著，習知記恢 體散熱裝置3 0在散熱片3 0 2片上設置限位槽3 〇 4、扣孔^ 0 5及導位孔3 0 6，以及配合夾扣件3 〇 3之倒鉤3 〇 3 a等 5 M355001 複雜結構設計，使得習知記憶體散熱裝置 不便’且製作程序也非常費時及費工。 =1知記體散熱裝置3 〇之夾扣件3 Q 3細上而下將二散 熱y Q 2扣合，雖能達到夾合二散刎3 ◦ 2之 rrt 了二散熱片3 0 2向上增加散熱單元的可能性，因此習 :己憶體散鮮置3 G，並無法有如再增加散熱效 月b，而使散熱片3 〇 2之散熱功效受到限制。M355001 VIII. New Description: 【New Technical Fields】 This creative department is about a side-button type that is simple and quick to combine, and can add a side-effect memory, especially a structural effect. Heat sink. According to the conventional direct-button type, the heat-dissipating device 301, the two heat-dissipating film 3, and the fourth heat-dissipating film are not the same. 1%', the thermal conductive film 3 01 is respectively attached to the two sets of loose fasteners 3 〇 3 and the upper end of the loose 3 3 0 2 - phase on the side of the political hot film 3 0 2, '1 The edge-side is provided with a fastening hook 3 0 ? a disk i μ 3 0 2 b and a buckle seat 3 〇 2 c, #-魅u 2 and a fastening hole uzc enable the heat sink 3 〇 2 to be engaged with each other, The inner side of the eight gansu forms a memory 2, which can be used for the storage of the memory 2, 7 of which is the middle of the buckle seat 3 02 c, and the downward display of the squat 3 〇 2 d, corresponding to the heat sink 3 〇 2 The body body = the lower side of the side & _ convex surface limit _3 〇 4, the upper end of the limiting groove 3 has a - button hole 3 0 5, and a hole in the upper part of the button hole 3 〇 5 ^ 6 For the clip type 3 〇 3 cross-groove 3 〇 2 d, and the barbs 3 〇 3 a set on the inner side of the two sides of the 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 The buttonhole is 3 0 5, so that the barb 3 〇 3 a is buckled and fixed, and the two holes 3 0 2 are closely related to the memory 2 The heat is applied to the heat sink to be quickly and evenly distributed to the heat sink. According to the above description, after the assembly of the conventional memory heat sink is completed, although the heat dissipation effect can be achieved, the following points are still missing: 1. In order to make the two heat sinks 3 〇 2 and the memory 2 closely fit together Wrapped, the conventional memory recovery device 30 sets a limit groove 3 〇4, a button hole ^ 0 5 and a guide hole 3 0 6 on the heat sink 30 2 piece, and a matching clip member 3 〇 3 Barbs 3 〇 3 a, etc. 5 M355001 Complex structure design makes the conventional memory heat sink inconvenient' and the production process is very time consuming and labor intensive. =1 know the body heat sink 3 〇 clips 3 Q 3 fine up and down the second heat y Q 2 snap, although it can reach the two 刎 3 ◦ 2 rrt two heat sink 3 0 2 up Increase the possibility of the heat sink unit. Therefore, it is not possible to add a heat dissipation effect b to the body, and the heat dissipation effect of the heat sink 3 〇 2 is limited.
、因現今科技日新賴下，電腦處理效能讀提高，相對使得 產生的溫度越來越高，f知記憶體散歸置3 〇，雖能 2到基礎·熱之功效’但並不财較缝熱 ==使記憶體因溫度過高而損毁，故明顯的習知』 ^、、、裝置3 0的散熱效能已無法滿足現今高階記憶體的散熱需 所以如何有效的增進f知記憶體散熱裝置3 q的散熱效能， 成為當今業界急需解決之難題。 …Due to the current technological advancement, the computer processing efficiency reading is improved, and the resulting temperature is getting higher and higher. The memory of the memory is set to 3 〇, although it can be 2 to the basic heat effect, but it is not financial. Sewing heat == The memory is damaged due to the high temperature, so the obvious knowledge 』,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,, The heat dissipation performance of the device 3 q has become an urgent problem to be solved in the industry today. ...
3 0在組合上非常繁瑣 ^爰是，本創作人有鑑於此，逐利用本身的_知識及多年的 貫務經驗’積敏事研纽反覆職，終㈣ 且應用範圍更廣且符合產業利用價值之本創作。 為貝用 【新型内容】 本創作之主要目的，在於提供—獅構簡單及可快速組合完 成，且可增加散熱面積之側扣式記憶體散熱裝置。 為了達到上述目的，本創作係為一種侧扣式 置’其係夾置於電_之隨機存取記舰上，以幫助其晶片進^ 散熱，該雜體散熱裝置包括。散熱體，係彼此姉設置，外 側面白具有複數散_片，且該二散熱體具有姉應的結構，於 ”彼此相對面之中段處皆設_夾持面，該等夾持面上皆設有一扣 孔’並於二散熱體上端分卿成有至少—向内延伸之散熱部；二 M355001 夾扣具，係爽制於二散熱體之二側，該失扣具係具有二爽扣部、 -體連接於二夾扣部間之彈性部，以及自彈性部向下延伸之勾 部，且該勾部係對應地勾抵於該記憶體二側，且該等失扣且上各 設有-凸扣’該凸扣係可對應地插扣於該扣孔中，藉此，使炎扣 具能從散歸__軸制兩散熱體，使麵雜合成散熱裝 =二ί創作結構簡單’且可快速結合而組成記憶體散熱 裝置，並祕由魏散_収健料增加 記憶體散熱功效。 κ30 is very cumbersome in the combination. ^Yes, this creator has taken advantage of this, and has used its own knowledge and years of experience in the past. The creation of value. For the use of shellfish [New content] The main purpose of this creation is to provide a side-lock memory heat sink that is simple and can be quickly combined and can increase the heat dissipation area. In order to achieve the above object, the present invention is a side-hook type device whose clip is placed on a random access ship to assist in heat dissipation of the wafer, and the heat sink device includes. The heat dissipating bodies are disposed on each other, and the outer side surface white has a plurality of scatter sheets, and the two heat dissipating bodies have a responsive structure, and _ clamping surfaces are provided at the middle portions of the opposite faces, and the clamping surfaces are all provided There is a buttonhole' and is disposed at the upper end of the two heat dissipating bodies to have at least the inwardly extending heat dissipating portion; the second M355001 clipping device is fastened on the two sides of the two heat dissipating bodies, and the deduction buckle has a two-sleeve button portion. The body is connected to the elastic portion between the two clip portions, and the hook portion extending downward from the elastic portion, and the hook portion is correspondingly hooked to the two sides of the memory body, and the buckles are respectively arranged The embossed button can be correspondingly inserted into the buttonhole, thereby enabling the squeezing device to be detached from the __ shaft to form two heat dissipating bodies, so that the surface is mixed with the heat dissipating device. Simple 'and can be quickly combined to form a memory heat sink, and the secret is to increase the heat dissipation effect of the memory by Wei San.
【實施方式】 、為了使審查委員能對本創作之目的、特徵、及功能，有更 進一步瞭解，轉—較佳實施例並配合圖式詳細說明如下： 首先請參閱第1圖至第3圖，係為本創作之立體分解示意 圖，本創作之立體組合示意圖及本創作之夾扣具立體示意圖，本 創作係為-麵扣式記紐散齡置，其齡置於電腦内之隨機 存取記憶體上，哺助其⑼進行散熱，該記鐘散絲置包括·· 散熱體1，係彼此相對設置，外侧面皆具有複數散熱韓片 14 ’頭二散鐘1具有相對應的結構，於其彼此相對面之中 段處皆设—炎持面11 ’該等夾持面上皆設有-扣孔12，並於 一散熱體1上端分卿成有至少-向峡伸之散熱部1 5 ; 二夾扣具3，係夾制於二散熱體i之二侧，請參閱第3圖， 該夾，具3係具有二夾扣部31、-體連接於二失扣部3丄間之 彈性部3 2，以及自雜部3 2向下延伸之勾部3 3，且該勾部 3 3係對應地勾抵於該記憶體2二侧，且該等夾扣具上各設有一 凸扣3 4 ’該凸扣3 4係可對應地插扣於該扣孔丄2中，藉此， 使夹扣具3能從散熱體1側面穩固地夾制兩散熱體1，使其快速 組合成散熱裝置者。 八、 7 M355001 也再者，由於本實施例中，二散熱體1皆係為銘擠型散埶片， 散熱體1内側面與記㈣2之晶片U表面在接觸 夺I有較佳之平貼政果，故亦可於二散 具有導熱效能之導熱介質i 3，以使記 熱量可迅速、平均的傳導至該對散熱體丄而散發。日，所產生的 散熱藉由上述之構造組成，即可得到本創作側扣式記憶體 二散熱體！彼此相對設置在記憶體2二側，再將二^呈=將 散熱體1勤夹人，使該夹扣具3之凸扣 地 該扣孔1 2中，且同時該夾扣具3之勾 、I對舰插扣於 二側，藉此，使夹扣JL 3能從^埶辦1 / A _於該記憶體2 1 ’以便幫助侧面穩固地夾制兩散熱體 ^可藉由夹㈣3卡扣快軌合絲紐置 熱和4及散熱部i 5之設計，可具體增加散:二2 積，故可有效提高記憶體2散熱功效。 …、之政熱面 綜上所陳，本創作實為不可多得之新 到預期之魏，__咬敎姆跡 ^達 且乃具有新穎性與進步性之功效，^^之值’ 使用’符合新型專利之卿、進牛辈: < 見’物亦未公開 予賜准，實感德Γ 進專要件’美依法提請專利，懇 上述實施例僅例示性說明本創作之原理及其功效 限制本創作。任何熟習此項技藝之人士均 用於 神及範訂，耻财_進彳博倾改變之精 利保護範圍，應如後述之申請專利範圍所口此本創作之權 8[Embodiment] In order to enable the reviewing committee to have a better understanding of the purpose, features, and functions of the present creation, the preferred embodiment will be described in detail with reference to the following figures: First, please refer to Figures 1 to 3, This is a three-dimensional exploded view of the creation, the three-dimensional combination diagram of the creation and the three-dimensional schematic diagram of the clip of the creation. The creation is a random-access memory of the age of the button-shaped button. Body, feeding it (9) to dissipate heat, the clock is arranged to include heat radiator 1 , which are arranged opposite each other, and the outer side has a plurality of heat-dissipating Korean films 14 'the first two scattered clocks 1 have corresponding structures, The middle portion of the opposite surface of each other is provided - the sturdy surface 11' is provided with a buckle hole 12 on the clamping surface, and is disposed at the upper end of a heat dissipating body 1 to have a heat dissipation portion 15 extending at least toward the gorge; The two clips 3 are clamped on the two sides of the two heat sinks i. Please refer to Fig. 3, the clip has a three-series with two clip portions 31, and the body is connected to the two buckles. a portion 3 2, and a hook portion 3 3 extending downward from the sub-portion 3 2, and the hook portion 3 3 is paired The ground hooks are disposed on the two sides of the memory body 2, and each of the clip fasteners is provided with a convex buckle 3 4 '. The male buckles 3 4 are correspondingly inserted into the buttonholes 2, thereby making the clips The clip 3 can firmly clamp the two heat dissipating bodies 1 from the side of the heat dissipating body 1 to be quickly combined into a heat dissipating device. VIII, 7 M355001 Also, in this embodiment, the two heat sinks 1 are all in the form of a squeezing type, and the inner surface of the heat sink 1 and the surface of the wafer U of the (4) 2 are better in contact with each other. Therefore, it is also possible to disperse the heat-conducting medium i 3 having thermal conductivity so that the heat can be quickly and evenly transmitted to the pair of heat sinks to be dissipated. On the day, the generated heat dissipation is composed of the above-mentioned structure, and the two side heat sinks of the creation side button type memory can be obtained! Opposite to each other on the two sides of the memory 2, and then the two ^== the heat sink 1 is clamped to the person, so that the clip 3 is buckled in the button hole 12, and at the same time the hook of the clip 3 I, the ship is buckled on the two sides, so that the clip JL 3 can handle 1 / A from the memory 2 1 ' to help the side firmly secure the two heat sinks ^ can be clamped (4) 3 The design of the buckle fast track wire and the heat dissipation part 4 and the heat dissipation part i 5 can specifically increase the dispersion: two or two products, so the heat dissipation effect of the memory 2 can be effectively improved. ..., the political hot side of the overall summary, this creation is a rare new to the expected Wei, __ bite 敎 敎 且 and is a novelty and progressive effect, ^ ^ value 'use 'Compliant with the new patents, the younger generation: < See 'the thing is not disclosed to the public, the real sense of morality into the special requirements 'US law to draw patents, the above examples only exemplify the principle of this creation and its efficacy Limit this creation. Anyone who is familiar with this skill is used for God's and Fan's book, and the scope of the invention is as follows.
M355001 【圖式簡單說明】 第1圖係為本創作之立體分解示意圖。 第2圖係為本創作之立體組合示意圖。 第3圖係為本創作之夾扣具立體示意圖。 第4圖係為習知記憶體散熱裝置之立體組接示意圖。 【主要元件符號說明】 散熱體· · · · • 1 夾持面.....11 扣孔..... • 1 2 導熱介質····13 散熱鰭片· · · • 1 4 散熱部.....15 記憶體· · · · .2 日日片......2 1 夾扣具···· •3 夾扣部.....3 1 彈性部···· •32 勾部......3 3 凸扣......3 4 習知記憶體散熱裝置............3 0 導熱膠片· · · · 3 0 1 散熱片.....3 0 2 扣接鉤.....3 0 2 a 扣接孔.....302 承扣座.....3 0 2 c 定位片.....302 夾扣件.....3 0 3 倒鉤......3 0 3 限位槽.....3 0 4 扣孔......3 0 5 導位孔.....3 0 6M355001 [Simple description of the diagram] The first diagram is a three-dimensional decomposition diagram of the creation. The second picture is a three-dimensional combination diagram of the creation. The third figure is a three-dimensional schematic diagram of the clip fastener of the present creation. Figure 4 is a schematic diagram of a three-dimensional assembly of a conventional memory heat sink. [Description of main component symbols] Heat sink · · · · • 1 Clamping surface .....11 Crimping hole..... • 1 2 Heat transfer medium····13 Heat sink fin · · · • 1 4 Heat dissipation部部.....15 Memory · · · · .2 日日片...2 1 Clips···· •3 Clips.....3 1 Elastic part··· · • 32 hooks... 3 3 clasps... 3 4 Conventional memory heat sinks............3 0 Thermal film · · · · 3 0 1 Heat sink.....3 0 2 Buckle hook .....3 0 2 a Button hole.....302 Buckle seat.....3 0 2 c Positioning piece... ..302 clips.....3 0 3 barbs...3 0 3 limit slots.....3 0 4 button holes...3 0 5 position holes .....3 0 6