TW200850123A - Assembly method of heat pipe and fin, and the assembled article thereof - Google Patents

Assembly method of heat pipe and fin, and the assembled article thereof Download PDF

Info

Publication number
TW200850123A
TW200850123A TW096120188A TW96120188A TW200850123A TW 200850123 A TW200850123 A TW 200850123A TW 096120188 A TW096120188 A TW 096120188A TW 96120188 A TW96120188 A TW 96120188A TW 200850123 A TW200850123 A TW 200850123A
Authority
TW
Taiwan
Prior art keywords
fins
heat pipe
opening
solder
fin
Prior art date
Application number
TW096120188A
Other languages
Chinese (zh)
Inventor
ke-ping Liu
Original Assignee
Tai Sol Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tai Sol Electronics Co Ltd filed Critical Tai Sol Electronics Co Ltd
Priority to TW096120188A priority Critical patent/TW200850123A/en
Priority to US11/896,188 priority patent/US20080301943A1/en
Publication of TW200850123A publication Critical patent/TW200850123A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0012—Brazing heat exchangers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
    • F28F1/32—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means having portions engaging further tubular elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4871—Bases, plates or heatsinks
    • H01L21/4882—Assembly of heatsink parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making
    • Y10T29/49353—Heat pipe device making

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Geometry (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

The present invention provides an assembly method of heat pipe and fins, and the assembled article thereof. Mainly, plural fins and at least a heat pipe are assembled together. The fins are stacked and have at least a mutually corresponding perforation. One side of each fin extends to form an extension wall along the rim of the perforation, and each extension wall forms a first opening toward one side. Each fin also forms a receiving part. The receiving part has a second opening corresponding to the first opening. Then solder is filled into the receiving parts and the heat pipe is threaded through the perforations. The fins are turned over, so that the first opening faces upward. Then the solder is heated up to melt and flow downward through the second opening into the first opening, and into the gap between the heat pipe and the extension walls. After cooling down, the assembly is completed and the assembled article is formed.

Description

200850123 九、發明說明： 【發明所屬之技術領域】 片200850123 IX. Description of the invention: [Technical field to which the invention belongs]

本發明係與散熱裝置有關’特別是指一種熱管與讀 之組合方法及其組合物。 /'I 【先前技術】 按，散熱裝置中，以散熱片為例，一般是由一广< 及設於該底底座上的複數直立的鰭片所組成，藉由該 片來增加與空氣接觸的面積，進而達到更好的散熱效果。9 另外，還有一種散熱裝置，是使用熱管與複數鰭片 組合，其主要是熱管穿過該等鰭片，藉由熱管的高^岣m 性來將熱源的熱量快速傳遞至該等鰭片，並利用鰭7 來增加與空氣接觸的面積，可達到極佳的散熱效果。 15 20 然而，熱管與鰭片的組合，並不是僅僅將熱管穿過鰭 片即可’還要考慮到熱管與該等鰭片之間的接觸面積。^ ，專利公告第M27l，361號專利’即提出—種散熱鰭片與熱 官組接結構的改良，其提出了—種散熱鰭片與熱管的^ 物’並揭露了其組合的方式，其主要是在鰭片向外延伸二 ^緣部的-側邊設置錫料導置部，*賴料導置部 2:、摺壓緣或痕、線的型態。然而，由其所揭露的技 竹“看（由销第3圖），必須先將錫料置於錫料導置 疊置’再將歸穿過，再加熱使錫料溶融而 進入熱管與凸緣部之間。 ㈣上1方式在置人錫料後才將鰭片疊置，事實上，在錫 置入衧是熱融的狀態(第三圖⑽，在疊置時為了不讓錫 4 200850123 ，亂跑’通常疋會等到錫料凝固後才開始進行疊置，此種 狀，會拖長製造時間’此外，錫料先置人才進行疊置、穿 ϊΐΐΐ可能造成錫料掉出，由該案的第3 _來看，在 牙熱^ ’錫料是位於熱管上方的，亦即，錫料導置部的 ^口疋朝下的，錫料有可能掉出。錫料掉出—樣會造成生 產上良率的影響。 【發明内容】 本發明之主要目的在於提供一種熱管與鰭片之組合方 法及其組合物，其可使熱管與則的結合更為方便、快速。 本發明之次-目的在於提供一種熱管與籍片之组合方 法及其組合物，其焊料的置入較為穩定，组敦良率較佳。 15 —緣是’為了達成前述目的’依據本發明所提供之一種 ，管錢片之組合方法，包含有下列步驟、）備置複數鱗 片以及至少-熱管，該等鰭片係相疊置’各該續片上 至少-穿孔彼此相對應且可讓該熱管穿過，各該籍片j ^穿孔周緣向外延伸-延伸壁，各該延伸壁向—側形成 -第-開D;各該鰭片並且同側於該延伸壁向外延伸一以 上的側板，由該側板形成一收容部，該收容 SO == 一開口; b)注入焊料:調整該等鰭片的Ϊ 度使该專收容部位於該等第一開口的 、、 月 伸入至該等鰭片的穿孔内，並由該 ’ ^一注射針頭 由該等第二開口注人於該等收容部内料而經 熱管穿置過該等穿孔;叫將該等二管使= 5 200850123 第一開口轉而朝上且該等收容部位於該等第一開口上方； e)加熱·對該等鰭片及該熱管整體加熱，位於該等收容部 内的焊料即會熔融而經由該第二開口向下流入該等第一開 口，並流於該熱管上，同時會繼續流入該熱管與該等延伸 5壁之間的空隙；以及f)冷卻完成：冷卻後，焊料即會凝固 而將該熱官結合於該等延伸壁上，且亦增加了該熱管與該 等延伸壁間的接觸面積。 ^ 而由上述方法所組成之組合物，包含有··複數鰭片， 彼此相疊置，各該鰭片上具有至少一穿孔彼此相對應，各 10該鰭片一侧沿該穿孔周緣向外延伸一延伸壁，各該延伸壁 向一侧形成一第一開口；各該鰭片並且同侧於該延伸壁= 外延伸一以上的侧板，由該侧板形成一收容部，該收容部 具有一第二開口對應於該第一開口；至少一熱管，穿置於 該等穿孔；以及焊料，充塞於該熱管與該等延伸壁之間。 15 藉由上述之組合方法及組合物，可具有焊料的置入較 為穩定，可確保每個延伸壁與熱管之間均有焊料充塞於 内。不但使得熱管與鰭片的結合更為方便、快速，而i組 裝良率較佳。 2〇【實施方式】 為了詳細說明本發明之技術特點所在，茲舉以下之二 較佳實施例並配合圖式說明如后，其中： 一 為了表示方便，本發明的圖式中僅以一熱管21表示穿 置於穿孔12的狀態。 ' 6 200850123 如第一圖至第七圖所示，本發明第一較佳實施例所提 供之一種熱管與鰭片之組合方法，主要具有下列步驟： a)備置複數鰭片11以及複數熱管21 :該等鰭片n係 相置，各5亥鰭片11上具有複數穿孔12，各該鰭片η 的穿孔12彼此相對應且可讓該等熱管21穿過，各該鰭片 11 一側沿各該穿孔12周緣向外延伸一延伸壁14，延 伸壁14向-侧形成一第一開口 141:各該讀片㈣且同側 :該=壁u向外延伸一以上的側板16，由該侧板16形 ΐ二=4Γ，ΐ收容部17具有—第二開σ m對應於該 弟開口 14卜各該鰭片u係抵於 Η以及側板16的外緣，各該鰭片u =的延伸壁 16向外延伸的寬度相同。本實施例中 I 14及側板 鯖片11上沖壓形成，該側板16 =板16係由各該 15 成1該第二開口⑺即形成於該收折的而上整方體形 b)注入焊料31:調整該等 。卩17的上方。 部17位於該等第一開口 141的下1的角度使該等收容 入至該等鰭片u的穿孔12内，如第注射針頭32伸 並由該注射針頭32流出焊料 二圖至第四圖所示， 注入於該等收容部17内(示於第二圖二由該等第二開口 171 20 31為錫。 —圖）°本實施例中該焊料 c) 置入熱管21 :如第五圖所 過該等穿孔12。 將該等熱管21穿置 d) 翻轉：將該等鑛片u翻轉 第一開Π⑷轉而朝上且該等 示’使該等 合邛17位於等第一開口 7 200850123 141的上方。 、e)加熱·庄人後的焊料3卜在上述步驟及步驟 的過程中’若未持續加熱，則會凝固成固態，此時即可 該等鰭片11及該熱管21整體加熱，位於該等收容部η内 的焊料31即會溶融而經由該第二開口 171向下流入該等第 一開口⑷，錢於軸管21上，时會賴流入該熱管 21與该等延伸壁14之間的空隙。其狀態如第七圖所示。 f)冷部完成：冷卻後，焊料31即會凝固而將該執管 21結合於該等延伸壁14上，而完成組合，且亦增^ 管21一與該等延伸㈣間的接觸面積。 …、 藉由j述步驟，可形成熱管21與鰭片11的組合物1〇。 而由剛述方法所組成之熱管與鰭片的組合物1〇，則包 含有： 、 ，_片U，彼此相置，各該鰭片lljL具有複數穿孔 15 ^ I亥鰭片11上的穿孔12彼此相對應，各該鰭片11 一 C, 側⑺各《穿孔12周緣向外延伸-延伸壁14，各該延伸壁 ^向-側形成—第一開口 141。各該鰭片η並且同側於各 f延伸壁14向外延伸一侧才反16 ,由該侧板16形成-收容 °卩17亥收容部17具有一第二開口 171對應於該第一開口 2〇 141。各該鰭片11係抵於另一鰭片11的延伸壁14以及側 板=外緣，各該延伸壁14及各該侧板ι6向外延伸的寬度 =其中各該側板16係由各該鰭片η沖壓形成，各該 貝1反w之兩側向上彎折形成ue，該第二開口 ΐ7ι 成 於其上方。 8 200850123 複數熱管21，穿置於該等穿孔12。 焊料31(即金屬錫）’充基於該熱管21與該等延伸壁14 之間。 請再參閱第八圖至第九圖，本發明第二較佳實施例所 5提供之一種熱管與鰭片之組合方法及其組成物40，大致與 前揭第一實施例相同’圖未中未顯示熱管，本第二實施例 不同於第一實施例之處在於： 各該籍片41上的收容部47，係由各該鰭片41上沖壓 出的二侧板46所开》成，該二侧板46係彼此以一端相遠離 10而另一端相靠近的方式排列，而大致呈V形，或V形而下 方開口的狀態(倒八字形），相遠離的一端即形成該第二開口 471(即V形的上方開口處）。 上述的收容部47，在焊料(圖中未示）置入時，若焊料 為液態，則可以呈V形的收容部47承接，若收容部47下 I5方疋開口的狀態時，則可置入溫度較低時，焊料呈半熔融 的狀態，而可保持位於該收容部47内不會以液態方式自底 部流出。 、藉由上述之方法以及以該方法形成之組合物，所能達 20 成之功效在於：藉组射翻直躲人焊料，可確保每個 ^部内都有焊料的置人較為穩定。在翻轉後的加 ”、、4 ’即可使％•每個鰭#的延伸壁與熱管之間均 而 塞於内。不錢得熱管朗料結合更為錢、快速 且組裝良率較佳。 9 200850123 【圖式簡單說明】 顯示二:本發明第—較佳實施例之局部構件立 體圖 5 f 15 a第二圖係第1之局部放大圖。 第三圖係本發明第—杏 注射針頭注入焊料的動作^貝知例之動作示意圖 第四圖係第二圖之側視示意圖。 第五®係本發料—較佳實施例 熱管置入於穿孔的狀態。 句作不思圖 第/、圖係本發明第—較佳實施例 翻轉後的狀態。 動作示意圖 第七圖係本發明第—較佳實施例之動一立 焊料熱融後的熱管與鰭片的結合狀態。不思圖 顯示較佳實施例之局部構件立體 顯示 顯示 顯示 顯示 圖 第九圖係第八圖之局部放大圖。 【主要元件符號說明】 U延伸壁 17收容部 31焊料 47收容部 10熱管與縛片的級合物 11鰭片 12穿孔 141第一開口 16侧板 171第二開口 21熱管 40熱管與鰭片的組合物 41鰭片 46侧板 471第二開口The present invention relates to a heat sink device' particularly to a combination of heat pipe and read methods and combinations thereof. /'I [Prior Art] According to the heat sink, taking the heat sink as an example, it is generally composed of a wide range of <and a plurality of upright fins provided on the base, by which the air is added to the air. The area of contact, in order to achieve better heat dissipation. In addition, there is a heat dissipating device which uses a heat pipe and a plurality of fins, which mainly pass through the fins, and the heat of the heat source is quickly transmitted to the fins by the high heat of the heat pipe. And use the fins 7 to increase the area in contact with the air for excellent heat dissipation. 15 20 However, the combination of heat pipes and fins does not simply pass the heat pipe through the fins. It also takes into account the contact area between the heat pipes and the fins. ^, Patent Announcement No. M27l, No. 361, which proposes an improvement of the heat sink fin and the thermal joint assembly structure, which proposes a kind of heat sink fin and heat pipe and discloses the combination thereof. Mainly, the tin material guiding portion is disposed on the side of the fin extending outwardly from the edge portion, and the material guiding portion 2: the folding edge or the shape of the line and the line. However, the bamboo that is exposed by it "see (by pin 3), the tin must be placed in the tin material to be stacked and then passed through, and then heated to melt the tin into the heat pipe and convex Between the edges. (4) The first method is to stack the fins after placing the tin. In fact, the tin is placed in a hot melt state (third figure (10), in order to prevent the tin 4 from being stacked 200850123, running around 'usually will wait until the tin is solidified before it starts to stack. This kind of shape will prolong the manufacturing time'. In addition, the tin material will be stacked first, and the tin may fall out. In the third _ of the case, the tin is placed above the heat pipe, that is, the tin of the tin guide is facing downward, and the tin may fall out. The tin falls out— The invention aims to provide a combination method of heat pipes and fins and a combination thereof, which can make the combination of heat pipes and the tubes more convenient and rapid. Secondly, the purpose is to provide a combination method of a heat pipe and a tablet, and a composition thereof, The composition is relatively stable, and the group yield is better. 15—The edge is a combination method of the tube money piece according to the present invention for the purpose of achieving the foregoing purpose, comprising the following steps: preparing a plurality of scales and at least a heat pipe, The fins are stacked on each other. At least the perforations are corresponding to each other and the heat pipes are allowed to pass through, and each of the sheets j ^ the perforated periphery extends outwardly - an extending wall, and each of the extending walls is formed to the side - a first opening D; each of the fins and the same side of the extending wall extending outwardly more than one side panel, the side panel forming a receiving portion, the receiving SO == an opening; b) injecting solder: adjusting the fins The entanglement of the first accommodating portion in the perforations of the first openings into the perforations of the fins, and the 'an injection needle is injected into the accommodating portions from the second openings Passing through the heat pipes through the heat pipes; calling the two pipes to make = 5 200850123 the first opening turned upwards and the accommodating portions are located above the first openings; e) heating the fins And the heat pipe is heated as a whole, and the solder located in the accommodating portions is melted Flowing down through the second opening into the first opening and flowing on the heat pipe while continuing to flow into the gap between the heat pipe and the wall of the extension 5; and f) cooling is completed: after cooling, the solder is Solidifying to bond the heat to the extended walls, and also increasing the contact area between the heat pipe and the extended walls. ^ The composition consisting of the above method comprises a plurality of fins, each other And the at least one of the fins has a plurality of perforations corresponding to each other, and each of the fins has an extending wall extending outwardly along the periphery of the perforation, and each of the extending walls forms a first opening toward one side; each of the fins And the same side of the extension wall = one or more side panels extending from the side panel, the side panel is formed with a receiving portion, the receiving portion has a second opening corresponding to the first opening; at least one heat pipe is placed on the same a through hole; and a solder that is stuffed between the heat pipe and the extended walls. 15 By the combination method and composition described above, the solder can be placed in a relatively stable manner to ensure that solder is filled between each of the extension walls and the heat pipe. Not only makes the combination of heat pipe and fin more convenient and fast, but the yield of i group is better. 2 〇 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施21 indicates a state in which the perforation 12 is placed. As shown in the first to seventh embodiments, a method for combining a heat pipe and a fin according to a first preferred embodiment of the present invention mainly has the following steps: a) preparing a plurality of fins 11 and a plurality of heat pipes 21 The fins n are arranged to each other, and each of the 5 fins 11 has a plurality of through holes 12, and the through holes 12 of the fins n correspond to each other and allow the heat pipes 21 to pass through, and the fins 11 are on one side. An extending wall 14 extends outwardly along the periphery of each of the perforations 12, and the extending wall 14 forms a first opening 141 toward the side: each of the reading sheets (four) and the same side: the = wall u extends outwardly more than one side panel 16, by The side plate 16 has a shape of ============================================================================================= The extension wall 16 has the same width extending outward. In this embodiment, the I 14 and the side panel slab 11 are stamped, and the side panel 16 = the panel 16 is formed by the 15 to 1 second opening (7) formed on the folded upper square shape b) the solder 31 is injected. : Adjust these. Above the 卩17. The angle of the lower portion 1 of the first opening 141 is such that the first insertion opening 141 is received into the perforation 12 of the fins u. For example, the first injection needle 32 extends and flows out of the soldering needle 32 to the fourth figure. As shown in the second accommodating portion 17 (shown in the second figure 2, the second openings 171 20 31 are tin. - Figure). In the present embodiment, the solder c) is placed in the heat pipe 21: as in the fifth The perforations 12 are passed through the figure. The heat pipes 21 are placed in a d) flip: the n pieces u are turned over, the first opening (4) is turned upwards and the said 'n' are placed above the first opening 7 200850123 141. , e) heating, Zhuangren's solder 3, during the above steps and steps, 'If it is not continuously heated, it will solidify into a solid state. At this time, the fins 11 and the heat pipe 21 can be heated as a whole. The solder 31 in the receiving portion η is melted and flows downward through the second opening 171 into the first opening (4), and is deposited on the shaft tube 21, and flows between the heat pipe 21 and the extending wall 14 . The gap. Its state is as shown in the seventh figure. f) Finishing of the cold portion: After cooling, the solder 31 is solidified to bond the tube 21 to the extension walls 14, to complete the combination, and to increase the contact area between the tube 21 and the extensions (4). ..., by the steps described, the composition 1 of the heat pipe 21 and the fins 11 can be formed. The combination of the heat pipe and the fin composed of the method described below includes: , , _ piece U, which are placed opposite each other, and each of the fins lljL has a plurality of perforations 15 ^ I perforated on the fin 11 12 corresponding to each other, each of the fins 11-C, the side (7) of each of the "perforations 12 extending outwardly-extending the wall 14, each of the extending walls - forming a first opening 141. Each of the fins η and the same side of the f-extending wall 14 extends outwardly from the side 16 to be formed by the side panel 16 and accommodates the housing 17 having a second opening 171 corresponding to the first opening. 2〇141. Each of the fins 11 is abutted against the extending wall 14 of the other fin 11 and the side panel=outer edge, and the width of each of the extending walls 14 and each of the side panels ι6 extends outwardly. The sheet n is formed by stamping, and the sides of each of the shells 1 and back w are bent upward to form a ue, and the second opening ΐ7ι is formed thereon. 8 200850123 A plurality of heat pipes 21 are placed in the perforations 12. Solder 31 (i.e., metal tin) is charged between the heat pipe 21 and the extension walls 14. Referring to FIG. 8 to FIG. 9 again, a method for combining a heat pipe and a fin and a composition 40 thereof according to a second preferred embodiment of the present invention are substantially the same as the first embodiment. The heat pipe is not shown, and the second embodiment is different from the first embodiment in that: the accommodating portion 47 of each of the pieces 41 is formed by the two side plates 46 punched out on the fins 41. The two side plates 46 are arranged in such a manner that one end is away from 10 and the other end is close to each other, and is substantially V-shaped, or V-shaped and open at the lower side (inverted figure-eight shape), and the second opening is formed at a farther end. 471 (that is, the upper opening of the V shape). When the solder is in a liquid state, the accommodating portion 47 can be received in a V-shaped accommodating portion 47, and the accommodating portion 47 can be placed in a state in which the accommodating portion 47 is opened in the direction of the I5. When the temperature is low, the solder is in a semi-molten state, and can remain in the accommodating portion 47 and does not flow out from the bottom in a liquid state. By the above method and the composition formed by the method, the effect of 20% is that by using a group of flip-flops to hide the solder, it is ensured that the solder in each of the parts is relatively stable. Adding ",, 4" after the flipping can make the extension wall of each fin# and the heat pipe both plug in. It is cheaper, quicker and better in assembly yield than the heat pipe. 9 200850123 [Simplified description of the drawings] Display 2: partial member perspective view of the first preferred embodiment of the present invention 5 f 15 a second diagram is a partial enlarged view of the first section. The third diagram is the first apricot injection needle of the present invention. The action of injecting the solder is shown in the fourth figure. The fifth diagram is a side view of the second diagram. The fifth embodiment of the present invention - the preferred embodiment of the heat pipe is placed in the state of the perforation. The figure is the state after the flipping of the first preferred embodiment of the present invention. The seventh diagram of the operation is the state of the heat pipe and the fin after the hot soldering of the first embodiment of the present invention. The partial member stereoscopic display display of the preferred embodiment shows a partial enlarged view of the eighth diagram of the ninth diagram of the figure. [Main component symbol description] U extension wall 17 housing portion 31 solder 47 housing portion 10 heat tube and binding sheet cascading Object 11 fin 12 perforation 141 first A second opening 16 side opening 21 of the heat pipe 171 of the heat pipe 40 and the fins 46 of the fin plate 41 the composition of the second opening 471

Claims (1)

200850123 十、申請專利範圍： j一種熱管與則之組合方法，包含有下列步 a)備置複數縛片以及至少—熱管片· 置，各該鍵Η卜呈古 * 乂寺.、、、曰片係相疊 ιΓ 少—穿孔彼此相對纽可讓該心 牙k ’各該鰭片-側沿該穿孔周緣向外延伸一延伸辟、、、： 該延伸壁向一側形成一第一開口；各該壁，各 向外延伸一以上的側板，由該“形成-該 h收谷部具有一第二開口對應於該第一開口；200850123 X. Patent application scope: j A combination method of heat pipe and the following, including the following steps: a) preparing a plurality of binding pieces and at least - a heat pipe piece, each of which is a * 呈 古 . , , , , 曰 呈Between the two sides, the perforations are opposite to each other, such that the dents k' each of the fins-sides extend outwardly along the periphery of the perforation, and the extension wall forms a first opening to one side; The wall, each extending outwardly more than one side panel, the "forming-the h-receiving portion having a second opening corresponding to the first opening; 轉i)=焊料：調整該等鰭片的角度使該等收容部位於 料弟的下方’以—注射針·人至料鰭片 孔内，亚由該注射針頭流出焊料而經由該等第 於該等收容部内； 入 C)置入熱管··將該熱管穿置過該等穿孔； d) 翻轉··將該等鰭片翻轉，使該等第一開口轉而朝上 且該等收容部位於該等第一開口上方； e) 加熱：對該等鰭片及該熱管整體加熱，位於該等收 容部内的焊料即會熔融而經由該第二開口向下流入該等第 一開口，並流於該熱管上，同時會繼續流入該熱管與該等 延伸壁之間的空隙；以及 f)冷卻完成··冷卻後，焊料即會凝固而將該熱管結合 2〇於該等延伸壁上，且亦增加了該熱管與該等延伸壁間的接 觸面積。 2·依據申請專利範圍第1項所述之熱管與鰭片之組合 方法，其中··於步驟b)中，該焊料係為錫。 3.依據申請專利範圍第2項所述之熱管與鰭片之組合 200850123 方法，其中：於步驟a)中，各該鰭片係抵於另一鰭片的延 伸壁及侧板外緣，該延伸壁及該侧板向外延伸的寬度相同。 4·依據申請專利範圍第3項所述之熱管與鰭片之組合 方法，其中：於步驟a)中，各該鰭片上的收容部，係由各 5該鰭片上沖壓出的一侧板所形成，該侧板之兩侧向上彎折 而整體形成U形，並形成該第二開口於上方。 5·依據申請專利範圍第3項所述之熱管與鰭片之組合 方法，其中：於步驟a)中，各該鰭片上的收容部，係由各 該鰭片上沖壓出的二侧板所形成，該二側板係彼此以一端 1〇相遠離而另一端相靠近的方式排列，相遠離之一端即形成 吞亥弟二開口。 6· —種由第1項之方法所組成之熱管與鰭片之組合 物，包含有： 複數鯖片，彼此相疊置，各該鰭片上具有至少一穿孔 15彼此相對應，各該鰭片一側沿該穿孔周緣向外延伸一延伸 壁’各該延伸壁向一侧形成一第一開口；各該鰭片並且同 侧於該延伸壁向外延伸一以上的侧板，由該侧板形成一收 容部，該收容部具有一第二開口對應於該第一開口； 至少一熱管，穿置於該等穿孔；以及 2〇 焊料，充塞於該熱管與該等延伸壁之間。 7·依據申請專利範圍第6項所述之熱管與鰭片之組合 物，其中：該焊料係為鍚。 依據申清專利範圍第7項所述之熱管與韓片之組合 物其中·各該鰭片係抵於另一鰭片的延伸壁及側板外緣， 12 200850123 該延伸壁及該側板向外延伸的寬度相同。 9·依據申請專利範圍第8項所述之熱管與鰭片之組合 物，其中··各該鰭片上的收容部，係由各該鰭片上沖壓^ 的一側板所形成，該侧板之兩侧向上彎折而整體形成^ 形，並形成該第二開口於上方。 10·依據申請專利範圍第8項所述之熱管與鰭片之組合 物，其中：各該鰭片上的收容部，係由各該鰭片上沖壓出 的二側板所形成’该一側板係彼此以一端相遠離而另一端 相靠近的方式排列’相遠離之一端即形成該第二開口。 13Turn i)=solder: adjust the angle of the fins so that the accommodating parts are located under the material of the younger ones, and the needles are flowed into the holes of the fins, and the solder flows out of the solder through the needles. Inside the accommodating portion; into C) placing the heat pipe · placing the heat pipe through the perforations; d) turning over the fins, turning the first openings upward and the accommodating portions Located above the first openings; e) heating: the fins and the heat pipes are integrally heated, and the solder located in the accommodating portions is melted and flows downward through the second openings into the first openings, and flows On the heat pipe, the gap between the heat pipe and the extending walls will continue to flow; and f) after the cooling is completed, the solder will solidify and the heat pipe is bonded to the extending walls, and The contact area between the heat pipe and the extension walls is also increased. 2. The method of combining a heat pipe and a fin according to the first aspect of the patent application, wherein in the step b), the solder is tin. 3. The method of combination of heat pipe and fin according to claim 2, wherein the fins are in the step a), the fins are in contact with the extending wall of the other fin and the outer edge of the side plate, The extension wall and the side panel extend outward to the same width. The method of combining the heat pipe and the fin according to the third aspect of the patent application, wherein: in the step a), the receiving portion on each of the fins is a side plate punched out by each of the fins. Forming, the sides of the side plate are bent upward to form a U-shape integrally, and the second opening is formed above. 5. The method according to claim 3, wherein in the step a), the receiving portion on each of the fins is formed by two side plates stamped on the fins. The two side plates are arranged in such a manner that one end is away from each other and the other end is close to each other, and one end away from the end forms a swallowing opening. The combination of the heat pipe and the fin composed of the method of the first aspect, comprising: a plurality of cymbals stacked on each other, each of the fins having at least one perforation 15 corresponding to each other, each of the fins One side of the perforated periphery extends outwardly from the periphery of the perforation; each of the extension walls defines a first opening toward one side; each of the fins and the same side of the extension wall extend outwardly by more than one side panel, the side panel Forming a receiving portion, the receiving portion has a second opening corresponding to the first opening; at least one heat pipe is disposed to the through holes; and 2 〇 solder is filled between the heat pipe and the extending walls. 7. The combination of a heat pipe and a fin according to claim 6 of the patent application, wherein the solder is tantalum. According to the combination of the heat pipe and the Korean piece according to claim 7 of the patent application, wherein the fins are formed on the extension wall of the other fin and the outer edge of the side plate, 12 200850123 the extension wall and the side plate extend outward The width is the same. 9. The composition of the heat pipe and the fin according to item 8 of the patent application scope, wherein the accommodating portion on each of the fins is formed by a side plate of each of the fins stamped, and the side plates are The side is bent upward to form a general shape, and the second opening is formed above. The combination of the heat pipe and the fin according to claim 8, wherein: the accommodating portion on each of the fins is formed by two side plates punched out on the fins. The second opening is formed by arranging one end away from the other end and approaching one end. 13
TW096120188A 2007-06-05 2007-06-05 Assembly method of heat pipe and fin, and the assembled article thereof TW200850123A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW096120188A TW200850123A (en) 2007-06-05 2007-06-05 Assembly method of heat pipe and fin, and the assembled article thereof
US11/896,188 US20080301943A1 (en) 2007-06-05 2007-08-30 Method of combining heat pipe and fins and the assembly thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW096120188A TW200850123A (en) 2007-06-05 2007-06-05 Assembly method of heat pipe and fin, and the assembled article thereof

Publications (1)

Publication Number Publication Date
TW200850123A true TW200850123A (en) 2008-12-16

Family

ID=40094515

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096120188A TW200850123A (en) 2007-06-05 2007-06-05 Assembly method of heat pipe and fin, and the assembled article thereof

Country Status (2)

Country Link
US (1) US20080301943A1 (en)
TW (1) TW200850123A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108544203A (en) * 2018-05-30 2018-09-18 南京国佑智能化系统有限公司 Side plate automatic assembling technique equipment and its method under a kind of heat exchanger of air condition
US10114274B2 (en) 2014-12-22 2018-10-30 Coretronic Corporation Heat dissipating module having turbulent structures
US10281807B2 (en) 2017-01-12 2019-05-07 Coretronic Corporation Projector, heat dissipation module, and heat dissipation fin set

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2211135B1 (en) * 2009-01-22 2013-05-29 Cpumate Inc. Fins-type heat sink and method for assembling the same
CN101959389B (en) * 2009-07-13 2014-07-16 富瑞精密组件（昆山）有限公司 Heat radiating device and manufacture method thereof
US8403032B2 (en) * 2009-12-31 2013-03-26 Kunshan Jue-Choung Electronics Co., Ltd. Structure of heat plate
JP6088724B2 (en) * 2010-08-31 2017-03-01 ユニ・チャーム株式会社 Absorber manufacturing apparatus and breathable member manufacturing method
US9560792B2 (en) * 2015-01-30 2017-01-31 Netgear, Inc. Apparatus and method for heat sink assembly
KR102297779B1 (en) * 2015-07-08 2021-09-03 히다카 세이키 가부시키가이샤 Flat tube insertion into fins for heat exchangers

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10114274B2 (en) 2014-12-22 2018-10-30 Coretronic Corporation Heat dissipating module having turbulent structures
US10281807B2 (en) 2017-01-12 2019-05-07 Coretronic Corporation Projector, heat dissipation module, and heat dissipation fin set
CN108544203A (en) * 2018-05-30 2018-09-18 南京国佑智能化系统有限公司 Side plate automatic assembling technique equipment and its method under a kind of heat exchanger of air condition

Also Published As

Publication number Publication date
US20080301943A1 (en) 2008-12-11

Similar Documents

Publication Publication Date Title
TW200850123A (en) Assembly method of heat pipe and fin, and the assembled article thereof
TWI360738B (en)
TWI273210B (en) Heat-dissipation device and fabricating method thereof
TW200934362A (en) Method of manufacturing heat dissipaters having heat sinks and structure thereof
TWM436314U (en) Heat dissipating device
TWI286919B (en) Heat dissipation module and assembling method thereof
TWM441308U (en) Heat dissipating fin and heat dissipating device
CN209419991U (en) Radiator, circuit board and calculating equipment
TWI322258B (en)
TWM302246U (en) Heat dissipating module
JP3834432B2 (en) One can multi-channel heat exchanger
TWM261011U (en) Assembly heat sink
TWM342014U (en) Processing fixture for heat dissipating module
TW201005250A (en) Stacked type heat conduction module
TWI269627B (en) Method for coupling heat dissipation fins and heat pipes and a device thereof
TWM392990U (en) Heat-dissipating module
TWI286194B (en) Method for combining heat sink fins and heat pipe
TWM317610U (en) Heat-dissipating base structure
TWM269700U (en) Fin set of heat sink
TWM268648U (en) Heatsink structure
TWI280095B (en) Water-cooled air cooler
TWM286920U (en) Improved assembly structure of heat sink fin set and heat conduction tube
TW200827996A (en) Heat dissipation device
CN109565929A (en) Radiator, circuit board and calculating equipment
TW201249319A (en) Heat dissipating device containing heat pipe with bottom adhesion type heat dissipating fin