M269700 八、新型說明： 【新型所屬之技術領域】 本新型有關於電子裝置之散熱裝置，特败有關於一種鰭片 串接形成環狀排列之散熱鰭片組。 【先前技術】 中央處理器（CPU)崎作雜快速進展，使電腦運作效能 突飛猛進，然而時脈的上升意味著消耗更高的電功率以及產生更 f的廢熱，週邊元件如《機、光碟機、顯示晶片及系統晶片組 等亦隨著效能的提昇而帶來更高的發熱量，因此必須有良好的散 熱襄置，將賴巾的減料至外界，以避免電網部溫度過高 而無法運作。 其中，中央處理器係為電腦的運作核心，隨時處於運作狀態， 2其純脈運轉’使得中央處理器具有極高的發熱量，散熱問 題最為嚴重；若無法有效地處对央處㈣的散齡卻，將影響 電腦運作甚至導致中央處理器燒毁。 目前對財央處職財式，仍明以絲器與風〉 的組合為主要手段，財液冷式雜”加強熱健置的設言卜 2，但是此_液體為導熱介質的散齡式有不易製造、不易: I及工作流财漏等問題存在，而且 對工作流親行冷卻，因此鍵WM t α此,u讀_仍為不 鰭片式散熱器係利用一底座直接接 觸熱源（如CPU等 電子晶 M269700 片絲），經由熱傳導將熱能傳導至位於底座上之鰭片，接著利用 空氣透過鱗流效應將熱能帶走，更可加上—助帶動氣流，形 成強麵流效果，加強散熱效果。若依據則式散鮮的製作方 式來分類，鰭片式散熱器可分為—體成型及接合式鰭片組二種形 式。-體颜的散熱鰭片組衫聰為製作材料，主要是利用銘 的熱阻抗低、重量輕、成本低以及易於_成型等優點，然而銘 ，成型有鰭片密度受限的問題，而使得散熱表面積無法進一步提 昇。現在㈣式散熱器之主流係為銅製鰭片接合於—域或銅製籲 底座上的接合式鰭>1組，接合式鰭纽以極小賴距制鰭片， 產生較大的散熱表面積以提昇散熱效率；為了快速進行籍片接合 作業，更有許多籍片串接設計出現，如中華民國專利092219聰 號申請案、中華民國公告543833號專利案等，皆為繼卡勾、串 接結構將錄個則進行轉，各則之—側賴設置一f折成 型之底板，侧各底域接形成—平板狀輯，_減於—底 座或直接接觸發熱元件表面。 ~ φ 請參閱「第1圖」，係為一習用散熱器1，該散熱器1可為鋁 擠成型、接合製作如Φ接鰭片貼合於—底座所製成，其型態概 王-矩賴’具有複數個平行排列之鰭片2設置於—底座3上， 各鰭片2之間形成-氣體通路；一風扇4設置於該散熱器i頂部， 藉由風扇4由該散熱器彳頂部向下推動氣流，使氣流由散熱器巧 頂部吹入後經過散熱器1表面進行吸熱，由散熱器彳前後側離開。 習用散熱$ 1之鰭片2係為平行排列，僅有二侧具有氣流出入， 6 M269700 影響氣體流量，且風扇4向下錢，氣流直麟擊在散熱器彳之 底座上，使得氣流速度大減，提高阻力。為解決此一問題，中華 民國專利092218743號申請案提出一種散熱器，係將鰭片進行環 狀排列，黏貼於-圓錐狀之金屬塊上，形成—鰭片環狀排列之散 熱斋，以加大氣體流動通路。然而〇922彳8743號一案並未提出鰭 片環狀排列以及鰭片與金屬塊接合之方法，因此如何將鰭片有= 快速地排賴環狀顧定於—底聽有技術上實施之困難；而前 述以922191195”請案、543833號專利案二案的串接結構，# =置於鰭片的頂、底邊兩端，限制鰭片串接後的排列型態，僅 滅取直線排列，無法依據底座型態自由變化，·因此如何使讀片 排列形式更為多樣化，而可㈣地呈現環狀翻，形成__ 為’ ϋ穩固地抵貼於-熱源或_於—底座上，成為有待解決之 技術課題。 、 【新型内容】 鐾於以上關題，本新型社要目的在練供— =將賴則串卿成雜剌，使散_肢顯皆能= 風机通道’猎以降低冷卻氣流的流阻，提升散熱效率。 因此，為達上述目的，本新型所揭露之—種散 =:複數個串減環狀之鰭片，該各則包含有一外側邊、1 侧、“了嫩—底邊’該各_接成環形後，該外側邊及該内 貝i邊刀別錄該各!f料側及_;_ 有朝向同一側延伸之卡勾元件，人之令#又位置分別具 卞k件林卡勾元件前端形成 M269700 勾70件之基部與該鰭片交接處具有-卡勾孔，用以供另-鰭 勾D卩插场成勾扣狀態；—底板，係由底邊沿垂直於鰭片的 以及-箍圈，環繞於該賴之外緣；藉由上述之組合， 、、、θ綱_，⑽射嶋，纖熱鰭片組之 週面都能供空氣流通，降低流阻提高散熱效率。 為放熱鰭片組更包含有—底座，該等鰭片係以該底板抵貼於該 二η’、該底座之底面係用以緊密貼合於—熱源表面’以將熱 里¥至该等鰭片，進行熱對流散熱。 為有效地將—風翻定於該_片之㈣上方 有複數個爪勾，一端嵌人土尺匕3 该風扇週緣’另-端卡勾於該等鰭片之外 貝以將該風扇穩固地_於該等鰭片之頂邊上方。 如下有關本新型的特徵與實作，兹配合圖示作最佳實施例詳細說明 【實施方式】 一 1第2Α圖」及「第2Β圖」所示，係為本新型所提供 之一種散_版’該散熱鰭片組係由複數個鰭ϋ 10串接所構 成_’該散熱鰭版可呈餘意·型態，可排列成-縱列型態亦 可頭尾串接形成一圓環形型態。 10可由!s、喊其他縛熱且容_ 材料所製成。該各鰭片10具有_内側邊n、一外侧邊12成= 邊二13及-底邊14，該各鰭片1〇串接成圓環形後，該外側邊Μ 及摘侧邊12分別位於該各鰭片】◦外侧及内侧，其中： M269700 該==13、14之中段位置分別具有朝向同—侧面 卡勾7L件15，該各卡勾元件15細沖卿 上，形成與該鰭片垂直之型態，該各：；勾元件鰭片 :::部⑹’該各卡勾部151之二側分別具有—向：伸:: Λ心5玄各卡勾元件15之基部與該鰭片1〇交接〆且右 成型之卡勾孔说，用以供另一鰭片1〇之卡勾…^插入开^ 扣狀態，其中該二卡勾151a尖端之_距離大於該卡勾孔啦 之見度，使該卡勾部151穩固地勾扣於該卡勾孔彳52，·此外 使該卡勾部⑹具備彈性以利於勾扣串接作業，使該二卡勾伽 :之距離在插人卡勾孔152時進行彈性變化，因此該卡勾部⑸ 前端更開設有-切槽151b，沿該卡勾部151長轴方向切割形成二 部分，以利該卡勾部151進行彈性變形，改變該二卡勾15^間之 距離。 該底邊14鄰接該内侧邊μ之一段，具有一由底邊14沿垂直 觸片1〇的方向延伸之底板141，該底板141係將該底邊14的φ :部份進行㈣使之向前折而成；射該各底板⑷概呈扇形， 藉以各底板141可互相拼接形成—雜翅形平板區域，用以抵 貼於一熱源表面。 取複數個鰭片10，而將其等之頂、底邊13、14以該等卡勾 το件15進行串接以構成一長鍊型態，接著依據散賴片組的需求 改變簿片10的排列型'態。由於該各則1〇互㈣接的位置係位 於頂、底邊13、14之中段’因此可任意改變各鰭片1〇之間的夾 9 M269700 产 ^卡勾轉15的型態所限制，可採取-縱列配置，亦可 知取碩尾串接形成®環形型態。 則2閱、第3圖」至「第6圖」所示’本新翻將複數個 ^ 接成一長列之後，再進行頭尾串接使其等形成圓形環狀 ’ ’使各鰭>M0之間形成放射狀配置。 門^加賴_ 1Q之間的連結，該各鰭片1〇之外側邊12 ^又缺π 121，-箍圈2Q’環繞於該_片彳。之外緣，並固 =於該等缺口 121上’以形成束缚效果，避免串接後之鰭片10散· 洛’该箍圈20係由一銅質帶體所組成’有一卡勾21及一卡勾孔 22，以頭、尾相接形成環狀用以束縛該等韓片1〇。 川該等籍片10之内側邊11上段形成一容置部川，該等容置部 所圍繞形成之區域，設置有一圓柱狀外廓之間隔元件3〇，設 置於該各鰭片所環繞的區域中央，該各轉片1〇之内側邊^係頂 抵於該間隔元件30之週面，避免各鰭片1〇之内側邊^互相錯 動，影響環狀排列型態。 3 ^ 該各鰭# 10串接成_型態後，該等底板141可拼接形成一 圓形或圓環形平面，可用以直接抵貼_熱源表面或接合於二底座 40’本新型德該等鰭>；1G_該等底板141接合於—底座扣， 如「第3圖」所示，該底座40具有_頂面41及一底面4^該各 …、曰片10之底板141係、抵貼於該頂面41，並以焊接方式進行接人， 亦可塗抹導熱介質後使底板141與頂面41直接接觸，該底面42 則用以抵貼於-熱源進行導熱，經由該等鰭片1〇以熱對流進行散 10 M269700 熱0 為了匹配一般電子晶片的封裝型態，該底座4〇係採取二段式 結構設計，接近頂面41之一段呈現圓板型態，以匹配該等鰭片1〇 的底板141互相拼接後形成的圓形平面，接近該底面42之一段呈 現矩形板結構，匹配該電子晶片的封裝型態，使該底座4〇恰可以 該底面42抵貼於電子晶片上。 為了使該等鰭片10連同該底座4〇能有效地裝設於一電子晶 片上，本新型更具有一扣合板50及一固定座60，其中： "亥扣合板5〇概呈一板片型態，其中央開設有一裝置孔51， 乂衣置孔51型恶係與該底座4〇之底面42互相匹配，裝置孔51 之周圍具有複數彳时孔52，該底座4(3侧設有複數個與該各穿 孔52匹配之螺孔43，藉以該底座4〇以該底面42容置於該裝置 孔51中’並利用複數個螺絲（圖未示），穿過該等穿孔泣而鎖合 於邊底座40之螺孔43，使該底座4q與該扣合板5〇結合為一體。 该固定座60係固定於一電路板（圖未示）上，其具有一底部 61 ’该底部61之中央形成一中空區域611，前述之電子晶片係位 於射工區域611，該固定座60係供該扣合板50勾扣結合，而 使亥底板40以底面42抵貼於該電子晶片上，發揮導熱效果。為 使该扣合板50與該固定座6〇發揮勾扣結合效果，其中該扣合板 5〇邊緣具有二向外延伸之第-彈片53及二向外延伸第二彈片 。亥各第-彈片53前端具有一開口向上之勾部531，該各第二 彈片54月ip而肷没有一勾抵元件％，該勾抵元件％之斷面呈匕形， M269700 具有開口向上之勾部551及-水平之抵壓部552，該二第一彈 片53及該二第二彈片54與該扣合板5〇形成一失角，而傾斜向上 延伸；該固定板60之底部61側緣向上延伸有二侧板62，該二侧 板62刀別開设有二扣合孔621，分別對應於該各第―、第二彈片 53 54 4各第一及第二彈片53、54係分別以其前端之勾部的1 及勾抵元件55勾抵於該各扣合孔621，藉以使該扣合板5〇結合 於該固定座60，並以該各第一、第二彈片53、54發揮彈性力， 以使該底座40緊密地抵貼於該電子晶片之表面。 ^ 欲結合該扣合板50及該固定座60時，先將該各第一彈片53 前端之勾部531勾扣於對應的扣合孔621後，接著壓下該各第二 彈片54前端之勾抵元件55的抵壓部552，使該勾抵元件55以勾 部551勾扣於對應的扣合孔621，即可使該扣合板5〇與該固定座 60結合，而使該底座40抵貼於該電子晶片；若是要分離該固定 座60及該扣合板50，將該底座40連同該等鰭片1〇取下，則再 度壓下該抵壓部552並略微平移，可使該勾抵元件55之勾部φ 脫離所勾扣之扣合孔621。 本新型更包含有複數個爪勾71及一風扇72，該各爪勾71係 用以結合風扇72及a亥專鰭片1〇’使該風扇72設置於該等鰭片iq 上方，以吸氣或吹氣方式推動冷卻氣流，通過各鰭片1〇之表面進 行散熱冷卻；由於該等鰭片10呈現環狀排列之後，形成由一圓心 向外放射狀延伸的型態，使得整個散熱鰭片組之周圍皆可供空氣 流通，相較於習用散熱器之鰭片呈現平行排列，僅有二侧面可供 12 M269700 耽流通過，本新型具有較小的流阻以提高冷卻氣流之流量；此外， .玄各鰭片10之外侧邊12可向外延伸，突伸至該底座4〇的範圍之 外’犬伸部分的鰭片1〇底邊14下方呈現懸空狀，更有利於空氣 流通。 上述之該各爪勾71之二端分別為—沿長軸方向延伸之後合柱 711及-垂直於長軸方向之凸、緣712，該各爪勾71上更有複數個 沿長軸方向設置之凸肋713，藉以加強該各爪勾7彳之強度。 而该風扇72之週緣係為一環狀外框721，該環狀外框72彳之 週緣向外凸設有複數個凸耳722，該各凸耳722上開設有一嵌合 孔723，以供該各爪勾71之喪合柱711嵌合於上，使該各爪勾 與該風扇72結合，再以該各爪勾71之凸緣712勾抵於該等鰭片 1〇外側邊12及底邊14交接處，使該風扇72抵靠於該等籍片1〇 之頂邊；若該爪勾71之長度小於該外㈣12之長度，可該各縛 片1〇之外侧邊12設置-内凹之卡合缺槽122，以供該凸緣712 勾抵於該卡合缺槽122，發揮固定結合效果。 請再參閱「第7圖」所示，係為本新型之另—實施例，該等 鰭片80之底板841，可與該底邊84及該等卡勾元件85形成一夾 角’當該等㈣80串接形成環狀排列後，該等底板841可互相拼 接形成-圓錐面，該底座90之頂面91亦形成—與該等底板841 匹配之圓錐面。在相同的圓週直徑大小下，騎面可提供較圓形、 圓環形平面為大之接觸面積，可以提昇韓片8〇及該底座9〇之的 熱傳導係數，提昇散熱鰭片組之散熱效能。 13 M269700 【圖式簡單說明】 第1圖為f用散熱器之立體圖； 籍片； 元件示意圖，揭示該等 第2B圖為第2A圖之局部放大示意圖，· ’為該等鰭月及該底座； 第2A圖為本新型一較佳實施例之部分 第3圖為本新型之部分構件剖視圖 第4圖為本新型之立體分解圖； 第5圖為本新型之側視圖； 第6圖為本新型之立體圖； 第7圖為本新型另一較佳實施例之部分構件剖視圖 【主要元件符號說明】 1 散熱器 2 鰭片 3 底座 4 風扇 10 鰭片 11 内側邊 111 容置部 12 外侧邊 121 缺口 122 卡合缺槽 13 頂邊 14 M269700 14 底邊 141 底板 15 卡勾元件 151 卡勾部 151a 卡勾 151b 切槽 152 卡勾孔 20 箍圈 21 卡勾 22 卡勾孔 30 間隔元件 40 底座 41 頂面 42 底面 43 螺孔 50 扣合板 51 裝置孔 52 穿孔 53 第一彈片 531 勾部 54 第二彈片 55 勾抵元件 M269700 551 552 60 61 611 62 621 71 711 712 713 72 721 722 723 80 84 841 85 90 91 勾部 抵壓部 固定座 底部 中空區域 側板 扣合孔 爪勾 嵌合柱 凸緣 凸肋 風扇 環狀外框 凸耳 谈合孔 縛片 底邊 底板 卡勾元件 底座 頂面M269700 8. Description of the new type: [Technical field to which the new type belongs] The new type relates to the heat dissipation device of the electronic device, and is particularly related to a type of fins connected in series to form a ring-shaped heat dissipation fin group. [Previous technology] The central processing unit (CPU) has made rapid progress, making the computer's operating efficiency leaps and bounds. However, the rise of the clock means higher power consumption and more waste heat. Peripheral components such as "machines, optical disc drives, The display chip and system chipset also bring higher heat generation with the improvement of performance. Therefore, good heat dissipation must be provided to reduce the weight of the towel to the outside to avoid the temperature of the power grid department being too high to operate. . Among them, the central processing unit is the operating core of the computer, which is always in operation. 2 Its pure pulse operation makes the central processing unit have extremely high heat generation, and the heat dissipation problem is the most serious; However, the age will affect the operation of the computer and even cause the central processing unit to burn out. At present, it is still clear that the combination of silk and wind is the main method for the financial and office style of the financial department, and the "liquid-liquid-cooling hybrid" is used to strengthen the thermal health setting. 2 There are problems that are not easy to manufacture and not easy: I, workflow leakage, etc., and the cooling of the workflow in-person, so the key WM t α this, u read _ is still a non-finned radiator system using a base to directly contact the heat source ( (Such as CPU and other electronic crystal M269700 pieces of wire), the heat energy is transmitted to the fins on the base through heat conduction, and then the heat energy is taken away by the air through the scale effect, which can also be added to help drive the air flow to form a strong surface flow effect Enhance the heat dissipation effect. If classified according to the production method of regular freshness, the fin type radiator can be divided into two forms: body molding and joint type fin group. It mainly uses the advantages of low thermal resistance, light weight, low cost, and easy molding. However, there are problems with the limitation of the density of the fins in the molding, which makes it impossible to further increase the heat dissipation surface area. Now the mainstream of ㈣-type radiators Department is The fin-making fins are bonded to a set of fins on a domain or a copper base. The fin-fins make fins with a very small distance, resulting in a large heat dissipation surface area to improve heat dissipation efficiency. There are also many series of serial design designs, such as the Republic of China Patent 092219 Satoshi Application, Republic of China Announcement No. 543833 Patent Case, etc., all of which follow the card hook and the concatenation structure will be recorded and transferred. — A f-shaped bottom plate is set on the side, and the bottom areas on the sides are connected to form a flat plate, _minus—the base or directly contact the surface of the heating element. ~ Φ Please refer to "Figure 1", which is a conventional radiator 1. The heat sink 1 can be made of aluminum extrusion and bonding, such as Φ connection fins attached to the base, its shape is almost king-Julai 'has a plurality of parallel arranged fins 2 is provided on the base 3, a gas path is formed between each fin 2; a fan 4 is provided on the top of the radiator i, and the fan 4 pushes the airflow downward from the top of the radiator 彳, so that the airflow is blown in from the top of the radiator Heat is absorbed through the surface of the radiator 1 Leaving the left foot front side. The fins 2 of the conventional cooling $ 1 are arranged in parallel, and only two sides have airflow in and out. 6 M269700 affects the gas flow, and the fan 4 is down, and the airflow hits the base of the radiator, making the airflow speed high. Reduce and increase resistance. In order to solve this problem, the application of the Republic of China Patent No. 092218743 proposes a heat sink. The fins are arranged in a ring shape and adhered to a conical metal block to form a fin-shaped array of heat sinks. Large gas flow path. However, No. 922 彳 8743 did not propose the method of fins to be arranged in a circle and the fins and metal blocks to be joined. Therefore, how to quickly circulate the fins depends on the ring. Difficulties; and the aforementioned tandem structure of 922191195 "and 543833 patent case ## is placed on the top and bottom ends of the fins, limiting the arrangement of the fins after they are connected, only the straight lines are eliminated. The arrangement cannot be freely changed according to the shape of the base, so how to make the arrangement of the readings more diversified, and can be presented in a ring shape, forming __ as' ϋ firmly against the heat source or the _ base It has become a technical problem to be solved. [New content] Based on the above questions, the main purpose of this new type of agency is to train the confession-= to assemble Lai Zheqing into a miscellaneous, so that scattered _ limbs can all = fan channel 'To reduce the flow resistance of the cooling airflow and improve the efficiency of heat dissipation. Therefore, in order to achieve the above purpose, the type disclosed in this model—seeds =: a plurality of string-ring-shaped fins, each of which includes an outer edge, 1 side, "Lenen-bottom edge" should be connected in a ring, the outer edge and The inner side of the knife should not record each of the! F material side and _; _ There are hook elements extending towards the same side, and the order of the person # is also equipped with 卞 k pieces of forest hook elements at the front end to form the base of M269700 hook 70 pieces The interface with the fin is provided with a -hook hole for another -fin hook D 卩 to be inserted into a hook state;-a bottom plate, the bottom edge of which is perpendicular to the fin, and a hoop that surrounds the base Outer edge; With the above combination, the peripheral surface of the fibrous fin group can provide air circulation, reduce flow resistance and improve heat dissipation efficiency. In order to release heat, the fin group further includes a base, the fins are abutted against the two η ′ with the bottom plate, and the bottom surface of the base is used to closely fit to the —heat source surface ’to transfer heat to Fins for thermal convection. In order to effectively set the wind on the top of the _ piece, there are several claw hooks, one end is embedded with a soil ruler 3, and the fan's periphery is hooked outside the fins to stabilize the fan. Ground_ is above the top edge of the fins. The following is a detailed description of the features and implementation of the new model, and the best embodiment will be described in detail with reference to the drawings. [Embodiment]-1 2A and 2B, as shown in Figure 2 Version 'The heat sink fin group is composed of a plurality of fins 10 connected in series_' The heat sink fin version can take the form of an aftermath, can be arranged in a tandem type or can be connected in series by a head and a tail to form a ring Shape. 10 can be made of! S, shouting other heat-binding and capacity materials. Each of the fins 10 has an inner side n, an outer side 12%, a side two 13 and a bottom side 14. After the fins 10 are connected in a circle shape, the outer side M and the off-side side 12 are respectively located on the fins] ◦ outside and inside, among which: M269700 The middle positions of == 13 and 14 respectively have the same-side hooks 7L pieces 15 and the hook elements 15 are finely punched on the sides to form and The vertical form of the fins, each :; hook element fin ::: 部 ⑹ 'The two sides of each hook portion 151 respectively have-to: extend :: Λ heart 5 base of each hook element 15 The hook hole that is connected to the fin 10 and is formed on the right says that it is used for the hook of the other fin 10 ... ^ Insert the ^ buckle state, where the distance between the tip of the two hooks 151a is greater than the card The visibility of the hook hole makes the hook portion 151 securely hook into the hook hole 彳 52, and in addition makes the hook portion ⑹ flexible to facilitate the hook stringing operation to make the two card hooks: The distance is elastically changed when the hook hole 152 is inserted. Therefore, the front end of the hook portion ⑸ is further provided with a notch 151b, which is cut into two parts along the long axis direction of the hook portion 151 to facilitate the hook. 151 is elastically deformed, the two hooks changing the distance between the 15 ^. The bottom edge 14 is adjacent to a section of the inner edge μ, and has a bottom plate 141 extending from the bottom edge 14 in the direction of the vertical contact piece 10. The bottom plate 141 is configured to orient the φ: portion of the bottom edge 14 The base plate 射 is roughly fan-shaped, so that the base plates 141 can be spliced to each other to form a wing-shaped flat plate area for abutting against a heat source surface. Take a plurality of fins 10, and concatenate the top and bottom edges 13 and 14 of these fins 15 to form a long chain type, and then change the book 10 according to the needs of the scattered sheet group Permutation type 'state. Because the positions of the 10 joints are located at the middle of the top and bottom sides 13 and 14 ', the clip 9 between the fins 10 can be changed arbitrarily. It can adopt the tandem configuration, and it can also be known that the tail is connected in series to form a ring shape. Then "read 2nd, 3rd figure" to "6th figure" "This new translation will connect a plurality of ^ into a long line, and then head and tail concatenation to form a circular ring, etc." 'Make each fin > Radial configuration is formed between M0. The connection between the gate ^ Galai_1Q, the outer side 12 of each fin 10, and the absence of π121, the -hoop 2Q 'surrounds the _piece 彳. Outer edge, and solid = on the notches 121 to form a restraint effect, to prevent the fins 10 from loosening after being connected in series. "The hoop 20 is composed of a copper belt." There is a hook 21 and A hook hole 22 is connected with the head and the tail to form a ring shape to bind the Korean films 10. An upper part of the inner side 11 of the ridge 10 forms an accommodating part. The area surrounded by the accommodating parts is provided with a cylindrical outer space element 30, which is arranged around the fins. In the center of the region, the inner sides of the fins 10 abut against the peripheral surface of the spacer element 30 to prevent the inner sides of the fins 10 from shifting to each other, which affects the annular arrangement pattern. 3 ^ After each fin # 10 is connected in series, the bottom plates 141 can be spliced to form a circular or circular annular plane, which can be directly abutted to the surface of the heat source or bonded to the two bases. Isofin> 1G_The bottom plates 141 are connected to the base buckle. As shown in "Figure 3", the base 40 has a top surface 41 and a bottom surface 4 ^ The bottom plate 141 of each ... 2. Abut on the top surface 41 and connect them by welding. You can also apply the heat-conducting medium to directly contact the bottom plate 141 and the top surface 41. The bottom surface 42 is used to abut the heat source for heat conduction. The fins 10 are dissipated by thermal convection 10 M269700 heat 0 In order to match the package type of general electronic wafers, the base 40 adopts a two-stage structure design, and a segment near the top surface 41 shows a circular plate shape to match the The circular plane formed after the bottom plates 141 of the equal fins 10 are spliced to each other, and a section close to the bottom surface 42 presents a rectangular plate structure, matching the packaging type of the electronic chip, so that the base 40 can just abut the bottom surface 42 against Electronic wafer. In order for the fins 10 and the base 40 to be effectively mounted on an electronic chip, the new model further has a buckle plate 50 and a fixing seat 60, of which: " Hai buckle plate 50 is generally a plate In the form of a sheet, a device hole 51 is set in the center, and the sacrifice hole type 51 is matched with the bottom surface 42 of the base 40. The device hole 51 has a plurality of time holes 52 around it, and the base 4 (3 side settings) There are a plurality of screw holes 43 matching the perforations 52, whereby the base 40 is accommodated in the device hole 51 with the bottom surface 42 'and a plurality of screws (not shown) are passed through the perforations and The screw hole 43 is locked to the side base 40, so that the base 4q is integrated with the buckle board 50. The fixing base 60 is fixed on a circuit board (not shown), and has a bottom 61 'The bottom A hollow area 611 is formed in the center of 61, the aforementioned electronic chip is located in the shooting area 611, and the fixing seat 60 is used for the buckle plate 50 to be hooked together, so that the bottom plate 40 abuts on the electronic chip with the bottom surface 42. The heat conduction effect is exerted. In order to make the buckle plate 50 and the fixing base 60 have a hook-and-loop effect The edge of the buckle plate 50 has two outwardly extending first elastic pieces 53 and two outwardly extending second elastic pieces. The front end of each of the first elastic pieces 53 has a hook portion 531 with an upward opening, and the second elastic pieces 54 month ip However, there is no hook element%. The cross section of the hook element% is a dagger. The M269700 has a hook portion 551 with an opening upward and a horizontal pressing portion 552. The two first elastic pieces 53 and the two second elastic pieces. 54 forms a missing angle with the fastening plate 50 and extends obliquely upwards; the side edge of the bottom 61 of the fixing plate 60 extends upward with two side plates 62, and the two side plates 62 are provided with two fastening holes 621, Corresponding to the respective first and second elastic pieces 53 54 4 Each of the first and second elastic pieces 53 and 54 respectively abuts against the respective fastening holes 621 with the hook portion 1 and the abutment element 55 at the front end thereof, respectively. The buckle plate 50 is coupled to the fixing base 60, and the first and second elastic pieces 53, 54 exert elastic force to make the base 40 closely abut against the surface of the electronic chip. ^ To combine the When the fastening plate 50 and the fixing base 60 are engaged, the hook portion 531 at the front end of each first elastic piece 53 is hooked to the corresponding fastening hole 621 first. Then, the pressing portion 552 of the abutting element 55 at the front end of each of the second elastic pieces 54 is pressed, so that the abutting element 55 is hooked to the corresponding fastening hole 621 by the hook portion 551, so that the fastening plate 5 can be made. Combined with the fixing base 60, so that the base 40 abuts against the electronic chip; if the fixing base 60 and the buckle plate 50 are to be separated, the base 40 and the fins 10 are removed, and then pressed again The pressing portion 552 is slightly translated, so that the hook portion φ of the hooking element 55 can be disengaged from the hooking hole 621. The new model further includes a plurality of claw hooks 71 and a fan 72, and each of the claw hooks 71 It is used to combine the fan 72 and the a fin 10 ′, so that the fan 72 is arranged above the fins iq, and the cooling airflow is promoted by suction or blowing, and the heat is cooled through the surface of each fin 10 ; After the fins 10 are arranged in a ring shape, they form a shape extending radially outward from a circle center, so that the entire heat dissipation fin group can be provided with air circulation, compared with the fins of conventional radiators. Arranged in parallel, only two sides can pass through 12 M269700, this new model has a smaller In order to increase the flow of cooling airflow; In addition, the outer side 12 of each fin 10 can extend outward, protruding beyond the range of the base 40. The bottom portion 14 of the fin 10 of the dog extension portion is presented The suspended shape is more conducive to air circulation. The two ends of the above-mentioned claw hooks 71 are respectively-the post 711 extending after extending in the long-axis direction and-the projections and edges 712 perpendicular to the long-axis direction. Each of the claw hooks 71 is further provided along the long-axis direction. The rib 713 is used to strengthen the strength of the claw hooks 7 彳. The peripheral edge of the fan 72 is a ring-shaped outer frame 721. A plurality of lugs 722 are protruding outwardly from the peripheral edge of the ring-shaped outer frame 72 彳. Each of the lugs 722 is provided with a fitting hole 723 for The pillars 711 of the claw hooks 71 are fitted on the top, so that the claw hooks are combined with the fan 72, and then the flanges 712 of the claw hooks 71 are hooked against the outer edges of the fins 10. And the bottom edge 14 where the fan 72 abuts against the top edge of the paper piece 10; if the length of the claw hook 71 is less than the length of the outer sleeve 12, the outer side edge 12 of the binding piece 10 can be set -The recessed engaging notch 122 is provided for the flange 712 to abut against the engaging notch 122 to exert a fixed coupling effect. Please refer to FIG. 7 again, which is another embodiment of the present invention. The bottom plate 841 of the fins 80 may form an angle with the bottom edge 84 and the hook elements 85. After ㈣80 is connected in series to form a circular arrangement, the bottom plates 841 can be spliced to form a conical surface, and the top surface 91 of the base 90 is also formed—a conical surface matching the bottom plates 841. At the same circumference diameter, the riding surface can provide a larger contact area than a circular, toroidal plane, which can increase the thermal conductivity of the Korean film 80 and the base 90, and improve the heat dissipation efficiency of the heat dissipation fin group. . 13 M269700 [Schematic description] Figure 1 is a perspective view of a radiator for f; books; schematic diagrams of components, revealing these 2B diagrams are partial enlarged diagrams of 2A diagrams, "'are the fin moons and the base Figure 2A is a part of a preferred embodiment of the present invention. Figure 3 is a sectional view of some components of the present model. Figure 4 is an exploded perspective view of the model. Figure 5 is a side view of the model. Figure 6 is a side view of the model. New type perspective view; Figure 7 is a sectional view of some components of another preferred embodiment of the present invention [Description of main component symbols] 1 Radiator 2 Fin 3 Base 4 Fan 10 Fin 11 Inner side 111 Receiving portion 12 Outer side 121 Notch 122 Snap slot 13 Top edge 14 M269700 14 Bottom edge 141 Base plate 15 Hook element 151 Hook part 151a Hook 151b Notch 152 Hook hole 20 Hoop 21 Hook 22 Hook hole 30 Spacer 40 Base 41 Top surface 42 Bottom surface 43 Screw hole 50 Fastening plate 51 Device hole 52 Perforation 53 First spring piece 531 Hook 54 Second spring piece 55 Hook element M269700 551 552 60 61 611 62 621 71 711 712 713 72 721 722 7 23 80 84 841 85 90 91 Hook part pressing part fixing seat bottom hollow area side plate snap hole claw hook fitting column flange rib fan ring frame lug talk hole binding piece bottom side bottom plate hook element base top surface