TWI513950B - Heat sink - Google Patents
Heat sink Download PDFInfo
- Publication number
- TWI513950B TWI513950B TW100122520A TW100122520A TWI513950B TW I513950 B TWI513950 B TW I513950B TW 100122520 A TW100122520 A TW 100122520A TW 100122520 A TW100122520 A TW 100122520A TW I513950 B TWI513950 B TW I513950B
- Authority
- TW
- Taiwan
- Prior art keywords
- heat dissipation
- heat
- fin
- dissipation fins
- fins
- Prior art date
Links
- 230000017525 heat dissipation Effects 0.000 claims description 95
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 230000005855 radiation Effects 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
本發明涉及一種散熱器,特別涉及一種用於對電子元件散熱的散熱器。 The present invention relates to a heat sink, and more particularly to a heat sink for dissipating heat from an electronic component.
隨著電子資訊業的迅速發展,微處理晶片等發熱電子元件產生的熱量愈來愈多,為了將該等熱量散發出去以保障電子元件的正常運行,業界通常採用在電子元件上設置一散熱裝置以對該發熱電子元件進行散熱。 With the rapid development of the electronic information industry, heat generated by heat-generating electronic components such as micro-processing wafers is increasing. In order to dissipate such heat to ensure the normal operation of electronic components, the industry generally employs a heat sink on the electronic components. The heat-dissipating electronic component is dissipated.
習知的散熱裝置通常包括一散熱器,該散熱器由複數散熱鰭片排列而成,每相鄰的兩個散熱鰭片間形成一氣體流通的通道。為了增加散熱器的散熱性能,根據電子裝置內可利用空間的大小適當增大散熱器整體或局部的尺寸,以增大散熱面積,然而,隨著散熱器尺寸的增加,散熱鰭片間結構強度相對降低,在散熱器組裝至電子裝置內時,難免會與其他元件碰撞,從而導致散熱器的兩側發生變形,進而影響散熱性能。 Conventional heat sinks generally include a heat sink that is formed by a plurality of heat sink fins that form a gas passage between each adjacent heat sink fin. In order to increase the heat dissipation performance of the heat sink, the overall or partial size of the heat sink is appropriately increased according to the available space in the electronic device to increase the heat dissipation area. However, as the size of the heat sink increases, the structural strength between the heat dissipation fins increases. Relatively lower, when the heat sink is assembled into the electronic device, it will inevitably collide with other components, which will cause deformation on both sides of the heat sink, thereby affecting the heat dissipation performance.
有鑒於此,有必要提供一種結構強度較強可防止其兩側變形的散熱器。 In view of this, it is necessary to provide a heat sink having a strong structural strength to prevent deformation on both sides thereof.
一種散熱器,包括複數平行排列的散熱鰭片,所述散熱鰭片中最外側的兩個散熱鰭片分別為第一散熱鰭片及第二散熱鰭片,與該 第一散熱鰭片相鄰的散熱鰭片為第三散熱鰭片,與該第二散熱鰭片相鄰的散熱鰭片為第四散熱鰭片,該第一散熱鰭片與第三散熱鰭片的其中一散熱鰭片設有向另一散熱鰭片凸出並抵靠於另一散熱鰭片上的凸起,所述第二散熱鰭片與第四散熱鰭片之間的其中一散熱鰭片設有向另一散熱鰭片凸出並抵靠於另一散熱鰭片上的凸起。 A heat sink includes a plurality of heat dissipating fins arranged in parallel, wherein the outermost two fins of the heat dissipating fin are a first fin and a second fin, respectively The heat dissipation fins adjacent to the first heat dissipation fins are the third heat dissipation fins, and the heat dissipation fins adjacent to the second heat dissipation fins are the fourth heat dissipation fins, the first heat dissipation fins and the third heat dissipation fins One of the heat dissipation fins is provided with a protrusion that protrudes toward the other heat dissipation fin and abuts against the other heat dissipation fin, and one of the heat dissipation fins between the second heat dissipation fin and the fourth heat dissipation fin A protrusion is provided that protrudes toward the other heat dissipation fin and abuts against the other heat dissipation fin.
與習知技術相比,該散熱器上由於設有凸起,且各凸起分別支撐於該散熱器最外側的第一散熱鰭片及第二散熱鰭片的內側,從而提高該散熱器的結構強度,防止組裝散熱器時其兩側被其他部件碰撞而變形,進而保證其具有較好的散熱性能。 Compared with the prior art, the heat sink is provided with a protrusion, and each protrusion is respectively supported on the inner side of the first heat dissipation fin and the second heat dissipation fin of the outermost side of the heat sink, thereby improving the heat sink. The structural strength prevents the two sides from being deformed by collision with other components when assembling the heat sink, thereby ensuring better heat dissipation performance.
100‧‧‧散熱器 100‧‧‧heatsink
10‧‧‧散熱鰭片 10‧‧‧ Heat sink fins
20‧‧‧通道 20‧‧‧ channel
11‧‧‧本體 11‧‧‧Ontology
13‧‧‧折邊 13‧‧‧Folding
110‧‧‧第一部分 110‧‧‧Part 1
113‧‧‧第二部分 113‧‧‧Part II
10a‧‧‧第一散熱鰭片 10a‧‧‧First heat sink fin
10b‧‧‧第二散熱鰭片 10b‧‧‧second heat sink fin
10c‧‧‧第三散熱鰭片 10c‧‧‧ Third heat sink fin
10d‧‧‧第四散熱鰭片 10d‧‧‧fourth heat sink fin
15、16‧‧‧凸起 15, 16‧‧‧ bumps
圖1為本發明散熱器一實施例的立體圖。 1 is a perspective view of an embodiment of a heat sink of the present invention.
圖2為圖1所示的散熱器拆除最外側一散熱鰭片的立體圖。 2 is a perspective view of the outermost heat sink fin of the heat sink shown in FIG. 1 .
圖3為圖1所示的散熱器的倒置圖。 3 is an inverted view of the heat sink shown in FIG. 1.
圖1所示,該散熱器100由複數散熱鰭片10排列而成,每相鄰的兩散熱鰭片10間形成一氣體流通的通道20。 As shown in FIG. 1 , the heat sink 100 is formed by arranging a plurality of heat dissipation fins 10 , and a gas passage 20 is formed between each adjacent two heat dissipation fins 10 .
每一散熱鰭片10包括一本體11及分別由該本體11的頂端及底端向同一方向彎折延伸形成的一折邊13。該本體11包括一第一部分110及由該第一部分110的一側向外延伸的一第二部分113,該第一部分110與第二部分113的底端在同一平面上,該第二部分113的高度高於第一部分110。每一散熱鰭片10的折邊13分別由其所在的散熱鰭片10向外垂直延伸,且各折邊13的末端分別抵靠於與 其相鄰的散熱鰭片10的本體11上。 Each of the heat dissipation fins 10 includes a body 11 and a flange 13 formed by bending a top end and a bottom end of the body 11 in the same direction. The body 11 includes a first portion 110 and a second portion 113 extending outwardly from a side of the first portion 110. The first portion 110 is in the same plane as the bottom end of the second portion 113. The height is higher than the first portion 110. The flanges 13 of each of the heat dissipation fins 10 extend perpendicularly outward from the heat dissipation fins 10, and the ends of the flanges 13 respectively abut It is on the body 11 of the adjacent heat dissipation fins 10.
請同時參閱圖2及圖3,該散熱器100中最外側的兩個散熱鰭片10分別為第一散熱鰭片10a及第二散熱鰭片10b,與該第一散熱鰭片10a相鄰的散熱鰭片10為第三散熱鰭片10c,與該第二散熱鰭片10b相鄰的散熱鰭片10為第四散熱鰭片10d。該第一散熱鰭片10a與第三散熱鰭片10c之間以及第二散熱鰭片10b與第四散熱鰭片10d之間分別設有一凸起15、16。本實施例中,該凸起15由第一散熱鰭片10a向第三散熱鰭片10c的方向凸出並使其末端抵靠於第三散熱鰭片10c上,該凸起16由第四散熱鰭片10d向第二散熱鰭片10b的方向凸出並使其末端抵靠於第二散熱鰭片10b上。所述凸起15、16的橫截面呈梯形設置,且分別由第一散熱鰭片10a及第四散熱鰭片10d的中部一體衝壓形成。所述凸起15、16分別形成於該第一散熱鰭片10a的第二部分113及第四散熱鰭片10d的第二部分113上,且分別由各第二部分113的一側沿與折邊13平行的方向延伸至另一側。該散熱器100上由於設有凸起15、16,且各凸起15、16分別支撐於該散熱器100最外側的第一散熱鰭片10a及第二散熱鰭片10b的內側,從而提高該散熱器100的結構強度,防止組裝散熱器100的兩側時被其他部件碰撞而變形,進而保證其具有較好的散熱性能。 Referring to FIG. 2 and FIG. 3 , the two outermost heat dissipation fins 10 of the heat sink 100 are respectively a first heat dissipation fin 10 a and a second heat dissipation fin 10 b adjacent to the first heat dissipation fin 10 a. The heat dissipation fins 10 are the third heat dissipation fins 10c, and the heat dissipation fins 10 adjacent to the second heat dissipation fins 10b are the fourth heat dissipation fins 10d. A protrusion 15 and 16 are respectively disposed between the first heat dissipation fin 10a and the third heat dissipation fin 10c and between the second heat dissipation fin 10b and the fourth heat dissipation fin 10d. In this embodiment, the protrusion 15 protrudes from the first heat dissipation fin 10a toward the third heat dissipation fin 10c and has its end abutting against the third heat dissipation fin 10c. The protrusion 16 is cooled by the fourth heat dissipation. The fin 10d protrudes in the direction of the second heat radiation fin 10b and has its end abutting against the second heat radiation fin 10b. The protrusions 15 and 16 have a trapezoidal cross section and are integrally stamped by the central portions of the first heat dissipation fins 10a and the fourth heat dissipation fins 10d. The protrusions 15 and 16 are respectively formed on the second portion 113 of the first heat dissipation fin 10a and the second portion 113 of the fourth heat dissipation fin 10d, and are respectively folded by one side of each second portion 113. The sides 13 extend in parallel to the other side. The heat sink 100 is provided with protrusions 15 and 16, and the protrusions 15 and 16 are respectively supported on the inner side of the first heat dissipation fin 10a and the second heat dissipation fin 10b of the outermost side of the heat sink 100, thereby improving the The structural strength of the heat sink 100 prevents the two sides of the heat sink 100 from being deformed by collision with other components, thereby ensuring better heat dissipation performance.
具體實施時,該散熱器100的結構不限於本實施例的情況,各散熱鰭片10的本體11可以分為高度不同的第一部分110及第二部分113,亦可使整個本體11為高度相同一板體,所述凸起15可由第一散熱鰭片10a向第三散熱鰭片10c的方向凸出並抵靠於第三散熱鰭片10c上,亦可由第三散熱鰭片10c向第一散熱鰭片10a的方向 凸出並抵靠於第一散熱鰭片10a上。同理,該凸起16可由第四散熱鰭片10d向第二散熱鰭片10b的方向凸出並抵靠於第二散熱鰭片10b上,亦可由第二散熱鰭片10b向第四散熱鰭片10d的方向凸出並抵靠於第四散熱鰭片10d上。所述凸起15、16的設置位置及延伸長度亦不限於本實施例的情況,即所述凸起15、16可僅設於本體11的第二部分113上,亦可同時設於第一部分110上,可由散熱鰭片10的一側沿其延伸方向延伸至其中部。所述凸起15、16的橫截面可為梯形,亦可為矩形或其他形狀,所述凸起15、16可為一個,亦可為兩個或多個。 In a specific implementation, the structure of the heat sink 100 is not limited to the case of the embodiment. The body 11 of each heat dissipation fin 10 can be divided into the first portion 110 and the second portion 113 having different heights, and the entire body 11 can be made the same height. a plate body, the protrusion 15 may protrude from the first heat dissipation fin 10a toward the third heat dissipation fin 10c and abut against the third heat dissipation fin 10c, or may be first to the third heat dissipation fin 10c. Direction of the heat dissipation fin 10a It protrudes and abuts against the first heat dissipation fin 10a. Similarly, the protrusion 16 may protrude from the fourth heat dissipation fin 10d toward the second heat dissipation fin 10b and abut against the second heat dissipation fin 10b, or may be from the second heat dissipation fin 10b to the fourth heat dissipation fin. The direction of the sheet 10d is convex and abuts against the fourth heat sink fin 10d. The arrangement position and the extension length of the protrusions 15 and 16 are not limited to the case of the embodiment, that is, the protrusions 15 and 16 may be disposed only on the second portion 113 of the body 11 or at the same time in the first portion. At 110, one side of the heat dissipation fin 10 may extend to the middle portion along the extending direction thereof. The protrusions 15 and 16 may have a trapezoidal cross section or a rectangular shape or other shapes. The protrusions 15 and 16 may be one or two or more.
可以理解的是,對於本領域的普通技術人員來說,可以根據本發明的技術構思做出其他各種像應的改變與變形,而所有該等改變與變形都應屬於本發明權利要求的保護範圍。 It is to be understood that those skilled in the art can make various changes and modifications of the various embodiments in accordance with the present invention, and all such changes and modifications should fall within the scope of the claims of the present invention. .
綜上所述,本發明符合發明專利要件,爰依法提出專利申請。惟,以上所述者僅為本發明之較佳實施例,舉凡熟悉本案技藝之人士,在爰依本發明精神所作之等效修飾或變化,皆應涵蓋於以下之申請專利範圍內。 In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. The above description is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art will be included in the following claims.
100‧‧‧散熱器 100‧‧‧heatsink
13‧‧‧折邊 13‧‧‧Folding
10a‧‧‧第一散熱鰭片 10a‧‧‧First heat sink fin
10b‧‧‧第二散熱鰭片 10b‧‧‧second heat sink fin
10c‧‧‧第三散熱鰭片 10c‧‧‧ Third heat sink fin
10d‧‧‧第四散熱鰭片 10d‧‧‧fourth heat sink fin
15、16‧‧‧凸起 15, 16‧‧‧ bumps
Claims (9)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2011101743099A CN102858132A (en) | 2011-06-27 | 2011-06-27 | Radiator |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201300721A TW201300721A (en) | 2013-01-01 |
TWI513950B true TWI513950B (en) | 2015-12-21 |
Family
ID=47360725
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW100122520A TWI513950B (en) | 2011-06-27 | 2011-06-28 | Heat sink |
Country Status (3)
Country | Link |
---|---|
US (1) | US20120325452A1 (en) |
CN (1) | CN102858132A (en) |
TW (1) | TWI513950B (en) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20020139515A1 (en) * | 1999-07-02 | 2002-10-03 | Kaveh Azar | Heat sink with textured regions |
US6595275B1 (en) * | 2002-07-02 | 2003-07-22 | Waffer Technology Corp. | Heat sink assembly |
TWM269700U (en) * | 2004-12-29 | 2005-07-01 | Chao-Chuan Chen | Fin set of heat sink |
CN1959590A (en) * | 2005-11-02 | 2007-05-09 | 富准精密工业(深圳)有限公司 | Heat sink |
TWM346778U (en) * | 2008-07-10 | 2008-12-11 | Lian Cherng Entpr Co Ltd | Heat sinking fin set |
Family Cites Families (11)
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US20020056544A1 (en) * | 1999-07-23 | 2002-05-16 | Kaveh Azar | Heat sink with radial shape |
CN2429859Y (en) * | 2000-06-12 | 2001-05-09 | 富准精密工业(深圳)有限公司 | Radiator assembly |
US6655448B1 (en) * | 2002-05-16 | 2003-12-02 | Hai-Ching Lin | Radiator with heat dissipation pieces connected in series |
US7568518B2 (en) * | 2006-07-21 | 2009-08-04 | Furui Precise Component (Kunshan) Co., Ltd. | Heat sink |
US7779894B2 (en) * | 2006-07-31 | 2010-08-24 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device |
US20080135215A1 (en) * | 2006-12-06 | 2008-06-12 | Foxconn Technology Co., Ltd. | Heat dissipation device |
TW200847908A (en) * | 2007-05-28 | 2008-12-01 | Delta Electronics Inc | Heat dissipating fin assembly and assembling method thereof |
CN101370371B (en) * | 2007-08-17 | 2011-06-08 | 富准精密工业(深圳)有限公司 | Heat radiation model set and radiator used for the same |
CN101945560B (en) * | 2009-07-07 | 2014-04-02 | 富瑞精密组件(昆山)有限公司 | Heat abstractor |
CN102006761A (en) * | 2009-08-28 | 2011-04-06 | 富准精密工业(深圳)有限公司 | Heat radiator |
CN102006762B (en) * | 2009-08-31 | 2014-12-24 | 富瑞精密组件(昆山)有限公司 | Heat-radiating device |
-
2011
- 2011-06-27 CN CN2011101743099A patent/CN102858132A/en active Pending
- 2011-06-28 TW TW100122520A patent/TWI513950B/en not_active IP Right Cessation
- 2011-08-30 US US13/220,687 patent/US20120325452A1/en not_active Abandoned
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20020139515A1 (en) * | 1999-07-02 | 2002-10-03 | Kaveh Azar | Heat sink with textured regions |
US6595275B1 (en) * | 2002-07-02 | 2003-07-22 | Waffer Technology Corp. | Heat sink assembly |
TWM269700U (en) * | 2004-12-29 | 2005-07-01 | Chao-Chuan Chen | Fin set of heat sink |
CN1959590A (en) * | 2005-11-02 | 2007-05-09 | 富准精密工业(深圳)有限公司 | Heat sink |
TWM346778U (en) * | 2008-07-10 | 2008-12-11 | Lian Cherng Entpr Co Ltd | Heat sinking fin set |
Also Published As
Publication number | Publication date |
---|---|
CN102858132A (en) | 2013-01-02 |
US20120325452A1 (en) | 2012-12-27 |
TW201300721A (en) | 2013-01-01 |
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