CN102858132A - Radiator - Google Patents
Radiator Download PDFInfo
- Publication number
- CN102858132A CN102858132A CN2011101743099A CN201110174309A CN102858132A CN 102858132 A CN102858132 A CN 102858132A CN 2011101743099 A CN2011101743099 A CN 2011101743099A CN 201110174309 A CN201110174309 A CN 201110174309A CN 102858132 A CN102858132 A CN 102858132A
- Authority
- CN
- China
- Prior art keywords
- radiating fin
- radiator
- heat dissipation
- fin
- dissipation fin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 208000012868 Overgrowth Diseases 0.000 claims description 2
- 238000004080 punching Methods 0.000 claims description 2
- 230000017525 heat dissipation Effects 0.000 abstract 23
- 239000006185 dispersion Substances 0.000 description 4
- 238000004891 communication Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
The invention discloses a radiator which comprises a plurality of heat dissipation fins which are parallelly arranged, and two heat dissipation fins at the most outer side in the heat dissipation fins are respectively provided with a first heat dissipation fin and a second heat dissipation fin; the heat dissipation fin adjacent to the first heat dissipation fin is a third heat dissipation fin, and the heat dissipation fin adjacent to the second heat dissipation fin is a fourth heat dissipation fin, wherein one of the heat dissipations fin between the first heat dissipation fin and the third heat dissipation fin is provided with a bulge which protrudes towards the other heat dissipation fin and props against the other heat dissipation fin; one of the heat dissipation fins between the second heat dissipation fin and the fourth heat dissipation fin is provided with a bulge which protrudes towards the other heat dissipation fin and props against the other heat dissipation fin; and the bulges respectively support the inner sides of the first heat dissipation fin and the second heat dissipation fin at the most outside of the radiator, the structural strength of the radiator is improved, and deformation of the radiator caused by collision of other parts is prevented when the radiator is assembled.
Description
Technical field
The present invention relates to a kind of radiator, particularly relate to a kind of for the radiator to electronic element radiating.
Background technology
Along with developing rapidly of electronic and information industry, the heat that the heat-generating electronic elements such as micro-chip processor produce is more and more many, for these dissipation of heats being gone out ensure the normal operation of electronic component, industry usually adopts and one heat abstractor is set so that this heat-generating electronic elements is dispelled the heat at electronic component.
Existing heat abstractor generally includes a radiator, and this radiator is arranged by some radiating fins and formed, and forms the passage of a gas communication between two whenever adjacent radiating fins.In order to increase the heat dispersion of radiator, suitably increase radiator integral or local size according to the size that can utilize the space in the electronic installation, with increasing heat radiation area, yet, along with the increase of heat sink size, structural strength relative reduce between radiating fin, in the time of in radiator panel is filled to electronic installation, unavoidably meeting and other element collisions, thus cause the both sides of radiator to deform, and then affect heat dispersion.
Summary of the invention
In view of this, be necessary to provide a kind of structural strength can prevent more by force the radiator of its both sides distortion.
A kind of radiator, comprise some radiating fins that are arranged in parallel, outermost two radiating fins are respectively the first radiating fin and the second radiating fin in the described radiating fin, the radiating fin adjacent with this first radiating fin is the 3rd radiating fin, the radiating fin adjacent with this second radiating fin is the hot fin that scatters, a wherein radiating fin of this first radiating fin and the 3rd radiating fin is provided with to another radiating fin and protrudes and be resisted against projection on another radiating fin, and scatter a wherein radiating fin between the hot fin of described the second radiating fin and the is provided with to another radiating fin protrusion and is resisted against projection on another radiating fin.
Compared with prior art, on this radiator owing to being provided with projection, and each projection is supported in respectively the inboard of outermost the first radiating fin of this radiator and the second radiating fin, thereby improve the structural strength of this radiator, its both sides are collided by miscellaneous part and are out of shape when preventing from assembling radiator, and then guarantee that it has preferably heat dispersion.
Description of drawings
Fig. 1 is the stereogram of radiator one embodiment of the present invention.
Fig. 2 is the stereogram that radiator shown in Figure 1 is removed outermost one radiating fin.
Fig. 3 is the inversion figure of radiator shown in Figure 1.
The main element symbol description
|
100 |
Radiating |
10 |
|
20 |
|
11 |
Flanging | 13 |
First | 110 |
|
113 |
The first radiating |
10a |
The second radiating |
10b |
The 3rd radiating |
10c |
The hot fin that scatters | |
Projection | |
15、16 |
Following embodiment further specifies the present invention in connection with above-mentioned accompanying drawing.
Embodiment
Shown in Figure 1, this radiator 100 is arranged by some radiating fins 10 and is formed, 10 passages 20 that form a gas communication of every two adjacent radiating fins.
Each radiating fin 10 comprises a body 11 and a flanging 13 that is extended to form to same direction bending by the top of this body 11 and bottom respectively.This body 11 comprises a first 110 and the second portion 113 of being stretched by an epitaxial lateral overgrowth of this first 110, the bottom of this first 110 and second portion 113 at grade, the height of this second portion 113 is higher than first 110.The flanging 13 of each radiating fin 10 is outwards vertically extended by the radiating fin 10 at its place respectively, and the end of each flanging 13 is resisted against respectively on the body 11 of the radiating fin 10 that is adjacent.
Please consult simultaneously Fig. 2 and Fig. 3, outermost two radiating fins 10 are respectively the first radiating fin 10a and the second radiating fin 10b in this radiator 100, the radiating fin 10 adjacent with this first radiating fin 10a is the 3rd radiating fin 10c, and the radiating fin 10 adjacent with this second radiating fin 10b is the hot fin 10d that scatters.Between this first radiating fin 10a and the 3rd radiating fin 10c and the second radiating fin 10b and scatter and be respectively equipped with a projection 15,16 between the hot fin 10d.In the present embodiment, this projection 15 is protruded and its end is resisted against on the 3rd radiating fin 10c to the direction of the 3rd radiating fin 10c by the first radiating fin 10a, and this projection 16 is protruded and its end is resisted against on the second radiating fin 10b to the direction of the second radiating fin 10b by the hot fin 10d that scatters.Described protruding 15,16 cross section is trapezoidal setting, and is formed by the first radiating fin 10a and the integral middle punching press that scatters hot fin 10d respectively.Described protruding 15,16 second portions 113 and that are formed at respectively this first radiating fin 10a scatter on the second portion 113 of hot fin 10d, and extend to opposite side by a side of each second portion 113 along the direction parallel with flanging 13 respectively.On this radiator 100 since be provided with the projection 15,16, and each projection 15,16 is supported in respectively the inboard of this radiator 100 outermost the first radiating fin 10a and the second radiating fin 10b, thereby improve the structural strength of this radiator 100, collided by miscellaneous part during the both sides that prevent from assembling radiator 100 and be out of shape, and then guarantee that it has preferably heat dispersion.
During implementation, the structure of this radiator 100 is not limited to the situation of the present embodiment, the body 11 of each radiating fin 10 can be divided into highly different first 110 and second portion 113, also can make whole body 11 be highly mutually same plate body, described protruding 15 can be protruded and are resisted against on the 3rd radiating fin 10c to the direction of the 3rd radiating fin 10c by the first radiating fin 10a, also can be protruded and are resisted against on the first radiating fin 10a to the direction of the first radiating fin 10a by the 3rd radiating fin 10c.In like manner, this projection 16 can be protruded and is resisted against on the second radiating fin 10b to the direction of the second radiating fin 10b by the hot fin 10d that scatters, and also can be protruded and be resisted against the to the direction that scatters hot fin 10d by the second radiating fin 10b to scatter on the hot fin 10d.Described protruding 15,16 setting position and development length also are not limited to the situation of the present embodiment, be described protruding 15,16 can only be located on the second portion 113 of body 11, also can be located at simultaneously in the first 110, can extend to its middle part along its bearing of trend by a side of radiating fin 10, also can be by a side of radiating fin 10 along its opposite side.Described protruding 15,16 cross section can be trapezoidal, also can be rectangle or other shapes, and described protruding 15,16 can be one, also can be two or more.
Be understandable that, for the person of ordinary skill of the art, can make change and the distortion that other various pictures are answered by technical conceive according to the present invention, and all these change the protection range that all should belong to claim of the present invention with distortion.
Claims (10)
1. radiator, comprise some radiating fins that are arranged in parallel, it is characterized in that: outermost two radiating fins are respectively the first radiating fin and the second radiating fin in the described radiating fin, the radiating fin adjacent with this first radiating fin is the 3rd radiating fin, the radiating fin adjacent with this second radiating fin is the hot fin that scatters, a wherein radiating fin of this first radiating fin and the 3rd radiating fin is provided with to another radiating fin and protrudes and be resisted against projection on another radiating fin, and scatter a wherein radiating fin between the hot fin of described the second radiating fin and the is provided with to another radiating fin protrusion and is resisted against projection on another radiating fin.
2. radiator as claimed in claim 1 is characterized in that: described projection is outwardly and be resisted against respectively on the 3rd radiating fin and the second radiating fin by the first radiating fin and hot fin that scatters respectively.
3. radiator as claimed in claim 1 is characterized in that: described projection is outwardly by the first radiating fin and the second radiating fin and be resisted against respectively the 3rd radiating fin and and scatter on the hot fin respectively.
4. radiator as claimed in claim 1 is characterized in that: described projection is outwardly and be resisted against respectively on the first radiating fin and the second radiating fin by the 3rd radiating fin and the hot fin that scatters respectively.
5. such as any one described radiator of claim 1 to 4, it is characterized in that: the cross section of described projection is trapezoidal setting.
6. such as any one described radiator of claim 1 to 4, it is characterized in that: described projection is formed by the radiating fin integrated punching at its place.
7. such as any one described radiator of claim 1 to 4, it is characterized in that: described projection is located at the middle part of the radiating fin at its place.
8. such as any one described radiator of claim 1 to 4, it is characterized in that: each radiating fin comprises a body and a flanging that is extended to the direction of the radiating fin that is adjacent by top and the bottom of this body, and described projection is extended along the direction parallel with flanging.
9. such as any one described radiator of claim 1 to 4, it is characterized in that: the flanging that each radiating fin comprises a body and the direction of the radiating fin that is adjacent by top and the bottom of body is respectively extended.
10. radiator as claimed in claim 9, it is characterized in that: described body comprises a first and the second portion of being stretched by first's one epitaxial lateral overgrowth, the height of this second portion is higher than first, and described projection is located on the second portion of radiating fin at its place.
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2011101743099A CN102858132A (en) | 2011-06-27 | 2011-06-27 | Radiator |
TW100122520A TWI513950B (en) | 2011-06-27 | 2011-06-28 | Heat sink |
US13/220,687 US20120325452A1 (en) | 2011-06-27 | 2011-08-30 | Heat sink |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2011101743099A CN102858132A (en) | 2011-06-27 | 2011-06-27 | Radiator |
Publications (1)
Publication Number | Publication Date |
---|---|
CN102858132A true CN102858132A (en) | 2013-01-02 |
Family
ID=47360725
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2011101743099A Pending CN102858132A (en) | 2011-06-27 | 2011-06-27 | Radiator |
Country Status (3)
Country | Link |
---|---|
US (1) | US20120325452A1 (en) |
CN (1) | CN102858132A (en) |
TW (1) | TWI513950B (en) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2429859Y (en) * | 2000-06-12 | 2001-05-09 | 富准精密工业(深圳)有限公司 | Radiator assembly |
US20020139515A1 (en) * | 1999-07-02 | 2002-10-03 | Kaveh Azar | Heat sink with textured regions |
US6595275B1 (en) * | 2002-07-02 | 2003-07-22 | Waffer Technology Corp. | Heat sink assembly |
CN1959590A (en) * | 2005-11-02 | 2007-05-09 | 富准精密工业(深圳)有限公司 | Heat sink |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20020056544A1 (en) * | 1999-07-23 | 2002-05-16 | Kaveh Azar | Heat sink with radial shape |
US6655448B1 (en) * | 2002-05-16 | 2003-12-02 | Hai-Ching Lin | Radiator with heat dissipation pieces connected in series |
TWM269700U (en) * | 2004-12-29 | 2005-07-01 | Chao-Chuan Chen | Fin set of heat sink |
US7568518B2 (en) * | 2006-07-21 | 2009-08-04 | Furui Precise Component (Kunshan) Co., Ltd. | Heat sink |
US7779894B2 (en) * | 2006-07-31 | 2010-08-24 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device |
US20080135215A1 (en) * | 2006-12-06 | 2008-06-12 | Foxconn Technology Co., Ltd. | Heat dissipation device |
TW200847908A (en) * | 2007-05-28 | 2008-12-01 | Delta Electronics Inc | Heat dissipating fin assembly and assembling method thereof |
CN101370371B (en) * | 2007-08-17 | 2011-06-08 | 富准精密工业(深圳)有限公司 | Heat radiation model set and radiator used for the same |
TWM346778U (en) * | 2008-07-10 | 2008-12-11 | Lian Cherng Entpr Co Ltd | Heat sinking fin set |
CN101945560B (en) * | 2009-07-07 | 2014-04-02 | 富瑞精密组件(昆山)有限公司 | Heat abstractor |
CN102006761A (en) * | 2009-08-28 | 2011-04-06 | 富准精密工业(深圳)有限公司 | Heat radiator |
CN102006762B (en) * | 2009-08-31 | 2014-12-24 | 富瑞精密组件(昆山)有限公司 | Heat-radiating device |
-
2011
- 2011-06-27 CN CN2011101743099A patent/CN102858132A/en active Pending
- 2011-06-28 TW TW100122520A patent/TWI513950B/en not_active IP Right Cessation
- 2011-08-30 US US13/220,687 patent/US20120325452A1/en not_active Abandoned
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20020139515A1 (en) * | 1999-07-02 | 2002-10-03 | Kaveh Azar | Heat sink with textured regions |
CN2429859Y (en) * | 2000-06-12 | 2001-05-09 | 富准精密工业(深圳)有限公司 | Radiator assembly |
US6595275B1 (en) * | 2002-07-02 | 2003-07-22 | Waffer Technology Corp. | Heat sink assembly |
CN1959590A (en) * | 2005-11-02 | 2007-05-09 | 富准精密工业(深圳)有限公司 | Heat sink |
Also Published As
Publication number | Publication date |
---|---|
TWI513950B (en) | 2015-12-21 |
TW201300721A (en) | 2013-01-01 |
US20120325452A1 (en) | 2012-12-27 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
RJ01 | Rejection of invention patent application after publication |
Application publication date: 20130102 |
|
RJ01 | Rejection of invention patent application after publication |