JP6964337B2 - Heat sink and electronic component package - Google Patents

Heat sink and electronic component package Download PDF

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JP6964337B2
JP6964337B2 JP2017229372A JP2017229372A JP6964337B2 JP 6964337 B2 JP6964337 B2 JP 6964337B2 JP 2017229372 A JP2017229372 A JP 2017229372A JP 2017229372 A JP2017229372 A JP 2017229372A JP 6964337 B2 JP6964337 B2 JP 6964337B2
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elongated hole
base portion
heat sink
space
surrounding
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JP2019102538A (en
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洋輔 中村
勝 坂本
宗佑 松浦
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Kaga Inc
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Kaga Inc
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Priority to PCT/JP2018/025384 priority patent/WO2019106873A1/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Description

本発明は、電子部品等の熱を放熱するようにしたヒートシンク及び電子部品パッケージに関するものである。 The present invention relates to a heat sink and an electronic component package that dissipate heat from electronic components and the like.

従来、この種の発明には、例えば特許文献１に記載されるように、ベース部と、該ベース部の左右端から上方へ突出する突片と、前記各突片から外向きに突出する複数のフィンと、左右の突片間にてベース部上に装着されたパワートランジスタとを備え、略コの字状に構成された放熱装置がある。 Conventionally, in this type of invention, for example, as described in Patent Document 1, a base portion, protrusions protruding upward from the left and right ends of the base portion, and a plurality of protrusions protruding outward from the respective protrusions. There is a heat radiating device which is provided with a fin and a power transistor mounted on the base portion between the left and right projecting pieces, and is configured in a substantially U shape.

実開昭５９−１０３４９６（第１図）Actual Kaisho 59-103496 (Fig. 1)

前記従来技術のように、立体的に構成された放熱装置では、外気に曝されるフィン等の表面積が比較的大きいことなどから、ある程度の効果的な放熱性能が期待される。
しかしながら、前記突片や複数のフィン等が、周囲の外気の流れを阻害してしまい、停滞した外気によって予期しない温度上昇を発生させてしまうおそれもある。 In a three-dimensionally configured heat radiating device as in the conventional technique, a certain degree of effective heat radiating performance is expected because the surface area of fins and the like exposed to the outside air is relatively large.
However, the projectiles, the plurality of fins, and the like may obstruct the flow of the surrounding outside air, and the stagnant outside air may cause an unexpected temperature rise.

このような課題に鑑みて、本発明の一つは、以下の構成を具備するものである。
一方側の面を電子部品接触面にした板状のベース部と、前記ベース部を境にした他方側の空間を囲むようにして前記ベース部の周縁側から突出する囲繞部とを備え、前記囲繞部は、貫通状の長孔と、前記空間の外側において前記長孔の長縁部に沿って突出する突片部とを有し、前記長孔が長方形であり、前記突片部が前記長孔に沿う長方形筒状に構成されていることを特徴とするヒートシンク。 In view of such a problem, one of the present inventions has the following configuration.
A plate-shaped base portion having one surface as an electronic component contact surface and a surrounding portion protruding from the peripheral edge side of the base portion so as to surround the space on the other side with the base portion as a boundary are provided. has a through-shaped long hole, possess a protruding piece that protrudes along the long edge portion of the slot on the outside of the space, the long hole is rectangular, the projecting piece portion is the elongated hole heat sink characterized that you have been configured in a rectangular tube shape along the.

本発明は、以上説明したように構成されているので、放熱性を向上することができる。 Since the present invention is configured as described above, heat dissipation can be improved.

本発明に係るヒートシンクの一例を示す斜視図である。It is a perspective view which shows an example of the heat sink which concerns on this invention. 図１における（II）−（II）線に沿う断面図である。It is sectional drawing which follows the line (II)-(II) in FIG. 本発明に係るヒートシンクの他例を示す斜視図である。It is a perspective view which shows another example of the heat sink which concerns on this invention. 本発明に係るヒートシンクの他例を示す斜視図である。It is a perspective view which shows another example of the heat sink which concerns on this invention. 本発明に係るヒートシンクの他例を示す斜視図である。It is a perspective view which shows another example of the heat sink which concerns on this invention. 図５における（VI）−（VI）線に沿う断面図である。It is sectional drawing which follows the line (VI)-(VI) in FIG. 本発明に係るヒートシンクの他例を示す斜視図である。It is a perspective view which shows another example of the heat sink which concerns on this invention. 図７における（VIII）−（VIII）線に沿う断面図である。It is sectional drawing which follows the line (VIII)-(VIII) in FIG. 本発明に係るヒートシンクの他例を示す斜視図である。It is a perspective view which shows another example of the heat sink which concerns on this invention. 本発明に係るヒートシンクの他例を示す斜視図である。It is a perspective view which shows another example of the heat sink which concerns on this invention. 図５のヒートシンクの（VI）−（VI）線に沿う断面図上において、コンピュータ解析による空気の流れを示す図である。It is a figure which shows the air flow by the computer analysis on the cross-sectional view along the line (VI)-(VI) of the heat sink of FIG. 比較例のヒートシンクを示す斜視図である。It is a perspective view which shows the heat sink of the comparative example.

本実施の形態では、以下の特徴を開示している。
第一の特徴は、一方側の面を電子部品接触面にした板状のベース部と、前記ベース部を境にした他方側の空間を囲むようにして前記ベース部の周縁側から突出する囲繞部とを備え、前記囲繞部は、貫通状の長孔と、前記空間の外側において前記長孔の長縁部に沿って突出する突片部とを有する。 In this embodiment, the following features are disclosed.
The first feature is a plate-shaped base portion having one surface as an electronic component contact surface, and a surrounding portion protruding from the peripheral edge side of the base portion so as to surround the space on the other side with the base portion as a boundary. The surrounding portion has a penetrating elongated hole and a projecting piece portion that protrudes along the long edge portion of the elongated hole outside the space.

第二の特徴は、前記長孔が長方形であり、前記突片部が前記長孔に沿う長方形筒状に構成されている（図１、図５及び図７参照）。 The second feature is that the elongated hole is rectangular, and the projecting piece portion is formed in a rectangular tubular shape along the elongated hole (see FIGS. 1, 5 and 7).

第三の特徴は、前記長孔が長方形であり、前記突片部が前記長孔の両側の長縁部と片側の短縁部に沿って凹状に構成されている（図３及び図９参照）。 The third feature is that the elongated hole is rectangular, and the projecting piece portion is formed to be concave along the long edge portions on both sides of the elongated hole and the short edge portion on one side (see FIGS. 3 and 9). ).

第四の特徴として、前記突片部は、前記長孔の両側の長縁部に沿って二つ設けられ、これら二つの突片部は、前記長孔を挟むようにして両側に分かれている（図４及び図１０参照）。 As a fourth feature, two projecting pieces are provided along the long edges on both sides of the elongated hole, and these two projecting pieces are divided on both sides so as to sandwich the elongated hole (FIG. 4 and FIG. 10).

第五の特徴として、前記長孔は、その短手方向へ並ぶように複数設けられ、前記長孔毎に対応して前記突片部が設けられている（図１参照）。 As a fifth feature, a plurality of the elongated holes are provided so as to be arranged in the lateral direction thereof, and the projecting piece portion is provided corresponding to each of the elongated holes (see FIG. 1).

第六の特徴として、前記囲繞部は、前記ベース部の周縁部から前記他方側へ立ち上がった平板状の囲繞片を有し、前記長孔は、前記囲繞片を厚み方向へ貫通しており、前記突片部は、前記囲繞片から前記空間とは逆側へ突出している（図１〜図４参照）。 As a sixth feature, the surrounding portion has a flat plate-shaped surrounding piece that rises from the peripheral edge portion of the base portion to the other side, and the elongated hole penetrates the surrounding piece in the thickness direction. The projecting piece portion projects from the surrounding piece to the opposite side of the space (see FIGS. 1 to 4).

第七の特徴として、前記囲繞部は、前記ベース部の周縁部から前記空間の外側へ突出する鍔部を有し、前記長孔は、前記鍔部を厚み方向へ貫通しており、前記突片部は、前記鍔部から反電子部品接触面側へ突出している（図５〜図１０参照）。 As a seventh feature, the surrounding portion has a flange portion that protrudes from the peripheral edge portion of the base portion to the outside of the space, and the elongated hole penetrates the flange portion in the thickness direction, and the protrusion. One portion protrudes from the collar portion toward the contact surface side of the anti-electronic component (see FIGS. 5 to 10).

第八の特徴として、上記ヒートシンクを用いた電子部品パッケージであって、前記ベース部の電子部品接触面には、電子部品が接触して支持されている（図２、図６及び図８参照）。 The eighth feature is an electronic component package using the heat sink, in which the electronic component is contacted and supported on the electronic component contact surface of the base portion (see FIGS. 2, 6 and 8). ..

なお、後述する実施態様では、以下の構成要件のみを必須とした発明も開示している。
すなわち、この発明は、一方側の面を電子部品接触面にした板状のベース部と、前記ベース部を境にした他方側の空間を囲むようにして前記ベース部の周縁側から突出する囲繞部とを備えたヒートシンクであって、前記囲繞部は、前記ベース部の周縁部から前記空間の外側へ突出する鍔部を有し、前記鍔部には、該鍔部を厚み方向へ貫通する通気孔と、前記通気孔の内縁部から反電子部品接触面側へ突出する突片部とが設けられている（図５〜図１０参照）。ここで、前記通気孔には、例えば、長孔や、真円の孔、多角形状の孔、その他の形状の孔等を含む。
この発明によれば、前記通気孔に前記空間の外側の比較的低温の空気が流通し、この空気に対し、前記突片部の熱が効果的に放熱される。このため、例えば、ベース部厚み方向の全長が比較的小さい扁平状に形成した場合でも、その放熱性能が良好である。 In addition, in the embodiment described later, an invention in which only the following constituent requirements are indispensable is also disclosed.
That is, in the present invention, a plate-shaped base portion having one surface as an electronic component contact surface and a surrounding portion protruding from the peripheral edge side of the base portion so as to surround the space on the other side with the base portion as a boundary. The surrounding portion has a flange portion that protrudes from the peripheral edge portion of the base portion to the outside of the space, and the flange portion has a vent hole that penetrates the flange portion in the thickness direction. And a projecting piece portion protruding from the inner edge portion of the ventilation hole toward the contact surface side of the anti-electronic component (see FIGS. 5 to 10). Here, the ventilation holes include, for example, elongated holes, perfect circular holes, polygonal holes, holes of other shapes, and the like.
According to the present invention, relatively low temperature air outside the space flows through the ventilation holes, and the heat of the projecting pieces is effectively dissipated to the air. Therefore, for example, even when the base portion is formed in a flat shape having a relatively small overall length in the thickness direction, its heat dissipation performance is good.

＜第一の実施形態＞
次に、上記特徴を有する具体的な実施態様について、図面に基づいて詳細に説明する。
図１及び図２に示すヒートシンクＡは、一方側（図１によれば下方側）の面を電子部品接触面１１とした板状のベース部１０と、ベース部１０を境にした他方側（図１によれば上方側）の空間Ｓ１を囲むようにして、ベース部１０の周縁側から立ち上がった囲繞部２０とを一体に具備している。
このヒートシンクＡの原材料には、単一の金属元素からなる純金属や、複数の金属元素あるいは金属元素と非金属元素から成る合金を含む。ここで、前記金属元素の具体例としては、アルミニウム、銅、ステンレス、ニッケル又はマグネシウム等が挙げられる。
また、このヒートシンクＡは、単一材料から形成してもよいし、二つ以上の異なる材料を一体的に組み合わせた複合材料から形成してもよい。
そして、図示例のヒートシンクＡは、電子部品接触面１１を電子部品Ｘ（例えば、ＣＰＵや、トランジスタ、サイリスタ、その他の半導体や電子部品等）に接触させて電子部品パッケージ（図２参照）を構成する。 <First Embodiment>
Next, a specific embodiment having the above characteristics will be described in detail with reference to the drawings.
The heat sink A shown in FIGS. 1 and 2 has a plate-shaped base portion 10 having one side (lower side according to FIG. 1) as an electronic component contact surface 11 and the other side (with the base portion 10 as a boundary). According to FIG. 1, it is integrally provided with a surrounding portion 20 rising from the peripheral edge side of the base portion 10 so as to surround the space S1 (on the upper side).
The raw material of the heat sink A includes a pure metal composed of a single metal element, a plurality of metal elements, or an alloy composed of a metal element and a non-metal element. Here, specific examples of the metal element include aluminum, copper, stainless steel, nickel, magnesium and the like.
Further, the heat sink A may be formed from a single material, or may be formed from a composite material in which two or more different materials are integrally combined.
The heat sink A in the illustrated example constitutes an electronic component package (see FIG. 2) by bringing the electronic component contact surface 11 into contact with the electronic component X (for example, a CPU, a transistor, a thyristor, other semiconductors, electronic components, etc.). do.

ベース部１０は、矩形平板状（図示例によれば正方形平板状）に形成され、その厚み方向の一方側に位置する面を、平坦状に形成して電子部品Ｘに接触させるための電子部品接触面１１としている。
このベース部１０の他方側（反対側）の面は、図示例によれば、貫通孔や凹凸のない平坦状に形成されるが、必要に応じて、適宜形状の放熱フィン等を設けることも可能である。 The base portion 10 is formed in a rectangular flat plate shape (square flat plate shape according to the illustrated example), and an electronic component for forming a flat surface located on one side in the thickness direction thereof into contact with the electronic component X. The contact surface 11 is used.
According to the illustrated example, the other side (opposite side) surface of the base portion 10 is formed in a flat shape without through holes or irregularities, but if necessary, heat radiation fins or the like having an appropriate shape may be provided. It is possible.

囲繞部２０は、貫通状の長孔２１ａを有する複数の囲繞片２１と、空間Ｓ１及び囲繞片２１の外側にて長孔２１ａの長縁部２１ａ１に沿って突出する突片部２２，２３とを有し、空間Ｓ１を四方から囲むとともに、空間Ｓ１の反ベース部側（図１によれば上方）を開口している。 The surrounding portion 20 includes a plurality of surrounding pieces 21 having a penetrating elongated hole 21a, and projecting pieces 22 and 23 protruding along the long edge portion 21a1 of the elongated hole 21a outside the space S1 and the surrounding piece 21. The space S1 is surrounded from all sides, and the anti-base portion side (upper side according to FIG. 1) of the space S1 is opened.

囲繞片２１は、ベース部１０の周縁部（図示例によれば各辺部）から空間Ｓ１を囲むようにして、反熱源側（電子部品ａ側に対する逆側）へ立ち上がっている。
この囲繞片２１は、図示例によれば、ベース部１０の各辺に対応するように複数設けられ、ベース部１０に対し略垂直に立ち上がっている。
各囲繞片２１は、矩形平板状に形成される。この囲繞片２１には、厚み方向へ貫通する長孔２１ａが設けられる。 The surrounding piece 21 rises from the peripheral edge portion (each side portion according to the illustrated example) of the base portion 10 to the antiheat source side (opposite side to the electronic component a side) so as to surround the space S1.
According to the illustrated example, a plurality of surrounding pieces 21 are provided so as to correspond to each side of the base portion 10, and stand up substantially perpendicular to the base portion 10.
Each surrounding piece 21 is formed in a rectangular flat plate shape. The surrounding piece 21 is provided with an elongated hole 21a penetrating in the thickness direction.

長孔２１ａは、交差する二つの径方向の寸法が異なる孔であり、図示例によれば、ベース部１０に対する垂直方向の寸法が水平方向の寸法よりも長い長方形状に形成される。この長孔２１ａは、間隔を置いて略平行する二つの長縁部２１ａ１と、これら長縁部２１ａ１の一端側と他端側にそれぞれ直角に接続された二つの短縁部２１ａ２とを有する。
そして、前記構成の長孔２１ａは、その短手方向へ並ぶように、所定のピッチで複数（図１の一例によれば一つの囲繞片２１毎に７つ）配設される。 The elongated hole 21a is a hole having two intersecting radial dimensions, and according to the illustrated example, the elongated hole 21a is formed in a rectangular shape in which the dimension in the vertical direction with respect to the base portion 10 is longer than the dimension in the horizontal direction. The elongated holes 21a have two long edge portions 21a1 that are substantially parallel to each other at intervals, and two short edge portions 21a2 that are connected at right angles to one end side and the other end side of the long edge portions 21a1.
Then, a plurality of elongated holes 21a having the above configuration are arranged at a predetermined pitch (7 for each surrounding piece 21 according to the example of FIG. 1) so as to be arranged in the lateral direction thereof.

突片部２２は、各長孔２１ａの両側の長縁部２１ａ１に沿う長尺な矩形平板状に形成され、長縁部２１ａ１から空間Ｓ１とは逆側へ突出している。
また、突片部２３は、突片部２２よりも短尺な矩形平板状に形成され、長孔２１ａの両側の短縁部２１ａ２から空間Ｓ１とは逆側へ突出している。
そして、これら突片部２２，２３は、長孔２１ａに沿う長方形筒状の長尺筒部ａを構成している。この長尺筒部ａの内面は、長孔２１ａ内面に連続している。 The projecting piece portion 22 is formed in a long rectangular flat plate shape along the long edge portions 21a1 on both sides of each elongated hole 21a, and protrudes from the long edge portion 21a1 to the side opposite to the space S1.
Further, the projecting piece portion 23 is formed in a rectangular flat plate shape shorter than the projecting piece portion 22, and projects from the short edge portions 21a2 on both sides of the elongated hole 21a to the side opposite to the space S1.
The projecting piece portions 22 and 23 form a rectangular tubular long cylinder portion a along the elongated hole 21a. The inner surface of the long tubular portion a is continuous with the inner surface of the elongated hole 21a.

隣接する二つの長尺筒部ａ，ａは、図１に示すように、これらの間の突片部２２を共用して一体化された頑強構造に構成される。
また、隣接する二つの長尺筒部ａ，ａは、両側（図示例によれば上側と下側）の突片部２３，２３同士を連続するように接続している。 As shown in FIG. 1, the two adjacent long tubular portions a and a are configured to have a robust structure in which a projecting piece portion 22 between them is shared and integrated.
Further, the two adjacent long cylinder portions a and a are connected so as to be continuous with the projecting piece portions 23 and 23 on both sides (upper side and lower side according to the illustrated example).

次に、上記構成のヒートシンクＡについて、その特徴的な作用効果を詳細に説明する。
ベース部１０の電子部品接触面１１を、発熱中の電子部品Ｘに接触させた状態（図２参照）において、周囲の空気温度は、四方が囲まれ且つ電子部品Ｘに比較的近い囲繞部２０内の空間Ｓ１よりも、囲繞部２０外側の空間Ｓ２の方が低くなる。また、空間Ｓ１の外側の空気は、長孔２１ａ及び長尺筒部ａを通過して、流動し易い。
このため、長尺筒部ａを構成する突片部２２，２２の熱が、長尺筒部ａ内を流動する比較的低温の空気に熱伝達し、効果的な放熱が行われる。 Next, the characteristic action and effect of the heat sink A having the above configuration will be described in detail.
In a state where the electronic component contact surface 11 of the base portion 10 is in contact with the electronic component X that is generating heat (see FIG. 2), the ambient air temperature is surrounded on all sides and is relatively close to the electronic component X. The space S2 outside the surrounding portion 20 is lower than the space S1 inside. Further, the air outside the space S1 easily flows through the elongated hole 21a and the elongated tubular portion a.
Therefore, the heat of the projecting pieces 22 and 22 constituting the long cylinder portion a is transferred to the relatively low temperature air flowing in the long cylinder portion a, and effective heat dissipation is performed.

なお、ヒートシンクＡの周囲の空気は自然対流により流動させればよいが、他例としては、適宜箇所に送風機を設け、周囲の空気を強制的に対流させて、より効果的に放熱が行われるようにしてもよい。 The air around the heat sink A may be flowed by natural convection, but as another example, a blower is provided at an appropriate place to forcibly convection the surrounding air to dissipate heat more effectively. You may do so.

＜第二の実施態様＞
次に、本発明に係るヒートシンクの他の実施態様について説明する。なお、以下に示す実施態様は、上述した実施態様を一部変更したものであるため、主にその変更部分について詳述し、共通部分の説明は同一符号を用いる等して適宜省略する。 <Second embodiment>
Next, another embodiment of the heat sink according to the present invention will be described. In addition, since the embodiment shown below is a partial modification of the above-described embodiment, the modified portion will be mainly described in detail, and the description of the common portion will be omitted as appropriate by using the same reference numerals and the like.

図３に示すヒートシンクＢは、上記構成のヒートシンクＡに対し、熱源側（ベース部１０側）の突片部２３を省いたものである。
すなわち、このヒートシンクＢでは、各長孔２１ａの両側の長縁部２１ａ１，２１ａ１に沿う長尺状の突片部２２，２２と、同長孔２１ａの一方（図示例によれば上側）に位置する短尺状の突片部２３とによって、空間Ｓ１及び囲繞片２１の外側へ突出する凹状壁部ｂを構成している。
このヒートシンクＢによれば、凹状壁部ｂを構成する突片部２２，２３の熱が、凹状壁部ｂ内を流動する比較的低温の空気に熱伝達し、効果的な放熱が行われる。 The heat sink B shown in FIG. 3 is obtained by omitting the projecting piece portion 23 on the heat source side (base portion 10 side) with respect to the heat sink A having the above configuration.
That is, in this heat sink B, the elongated projecting pieces 22 and 22 along the long edge portions 21a1, 21a1 on both sides of each elongated hole 21a and one of the elongated holes 21a (upper side according to the illustrated example) are located. The short projecting piece portion 23 forms a concave wall portion b projecting to the outside of the space S1 and the surrounding piece 21.
According to this heat sink B, the heat of the projecting pieces 22 and 23 constituting the concave wall portion b is transferred to the relatively low temperature air flowing in the concave wall portion b, and effective heat dissipation is performed.

なお、図示例のヒートシンクＢでは、上記ヒートシンクＡに対し反熱源側の突片部２３を省いたが、他例としては、ヒートシンクＡに対し熱源側の突片部２３を省いた態様（図示の凹状壁部ｂが上下逆の態様）とすることも可能である。 In the heat sink B of the illustrated example, the projecting piece portion 23 on the antiheat source side is omitted from the heat sink A, but as another example, the projecting piece portion 23 on the heat source side is omitted from the heat sink A (not shown). It is also possible that the concave wall portion b is upside down).

＜第三の実施態様＞
図４に示すヒートシンクＣは、上記構成のヒートシンクＡに対し、両側の突片部２３，２３を省いたものである。
すなわち、このヒートシンクＣでは、各長孔２１ａの両側の長縁部２１ａ１，２１ａ１に沿う長尺状の突片部２２，２２が、長孔２１ａを間に挟むようにして二つに分かれ、空間Ｓ１及び囲繞片２１の外側へ略平行に平行フィンｃを突出している。
このヒートシンクＣによれば、上記ヒートシンクＡと略同様に、平行フィンｃを構成する突片部２２，２２の熱が、これら突片部間を流動する比較的低温の空気に熱伝達し、効果的な放熱が行われる。 <Third embodiment>
The heat sink C shown in FIG. 4 is obtained by omitting the projecting pieces 23, 23 on both sides of the heat sink A having the above configuration.
That is, in this heat sink C, the elongated projecting pieces 22 and 22 along the long edge portions 21a1, 21a1 on both sides of each elongated hole 21a are divided into two so as to sandwich the elongated hole 21a in between, and the space S1 and The parallel fins c project substantially parallel to the outside of the surrounding piece 21.
According to the heat sink C, substantially similar to the heat sink A, the heat of the projecting pieces 22 and 22 constituting the parallel fins c is transferred to the relatively low temperature air flowing between the projecting pieces, which is effective. Heat dissipation is performed.

＜第四の実施態様＞
図５に示すヒートシンクＤは、上記ヒートシンクＡと同様の金属材料から形成され、一方側（図６の下方側）の面を電子部品接触面１１とした板状のベース部１０と、ベース部１０を境にした他方側（図１によれば上方側）の空間Ｓ１を囲むようにして、ベース部１０の周縁側から突出する囲繞部３０とを一体に具備し、ベース部１０の電子部品接触面１１を電子部品Ｘに接触させる。 <Fourth embodiment>
The heat sink D shown in FIG. 5 is formed of the same metal material as the heat sink A, and has a plate-shaped base portion 10 having a surface on one side (lower side in FIG. 6) as an electronic component contact surface 11 and a base portion 10. A surrounding space S1 protruding from the peripheral edge side of the base portion 10 is integrally provided so as to surround the space S1 on the other side (upper side according to FIG. 1), and the electronic component contact surface 11 of the base portion 10 is provided. Is brought into contact with the electronic component X.

囲繞部３０は、ベース部１０の周縁部（図示例によれば各辺部）から空間Ｓ１の外側へ突出する鍔部３１と、鍔部３１から反電子部品接触面側（図６の上方）へ突出する突片部３２，３３とを有する。 The surrounding portion 30 includes a flange portion 31 projecting outward from the peripheral portion (each side portion according to the illustrated example) of the base portion 10 and an anti-electronic component contact surface side (upper side of FIG. 6) from the collar portion 31. It has projecting pieces 32 and 33 protruding toward.

鍔部３１は、図６に示すように、ベース部１０各片部において、ベース部１０内面から反電子部品接触面側へ突出し、さらにその突端から空間Ｓ１の外側へ突出する断面逆Ｌ字状に形成され、図示例によれば、ベース部１０の各片部から略垂直に立ち上がった立上り片部３１ａと、該立上り片部３１ａの突端からベース部１０と略平行に反空間Ｓ１側へ突出する平板部３１ｂとを有する。 As shown in FIG. 6, the flange portion 31 has an inverted L-shaped cross section that protrudes from the inner surface of the base portion 10 toward the anti-electronic component contact surface side and further projects from the tip to the outside of the space S1 in each piece of the base portion 10. According to the illustrated example, the rising piece portion 31a rising substantially vertically from each piece of the base portion 10 and protruding toward the anti-space S1 side substantially parallel to the base portion 10 from the tip of the rising piece portion 31a. It has a flat plate portion 31b to be formed.

鍔部３１の平板部３１ｂには、その厚み方向へ貫通するように長孔３１ｃ（通気孔）が設けられる。
この長孔３１ｃは、上記長孔２１ａと略同様に、交差する二つの径方向の寸法が異なる孔であり、図示例によれば、ベース部１０の一辺に沿う寸法が該一辺に直交する寸法よりも長い長方形状に形成され、間隔を置いて略平行する二つの長縁部３１ｃ１（図６参照）と、これら長縁部３１ｃ１の一端側と他端側にそれぞれ直角に接続された二つの短縁部３１ｃ２とを有する。
この長孔３１ｃは、ベース部１０の各辺に沿って複数（図５及び図６の一例によれば２つ）設けられる。 The flat plate portion 31b of the flange portion 31 is provided with an elongated hole 31c (vent hole) so as to penetrate in the thickness direction thereof.
Similar to the elongated hole 21a, the elongated hole 31c is a hole having two intersecting radial dimensions, and according to the illustrated example, the dimension along one side of the base portion 10 is orthogonal to the one side. Two long edge portions 31c1 (see FIG. 6) formed in a longer rectangular shape and substantially parallel to each other at intervals, and two long edge portions 31c1 connected at right angles to one end side and the other end side, respectively. It has a short edge portion 31c2.
A plurality of elongated holes 31c (two according to an example of FIGS. 5 and 6) are provided along each side of the base portion 10.

また、突片部３２は、各長孔３１ｃの両側の長縁部３１ｃ１から反熱源側（反電子部品接触面側）へ突出している。同様に、突片部３３は、同長孔３１ｃの両側の短縁部３１ｃ２から反熱源側へ突出している。
そして、これら突片部３２，３３の各々は、図５に例示するように、開口側から視て長方形状の長尺筒部ｄを構成している。 Further, the projecting piece portion 32 projects from the long edge portions 31c1 on both sides of each elongated hole 31c toward the anti-heat source side (anti-electronic component contact surface side). Similarly, the projecting piece portion 33 projects from the short edge portions 31c2 on both sides of the elongated hole 31c toward the antiheat source side.
Then, as illustrated in FIG. 5, each of these projecting piece portions 32 and 33 constitutes a rectangular long cylinder portion d when viewed from the opening side.

ベース部１０の一辺に沿って隣接する二つの長尺筒部ｄ，ｄは、図５に示すように、これらの間の突片部３３を共用して一体化された頑強構造に構成される。
隣接する二つの長尺筒部ｄ，ｄは、短手方向両側の突片部３２，３２同士を、ベース部１０の一辺に沿って連続するように接続している。 As shown in FIG. 5, the two long tubular portions d and d adjacent to each other along one side of the base portion 10 are configured to have a robust structure that is integrated by sharing the protruding piece portion 33 between them. ..
The two adjacent long cylinder portions d, d connect the projecting pieces 32, 32 on both sides in the lateral direction so as to be continuous along one side of the base portion 10.

また、図５の一例によれば、ベース部１０の一辺に沿う二つの長尺筒部ｄ，ｄと、該一辺に直交する他の一辺に沿う二つの長尺筒部ｄ，ｄとの間には、隙間ｇ１が設けられる。この隙間ｇ１は、長尺筒部ｄの成形性を良好にするとともに空気流通空間として機能する。 Further, according to an example of FIG. 5, between two long cylinder portions d and d along one side of the base portion 10 and two long cylinder portions d and d along the other side orthogonal to the one side. Is provided with a gap g1. The gap g1 improves the moldability of the long tubular portion d and functions as an air flow space.

次に、上記構成のヒートシンクＤについて、その特徴的な作用効果を詳細に説明する。
ベース部１０の電子部品接触面１１を発熱中の電子部品Ｘに接触させた状態（図６参照）において、周囲の空気温度は、四方が囲まれ且つ電子部品Ｘに比較的近い囲繞部３０内の空間Ｓ１よりも、囲繞部３０外側の空間Ｓ２の方が低くなる。また、空間Ｓ１の外側の空気は、長尺筒部ｄ及び長孔等を通過して、流動し易い。
このため、長尺筒部ｄを構成する突片部３２，３２の熱が、長尺筒部ｄ内を流動する比較的低温の空気に熱伝達し、効果的な放熱が行われる。
しかも、ヒートシンクＤによれば、上述したヒートシンクＡ〜Ｃに比較して、ベース部１０厚み方向の全長が小さい扁平状に形成することができ、例えば、比較的狭い間隔で平行に配設された二枚の基板間に当該ヒートシンクＤ及び電子部品Ｘを設ける場合等、省スペースな設置態様に対応することができる。 Next, the characteristic action and effect of the heat sink D having the above configuration will be described in detail.
In a state where the electronic component contact surface 11 of the base portion 10 is in contact with the electronic component X that is generating heat (see FIG. 6), the ambient air temperature is inside the surrounding portion 30 that is surrounded on all sides and is relatively close to the electronic component X. The space S2 outside the surrounding portion 30 is lower than the space S1 of. Further, the air outside the space S1 easily flows through the long cylinder portion d, the elongated hole, and the like.
Therefore, the heat of the projecting piece portions 32, 32 constituting the long cylinder portion d is transferred to the relatively low temperature air flowing in the long cylinder portion d, and effective heat dissipation is performed.
Moreover, according to the heat sink D, the base portion 10 can be formed in a flat shape having a smaller overall length in the thickness direction than the heat sinks A to C described above, and are arranged in parallel at relatively narrow intervals, for example. It is possible to cope with a space-saving installation mode such as a case where the heat sink D and the electronic component X are provided between the two substrates.

＜第五の実施態様＞
図７に示すヒートシンクＥは、上記構成のヒートシンクＤに対し、長尺筒部の配設態様が異なるものである。
このヒートシンクＥは、上記ヒートシンクＤと略同様に、ベース部１０の周縁部に、上記ヒートシンクＤのものと略同様の鍔部３１を具備している。
鍔部３１には、ベース部１０の対向する一方の両辺に沿って、複数の長尺筒部ｅが設けられ、前記一方の両辺に直交する他方の両辺に沿って、複数の長尺筒部ｆが設けられる。 <Fifth embodiment>
The heat sink E shown in FIG. 7 has a long tubular portion arranged differently from the heat sink D having the above configuration.
The heat sink E is provided with a flange portion 31 substantially similar to that of the heat sink D on the peripheral edge portion of the base portion 10 as in the heat sink D.
The collar portion 31 is provided with a plurality of long cylinder portions e along both opposite sides of the base portion 10, and a plurality of long cylinder portions along both sides orthogonal to both of the one side. f is provided.

一方の各長尺筒部ｅは、ベース部１０の一辺に沿う長尺状であって、図示例によれば、短手方向両側の突片部３２，３２と、長手方向両側の突片部３３，３３とを有する長方形筒状に形成される。この長尺筒部ｅの内面は、鍔部３１を貫通する長孔３１ｃ（図８参照）の内面に連続している。
この長尺筒部ｅは、ベース部１０の一辺に沿って複数（図示例によれば三つ）並設され、且つ前記一辺に対する交差方向に沿って複数（図示例によれば二つ）並設される。
前記一辺に沿って隣接する二つの長尺筒部ｅ，ｅは、その間に隙間ｇ２を有する。この隙間ｇ２は、各長尺筒部ｅの成形性を良好にするとともに空気流通空間としても機能する。
前記交差方向に隣接する二つの長尺筒部ｅ，ｅは、これらの間の突片部３２を共用して接続されている。 One of the long tubular portions e has a long shape along one side of the base portion 10, and according to the illustrated example, the projecting pieces 32, 32 on both sides in the lateral direction and the projecting portions 32 on both sides in the longitudinal direction. It is formed in a rectangular tubular shape having 33 and 33. The inner surface of the long tubular portion e is continuous with the inner surface of the elongated hole 31c (see FIG. 8) penetrating the flange portion 31.
A plurality (three according to the illustrated example) of the long tubular portions e are arranged side by side along one side of the base portion 10, and a plurality (two according to the illustrated example) are arranged side by side along the intersecting direction with respect to the one side. Will be set up.
The two long tubular portions e and e adjacent to each other along one side have a gap g2 between them. The gap g2 improves the moldability of each long tubular portion e and also functions as an air flow space.
The two long tubular portions e and e adjacent to each other in the intersecting direction are connected by sharing a projecting piece portion 32 between them.

また、他方の各長尺筒部ｆは、上記長尺筒部ｅと同方向へ長尺であって且つ長尺筒部ｅよりも短い長方形筒状に形成され、短手方向両側の突片部３２’，３２’と、長手方向両側の突片部３３’，３３’とを有する。
この長尺筒部ｆは、前記交差方向に沿って複数並設され、隣接する二つの長尺筒部ｆ，ｆは、これらの間の突片部３２’を共用して一体化されている。
そして、これら複数の長尺筒部ｆと、その両側の長尺筒部ｅとの間には、隙間ｇ３が確保されている。この隙間ｇ３は、長尺筒部ｆの成形性を良好にするとともに空気流通空間としても機能する。 Further, each of the other long tubular portions f is formed in a rectangular tubular shape that is elongated in the same direction as the long tubular portion e and shorter than the long tubular portion e, and has protrusions on both sides in the lateral direction. It has portions 32', 32'and projecting pieces 33', 33'on both sides in the longitudinal direction.
A plurality of the long cylinder portions f are arranged side by side along the intersecting direction, and two adjacent long cylinder portions f and f are integrated by sharing a projecting piece portion 32'between them. ..
A gap g3 is secured between the plurality of long cylinder portions f and the long cylinder portions e on both sides thereof. The gap g3 improves the moldability of the long tubular portion f and also functions as an air flow space.

よって、上記構成のヒートシンクＥによれば、上記ヒートシンクＤと略同様に、長尺筒部ｅ，ｆを構成する突片部３２，３３，３２’，３３’の熱が、長尺筒部ｅ，ｆ内を流通する比較的低温の空気に熱伝達し、効果的な放熱が行われる。また、このヒートシンクＥにおいても、ベース部１０厚み方向の全長を比較的小さくすることができ、省スペースな設置態様に対応することができる。 Therefore, according to the heat sink E having the above configuration, the heat of the projecting pieces 32, 33, 32', 33'consisting of the long cylinders e and f is generated by the long cylinder e, substantially the same as the heat sink D. , F heat is transferred to the relatively low temperature air circulating in f, and effective heat dissipation is performed. Further, also in this heat sink E, the total length in the thickness direction of the base portion 10 can be made relatively small, and it is possible to correspond to a space-saving installation mode.

＜第六の実施態様＞
図９に示すヒートシンクＦは、上記構成のヒートシンクＥに対し、長尺筒部ｅ，ｆの長手方向の一方の突片部３３，３３’を省いたものである。
すなわち、このヒートシンクＦでは、短手方向両側の突片部３２，３２と長手方向の一方（図９によれば下方）の突片部３３とから凹状壁部ｈを構成し、短手方向両側の突片部３２’，３２’と長手方向の一方（図９によれば下方）の突片部３３’とから凹状壁部ｉを構成し、これら凹状壁部ｈ，ｉを、上記ヒートシンクＥの長尺筒部ｅ，ｆと同様に配設している。
凹状壁部ｈの内側空間は、鍔部３１を貫通する長孔３１ｃ（通気孔）に連続している。同様に、凹状壁部ｈの内部空間は、鍔部３１を貫通する長孔３１ｃ’（通気孔、図９参照）に連続している。
このヒートシンクＦによれば、上記ヒートシンクＥと略同様に、凹状壁部ｈ，ｉを構成する突片部３２，３３，３２’，３３’の熱が、凹状壁部ｈ，ｉ内を流動する比較的低温の空気に熱伝達し、効果的な放熱が行われる。また、このヒートシンクＦにおいても、ベース部１０厚み方向の全長を比較的小さくすることができ、省スペースな設置態様に対応することができる。 <Sixth Embodiment>
The heat sink F shown in FIG. 9 is obtained by omitting one of the projecting piece portions 33, 33'in the longitudinal direction of the long tubular portions e and f with respect to the heat sink E having the above configuration.
That is, in this heat sink F, the concave wall portion h is formed from the projecting piece portions 32, 32 on both sides in the lateral direction and the projecting piece portions 33 on one side in the longitudinal direction (lower according to FIG. 9), and both sides in the lateral direction. The concave wall portions i are formed from the projecting piece portions 32'and 32'and one of the projecting piece portions 33'in the longitudinal direction (lower according to FIG. 9), and these concave wall portions h and i are used as the heat sink E. It is arranged in the same manner as the long tubular portions e and f of.
The inner space of the concave wall portion h is continuous with the elongated hole 31c (vent hole) penetrating the flange portion 31. Similarly, the internal space of the concave wall portion h is continuous with the elongated hole 31c'(vent hole, see FIG. 9) penetrating the flange portion 31.
According to the heat sink F, heat of the projecting pieces 32, 33, 32', 33' forming the concave wall portions h, i flows in the concave wall portions h, i, substantially similar to the heat sink E. Heat is transferred to relatively low temperature air to effectively dissipate heat. Further, also in this heat sink F, the total length in the thickness direction of the base portion 10 can be made relatively small, and it is possible to correspond to a space-saving installation mode.

なお、図示例のヒートシンクＦでは、上記ヒートシンクＥに対し図示の上方側の突片部３３，３３’を省いたが、他例としては、ヒートシンクＥに対し逆側（図示の下側）の突片部３３，３３’を省いた態様（図示の凹状壁部ｈ，ｉが上下逆の態様）とすることも可能である。 In the heat sink F of the illustrated example, the protrusions 33, 33'on the upper side of the figure are omitted from the heat sink E, but as another example, the protrusion on the opposite side (lower side of the figure) to the heat sink E is omitted. It is also possible to omit the single portions 33 and 33'(the concave wall portions h and i in the figure are upside down).

＜第七の実施態様＞
図１０に示すヒートシンクＧは、上記構成のヒートシンクＥに対し、長尺筒部ｅ，ｆの長手方向の両方の突片部３３，３３’を省いたものである。
すなわち、このヒートシンクＦでは、長孔３１ｃを短手方向に挟む両側の突片部３２が、二つに分離した平行フィンｊを構成し、長孔３１ｃ’を短手方向に挟む両側の突片部３２’が、二つに分離した平行フィンｋを構成している。
そして、この平行フィンｊ，ｋを、上記ヒートシンクＥと同様の配置にて、鍔部３１上に複数配設している。
このヒートシンクＧによれば、上記ヒートシンクＥと略同様に、平行フィンｊ，ｋを構成する突片部３２，３２’の熱が、これらフィン間を流通する比較的低温の空気に熱伝達し、効果的な放熱が行われる。また、このヒートシンクＧにおいても、ベース部１０厚み方向の全長を比較的小さくすることができ、省スペースな設置態様に対応することができる。 <Seventh Embodiment>
The heat sink G shown in FIG. 10 is obtained by omitting both the projecting piece portions 33 and 33'in the longitudinal direction of the long tubular portions e and f with respect to the heat sink E having the above configuration.
That is, in this heat sink F, the projecting pieces 32 on both sides sandwiching the elongated hole 31c in the lateral direction form two parallel fins j, and projecting pieces on both sides sandwiching the elongated hole 31c'in the lateral direction. The portion 32'consists of the parallel fins k separated into two.
A plurality of the parallel fins j and k are arranged on the flange portion 31 in the same arrangement as the heat sink E.
According to the heat sink G, substantially similar to the heat sink E, the heat of the projecting pieces 32, 32'constituting the parallel fins j, k is transferred to the relatively low temperature air flowing between the fins. Effective heat dissipation is performed. Further, also in this heat sink G, the total length in the thickness direction of the base portion 10 can be made relatively small, and it is possible to correspond to a space-saving installation mode.

次に、上記構成のヒートシンクＡ〜Ｇと、図１２に示す比較例のヒートシンク１００について、同一箇所（囲繞部）の温度上昇値を、コンピュータ解析により求めた結果を説明する。
ヒートシンク１００（図１２参照）は、ヒートシンクＡ〜Ｇと略同寸法のベース部１０を備え、空間Ｓ１を囲む囲繞部２０の各囲繞片２１に、内外へ貫通するハニカム状の放熱フィン１０１を複数有しており、一般的な従来のヒートシンクに比べ高い放熱性能を有するものである。
前記コンピュータ解析の結果、比較例のヒートシンク１００の温度上昇値が約４７℃であるのに対し、本願発明のヒートシンクＡ〜Ｇの温度上昇値は、３９〜４２℃であった。
本願発明のヒートシンクＡ〜Ｇでは、長孔３１ｃ，３１ｃ’の長手方向に沿って長尺状に突片部２２，３２，３２’を有するため、空間Ｓ１の外側において空気との接触面積が比較的広く確保され、その結果、ヒートシンク１００よりも効果的に放熱が行われるものと考えられる。 Next, with respect to the heat sinks A to G having the above configurations and the heat sink 100 of the comparative example shown in FIG. 12, the results obtained by computer analysis of the temperature rise value at the same location (surrounding portion) will be described.
The heat sink 100 (see FIG. 12) includes a base portion 10 having substantially the same dimensions as the heat sinks A to G, and a plurality of honeycomb-shaped heat radiating fins 101 penetrating in and out are provided in each surrounding piece 21 of the surrounding portion 20 surrounding the space S1. It has a higher heat dissipation performance than a general conventional heat sink.
As a result of the computer analysis, the temperature rise value of the heat sink 100 of the comparative example was about 47 ° C., whereas the temperature rise value of the heat sinks A to G of the present invention was 39 to 42 ° C.
Since the heat sinks A to G of the present invention have projecting pieces 22, 32, 32'long in the longitudinal direction of the elongated holes 31c, 31c', the contact areas with air are compared outside the space S1. It is considered that the heat is widely secured, and as a result, heat is dissipated more effectively than the heat sink 100.

また、図１１は、図５のヒートシンクＤの（VI）−（VI）線に沿う断面図上において、コンピュータ解析による空気の流れを示す図である。
このコンピュータ解析では、ヒートシンクＤについて、ベース部１０を上下方向へ向けた姿勢（縦置き状の姿勢）とし、電子部品接触面１１に熱源が接触しているものとしている。
この解析の結果、図１１に矢印で示すように、上側の長尺筒部ｄ内において、空間Ｓ２側から基板側（電子部品Ｘ側）へ通過する空気の流れＦ１があり、下側の長尺筒部ｄにおては、基板側から空間Ｓ２側へ通過する空気の流れＦ２があることがわかった。なお、図中、符合Ｆ０は、囲繞部３０内（空間Ｓ１）における空気の上昇を示す。
この解析結果より、ヒートシンクＤでは、囲繞部２０の外側（空間Ｓ２）の比較的低温の空気が、長尺筒部ｄ内を通過することがわかった。したがって、この低温の空気により突片部３２の熱が効果的に放熱されるものと考えられる。 Further, FIG. 11 is a diagram showing an air flow obtained by computer analysis on a cross-sectional view taken along the line (VI)-(VI) of the heat sink D of FIG.
In this computer analysis, it is assumed that the heat sink D is in a posture in which the base portion 10 is oriented in the vertical direction (vertical posture), and the heat source is in contact with the electronic component contact surface 11.
As a result of this analysis, as shown by an arrow in FIG. 11, there is an air flow F1 passing from the space S2 side to the substrate side (electronic component X side) in the long tubular portion d on the upper side, and the length on the lower side. It was found that the scale tube portion d has an air flow F2 passing from the substrate side to the space S2 side. In the figure, the sign F0 indicates the rise of air in the surrounding portion 30 (space S1).
From this analysis result, it was found that in the heat sink D, relatively low temperature air outside the surrounding portion 20 (space S2) passes through the long tubular portion d. Therefore, it is considered that the heat of the projecting piece portion 32 is effectively dissipated by the low temperature air.

なお、上記実施態様では、鍔部３１に形成される長孔３１ｃ，３１ｃ’を、長方形状に形成したが、他例としては、この長孔を、楕円形状や、ひし形状、長尺な多角形状、その他の形の長尺状とすることが可能である。 In the above embodiment, the elongated holes 31c and 31c'formed in the flange portion 31 are formed in a rectangular shape, but as another example, the elongated holes are formed in an elliptical shape, a rhombus shape, or a long polygonal shape. It can be long in shape or other shape.

また、上記実施態様では、ヒートシンクＡ〜Ｃをベース部１０下向きの姿勢（図１〜図４参照）で用い、ヒートシンクＤ〜Ｇをベース部１０横向きの姿勢（図５〜図１０参照）で用いたが、これらヒートシンクＡ〜Ｇの姿勢は図示例に限定されず、周囲の部品との関係等により適宜な姿勢とすることが可能である。 Further, in the above embodiment, the heat sinks A to C are used in the downward posture of the base portion 10 (see FIGS. 1 to 4), and the heat sinks D to G are used in the horizontal posture of the base portion 10 (see FIGS. 5 to 10). However, the postures of the heat sinks A to G are not limited to the illustrated examples, and can be set to an appropriate posture depending on the relationship with surrounding parts and the like.

また、上記ヒートシンクＤ〜Ｇ（図５〜図１０）は、特に放熱性に秀でた具体例を示したが、他の発明としては、鍔部３１を有するヒートシンクＤ〜Ｇについて、長方形の長孔３１ｃ，３１ｃ’を、長方形以外の形状の通気孔に置換することも可能であり、このようにした場合でも、ベース部厚み方向の寸法が小さい扁平状に形成できる上、良好な放熱性を得ることができる。 Further, the heat sinks D to G (FIGS. 5 to 10) show specific examples particularly excellent in heat dissipation, but as another invention, the heat sinks D to G having a flange portion 31 have a rectangular length. It is also possible to replace the holes 31c and 31c'with ventilation holes having a shape other than a rectangle, and even in this case, it is possible to form a flat shape having a small dimension in the thickness direction of the base portion and to provide good heat dissipation. Obtainable.

また、本発明は上述した実施態様に限定されず、本発明の要旨を変更しない範囲で適宜変更可能である。 Further, the present invention is not limited to the above-described embodiment, and can be appropriately changed without changing the gist of the present invention.

１０：ベース部
１１：電子部品接触面
２０：囲繞部
２１：囲繞片
２１ａ：長孔
２１ａ１：長縁部
２１ａ２：短縁部
２２，２３，３２，３３，３２’，３３’：突片部
３１：鍔部
３１ｃ，３１ｃ’：長孔（通気孔）
３１ｃ１：長縁部（内縁部）
３１ｃ２：短縁部（内縁部）
Ａ〜Ｇ：ヒートシンク
Ｓ１，Ｓ２：空間
ａ：長尺筒部
ｂ：凹状壁部
ｃ：平行フィン
ｄ，ｅ，ｆ：長尺筒部
ｇ，ｈ，ｉ：凹状壁部
ｊ，ｋ：平行フィン 10: Base part 11: Electronic component contact surface 20: Surrounding part 21: Surrounding piece 21a: Long hole 21a1: Long edge part 21a2: Short edge part 22, 23, 32, 33, 32', 33': Projection piece 31 : Flange 31c, 31c': Long hole (vent hole)
31c1: Long edge (inner edge)
31c2: Short edge (inner edge)
A to G: Heat sink S1, S2: Space a: Long cylinder part b: Concave wall part c: Parallel fins d, e, f: Long cylinder part g, h, i: Concave wall part j, k: Parallel fins

Claims (7)

一方側の面を電子部品接触面にした板状のベース部と、前記ベース部を境にした他方側の空間を囲むようにして前記ベース部の周縁側から突出する囲繞部とを備え、前記囲繞部は、貫通状の長孔と、前記空間の外側において前記長孔の長縁部に沿って突出する突片部とを有し、
前記長孔が長方形であり、前記突片部が前記長孔に沿う長方形筒状に構成されていることを特徴とするヒートシンク。 A plate-shaped base portion having one surface as an electronic component contact surface and a surrounding portion protruding from the peripheral edge side of the base portion so as to surround the space on the other side with the base portion as a boundary are provided. is possess a through-shaped long hole, and a protruding piece that protrudes along the long edge portion of the slot on the outside of the space,
A heat sink characterized in that the elongated hole is rectangular and the projecting piece portion is formed in a rectangular tubular shape along the elongated hole. 一方側の面を電子部品接触面にした板状のベース部と、前記ベース部を境にした他方側の空間を囲むようにして前記ベース部の周縁側から突出する囲繞部とを備え、前記囲繞部は、貫通状の長孔と、前記空間の外側において前記長孔の長縁部に沿って突出する突片部とを有し、
前記長孔が長方形であり、前記突片部が前記長孔の両側の長縁部と片側の短縁部に沿って凹状に構成されていることを特徴とするヒートシンク。 A plate-shaped base portion having one surface as an electronic component contact surface and a surrounding portion protruding from the peripheral edge side of the base portion so as to surround the space on the other side with the base portion as a boundary are provided. Has a penetrating elongated hole and a projecting piece portion that protrudes along the long edge portion of the elongated hole outside the space.
A heat sink characterized in that the elongated hole is rectangular, and the projecting piece portion is formed in a concave shape along a long edge portion on both sides of the elongated hole and a short edge portion on one side. 一方側の面を電子部品接触面にした板状のベース部と、前記ベース部を境にした他方側の空間を囲むようにして前記ベース部の周縁側から突出する囲繞部とを備え、前記囲繞部は、貫通状の長孔と、前記空間の外側において前記長孔の長縁部に沿って突出する突片部とを有し、
前記囲繞部は、前記ベース部の周縁部から前記他方側へ立ち上がった平板状の囲繞片を有し、前記長孔は、前記囲繞片を厚み方向へ貫通しており、前記突片部は、前記囲繞片から前記空間とは逆側へ突出していることを特徴とするヒートシンク。 A plate-shaped base portion having one surface as an electronic component contact surface and a surrounding portion protruding from the peripheral edge side of the base portion so as to surround the space on the other side with the base portion as a boundary are provided. Has a penetrating elongated hole and a projecting piece portion that protrudes along the long edge portion of the elongated hole outside the space.
The surrounding portion has a flat plate-shaped surrounding piece that rises from the peripheral edge portion of the base portion to the other side, the elongated hole penetrates the surrounding piece in the thickness direction, and the protruding piece portion is A heat sink characterized in that it projects from the surrounding piece to the side opposite to the space. 一方側の面を電子部品接触面にした板状のベース部と、前記ベース部を境にした他方側の空間を囲むようにして前記ベース部の周縁側から突出する囲繞部とを備え、前記囲繞部は、貫通状の長孔と、前記空間の外側において前記長孔の長縁部に沿って突出する突片部とを有し、
前記囲繞部は、前記ベース部の周縁部から前記空間の外側へ突出する鍔部を有し、前記長孔は、前記鍔部を厚み方向へ貫通しており、前記突片部は、前記鍔部から反電子部品接触面側へ突出していることを特徴とするヒートシンク。 A plate-shaped base portion having one surface as an electronic component contact surface and a surrounding portion protruding from the peripheral edge side of the base portion so as to surround the space on the other side with the base portion as a boundary are provided. Has a penetrating elongated hole and a projecting piece portion that protrudes along the long edge portion of the elongated hole outside the space.
The surrounding portion has a flange portion that protrudes outward from the peripheral portion of the base portion, the elongated hole penetrates the flange portion in the thickness direction, and the projecting piece portion is the flange portion. A heat sink characterized in that it protrudes from the portion toward the contact surface side of anti-electronic components. 前記突片部は、前記長孔の両側の長縁部に沿って二つ設けられ、これら二つの突片部は、前記長孔を挟むようにして両側に分かれていることを特徴とする請求項３又は４記載のヒートシンク。 The third aspect of the present invention is characterized in that two projecting piece portions are provided along the long edge portions on both sides of the elongated hole, and the two projecting piece portions are divided on both sides so as to sandwich the elongated hole. Or the heat sink according to 4. 前記長孔は、その短手方向へ並ぶように複数設けられ、前記長孔毎に対応して前記突片部が設けられていることを特徴とする請求項１乃至５何れか１項記載のヒートシンク。 The method according to any one of claims 1 to 5, wherein a plurality of the elongated holes are provided so as to be arranged in the lateral direction thereof, and the projecting piece portion is provided corresponding to each elongated hole. heat sink. 前記ベース部の電子部品接触面には、電子部品が接触して支持されていることを特徴とする請求項１乃至６何れか１項記載のヒートシンクを用いた電子部品パッケージ。
 The electronic component package using the heat sink according to any one of claims 1 to 6, wherein the electronic component is contacted and supported on the electronic component contact surface of the base portion .
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