WO2020144886A1 - Heat sink and electronic component package - Google Patents

Heat sink and electronic component package Download PDF

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Publication number
WO2020144886A1
WO2020144886A1 PCT/JP2019/030273 JP2019030273W WO2020144886A1 WO 2020144886 A1 WO2020144886 A1 WO 2020144886A1 JP 2019030273 W JP2019030273 W JP 2019030273W WO 2020144886 A1 WO2020144886 A1 WO 2020144886A1
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WO
WIPO (PCT)
Prior art keywords
ventilation
heat sink
surrounding
internal space
electronic component
Prior art date
Application number
PCT/JP2019/030273
Other languages
French (fr)
Japanese (ja)
Inventor
坂本　勝
洋輔 中村
宗佑 松浦
Original Assignee
かがつう株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2019002769A external-priority patent/JP6570208B1/en
Application filed by かがつう株式会社 filed Critical かがつう株式会社
Publication of WO2020144886A1 publication Critical patent/WO2020144886A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Definitions

  • the present invention relates to a heat sink and an electronic component package that radiate heat from electronic components and the like.
  • Patent Document 1 a plate-shaped base portion capable of contacting an electronic component and four protrusions surrounding a space on one side in the thickness direction of the base portion.
  • a heat sink having a piece portion, a plurality of tubular projections protruding from each projection piece portion in a direction opposite to the space, and a plurality of grooves formed inside four projection piece portions.
  • good heat dissipation performance can be obtained by the plurality of cylindrical protrusions and the plurality of grooves.
  • the present invention has the following configurations.
  • a plate-shaped base portion having a surface on one side as an electronic component contact surface, and a surrounding portion projecting from a peripheral side of the base portion so as to surround an inner space on the other side with the base portion as a boundary, and the surrounding.
  • the portion is provided with a ventilation portion that communicates the internal space with an external space on the side of the surrounding portion, and an inner edge of the ventilation portion is provided with a protruding portion that projects toward the internal space.
  • a heat sink characterized by.
  • the present invention is configured as described above, it is possible to obtain good heat dissipation performance due to the space-saving shape.
  • FIG. 3 is a sectional view taken along line (III)-(III) of FIG. 2. It is sectional drawing which follows the (IV)-(IV) line of FIG.
  • FIG. 3 is a perspective view which shows the other example of the heat sink which concerns on this invention. It is a perspective view which shows the other example of the heat sink which concerns on this invention. It is a perspective view which shows the other example of the heat sink which concerns on this invention. It is a perspective view which shows the other example of the heat sink which concerns on this invention. It is a perspective view which shows the other example of the heat sink which concerns on this invention. It is a figure which shows the flow of air about the heat sink shown in FIG.
  • FIG. 11A is a cross-sectional view taken along the line (a)-(a) of FIG. 11
  • FIG. 11B is a cross-sectional view taken along the line (b)-(b) of FIG. 11, with the base portion oriented in the lateral direction. Shows the state.
  • 13A is a sectional view taken along the line (a)-(a) of FIG. 13
  • FIG. 13B is a sectional view taken along the line (b)-(b) of FIG. It shows the state.
  • FIG. 13A is a sectional view taken along the line (a)-(a) of FIG. 13
  • FIG. 13B is a sectional view taken along the line (b)-(b) of FIG. It shows the state.
  • FIG. 13B is a perspective view which shows an example of the conventional heat sink.
  • the first feature is that a plate-shaped base portion whose one side surface is an electronic component contact surface and an inner space on the other side with the base portion as a boundary surrounds the surrounding portion protruding from the peripheral side of the base portion.
  • a ventilation part that communicates the internal space with an external space on the side of the surrounding part is provided in the surrounding part, and an inner edge of the ventilation part has a protruding piece part protruding toward the internal space.
  • the "ventilation part” includes a through hole or a notch that penetrates the surrounding part.
  • the second feature is that the ventilation part is a long hole and the projecting piece is provided along the long edge of the ventilation part (see FIGS. 1 to 8).
  • a third feature is that the projecting piece portions are provided along the long edges on both sides of the ventilation part, and the projecting piece portions on both sides are open between ends in the longitudinal direction (FIG. 6). (See FIG. 8).
  • a fourth characteristic is that the ventilation part includes a first ventilation part elongated to the other side, and a second ventilation part elongated in a direction along the base part.
  • the protrusion and the second ventilation portion are each provided with the projecting portion along the long edge thereof (see FIG. 7 ).
  • a fifth feature is that, as the ventilation part, a first ventilation part that is elongatedly extended to the other side, and a second ventilation part that is elongatedly extended in a direction along the base part. And the one of the first ventilation portion and the second ventilation portion, the one ventilation portion is provided with the projecting piece portion protruding toward the internal space along the long edge thereof, and the other The ventilation part is provided with a projecting piece that projects toward the external space (see FIG. 8 ).
  • a third ventilation that penetrates the surrounding portion in the thickness direction and communicates the internal space and the external space. Sections are provided (see FIGS. 1, 5 to 8 and 11 to 16).
  • the surrounding portion is formed into a rectangular tube shape having an inner corner between adjacent surrounding pieces, and the third ventilation portion is provided on the inner corner side with respect to the protruding piece portion. (See FIGS. 1, 5 to 8 and 11 to 16).
  • the surrounding portion is provided with a plurality of ventilation portions having the protruding pieces at intervals, and among the plurality of ventilation portions, between the two adjacent ventilation portions, the third Is provided (see FIGS. 11 to 12).
  • the surrounding portion is formed of a plurality of surrounding pieces into a rectangular tube shape, and at least one of the plurality of surrounding pieces has a vent portion and the protrusion having the protruding piece portion. There is no one part, and the third ventilation part is provided (see FIGS. 13 to 16).
  • a tenth feature is an electronic component package using the heat sink, in which the electronic component is in contact with the electronic component contact surface of the base portion (FIGS. 3 to 4, FIG. 12, FIG. 14, FIG. 16). reference).
  • the heat sink A shown in FIGS. 1 to 4 surrounds a plate-shaped base portion 10 having an electronic component contact surface 11 on one side and an internal space S2 on the other side of the base portion 10 as a boundary. And a surrounding portion 20 projecting from the peripheral edge side.
  • the heat sink A makes the electronic component contact surface 11 contact an electronic component X (for example, a CPU, a transistor, a thyristor, other semiconductors or electronic components) to form an electronic component package (see FIGS. 3 and 4). ..
  • a fan may be provided around the electronic component package if necessary.
  • the heat sink A is formed of a metal material containing aluminum, copper, stainless steel, nickel, magnesium or the like, and the surface thereof is subjected to alumite treatment.
  • the base portion 10 is formed in a rectangular flat plate shape (square flat plate shape in the illustrated example), and a surface located on one side (lower side in the illustrated example) in the thickness direction is formed in a flat shape to generate electrons.
  • the electronic component contact surface 11 for contacting the component X is used.
  • the surface on the other side (upper side in the illustrated example) of the base portion 10 is formed in a flat shape without through holes or irregularities, but a heat radiation fin or the like having an appropriate shape can be provided if necessary. is there.
  • the surrounding portion 20 has a plurality of surrounding pieces 21 and projecting pieces 22 and 23 that project inside the surrounding piece 21 along the ventilation portion 21a toward the internal space S2.
  • Each surrounding piece 21 rises substantially vertically from the edge portion along each side of the base portion 10 toward the anti-heat source side (the side opposite to the electronic component X side).
  • Each surrounding piece 21 is provided with a plurality of ventilation portions 21 a arranged in a direction along the surface of the base portion 10 (horizontal direction according to the illustrated example).
  • the plurality of surrounding pieces 21 are configured in a rectangular tube shape (a rectangular tube shape in the illustrated example) that surrounds the internal space S2, and open on the side opposite to the base portion (the upper side in the drawing).
  • the inner corner portion and the outer corner portion between each surrounding piece 21 and the base portion 10 are formed into curved surfaces by bending or the like.
  • Each ventilation part 21a is formed in a long shape (rectangular shape according to the illustrated example) along the rising direction of the surrounding piece 21, penetrates the surrounding piece 21 in the thickness direction, and surrounds the internal space S2 to the surrounding part 20 side. Communicating with the external space S1.
  • the protrusions 22 and 23 are flat plate-shaped protrusions that protrude toward the internal space S2 along the inner edge of the ventilation portion 21a.
  • the one protruding piece portion 22 is formed in a long shape along the long edges (long sides) on both sides of the ventilation portion 21a, and projects toward the internal space S2 side.
  • the protruding piece portion 22 located between the two adjacent ventilation portions 21a, 21a is formed in a single plate shape that partitions the space on both sides.
  • the other protruding piece 23 is formed along the short edges (short sides) on both sides of the ventilation portion 21a and projects into the internal space S2.
  • the two projecting piece portions 23, 23 that straddle the adjacent ventilation portions 21a, 21a are continuous as shown in FIG. That is, as shown in FIG. 1, the projecting piece portions 22 and 23 are formed in the shape of a rectangular tube that projects toward the internal space S2, and are arranged in the horizontal direction in the drawing.
  • the air around the heat sink A may be caused to flow by natural convection, but as another example, a blower may be provided at an appropriate location to force the ambient air to flow.
  • the heat sink A having the above structure may be provided with a third ventilation part 21b shown by a two-dot chain line in FIG. 1 to further improve the fluidity of air.
  • the third ventilation portion 21b is located closer to the inner corner 21c side than the projecting piece portion 22 and is formed so as to communicate the inner space S3 on the inner corner 21c side with the outer space S1, and the inner corner 21c side of the inner space S3. It is possible to prevent the air from becoming stagnant and to become a high heat, and further improve the heat dissipation effect of the heat sink A as a whole.
  • the heat sink B shown in FIG. 5 is obtained by replacing the heat sink A having the above-mentioned configuration with the ventilation portion 21a and the protruding piece portions 22 and 23 replaced with the ventilation portion 21a' and the protruding piece portions 22' and 23'.
  • the ventilation part 21a' is formed in a long shape (rectangular shape according to the illustrated example) in the direction along the base part 10 in the surrounding piece 21, penetrates the surrounding piece 21 in the thickness direction, and surrounds the internal space S2. It communicates with the external space S1 on the side of 20.
  • a plurality (three according to the illustrated example) of the ventilation portions 21 a ′ are provided along the rising direction of the surrounding piece 21.
  • the projecting pieces 22' and 23' are flat plate-shaped projections that project toward the internal space S2 along the inner edge of the ventilation portion 21a'.
  • the one projecting piece 22' is formed along the short edges (short sides) on both sides of the ventilation part 21a' and projects into the internal space S2.
  • the two projecting piece portions 22' and 22' straddling the adjacent ventilation portions 21a' and 21a' are continuous as shown in FIG.
  • the other protruding piece portion 23' is formed in a long shape along the long edges (long sides) on both sides of the ventilation portion 21a', and projects toward the internal space S2 side.
  • the protruding piece portion 23′ located between the two adjacent ventilation portions 21a′, 21a′ is formed in a single plate shape that partitions spaces on both sides in the vertical direction.
  • the heat sink B configured as described above, like the heat sink A, an air flow that rises due to the heat of the base portion 10 is formed in the internal space S2 above the base portion 10. Therefore, the air in the external space S1 having a relatively low temperature is drawn into the rising airflow to form a continuous air flow F. Therefore, the continuously flowing air comes into contact with the protruding piece portion 23 ′, efficient heat exchange is performed, and the temperature rise of the base portion 10 and the electronic component X is suppressed.
  • the third ventilation portion 21b (see the chain double-dashed line in FIG. 5) corresponding to the inner corner 21c side of the inner space S2 is provided, and the inner space on the inner corner side is formed. It is possible to prevent air from stagnating in S3 and further improve the heat dissipation effect.
  • the heat sink C shown in FIG. 6 is obtained by omitting the upper and lower projecting piece portions 23, 23 (see FIG. 1) corresponding to each ventilation portion 21a from the heat sink A having the above-mentioned configuration. That is, in this heat sink C, the protruding pieces 22 are provided along the long edges on both sides of the ventilation portion 21a. The projecting pieces 22, 22 on both sides have openings between the ends in the longitudinal direction, and air is allowed to flow through the openings. According to the heat sink C, the air that has entered the ventilation portion 21a from the external space S1 rises along the space between the adjacent protruding piece portions 22 and 22 and escapes upward from between the protruding piece portions 22 and 22 so that the resistance is relatively high.
  • a continuous air flow F that is hard to receive is formed. For this reason, in addition to operating in substantially the same manner as the heat sink A described above, more efficient heat exchange is performed by the air flow F, which in turn effectively increases the temperature of the base portion 10 and the electronic component X. Can be suppressed.
  • a third ventilation portion 21b (see the chain double-dashed line in FIG. 6) corresponding to the inner corner 21c side of the internal space S2 is provided to further enhance the heat radiation effect. It is possible to improve.
  • the heat sink D shown in FIG. 7 is different from the heat sink C having the above-described structure in that the ventilation portions 21a and the projecting piece portions 22 on both sides facing each other with the internal space S2 in between are provided as the second ventilation portion 21a′ and the projecting piece portion, respectively. 23". That is, the heat sink D includes a first ventilation part 21a extending in a long shape toward the other side (upper side in the drawing) as a ventilation part and a first ventilation part 21a elongated in a direction along the surface of the base part 10. The first ventilation part 21a and the second ventilation part 21a' are provided with projecting piece parts 22 and 23' along their long edges, respectively.
  • the first ventilation portion 21a and the protruding piece portion 22 are configured similarly to the ventilation portion 21a and the protruding piece portion 22 of the heat sink C (see FIG. 6), and are shown by the same reference numerals as those of the heat sink C.
  • the second ventilation portion 21a′ and the protruding piece portion 23′ are configured in substantially the same manner as the ventilation portion 21a′ and the protruding piece portion 23′ of the heat sink B (see FIG. 5) and have the same reference numerals as those of the heat sink B. Illustrated. It should be noted that the space between two adjacent projecting piece portions 23 ′, 23 ′ penetrates in the direction along the surface of the base portion 10 (the horizontal direction in the drawing), and this point is different from that of the heat sink B.
  • the heat sink D having the above-described configuration, similar to the heat sink C, efficient heat exchange can effectively suppress the temperature rise of the base portion 10 and the electronic component X, and also the posture of the heat sink D as a whole. Similar effects can be obtained even when changed.
  • the protruding piece portion 23 ′ has a posture in which the electronic component contact surface 11 of the base portion 10 is directed to the side and the surrounding piece 21 having the ventilation portion 21 a is directed downward. It becomes a long air passage that is continuous in the vertical direction. Therefore, even when used in such a sideways posture, it is possible to improve the air flow in the internal space S2 and perform efficient heat exchange.
  • a third ventilation portion 21b (see the chain double-dashed line in FIG. 7) corresponding to the inner corner 21c side of the internal space S2 is provided, and the inner corner side is formed. It is possible to prevent air from stagnating in the internal space S3 and further improve the heat dissipation effect.
  • the heat sink E shown in FIG. 8 is obtained by replacing the heat sink D having the above-mentioned configuration with the projecting piece portion 23′′ that faces the inner space S2 by a projecting piece portion 23′′ that faces the outer space S1. That is, the heat sink E is a ventilation part, and the first ventilation part 21a extending in a long shape to the other side (upper side in the drawing) and the long length extending in a direction along the surface of the base part 10.
  • the second ventilation part 21a' is provided.
  • one of the ventilation portions (the first ventilation portion 21a according to the illustrated example) has an internal space S2 along its long edge.
  • the protruding piece 22 protruding toward the side is provided, and the other ventilation portion (the second ventilation portion 21a′ according to the illustrated example) is provided with the protruding portion 23′′ protruding toward the external space S1 side. ..
  • this heat sink E similar to the heat sinks A to D described above, efficient heat exchange can be performed by the air flow F, and the projecting piece portion 23′′ is arranged on the side of the external space S1 where the air temperature is relatively low. Therefore, the heat dissipation effect can be further improved.
  • this heat sink E is effective when there is a margin of installation space in the protruding direction of the projecting piece 23′′.
  • the third ventilation portion 21b (see the chain double-dashed line in FIG. 8) corresponding to the inner corner 21c side of the internal space S2 is provided with the projecting piece portion 23′′, similarly to the heat sinks A to C. It is possible to prevent the air from stagnating in the inner space S3 on the inner corner side by providing it on the surrounding piece 21 having the above, and to further improve the heat radiation effect.
  • the temperature rise value at the same location was obtained by computer analysis, and the heat sink A was 82.3° C. with the base portion 10 facing downward. It was confirmed that the heat sink C had a temperature of 73.7° C., and the heat sink C had a higher heat dissipation effect.
  • the heat sink of the above-described embodiment is used in a vertically placed shape with the base portion 10 facing downward, as in the illustrated example, but as another usage example, a horizontal orientation with the base portion 10 facing sideways is used. It can also be used in the form of a sheet.
  • the embodiment described below is a preferred embodiment in which the heat radiation performance is relatively small even when the base portion 10 is oriented laterally.
  • the heat sink G shown in FIGS. 11 to 12 is different from the heat sink A in that the projecting piece portions 22 and 23 are replaced with projecting piece portions 24 and 25 for each first ventilation portion 21a. 21b is provided.
  • each surrounding piece 21 forming the surrounding portion 20 is provided on each surrounding piece 21 forming the surrounding portion 20 at intervals in the direction along the surface of the base portion 10 (according to the illustrated example, closer to the center in the lateral direction). 2) are provided.
  • Each first ventilation part 21a is formed in a long shape (rectangular shape according to the illustrated example) along the rising direction of the surrounding piece 21, penetrates the surrounding piece 21 in the thickness direction, and surrounds the internal space S2. It communicates with the external space S1 on the side of 20.
  • Each of the first ventilation portions 21a is provided with projecting piece portions 24, 25 so as to project from the inner edge portion thereof toward the internal space S2.
  • One protrusion piece 24 is provided along each long edge on both sides of the first ventilation portion 21a.
  • the other protruding piece portion 25 is provided along each of the upper and lower short edges of the first ventilation portion 21a. Then, the projecting piece portions 24, 25 on both sides and the upper and lower sides are formed in a cylindrical shape projecting from the inner surface of the surrounding piece 21 into the internal space S2.
  • the third ventilation portion 21b is a portion of the surrounding portion 20 other than the first ventilation portion 21a having the projecting piece portions 24 and 25, and penetrates the surrounding piece 21 in the thickness direction to form an internal space.
  • the S2 and the external space S1 communicate with each other.
  • the surrounding section 20 is formed in a rectangular tube shape having an inner corner 21c between the adjacent surrounding pieces 21 and 21.
  • the third ventilation portion 21b is provided closer to the inner corner 21c than the protruding piece portions 24 and 25 in each surrounding piece 21.
  • the third ventilation part 21b is also provided between the two adjacent first ventilation parts 21a, 21a in each surrounding piece 21.
  • the heat of the base portion 10 raises the internal space S2 above the base portion 10. A flow of air is formed. Therefore, the air in the external space S1 having a relatively low temperature is drawn into the rising airflow to form a continuous air flow F. Therefore, the continuously flowing air comes into contact with the projecting piece portions 24, 25, etc., and efficient heat exchange is performed, so that the temperature rise of the base portion 10 and the electronic component X can be suppressed.
  • the air resistance of the protrusions 24 and 25 causes The decrease in the air flow rate can be compensated by the increase in the air flow rate by the third ventilation portion 21b, and consequently, the change in the heat radiation performance due to the difference in posture can be reduced.
  • the heat sink G has a temperature of 74.5° C. in a posture in which the Z direction is vertical (see FIG. 11) and 80.8° C. in a posture in which the X direction is vertical (see FIG. 12 ).
  • the temperature was 74.0° C. in the posture in which the Z direction was vertical (see FIG. 17), and 88.7° C. in the posture in which the X direction was vertical. That is, in the heat sink G, the temperature difference due to the difference in posture in the ZX direction was relatively small, and particularly in the posture in which the X direction was vertical, a lower temperature than that of the conventional product was obtained.
  • the conventional heat sink 100 a large number of columnar heat dissipation fins are provided on the upper surface of the base portion, and the outline (outer shape) of the dimensions (25 ⁇ 25 ⁇ 15 mm) in the XYZ directions is substantially the same as that of the heat sink A. It is a thing.
  • the heat sink H shown in FIGS. 13 to 14 is different from the heat sink A in that the two surrounding pieces of the four surrounding pieces, which are opposed to each other, do not include the protruding pieces 22 and 23, and the third ventilation portion does not include the protruding piece. 21b is provided.
  • the surrounding portion 20 of the heat sink H has the first ventilation portion 21a with the protruding piece portions 22 and 23, and the surrounding surrounding pieces 21 and 21 facing each other, and the third ventilation portion without the protruding portion. It has a portion 21b and also has opposing surrounding pieces 21', 21', and is configured in a rectangular tube shape.
  • Each of the one surrounding pieces 21 has a first ventilation portion 21 a and projecting piece portions 22 and 23 having substantially the same configuration as the heat sink A.
  • Each of the other surrounding pieces 21' is provided with a plurality of third ventilation portions 21b having no protruding piece portion at intervals in the surface direction of the base portion 10.
  • Each third ventilation part 21b is formed narrower than the first ventilation part 21a.
  • the heat sink H configured as described above, like the heat sink A, in the posture in which the base portion 10 is directed downward (see FIG. 13), the heat of the base portion 10 raises the internal space S2 above the base portion 10. A flow of air is formed. Therefore, the air in the external space S1 having a relatively low temperature is drawn into the rising airflow to form a continuous air flow F. Therefore, the continuously flowing air comes into contact with the projecting piece portions 22 and 23, efficient heat exchange is performed, and the temperature rise of the base portion 10 and the electronic component can be suppressed.
  • this heat sink H when the X direction shown in the drawing is substantially vertical (see FIGS. 14A and 14B), the decrease in the air flow rate due to the air resistance of the projecting piece portions 22 and 23 is reduced to the third value. This can be compensated for by increasing the air flow rate by the ventilation part 21b, and thus good heat dissipation performance can be obtained in this posture.
  • the heat sink H had a temperature of 73.0° C. in a posture in which the Z direction was vertical (see FIG. 13), and 77.4° C. in a posture in which the X direction was vertical (see FIG. 14 ). That is, in the heat sink H, a lower temperature can be obtained as compared with the conventional heat sink 100 described above (see FIG. 17), and in particular, even when the X direction is used substantially vertically (see FIG. 14), The change was small.
  • the heat sink I shown in FIG. 15 to FIG. 16 has projecting piece portions 22 and 23 for two facing one of the four surrounding pieces of the heat sink A, and the projecting piece portions for each first ventilation portion 21a. 24, 25, the other two opposing surrounding pieces, the protruding piece portions 22, 23 are omitted, and the third ventilation portions 21b, 12b′ having no protruding piece portion are provided, and the adjacent surrounding piece 21 is further provided. , 21' is provided with a third ventilation portion 21b".
  • the surrounding portion 20 of the heat sink I has the first ventilation portion 21a with the protruding piece portions 24 and 25, and the two surrounding facing pieces 21 and 21 facing each other, and the third surrounding portion without the protruding piece portion. It has a ventilation part 21b, 12b' and is provided with two facing surrounding pieces 21', 21', and is configured in a rectangular tube shape.
  • Each of the surrounding pieces 21 on one side has projecting piece portions 24, 25 in the shape of a square tube protruding from the inner edge thereof to the internal space S2 for each first ventilation portion 21a, and between the adjacent projecting piece portions 24, 25. Has a gap.
  • Each of the other surrounding pieces 21' is provided with a plurality of third ventilation portions 21b, 21b' at intervals in the surface direction of the base portion 10.
  • the plurality of (three in the illustrated example) third ventilation portions 21b located near the center in the width direction of each surrounding piece 21' are each formed narrower than the first ventilation portion 21a.
  • the third ventilation portions 21b' and 21b' located on both sides of the third ventilation portion 21b are formed wider than the third ventilation portion 21b.
  • a gap is provided between the adjacent two surrounding pieces 21, 21', and this gap functions as a third ventilation portion 21b" that connects the external space S1 and the internal space S2.
  • the heat sink I having the above-described configuration, like the heat sink A, in the posture in which the base portion 10 is directed downward (see FIG. 15), the heat of the base portion 10 raises the internal space S2 above the base portion 10. A flow of air is formed. Therefore, the air in the external space S1 having a relatively low temperature is drawn into the rising airflow to form a continuous air flow F. Therefore, the continuously flowing air comes into contact with the projecting pieces 24 and 25, efficient heat exchange is performed, and the temperature rise of the base 10 and the electronic component X can be suppressed.
  • this heat sink I when the posture in which the X direction shown in the figure is substantially vertical (see FIGS. 16A and 16B), the decrease in the air flow rate due to the air resistance of the projecting pieces 24 and 25 is reduced to the third value. This can be compensated for by increasing the air flow rate by the ventilation parts 21b, 21b', 21b", and thus good heat dissipation performance can be obtained in this posture.
  • the heat sink I had a temperature of 71.8° C. in a posture in which the Z direction was vertical (see FIG. 15), and 76.8° C. in a posture in which the Z direction was vertical (see FIG. 16 ). That is, the heat sink I can obtain a lower temperature than the conventional heat sink 100 (see FIG. 17) described above, and in particular, even when the X direction shown in the figure is used substantially vertically (see FIG. 16), The change was small.

Abstract

The purpose of the present invention is to obtain improved heat dissipation performance using a shape that enables space to be saved. The present invention comprises a plate-shaped base part 10 in which the surface on one side is an electronic component contact surface 11, and a surrounding part 20 that projects from the peripheral edge side of the base part 10 so as surround an internal space S2 on the other side across the base part 10. The surrounding part 20 is provided with ventilation holes 21a by which the internal space S2 communicates with an exterior space S1 beside the surrounding part 20. Projecting pieces 22 projecting toward the internal space S2 side are provided to the inner edges of the ventilation holes 21a.

Description

ヒートシンク及び電子部品パッケージHeat sink and electronic component package
　本発明は、電子部品等の熱を放熱するようにしたヒートシンク及び電子部品パッケージに関するものである。 The present invention relates to a heat sink and an electronic component package that radiate heat from electronic components and the like.
　従来、この種の発明には、例えば特許文献１に記載されるように、電子部品に接触可能な板状のベース部と、このベース部の厚み方向の一方側の空間を囲む四枚の突片部と、各突片部から前記空間とは逆の方向へ突出する複数の筒状突起と、四枚の突片部の内側に形成された複数の溝とを有するヒートシンクがある。
　このヒートシンクでは、前記複数の筒状突起や複数の溝により、良好な放熱性能を得ることができる。 Conventionally, in this type of invention, as described in Patent Document 1, for example, a plate-shaped base portion capable of contacting an electronic component and four protrusions surrounding a space on one side in the thickness direction of the base portion. There is a heat sink having a piece portion, a plurality of tubular projections protruding from each projection piece portion in a direction opposite to the space, and a plurality of grooves formed inside four projection piece portions.
In this heat sink, good heat dissipation performance can be obtained by the plurality of cylindrical protrusions and the plurality of grooves.
特開２０１８－１４５３９号公報JP, 2018-14539, A
　しかしながら、上記従来技術によれば、ベース部の輪郭から、複数の突起が水平方向へ突出する構造であるため、全体的な水平方向の面積が大きくなる傾向にある。このため、水平方向の取付けスペースが予め決められている場合には、対応が困難になる場合が想定される。 However, according to the above-mentioned conventional technique, since the plurality of protrusions horizontally protrude from the contour of the base portion, the overall horizontal area tends to increase. For this reason, when the horizontal mounting space is determined in advance, it may be difficult to deal with it.
　このような課題に鑑みて、本発明は、以下の構成を具備するものである。
　一方側の面を電子部品接触面とした板状のベース部と、前記ベース部を境にした他方側の内部空間を囲むようにして前記ベース部の周縁側から突出する囲繞部とを備え、前記囲繞部には、前記内部空間を前記囲繞部の側方の外部空間へ連通する通気部が設けられ、この通気部の内縁には、前記内部空間側へ突出する突片部が設けられていることを特徴とするヒートシンク。 In view of such a problem, the present invention has the following configurations.
A plate-shaped base portion having a surface on one side as an electronic component contact surface, and a surrounding portion projecting from a peripheral side of the base portion so as to surround an inner space on the other side with the base portion as a boundary, and the surrounding. The portion is provided with a ventilation portion that communicates the internal space with an external space on the side of the surrounding portion, and an inner edge of the ventilation portion is provided with a protruding portion that projects toward the internal space. A heat sink characterized by.
　本発明は、以上説明したように構成されているので、省スペースな形状により良好な放熱性能を得ることができる。 Since the present invention is configured as described above, it is possible to obtain good heat dissipation performance due to the space-saving shape.
本発明に係るヒートシンクの一例を示す斜視図である。It is a perspective view showing an example of a heat sink concerning the present invention. 同ヒートシンクの平面図である。It is a top view of the heat sink. 図２の（III）-（III）線に沿う断面図である。FIG. 3 is a sectional view taken along line (III)-(III) of FIG. 2. 図２の（IV）-（IV）線に沿う断面図である。It is sectional drawing which follows the (IV)-(IV) line of FIG. 本発明に係るヒートシンクの他例を示す斜視図である。It is a perspective view which shows the other example of the heat sink which concerns on this invention. 本発明に係るヒートシンクの他例を示す斜視図である。It is a perspective view which shows the other example of the heat sink which concerns on this invention. 本発明に係るヒートシンクの他例を示す斜視図である。It is a perspective view which shows the other example of the heat sink which concerns on this invention. 本発明に係るヒートシンクの他例を示す斜視図である。It is a perspective view which shows the other example of the heat sink which concerns on this invention. 図１に示すヒートシンクについて、空気の流れを示す図である。It is a figure which shows the flow of air about the heat sink shown in FIG. 図６に示すヒートシンクについて、空気の流れを示す図である。It is a figure which shows the flow of air about the heat sink shown in FIG. 本発明に係るヒートシンクの他例を示す斜視図である。It is a perspective view which shows the other example of the heat sink which concerns on this invention. （ａ）は図１１の（ａ）－（ａ）線に沿う断面図、（ｂ）は図１１の（ｂ）－（ｂ）線に沿う断面図であり、ベース部を横方向へ向けた状態を示している。11A is a cross-sectional view taken along the line (a)-(a) of FIG. 11, and FIG. 11B is a cross-sectional view taken along the line (b)-(b) of FIG. 11, with the base portion oriented in the lateral direction. Shows the state. 本発明に係るヒートシンクの他例を示す斜視図である。It is a perspective view which shows the other example of the heat sink which concerns on this invention. （ａ）は図１３の（ａ）－（ａ）線に沿う断面図、（ｂ）は図１３の（ｂ）－（ｂ）線に沿う断面図であり、ベース部を横方向へ向けた状態を示している。13A is a sectional view taken along the line (a)-(a) of FIG. 13, and FIG. 13B is a sectional view taken along the line (b)-(b) of FIG. It shows the state. 本発明に係るヒートシンクの他例を示す斜視図である。It is a perspective view which shows the other example of the heat sink which concerns on this invention. （ａ）は図１３の（ａ）－（ａ）線に沿う断面図、（ｂ）は図１３の（ｂ）－（ｂ）線に沿う断面図であり、ベース部を横方向へ向けた状態を示している。13A is a sectional view taken along the line (a)-(a) of FIG. 13, and FIG. 13B is a sectional view taken along the line (b)-(b) of FIG. It shows the state. 従来のヒートシンクの一例を示す斜視図である。It is a perspective view which shows an example of the conventional heat sink.
　本実施の形態では、以下の特徴を開示している。
　第一の特徴は、一方側の面を電子部品接触面とした板状のベース部と、前記ベース部を境にした他方側の内部空間を囲むようにして前記ベース部の周縁側から突出する囲繞部とを備え、前記囲繞部には、前記内部空間を前記囲繞部の側方の外部空間へ連通する通気部が設けられ、この通気部の内縁には、前記内部空間側へ突出する突片部が設けられている（図１～図８参照）。
　ここで、前記「通気部」には、前記囲繞部を貫通する貫通孔や切欠を含む。 The following features are disclosed in the present embodiment.
The first feature is that a plate-shaped base portion whose one side surface is an electronic component contact surface and an inner space on the other side with the base portion as a boundary surrounds the surrounding portion protruding from the peripheral side of the base portion. And a ventilation part that communicates the internal space with an external space on the side of the surrounding part is provided in the surrounding part, and an inner edge of the ventilation part has a protruding piece part protruding toward the internal space. Are provided (see FIGS. 1 to 8).
Here, the "ventilation part" includes a through hole or a notch that penetrates the surrounding part.
　第二の特徴は、前記通気部が長尺状の孔であり、前記突片部が前記通気部の長縁に沿って設けられている（図１～図８参照）。 The second feature is that the ventilation part is a long hole and the projecting piece is provided along the long edge of the ventilation part (see FIGS. 1 to 8).
　第三の特徴は、前記突片部が、前記通気部における両側の長縁に沿ってそれぞれ設けられ、これら両側の突片部は、その長手方向の端部間を開口している（図６～図８参照）。 A third feature is that the projecting piece portions are provided along the long edges on both sides of the ventilation part, and the projecting piece portions on both sides are open between ends in the longitudinal direction (FIG. 6). (See FIG. 8).
　第四の特徴は、前記通気部として、前記他方側へ長尺な第一の通気部と、前記ベース部に沿う方向へ長尺な第二の通気部とを有し、これら第一の通気部と第二の通気部には、それぞれ、その長縁に沿う前記突片部が設けられている（図７参照）。 A fourth characteristic is that the ventilation part includes a first ventilation part elongated to the other side, and a second ventilation part elongated in a direction along the base part. The protrusion and the second ventilation portion are each provided with the projecting portion along the long edge thereof (see FIG. 7 ).
　第五の特徴は、前記通気部として、前記他方側へ長尺状に延設された第一の通気部と、前記ベース部に沿う方向へ長尺状に延設された第二の通気部とを有し、これら第一の通気部と第二の通気部のうち、その一方の通気部には、その長縁に沿って前記内部空間側へ突出する前記突片部が設けられ、他方の通気部には、前記外部空間側へ突出する突片部が設けられている（図８参照）。 A fifth feature is that, as the ventilation part, a first ventilation part that is elongatedly extended to the other side, and a second ventilation part that is elongatedly extended in a direction along the base part. And the one of the first ventilation portion and the second ventilation portion, the one ventilation portion is provided with the projecting piece portion protruding toward the internal space along the long edge thereof, and the other The ventilation part is provided with a projecting piece that projects toward the external space (see FIG. 8 ).
　第六の特徴として、前記囲繞部には、前記突片部を有する通気部以外の部分で、前記囲繞部を厚み方向へ貫通して前記内部空間と前記外部空間とを連通する第三の通気部が設けられている（図１、図５～図８、図１１～図１６参照）。 As a sixth feature, in the surrounding portion, in a portion other than the ventilation portion having the projecting piece portion, a third ventilation that penetrates the surrounding portion in the thickness direction and communicates the internal space and the external space. Sections are provided (see FIGS. 1, 5 to 8 and 11 to 16).
　第七の特徴としては、前記囲繞部が、隣接する囲繞片の間に内隅を有する角筒状に形成され、前記第三の通気部が、前記突片部よりも前記内隅側に設けられている（図１、図５～図８、図１１～図１６参照）。 As a seventh feature, the surrounding portion is formed into a rectangular tube shape having an inner corner between adjacent surrounding pieces, and the third ventilation portion is provided on the inner corner side with respect to the protruding piece portion. (See FIGS. 1, 5 to 8 and 11 to 16).
　第八の特徴として、前記囲繞部には、前記突片部を有する通気部が間隔を置いて複数設けられ、これら複数の通気部のうち、隣接する二つの通気部の間に、前記第三の通気部が設けられている（図１１～図１２参照）。 As an eighth feature, the surrounding portion is provided with a plurality of ventilation portions having the protruding pieces at intervals, and among the plurality of ventilation portions, between the two adjacent ventilation portions, the third Is provided (see FIGS. 11 to 12).
　第九の特徴として、前記囲繞部が、複数の囲繞片から角筒状に形成され、前記複数の囲繞片のうち、少なくとも一つの囲繞片には、前記突片部を有する通気部及び前記突片部が無く、かつ前記第三の通気部が設けられている（図１３～図１６参照）。 As a ninth feature, the surrounding portion is formed of a plurality of surrounding pieces into a rectangular tube shape, and at least one of the plurality of surrounding pieces has a vent portion and the protrusion having the protruding piece portion. There is no one part, and the third ventilation part is provided (see FIGS. 13 to 16).
　第十の特徴は、上記ヒートシンクを用いた電子部品パッケージであって、前記ベース部の電子部品接触面に、電子部品が接触している（図３～図４、図１２、図１４、図１６参照）。 A tenth feature is an electronic component package using the heat sink, in which the electronic component is in contact with the electronic component contact surface of the base portion (FIGS. 3 to 4, FIG. 12, FIG. 14, FIG. 16). reference).
＜第一の実施態様＞
　次に、上記特徴を有する具体的な実施態様について、図面に基づいて詳細に説明する。
　図１～図４に示すヒートシンクＡは、一方側の面を電子部品接触面１１とした板状のベース部１０と、ベース部１０を境にした他方側の内部空間Ｓ２を囲むようにしてベース部１０の周縁側から突出する囲繞部２０とを備える。 <First embodiment>
Next, specific embodiments having the above characteristics will be described in detail with reference to the drawings.
The heat sink A shown in FIGS. 1 to 4 surrounds a plate-shaped base portion 10 having an electronic component contact surface 11 on one side and an internal space S2 on the other side of the base portion 10 as a boundary. And a surrounding portion 20 projecting from the peripheral edge side.
　このヒートシンクＡは、電子部品接触面１１を電子部品Ｘ（例えば、ＣＰＵや、トランジスタ、サイリスタ、その他の半導体や電子部品等）に接触させて電子部品パッケージ（図３及び図４参照）を構成する。なお、この電子部品パッケージの周囲には、必要に応じてファンを設けるようにしてもよい。
　このヒートシンクＡは、アルミニウム、銅、ステンレス、ニッケル又はマグネシウム等を含む金属材料から形成され、その表面にはアルマイト処理が施される。 The heat sink A makes the electronic component contact surface 11 contact an electronic component X (for example, a CPU, a transistor, a thyristor, other semiconductors or electronic components) to form an electronic component package (see FIGS. 3 and 4). .. A fan may be provided around the electronic component package if necessary.
The heat sink A is formed of a metal material containing aluminum, copper, stainless steel, nickel, magnesium or the like, and the surface thereof is subjected to alumite treatment.
　ベース部１０は、矩形平板状（図示例によれば正方形平板状）に形成され、その厚み方向の一方側（図示例によれば下側）に位置する面を、平坦状に形成して電子部品Ｘに接触させるための電子部品接触面１１としている。
　このベース部１０の他方側（図示例によれば上側）の面は、貫通孔や凹凸のない平坦状に形成されるが、必要に応じて、適宜形状の放熱フィン等を設けることも可能である。 The base portion 10 is formed in a rectangular flat plate shape (square flat plate shape in the illustrated example), and a surface located on one side (lower side in the illustrated example) in the thickness direction is formed in a flat shape to generate electrons. The electronic component contact surface 11 for contacting the component X is used.
The surface on the other side (upper side in the illustrated example) of the base portion 10 is formed in a flat shape without through holes or irregularities, but a heat radiation fin or the like having an appropriate shape can be provided if necessary. is there.
　囲繞部２０は、複数の囲繞片２１と、囲繞片２１の内側にて通気部２１ａに沿って内部空間Ｓ２側へ突出する突片部２２，２３とを有する。 The surrounding portion 20 has a plurality of surrounding pieces 21 and projecting pieces 22 and 23 that project inside the surrounding piece 21 along the ventilation portion 21a toward the internal space S2.
　各囲繞片２１は、ベース部１０の各辺に沿う縁部から反熱源側へ（電子部品Ｘ側に対する逆側）へ略垂直に立ち上がっている。
　各囲繞片２１には、ベース部１０面に沿う方向（図示例によれば水平方向）へ並ぶ複数の通気部２１ａが設けられる。
　複数の囲繞片２１は、内部空間Ｓ２を囲む角筒状（図示例によれば四角筒状）に構成され、その反ベース部側（図示の上方）を開口している。
　各囲繞片２１とベース部１０間の内角部分及び外角部分は、曲げ加工等により曲面状に形成されている。 Each surrounding piece 21 rises substantially vertically from the edge portion along each side of the base portion 10 toward the anti-heat source side (the side opposite to the electronic component X side).
Each surrounding piece 21 is provided with a plurality of ventilation portions 21 a arranged in a direction along the surface of the base portion 10 (horizontal direction according to the illustrated example).
The plurality of surrounding pieces 21 are configured in a rectangular tube shape (a rectangular tube shape in the illustrated example) that surrounds the internal space S2, and open on the side opposite to the base portion (the upper side in the drawing).
The inner corner portion and the outer corner portion between each surrounding piece 21 and the base portion 10 are formed into curved surfaces by bending or the like.
　各通気部２１ａは、囲繞片２１の立ち上がり方向に沿う長尺状（図示例によれば長方形状）に形成され、囲繞片２１を厚み方向へ貫通して、内部空間Ｓ２を囲繞部２０側方の外部空間Ｓ１に連通している。 Each ventilation part 21a is formed in a long shape (rectangular shape according to the illustrated example) along the rising direction of the surrounding piece 21, penetrates the surrounding piece 21 in the thickness direction, and surrounds the internal space S2 to the surrounding part 20 side. Communicating with the external space S1.
　突片部２２，２３は、通気部２１ａの内縁に沿って内部空間Ｓ２側へ突出する平板状の突起である。 The protrusions 22 and 23 are flat plate-shaped protrusions that protrude toward the internal space S2 along the inner edge of the ventilation portion 21a.
　詳細に説明すれば、一方の突片部２２は、通気部２１ａの両側の長縁（長辺）に沿う長尺状に形成され、内部空間Ｓ２側へ突出している。
　隣接する二つの通気部２１ａ，２１ａ間に位置する突片部２２は、両側の空間を仕切る単一板状に形成される。 More specifically, the one protruding piece portion 22 is formed in a long shape along the long edges (long sides) on both sides of the ventilation portion 21a, and projects toward the internal space S2 side.
The protruding piece portion 22 located between the two adjacent ventilation portions 21a, 21a is formed in a single plate shape that partitions the space on both sides.
　他方の突片部２３は、通気部２１ａの両側の短縁（短辺）に沿って形成され、内部空間Ｓ２へ突出している。隣接する通気部２１ａ，２１ａに跨る二つの突片部２３，２３は、図１に示すように連続している。
　すなわち、突片部２２，２３は、図１に示すように、内部空間Ｓ２側へ突出する四角筒状に構成され、図示の水平方向に複数並んでいる。 The other protruding piece 23 is formed along the short edges (short sides) on both sides of the ventilation portion 21a and projects into the internal space S2. The two projecting piece portions 23, 23 that straddle the adjacent ventilation portions 21a, 21a are continuous as shown in FIG.
That is, as shown in FIG. 1, the projecting piece portions 22 and 23 are formed in the shape of a rectangular tube that projects toward the internal space S2, and are arranged in the horizontal direction in the drawing.
　次に、上記構成のヒートシンクＡについて、その特徴的な作用効果を詳細に説明する。
　ベース部１０の電子部品接触面１１を、発熱中の電子部品Ｘに接触させた状態（図３及び図４参照）において、ベース部１０上方側の内部空間Ｓ２には、ベース部１０の熱により上昇する空気の流れが形成される。このため、この上昇する気流に、比較的温度の低い外部空間Ｓ１の空気が引き込まれて、連続的な空気の流れＦが形成される。
　したがって、前記のように連続的に流れる空気が、各突片部２３に接触して、効率的な熱交換が行われ、ベース部１０及び電子部品Ｘの温度上昇が抑制される。 Next, the characteristic effects of the heat sink A having the above structure will be described in detail.
When the electronic component contact surface 11 of the base portion 10 is in contact with the electronic component X that is generating heat (see FIGS. 3 and 4), the internal space S2 above the base portion 10 is heated by the heat of the base portion 10. A rising air stream is formed. Therefore, the air in the external space S1 having a relatively low temperature is drawn into the rising airflow to form a continuous air flow F.
Therefore, as described above, the continuously flowing air comes into contact with each of the projecting piece portions 23, efficient heat exchange is performed, and the temperature rise of the base portion 10 and the electronic component X is suppressed.
　なお、ヒートシンクＡの周囲の空気は自然対流により流動させればよいが、他例としては、適宜箇所に送風機を設け、周囲の空気を強制的に流動させるようにしてもよい。 Note that the air around the heat sink A may be caused to flow by natural convection, but as another example, a blower may be provided at an appropriate location to force the ambient air to flow.
　また、上記構成のヒートシンクＡに対し、図１に二点鎖線で示す第三の通気部２１ｂを設けて、より空気の流動性を向上するようにしてもよい。第三の通気部２１ｂは、突片部２２よりも内隅２１ｃ側に位置し、内隅２１ｃ側の内部空間Ｓ３を外部空間Ｓ１へ連通するように形成され、内部空間Ｓ３の内隅２１ｃ側に空気が滞って高熱になるのを防ぎ、ヒートシンクＡ全体の放熱効果をより向上させる。 Further, the heat sink A having the above structure may be provided with a third ventilation part 21b shown by a two-dot chain line in FIG. 1 to further improve the fluidity of air. The third ventilation portion 21b is located closer to the inner corner 21c side than the projecting piece portion 22 and is formed so as to communicate the inner space S3 on the inner corner 21c side with the outer space S1, and the inner corner 21c side of the inner space S3. It is possible to prevent the air from becoming stagnant and to become a high heat, and further improve the heat dissipation effect of the heat sink A as a whole.
＜第二の実施態様＞
　次に、本発明に係るヒートシンクの他の実施態様について説明する。なお、以下に示す実施態様は、上述した実施態様を一部変更したものであるため、主にその変更部分について詳述し、共通部分の説明は同一符号を用いる等して適宜省略する。 <Second embodiment>
Next, another embodiment of the heat sink according to the present invention will be described. Since the embodiment described below is a partial modification of the above-described embodiment, the modified part will be mainly described in detail, and the description of the common part will be appropriately omitted by using the same reference numerals or the like.
　図５に示すヒートシンクＢは、上記構成のヒートシンクＡに対し、通気部２１ａ及び突片部２２，２３を、通気部２１ａ’及び突片部２２’，２３’に置換したものである。 The heat sink B shown in FIG. 5 is obtained by replacing the heat sink A having the above-mentioned configuration with the ventilation portion 21a and the protruding piece portions 22 and 23 replaced with the ventilation portion 21a' and the protruding piece portions 22' and 23'.
　通気部２１ａ’は、囲繞片２１においてベース部１０に沿う方向へ長尺状（図示例によれば長方形状）に形成され、囲繞片２１を厚み方向へ貫通して、内部空間Ｓ２を囲繞部２０側方の外部空間Ｓ１に連通している。
　この通気部２１ａ’は、囲繞片２１の立ち上がり方向に沿って複数（図示例によれば三つ）設けられる。 The ventilation part 21a' is formed in a long shape (rectangular shape according to the illustrated example) in the direction along the base part 10 in the surrounding piece 21, penetrates the surrounding piece 21 in the thickness direction, and surrounds the internal space S2. It communicates with the external space S1 on the side of 20.
A plurality (three according to the illustrated example) of the ventilation portions 21 a ′ are provided along the rising direction of the surrounding piece 21.
　突片部２２’，２３’は、通気部２１ａ’の内縁に沿って内部空間Ｓ２側へ突出する平板状の突起である。 The projecting pieces 22' and 23' are flat plate-shaped projections that project toward the internal space S2 along the inner edge of the ventilation portion 21a'.
　一方の突片部２２’は、通気部２１ａ’の両側の短縁（短辺）に沿って形成され、内部空間Ｓ２へ突出している。隣接する通気部２１ａ’，２１ａ’に跨る二つの突片部２２’，２２’は、図５に示すように連続している。 The one projecting piece 22' is formed along the short edges (short sides) on both sides of the ventilation part 21a' and projects into the internal space S2. The two projecting piece portions 22' and 22' straddling the adjacent ventilation portions 21a' and 21a' are continuous as shown in FIG.
　他方の突片部２３’は、通気部２１ａ’の両側の長縁（長辺）に沿う長尺状に形成され、内部空間Ｓ２側へ突出している。
　隣接する二つの通気部２１ａ’，２１ａ’の間に位置する突片部２３’は、上下方向の両側の空間を仕切る単一板状に形成される。 The other protruding piece portion 23' is formed in a long shape along the long edges (long sides) on both sides of the ventilation portion 21a', and projects toward the internal space S2 side.
The protruding piece portion 23′ located between the two adjacent ventilation portions 21a′, 21a′ is formed in a single plate shape that partitions spaces on both sides in the vertical direction.
　上記構成のヒートシンクＢによれば、ヒートシンクＡと同様に、ベース部１０上方側の内部空間Ｓ２には、ベース部１０の熱により上昇する空気の流れが形成される。このため、この上昇する気流に、比較的温度の低い外部空間Ｓ１の空気が引き込まれて、連続的な空気の流れＦが形成される。
　したがって、連続的に流れる空気が、突片部２３’に接触して、効率的な熱交換が行われ、ベース部１０及び電子部品Ｘの温度上昇が抑制される。 According to the heat sink B configured as described above, like the heat sink A, an air flow that rises due to the heat of the base portion 10 is formed in the internal space S2 above the base portion 10. Therefore, the air in the external space S1 having a relatively low temperature is drawn into the rising airflow to form a continuous air flow F.
Therefore, the continuously flowing air comes into contact with the protruding piece portion 23 ′, efficient heat exchange is performed, and the temperature rise of the base portion 10 and the electronic component X is suppressed.
　なお、このヒートシンクＢにおいても、ヒートシンクＡと同様に、内部空間Ｓ２の内隅２１ｃ側に対応する第三の通気部２１ｂ（図５の二点鎖線参照）を設けて、内隅側の内部空間Ｓ３に空気が滞るのを防ぎ、より放熱効果を向上することが可能である。 In this heat sink B as well, similar to the heat sink A, the third ventilation portion 21b (see the chain double-dashed line in FIG. 5) corresponding to the inner corner 21c side of the inner space S2 is provided, and the inner space on the inner corner side is formed. It is possible to prevent air from stagnating in S3 and further improve the heat dissipation effect.
＜第三の実施態様＞
　図６に示すヒートシンクＣは、上記構成のヒートシンクＡに対し、各通気部２１ａに対応する上下の突片部２３，２３（図１参照）を省いたものである。
　すなわち、このヒートシンクＣでは、突片部２２が、通気部２１ａにおける両側の長縁に沿ってそれぞれ設けられる。そして、これら両側の突片部２２，２２は、その長手方向の端部間を開口しており、この開口に空気を流通するようにしている。
　このヒートシンクＣによれば、外部空間Ｓ１から通気部２１ａへ侵入した空気が、隣接する突片部２２，２２間に沿って上昇し、突片部２２，２２間から上方へ抜け、比較的抵抗を受け難い連続的な空気の流れＦが形成される。
　このため、上述したヒートシンクＡと略同様に作用するのに加えて、空気の流れＦによっていっそう効率的な熱交換が行われ、ひいては、ベース部１０及び電子部品Ｘの温度上昇をより効果的に抑制することができる。 <Third embodiment>
The heat sink C shown in FIG. 6 is obtained by omitting the upper and lower projecting piece portions 23, 23 (see FIG. 1) corresponding to each ventilation portion 21a from the heat sink A having the above-mentioned configuration.
That is, in this heat sink C, the protruding pieces 22 are provided along the long edges on both sides of the ventilation portion 21a. The projecting pieces 22, 22 on both sides have openings between the ends in the longitudinal direction, and air is allowed to flow through the openings.
According to the heat sink C, the air that has entered the ventilation portion 21a from the external space S1 rises along the space between the adjacent protruding piece portions 22 and 22 and escapes upward from between the protruding piece portions 22 and 22 so that the resistance is relatively high. A continuous air flow F that is hard to receive is formed.
For this reason, in addition to operating in substantially the same manner as the heat sink A described above, more efficient heat exchange is performed by the air flow F, which in turn effectively increases the temperature of the base portion 10 and the electronic component X. Can be suppressed.
　なお、このヒートシンクＣにおいても、ヒートシンクＡ，Ｂと同様に、内部空間Ｓ２の内隅２１ｃ側に対応する第三の通気部２１ｂ（図６の二点鎖線参照）を設けて、より放熱効果を向上することが可能である。 In this heat sink C as well, similar to the heat sinks A and B, a third ventilation portion 21b (see the chain double-dashed line in FIG. 6) corresponding to the inner corner 21c side of the internal space S2 is provided to further enhance the heat radiation effect. It is possible to improve.
＜第四の実施態様＞
　図７に示すヒートシンクＤは、上記構成のヒートシンクＣに対し、内部空間Ｓ２を間にして対向する両側の通気部２１ａ及び突片部２２を、それぞれ、第二の通気部２１ａ’及び突片部２３”に置換したものである。
　すなわち、このヒートシンクＤは、通気部として、前記他方側（図示の上方側）へ長尺状に延設された第一の通気部２１ａと、ベース部１０面に沿う方向へ長尺状の第二の通気部２１ａ’とを有し、これら第一の通気部２１ａと第二の通気部２１ａ’には、それぞれ、その長縁に沿う突片部２２，２３’が設けられている。 <Fourth Embodiment>
The heat sink D shown in FIG. 7 is different from the heat sink C having the above-described structure in that the ventilation portions 21a and the projecting piece portions 22 on both sides facing each other with the internal space S2 in between are provided as the second ventilation portion 21a′ and the projecting piece portion, respectively. 23".
That is, the heat sink D includes a first ventilation part 21a extending in a long shape toward the other side (upper side in the drawing) as a ventilation part and a first ventilation part 21a elongated in a direction along the surface of the base part 10. The first ventilation part 21a and the second ventilation part 21a' are provided with projecting piece parts 22 and 23' along their long edges, respectively.
　第一の通気部２１ａ及び突片部２２は、上記ヒートシンクＣにおける通気部２１ａ及び突片部２２と同様に構成され（図６参照）、ヒートシンクＣのものと同一の符号で図示している。 The first ventilation portion 21a and the protruding piece portion 22 are configured similarly to the ventilation portion 21a and the protruding piece portion 22 of the heat sink C (see FIG. 6), and are shown by the same reference numerals as those of the heat sink C.
　第二の通気部２１ａ’及び突片部２３’は、上記ヒートシンクＢにおける通気部２１ａ’及び突片部２３’と略同様に構成され（図５参照）、ヒートシンクＢのものと同一の符号で図示している。
　なお、隣接する二つの突片部２３’，２３’間は、ベース部１０面に沿う方向（図示の水平方向）において貫通しており、この点はヒートシンクＢのものと異なる。 The second ventilation portion 21a′ and the protruding piece portion 23′ are configured in substantially the same manner as the ventilation portion 21a′ and the protruding piece portion 23′ of the heat sink B (see FIG. 5) and have the same reference numerals as those of the heat sink B. Illustrated.
It should be noted that the space between two adjacent projecting piece portions 23 ′, 23 ′ penetrates in the direction along the surface of the base portion 10 (the horizontal direction in the drawing), and this point is different from that of the heat sink B.
　上記構成のヒートシンクＤによれば、ヒートシンクＣと略同様に、効率的な熱交換によって、ベース部１０及び電子部品Ｘの温度上昇を効果的に抑制することができる上、ヒートシンクＤ全体の姿勢を変化させた場合も同様の作用効果を得ることができる。
　詳細に説明すれば、このヒートシンクＤでは、例えば、ベース部１０の電子部品接触面１１を側方へ向け、通気部２１ａを有する囲繞片２１を下方へ向けた姿勢で、突片部２３’が上下方向へ連続する長尺な空気流路になる。このため、このような横向きの姿勢で用いられた場合でも、内部空間Ｓ２の空気の流れを良好にして、効率的な熱交換を行うことができる。 According to the heat sink D having the above-described configuration, similar to the heat sink C, efficient heat exchange can effectively suppress the temperature rise of the base portion 10 and the electronic component X, and also the posture of the heat sink D as a whole. Similar effects can be obtained even when changed.
More specifically, in this heat sink D, for example, the protruding piece portion 23 ′ has a posture in which the electronic component contact surface 11 of the base portion 10 is directed to the side and the surrounding piece 21 having the ventilation portion 21 a is directed downward. It becomes a long air passage that is continuous in the vertical direction. Therefore, even when used in such a sideways posture, it is possible to improve the air flow in the internal space S2 and perform efficient heat exchange.
　なお、このヒートシンクＤにおいても、ヒートシンクＡ～Ｃと同様に、内部空間Ｓ２の内隅２１ｃ側に対応する第三の通気部２１ｂ（図７の二点鎖線参照）を設けて、内隅側の内部空間Ｓ３に空気が滞るのを防ぎ、より放熱効果を向上することが可能である。 In this heat sink D as well, similar to the heat sinks A to C, a third ventilation portion 21b (see the chain double-dashed line in FIG. 7) corresponding to the inner corner 21c side of the internal space S2 is provided, and the inner corner side is formed. It is possible to prevent air from stagnating in the internal space S3 and further improve the heat dissipation effect.
＜第五の実施態様＞
　図８に示すヒートシンクＥは、上記構成のヒートシンクＤに対し、内部空間Ｓ２へ向く突片部２３”を、外部空間Ｓ１へ向へ突片部２３”に置換したものである。
　すなわち、このヒートシンクＥは、通気部として、前記他方側（図示の上方側）へ長尺状に延設された第一の通気部２１ａと、ベース部１０面に沿う方向へ長尺状に延設された第二の通気部２１ａ’とを有する。
　そして、これら第一の通気部２１ａと第二の通気部２１ａ’のうち、その一方の通気部（図示例によれば第一の通気部２１ａ）には、その長縁に沿って内部空間Ｓ２側へ突出する突片部２２が設けられ、他方の通気部（図示例によれば第二の通気部２１ａ’）には、外部空間Ｓ１側へ突出する突片部２３”が設けられている。 <Fifth Embodiment>
The heat sink E shown in FIG. 8 is obtained by replacing the heat sink D having the above-mentioned configuration with the projecting piece portion 23″ that faces the inner space S2 by a projecting piece portion 23″ that faces the outer space S1.
That is, the heat sink E is a ventilation part, and the first ventilation part 21a extending in a long shape to the other side (upper side in the drawing) and the long length extending in a direction along the surface of the base part 10. The second ventilation part 21a' is provided.
Then, of the first ventilation portion 21a and the second ventilation portion 21a', one of the ventilation portions (the first ventilation portion 21a according to the illustrated example) has an internal space S2 along its long edge. The protruding piece 22 protruding toward the side is provided, and the other ventilation portion (the second ventilation portion 21a′ according to the illustrated example) is provided with the protruding portion 23″ protruding toward the external space S1 side. ..
　このヒートシンクＥによれば、上述したヒートシンクＡ～Ｄと同様に、空気の流れＦによって効率的な熱交換を行える上、突片部２３”を、比較的空気温度の低い外部空間Ｓ１側に配置しているため、より放熱効果を向上することができる。
　特に、このヒートシンクＥは、突片部２３”の突出方向に設置スペースの余裕がある場合に有効である。 According to this heat sink E, similar to the heat sinks A to D described above, efficient heat exchange can be performed by the air flow F, and the projecting piece portion 23″ is arranged on the side of the external space S1 where the air temperature is relatively low. Therefore, the heat dissipation effect can be further improved.
In particular, this heat sink E is effective when there is a margin of installation space in the protruding direction of the projecting piece 23″.
　なお、このヒートシンクＥにおいても、ヒートシンクＡ～Ｃと略同様に、内部空間Ｓ２の内隅２１ｃ側に対応する第三の通気部２１ｂ（図８の二点鎖線参照）を、突片部２３”を有する囲繞片２１に設けて、内隅側の内部空間Ｓ３に空気が滞るのを防ぎ、より放熱効果を向上することが可能である。 In this heat sink E as well, the third ventilation portion 21b (see the chain double-dashed line in FIG. 8) corresponding to the inner corner 21c side of the internal space S2 is provided with the projecting piece portion 23″, similarly to the heat sinks A to C. It is possible to prevent the air from stagnating in the inner space S3 on the inner corner side by providing it on the surrounding piece 21 having the above, and to further improve the heat radiation effect.
＜ヒートシンクＡ及びＣのコンピュータ解析結果＞
　次に、上記構成のヒートシンクＡ（図１～図４参照）と、ヒートシンクＣ（図６参照）について、空気の流れを可視化するようにしたコンピュータ解析の結果を説明する。このコンピュータ解析では、ベース部１０を下方へ向けた縦置き姿勢とし、その下端の電子部品接触面１１に熱源が接触しているものとする。 <Computer analysis results of heat sinks A and C>
Next, the results of the computer analysis for visualizing the air flow of the heat sink A (see FIGS. 1 to 4) and the heat sink C (see FIG. 6) having the above-described configurations will be described. In this computer analysis, it is assumed that the base portion 10 is in a vertically placed posture with the base portion 10 facing downward, and the heat source is in contact with the electronic component contact surface 11 at the lower end thereof.
　この解析の結果、ヒートシンクＡでは、ベース部１０の熱により上昇する空気の流れに、比較的温度の低い外部空間Ｓ１の空気が引き込まれるようにして、連続的な空気の流れＦが形成されるのを確認できた（図９参照）。
　さらに、ヒートシンクＣでは、囲繞片２１内側における上部側の流れが、ヒートシンクＡの場合よりも多くなることを確認できた（図１０参照）。
　これら解析結果より、連続的な空気の流れＦが、熱交換を促進し、ベース部１０の温度上昇を効果的に抑制するものと考えられる。 As a result of this analysis, in the heat sink A, a continuous air flow F is formed so that the air in the external space S1 having a relatively low temperature is drawn into the air flow rising by the heat of the base portion 10. Was confirmed (see FIG. 9).
Further, in the heat sink C, it was confirmed that the flow on the upper side inside the surrounding piece 21 was larger than that in the heat sink A (see FIG. 10 ).
From these analysis results, it is considered that the continuous air flow F promotes heat exchange and effectively suppresses the temperature rise of the base portion 10.
　また、上記構成のヒートシンクＡ，Ｃについて、コンピュータ解析により、同一箇所（ベース部１０）の温度上昇値を求めたところ、ベース部１０を下方へ向けた姿勢にて、ヒートシンクＡが８２．３℃、ヒートシンクＣが７３．７℃あり、ヒートシンクＣの方が放熱効果が高いことを確認した。 Further, regarding the heat sinks A and C having the above-described configuration, the temperature rise value at the same location (base portion 10) was obtained by computer analysis, and the heat sink A was 82.3° C. with the base portion 10 facing downward. It was confirmed that the heat sink C had a temperature of 73.7° C., and the heat sink C had a higher heat dissipation effect.
　なお、上記実施態様のヒートシンクは、図示例のように、ベース部１０を下方へ向けた縦置き状に用いるのが好ましいが、他の使用例としては、ベース部１０を側方へ向けた横向き状に用いることも可能である。
　特に、以下に示す実施態様は、ベース部１０を側方へ向けた場合でも放熱性能の変化が比較的小さい好ましい態様である。 It is preferable that the heat sink of the above-described embodiment is used in a vertically placed shape with the base portion 10 facing downward, as in the illustrated example, but as another usage example, a horizontal orientation with the base portion 10 facing sideways is used. It can also be used in the form of a sheet.
In particular, the embodiment described below is a preferred embodiment in which the heat radiation performance is relatively small even when the base portion 10 is oriented laterally.
＜第六の実施態様＞
　図１１～図１２に示すヒートシンクＧは、ヒートシンクＡに対し、突片部２２，２３を、第一の通気部２１ａ毎の突片部２４，２５に置換し、要所に第三の通気部２１ｂを設けたものである。 <Sixth embodiment>
The heat sink G shown in FIGS. 11 to 12 is different from the heat sink A in that the projecting piece portions 22 and 23 are replaced with projecting piece portions 24 and 25 for each first ventilation portion 21a. 21b is provided.
　このヒートシンクＧにおいて、第一の通気部２１ａは、囲繞部２０を構成する各囲繞片２１に、ベース部１０面に沿う方向に間隔を置いて複数（図示例によれば横方向の中央寄りに２つ）設けられる。
　各第一の通気部２１ａは、囲繞片２１の立ち上がり方向に沿う長尺状（図示例によれば長方形状）に形成され、囲繞片２１を厚み方向へ貫通して、内部空間Ｓ２を囲繞部２０側方の外部空間Ｓ１に連通している。 In this heat sink G, a plurality of first ventilation portions 21a are provided on each surrounding piece 21 forming the surrounding portion 20 at intervals in the direction along the surface of the base portion 10 (according to the illustrated example, closer to the center in the lateral direction). 2) are provided.
Each first ventilation part 21a is formed in a long shape (rectangular shape according to the illustrated example) along the rising direction of the surrounding piece 21, penetrates the surrounding piece 21 in the thickness direction, and surrounds the internal space S2. It communicates with the external space S1 on the side of 20.
　各第一の通気部２１ａには、その内縁部から内部空間Ｓ２へ向かって突出するように突片部２４，２５が設けられる。
　一方の突片部２４は、第一の通気部２１ａの両側の各長縁に沿って設けられる。他方の突片部２５は、第一の通気部２１ａの上下の各短縁に沿って設けられる。そして、これら両側と上下の突片部２４，２５は、囲繞片２１内面から内部空間Ｓ２へ突出する筒状に構成される。 Each of the first ventilation portions 21a is provided with projecting piece portions 24, 25 so as to project from the inner edge portion thereof toward the internal space S2.
One protrusion piece 24 is provided along each long edge on both sides of the first ventilation portion 21a. The other protruding piece portion 25 is provided along each of the upper and lower short edges of the first ventilation portion 21a. Then, the projecting piece portions 24, 25 on both sides and the upper and lower sides are formed in a cylindrical shape projecting from the inner surface of the surrounding piece 21 into the internal space S2.
　また、ヒートシンクＧにおいて、第三の通気部２１ｂは、囲繞部２０において、突片部２４，２５を有する第一の通気部２１ａ以外の部分で、囲繞片２１を厚み方向へ貫通して内部空間Ｓ２と外部空間Ｓ１とを連通する。
　詳細に説明すれば、囲繞部２０は、隣接する囲繞片２１，２１間に内隅２１ｃを有する角筒状に形成される。第三の通気部２１ｂは、各囲繞片２１において、突片部２４，２５よりも内隅２１ｃ寄りに設けられている。
　さらに、第三の通気部２１ｂは、各囲繞片２１において、隣接する二つの第一の通気部２１ａ，２１ａの間にも設けられる。 Further, in the heat sink G, the third ventilation portion 21b is a portion of the surrounding portion 20 other than the first ventilation portion 21a having the projecting piece portions 24 and 25, and penetrates the surrounding piece 21 in the thickness direction to form an internal space. The S2 and the external space S1 communicate with each other.
More specifically, the surrounding section 20 is formed in a rectangular tube shape having an inner corner 21c between the adjacent surrounding pieces 21 and 21. The third ventilation portion 21b is provided closer to the inner corner 21c than the protruding piece portions 24 and 25 in each surrounding piece 21.
Furthermore, the third ventilation part 21b is also provided between the two adjacent first ventilation parts 21a, 21a in each surrounding piece 21.
　上記構成のヒートシンクＧによれば、ヒートシンクＡと同様に、ベース部１０を下方へ向けた姿勢（図１１参照）において、ベース部１０上方側の内部空間Ｓ２には、ベース部１０の熱により上昇する空気の流れが形成される。このため、この上昇する気流に、比較的温度の低い外部空間Ｓ１の空気が引き込まれて、連続的な空気の流れＦが形成される。
　したがって、連続的に流れる空気が、突片部２４，２５等に接触して、効率的な熱交換が行われ、ベース部１０及び電子部品Ｘの温度上昇を抑制することができる。 According to the heat sink G having the above-described configuration, like the heat sink A, in the posture in which the base portion 10 is directed downward (see FIG. 11), the heat of the base portion 10 raises the internal space S2 above the base portion 10. A flow of air is formed. Therefore, the air in the external space S1 having a relatively low temperature is drawn into the rising airflow to form a continuous air flow F.
Therefore, the continuously flowing air comes into contact with the projecting piece portions 24, 25, etc., and efficient heat exchange is performed, so that the temperature rise of the base portion 10 and the electronic component X can be suppressed.
　特に、このヒートシンクＧでは、ベース部１０を横へ向けてＸ方向を垂直にした姿勢で用いた場合（図１２（ａ）（ｂ）参照）に、突片部２４，２５の空気抵抗等による空気流量の低下を、第三の通気部２１ｂによる空気流量の増加により補うことができ、ひいては、姿勢の違いによる放熱性能の変化を小さくすることができる。 In particular, in the heat sink G, when the base portion 10 is used in a posture in which the base portion 10 is oriented horizontally and the X direction is vertical (see FIGS. 12A and 12B ), the air resistance of the protrusions 24 and 25 causes The decrease in the air flow rate can be compensated by the increase in the air flow rate by the third ventilation portion 21b, and consequently, the change in the heat radiation performance due to the difference in posture can be reduced.
　以下は、ヒートシンクＧと、従来のヒートシンク１００（図１７参照）について、コンピュータ解析により、同条件にて同一箇所（ベース部１０）の温度上昇値を求め比較した結果である。
　ヒートシンクＧは、Ｚ方向を垂直にした姿勢（図１１参照）で７４．５℃、Ｘ方向を垂直にした姿勢（図１２参照）で８０．８℃であった。
　それに対し、従来のヒートシンク１００は、Ｚ方向を垂直にした姿勢（図１７参照）で７４．０℃、Ｘ方向を垂直にした姿勢で８８．７℃であった。
　つまり、ヒートシンクＧでは、ＺＸ方向の姿勢の違いによる温度差が比較的に小さく、且つ、特にＸ方向を垂直にした姿勢で、従来品よりも低い温度が得られた。 The following are the results obtained by comparing the heat sink G and the conventional heat sink 100 (see FIG. 17) by computer analysis to find the temperature rise value at the same location (base portion 10) under the same conditions.
The heat sink G has a temperature of 74.5° C. in a posture in which the Z direction is vertical (see FIG. 11) and 80.8° C. in a posture in which the X direction is vertical (see FIG. 12 ).
On the other hand, in the conventional heat sink 100, the temperature was 74.0° C. in the posture in which the Z direction was vertical (see FIG. 17), and 88.7° C. in the posture in which the X direction was vertical.
That is, in the heat sink G, the temperature difference due to the difference in posture in the ZX direction was relatively small, and particularly in the posture in which the X direction was vertical, a lower temperature than that of the conventional product was obtained.
　なお、従来のヒートシンク１００は、ベース部の上面に多数の柱状の放熱フィンを設けたものであり、その輪郭（外形）のＸＹＺ方向の寸法（２５×２５×１５ｍｍ）がヒートシンクＡと略同じのものである。 In the conventional heat sink 100, a large number of columnar heat dissipation fins are provided on the upper surface of the base portion, and the outline (outer shape) of the dimensions (25×25×15 mm) in the XYZ directions is substantially the same as that of the heat sink A. It is a thing.
＜第七の実施態様＞
　図１３～図１４に示すヒートシンクＨは、ヒートシンクＡに対し、四つの囲繞片のうち、対向する二つの囲繞片について、突片部２２，２３を省き、突片部の無い第三の通気部２１ｂを設けたものである。 <Seventh embodiment>
The heat sink H shown in FIGS. 13 to 14 is different from the heat sink A in that the two surrounding pieces of the four surrounding pieces, which are opposed to each other, do not include the protruding pieces 22 and 23, and the third ventilation portion does not include the protruding piece. 21b is provided.
　詳細に説明すれば、このヒートシンクＨの囲繞部２０は、突片部２２，２３付きの第一の通気部２１ａを有するとともに対向する囲繞片２１，２１と、突片部の無い第三の通気部２１ｂを有するとともに対向する囲繞片２１’，２１’とを具備し、四角形筒状に構成される。 More specifically, the surrounding portion 20 of the heat sink H has the first ventilation portion 21a with the protruding piece portions 22 and 23, and the surrounding surrounding pieces 21 and 21 facing each other, and the third ventilation portion without the protruding portion. It has a portion 21b and also has opposing surrounding pieces 21', 21', and is configured in a rectangular tube shape.
　一方の各囲繞片２１は、ヒートシンクＡと略同様の構成の第一の通気部２１ａ、突片部２２，２３を有する。
　他方の各囲繞片２１’には、ベース部１０面方向に間隔を置いて、突片部の無い複数の第三の通気部２１ｂが設けられる。各第三の通気部２１ｂは、第一の通気部２１ａよりも幅狭に形成される。 Each of the one surrounding pieces 21 has a first ventilation portion 21 a and projecting piece portions 22 and 23 having substantially the same configuration as the heat sink A.
Each of the other surrounding pieces 21' is provided with a plurality of third ventilation portions 21b having no protruding piece portion at intervals in the surface direction of the base portion 10. Each third ventilation part 21b is formed narrower than the first ventilation part 21a.
　上記構成のヒートシンクＨによれば、ヒートシンクＡと同様に、ベース部１０を下方へ向けた姿勢（図１３参照）において、ベース部１０上方側の内部空間Ｓ２には、ベース部１０の熱により上昇する空気の流れが形成される。このため、この上昇する気流に、比較的温度の低い外部空間Ｓ１の空気が引き込まれて、連続的な空気の流れＦが形成される。
　したがって、連続的に流れる空気が、突片部２２，２３に接触して、効率的な熱交換が行われ、ベース部１０及び電子部品の温度上昇を抑制することができる。 According to the heat sink H configured as described above, like the heat sink A, in the posture in which the base portion 10 is directed downward (see FIG. 13), the heat of the base portion 10 raises the internal space S2 above the base portion 10. A flow of air is formed. Therefore, the air in the external space S1 having a relatively low temperature is drawn into the rising airflow to form a continuous air flow F.
Therefore, the continuously flowing air comes into contact with the projecting piece portions 22 and 23, efficient heat exchange is performed, and the temperature rise of the base portion 10 and the electronic component can be suppressed.
　特に、このヒートシンクＨでは、図示のＸ方向を略垂直にした姿勢（図１４（ａ）（ｂ）参照）にて、突片部２２，２３の空気抵抗等による空気流量の低下を、第三の通気部２１ｂによる空気流量の増加により補うことができ、ひいては、この姿勢において良好な放熱性能を得ることができる。 Particularly, in this heat sink H, when the X direction shown in the drawing is substantially vertical (see FIGS. 14A and 14B), the decrease in the air flow rate due to the air resistance of the projecting piece portions 22 and 23 is reduced to the third value. This can be compensated for by increasing the air flow rate by the ventilation part 21b, and thus good heat dissipation performance can be obtained in this posture.
　以下は、ヒートシンクＨについて、コンピュータ解析により、同条件にて同一箇所（ベース部１０）の温度上昇値を求め比較した結果である。
　ヒートシンクＨは、Ｚ方向を垂直にした姿勢（図１３参照）で７３．０℃、Ｘ方向を垂直にした姿勢（図１４参照）で７７．４℃であった。
　つまり、ヒートシンクＨでは、先に説明した従来のヒートシンク１００（図１７参照）と比較し、低い温度が得られる上、特に、Ｘ方向を略垂直にして用いた場合（図１４参照）でも、温度変化が小さかった。 The following are the results obtained by comparing the heat sink H with the temperature rise value at the same location (base portion 10) under the same conditions by computer analysis.
The heat sink H had a temperature of 73.0° C. in a posture in which the Z direction was vertical (see FIG. 13), and 77.4° C. in a posture in which the X direction was vertical (see FIG. 14 ).
That is, in the heat sink H, a lower temperature can be obtained as compared with the conventional heat sink 100 described above (see FIG. 17), and in particular, even when the X direction is used substantially vertically (see FIG. 14), The change was small.
＜第八の実施態様＞
　図１５～図１６に示すヒートシンクＩは、ヒートシンクＡの四つの囲繞片のうち、一方の対向する二つの囲繞片について、突片部２２，２３を、第一の通気部２１ａ毎の突片部２４，２５に置換し、他方の対向する二つの囲繞片について、突片部２２，２３を省き、突片部の無い第三の通気部２１ｂ，１２ｂ’を設け、さらに、隣接する囲繞片２１，２１’間に第三の通気部２１ｂ”を設けたものである。 <Eighth Embodiment>
The heat sink I shown in FIG. 15 to FIG. 16 has projecting piece portions 22 and 23 for two facing one of the four surrounding pieces of the heat sink A, and the projecting piece portions for each first ventilation portion 21a. 24, 25, the other two opposing surrounding pieces, the protruding piece portions 22, 23 are omitted, and the third ventilation portions 21b, 12b′ having no protruding piece portion are provided, and the adjacent surrounding piece 21 is further provided. , 21' is provided with a third ventilation portion 21b".
　詳細に説明すれば、このヒートシンクＩの囲繞部２０は、突片部２４，２５付きの第一の通気部２１ａを有するとともに対向する二つの囲繞片２１，２１と、突片部の無い第三の通気部２１ｂ，１２ｂ’を有するとともに対向する二つの囲繞片２１’，２１’とを具備し、四角形筒状に構成される。 More specifically, the surrounding portion 20 of the heat sink I has the first ventilation portion 21a with the protruding piece portions 24 and 25, and the two surrounding facing pieces 21 and 21 facing each other, and the third surrounding portion without the protruding piece portion. It has a ventilation part 21b, 12b' and is provided with two facing surrounding pieces 21', 21', and is configured in a rectangular tube shape.
　一方の各囲繞片２１は、第一の通気部２１ａ毎にその内縁から内部空間Ｓ２へ突出する角筒状の突片部２４，２５を有し、隣接する突片部２４，２５間には隙間を有する。 Each of the surrounding pieces 21 on one side has projecting piece portions 24, 25 in the shape of a square tube protruding from the inner edge thereof to the internal space S2 for each first ventilation portion 21a, and between the adjacent projecting piece portions 24, 25. Has a gap.
　他方の各囲繞片２１’には、ベース部１０面方向に間隔を置いて、複数の第三の通気部２１ｂ，２１ｂ’が設けられる。
　各囲繞片２１’の幅方向中央寄りに位置する複数（図示例によれば三つ）の第三の通気部２１ｂは、それぞれ、第一の通気部２１ａよりも幅狭に形成される。
　そして、これら第三の通気部２１ｂの両側に位置する第三の通気部２１ｂ’，２１ｂ’は、前記第三の通気部２１ｂよりも幅広に形成される。 Each of the other surrounding pieces 21' is provided with a plurality of third ventilation portions 21b, 21b' at intervals in the surface direction of the base portion 10.
The plurality of (three in the illustrated example) third ventilation portions 21b located near the center in the width direction of each surrounding piece 21' are each formed narrower than the first ventilation portion 21a.
The third ventilation portions 21b' and 21b' located on both sides of the third ventilation portion 21b are formed wider than the third ventilation portion 21b.
　また、隣接する二つの囲繞片２１，２１’には隙間が設けられ、この隙間は、外部空間Ｓ１と内部空間Ｓ２を連通する第三の通気部２１ｂ”として機能する。 Also, a gap is provided between the adjacent two surrounding pieces 21, 21', and this gap functions as a third ventilation portion 21b" that connects the external space S1 and the internal space S2.
　上記構成のヒートシンクＩによれば、ヒートシンクＡと同様に、ベース部１０を下方へ向けた姿勢（図１５参照）において、ベース部１０上方側の内部空間Ｓ２には、ベース部１０の熱により上昇する空気の流れが形成される。このため、この上昇する気流に、比較的温度の低い外部空間Ｓ１の空気が引き込まれて、連続的な空気の流れＦが形成される。
　したがって、連続的に流れる空気が、突片部２４，２５に接触して、効率的な熱交換が行われ、ベース部１０及び電子部品Ｘの温度上昇を抑制することができる。 According to the heat sink I having the above-described configuration, like the heat sink A, in the posture in which the base portion 10 is directed downward (see FIG. 15), the heat of the base portion 10 raises the internal space S2 above the base portion 10. A flow of air is formed. Therefore, the air in the external space S1 having a relatively low temperature is drawn into the rising airflow to form a continuous air flow F.
Therefore, the continuously flowing air comes into contact with the projecting pieces 24 and 25, efficient heat exchange is performed, and the temperature rise of the base 10 and the electronic component X can be suppressed.
　特に、このヒートシンクＩでは、図示のＸ方向を略垂直にした姿勢（図１６（ａ）（ｂ）参照）にて、突片部２４，２５の空気抵抗等による空気流量の低下を、第三の通気部２１ｂ，２１ｂ’，２１ｂ”による空気流量の増加により補うことができ、ひいては、この姿勢において良好な放熱性能を得ることができる。 Particularly, in this heat sink I, when the posture in which the X direction shown in the figure is substantially vertical (see FIGS. 16A and 16B), the decrease in the air flow rate due to the air resistance of the projecting pieces 24 and 25 is reduced to the third value. This can be compensated for by increasing the air flow rate by the ventilation parts 21b, 21b', 21b", and thus good heat dissipation performance can be obtained in this posture.
　以下は、ヒートシンクＩについて、コンピュータ解析により、同条件にて同一箇所（ベース部１０）の温度上昇値を求め比較した結果である。
　ヒートシンクＩは、Ｚ方向を垂直にした姿勢（図１５参照）で７１．８℃、Ｘ方向を垂直にした姿勢（図１６参照）で７６．８℃℃であった。
　つまり、ヒートシンクＩでは、先に説明した従来のヒートシンク１００（図１７参照）よりも低い温度が得られる上、特に、図示のＸ方向を略垂直にして用いた場合（図１６参照）でも、温度変化が小さかった。 The following are the results of comparing the heat sink I by calculating the temperature rise value at the same location (base portion 10) under the same conditions by computer analysis.
The heat sink I had a temperature of 71.8° C. in a posture in which the Z direction was vertical (see FIG. 15), and 76.8° C. in a posture in which the Z direction was vertical (see FIG. 16 ).
That is, the heat sink I can obtain a lower temperature than the conventional heat sink 100 (see FIG. 17) described above, and in particular, even when the X direction shown in the figure is used substantially vertically (see FIG. 16), The change was small.
　なお、本発明は上述した実施態様に限定されず、本発明の要旨を変更しない範囲で適宜変更可能である。 It should be noted that the present invention is not limited to the above-described embodiments, and can be changed as appropriate without changing the gist of the present invention.
　１０：ベース部
　１１：電子部品接触面
　２０：囲繞部
　２１，２１’：囲繞片
　２１ａ：通気部（第一の通気部）
　２１ａ’：通気部（第二の通気部）
　２１ｂ，２１ｂ’，２１ｂ”：第三の通気部
　２２，２２’，２３，２３’，２３”，２４，２５：突片部
　Ｓ１：外部空間
　Ｓ２：内部空間
　Ｓ３：内隅側の内部空間
　Ａ～Ｉ：ヒートシンク
　Ｆ：空気の流れ 10: Base part 11: Electronic component contact surface 20: Enclosure part 21, 21': Enclosure piece 21a: Ventilation part (first ventilation part)
21a': ventilation part (second ventilation part)
21b, 21b', 21b": Third ventilation part 22, 22', 23, 23', 23", 24, 25: Projection piece S1: External space S2: Internal space S3: Internal space on inner corner side A -I: Heat sink F: Air flow

Claims (10)

  1. 　一方側の面を電子部品接触面とした板状のベース部と、前記ベース部を境にした他方側の内部空間を囲むようにして前記ベース部の周縁側から突出する囲繞部とを備え、
    　前記囲繞部には、前記内部空間を前記囲繞部の側方の外部空間へ連通する通気部が設けられ、この通気部の内縁には、前記内部空間側へ突出する突片部が設けられていることを特徴とするヒートシンク。     A plate-shaped base portion having a surface on one side as an electronic component contact surface, and a surrounding portion protruding from the peripheral side of the base portion so as to surround the internal space on the other side with the base portion as a boundary,
    The surrounding portion is provided with a ventilation portion that communicates the internal space with an external space on a side of the surrounding portion, and an inner edge of the ventilation portion is provided with a projecting portion protruding toward the internal space. A heat sink that is characterized by
  2. 　前記通気部が長尺状の孔であり、前記突片部が前記通気部の長縁に沿って設けられていることを特徴とする請求項１記載のヒートシンク。 The heat sink according to claim 1, wherein the ventilation part is a long hole, and the protruding piece is provided along a long edge of the ventilation part.
  3. 　前記突片部が、前記通気部における両側の長縁に沿ってそれぞれ設けられ、
    　これら両側の突片部は、その長手方向の端部間を開口していることを特徴とする請求項２記載のヒートシンク。     The protrusions are provided along the long edges on both sides of the ventilation part,
    The heat sink according to claim 2, wherein the projecting pieces on both sides have openings between end portions in the longitudinal direction.
  4. 　前記通気部として、前記他方側へ長尺な第一の通気部と、前記ベース部に沿う方向へ長尺な第二の通気部とを有し、
    　これら第一の通気部と第二の通気部には、それぞれ、その長縁に沿う前記突片部が設けられていることを特徴とすることを特徴とする請求項１～３何れか１項記載のヒートシンク。     As the ventilation part, having a first ventilation part elongated to the other side, and a second ventilation part elongated in a direction along the base part,
    4. The first and second ventilation parts are each provided with the projecting piece along the long edge thereof. Heatsink as described.
  5. 　前記通気部として、前記他方側へ長尺状に延設された第一の通気部と、前記ベース部に沿う方向へ長尺状に延設された第二の通気部とを有し、
    　これら第一の通気部と第二の通気部のうち、その一方の通気部には、その長縁に沿って前記内部空間側へ突出する前記突片部が設けられ、他方の通気部には、前記外部空間側へ突出する突片部が設けられていることを特徴とする請求項１～３何れか１項記載のヒートシンク。     As the ventilation part, having a first ventilation part that is elongatedly extended to the other side, and a second ventilation part that is elongatedly extended in a direction along the base portion,
    Of these first ventilation portion and second ventilation portion, one of the ventilation portions is provided with the projecting piece portion protruding toward the internal space along the long edge thereof, and the other ventilation portion is provided in the other ventilation portion. The heat sink according to any one of claims 1 to 3, further comprising a protruding piece portion protruding toward the external space.
  6. 　前記囲繞部には、前記突片部を有する通気部以外の部分で、前記囲繞部を厚み方向へ貫通して前記内部空間と前記外部空間とを連通する第三の通気部が設けられていることを特徴とする請求項１～５何れか１項記載のヒートシンク。 The surrounding portion is provided with a third ventilation portion that penetrates the surrounding portion in the thickness direction and communicates the internal space and the external space with each other at a portion other than the ventilation portion having the projecting piece portion. The heat sink according to any one of claims 1 to 5, characterized in that:
  7. 　前記囲繞部が、隣接する囲繞片の間に内隅を有する角筒状に形成され、
    　前記第三の通気部が、前記突片部よりも前記内隅側に設けられていることを特徴とする請求項６記載のヒートシンク。     The surrounding portion is formed in a rectangular tube shape having an inner corner between adjacent surrounding pieces,
    The heat sink according to claim 6, wherein the third ventilation portion is provided closer to the inner corner side than the projecting piece portion.
  8. 　前記囲繞部には、前記突片部を有する通気部が間隔を置いて複数設けられ、これら複数の通気部のうち、隣接する二つの通気部の間に、前記第三の通気部が設けられていることを特徴とする請求項６又は７記載のヒートシンク。 The surrounding portion is provided with a plurality of ventilation portions having the protruding piece portion at intervals, and among the plurality of ventilation portions, the third ventilation portion is provided between two adjacent ventilation portions. The heat sink according to claim 6 or 7, characterized in that:
  9. 　前記囲繞部が、複数の囲繞片から角筒状に形成され、
    　前記複数の囲繞片のうち、少なくとも一つの囲繞片には、前記突片部を有する通気部と前記突片部が無く、かつ前記第三の通気部が設けられていることを特徴とする請求項６記載のヒートシンク。     The surrounding portion is formed into a rectangular tube shape from a plurality of surrounding pieces,
    At least one surrounding piece among the plurality of surrounding pieces is characterized in that the ventilation portion having the protruding piece portion and the protruding piece portion are absent, and the third ventilation portion is provided. Item 6. The heat sink according to item 6.
  10. 　前記ベース部の電子部品接触面に、電子部品が接触していることを特徴とする請求項１～９何れか１項記載のヒートシンクを用いた電子部品パッケージ。
    　     The electronic component package using a heat sink according to any one of claims 1 to 9, wherein the electronic component is in contact with the electronic component contact surface of the base portion.
PCT/JP2019/030273 2019-01-10 2019-08-01 Heat sink and electronic component package WO2020144886A1 (en)

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