JP6570208B1 - Heat sink and electronic component package - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a good heat dissipation performance by a space-saving shape. SOLUTION: An enclosure that protrudes from a peripheral side of a base portion 10 so as to surround a plate-like base portion 10 having a surface on one side as an electronic component contact surface 11 and an internal space S2 on the other side of the base portion 10 as a boundary. The surrounding portion 20 is provided with a vent hole 21a that communicates the internal space S2 with the outer space S1 on the side of the surrounding portion 20, and the inner edge of the vent hole 21a faces the inner space S2 side. A protruding piece portion 22 is provided. [Selection] Figure 1

Description

  The present invention relates to a heat sink and an electronic component package configured to dissipate heat from an electronic component or the like.

Conventionally, in this type of invention, for example, as described in Patent Document 1, a plate-like base portion that can contact an electronic component and four protrusions surrounding a space on one side in the thickness direction of the base portion. There is a heat sink having one piece, a plurality of cylindrical protrusions protruding from each protrusion piece in a direction opposite to the space, and a plurality of grooves formed inside the four protrusion pieces.
In this heat sink, good heat dissipation performance can be obtained by the plurality of cylindrical protrusions and the plurality of grooves.

JP 2018-14539 A

  However, according to the prior art, since the plurality of protrusions protrude in the horizontal direction from the outline of the base portion, the overall horizontal area tends to increase. For this reason, when the horizontal installation space is determined in advance, it may be difficult to cope with it.

In view of such problems, the present invention has the following configuration.
A plate-like base portion having a surface on one side as an electronic component contact surface, and a surrounding portion projecting from the peripheral side of the base portion so as to surround the inner space on the other side with the base portion as a boundary, The portion is provided with a ventilation portion that communicates the internal space with the outer space on the side of the surrounding portion, and a protruding piece portion that protrudes toward the internal space is provided at the inner edge of the ventilation portion. Heat sink characterized by.

  Since the present invention is configured as described above, good heat dissipation performance can be obtained with a space-saving shape.

It is a perspective view which shows an example of the heat sink which concerns on this invention. It is a top view of the heat sink. It is sectional drawing which follows the (III)-(III) line | wire of FIG. It is sectional drawing which follows the (IV)-(IV) line | wire of FIG. It is a perspective view which shows the other example of the heat sink which concerns on this invention. It is a perspective view which shows the other example of the heat sink which concerns on this invention. It is a perspective view which shows the other example of the heat sink which concerns on this invention. It is a perspective view which shows the other example of the heat sink which concerns on this invention. It is a figure which shows the flow of air about the heat sink shown in FIG. It is a figure which shows the flow of air about the heat sink shown in FIG. It is a perspective view which shows the other example of the heat sink which concerns on this invention. (A) is sectional drawing which follows the (a)-(a) line of FIG. 11, (b) is sectional drawing which follows the (b)-(b) line of FIG. 11, and turned the base part to the horizontal direction. Indicates the state. It is a perspective view which shows the other example of the heat sink which concerns on this invention. (A) is sectional drawing which follows the (a)-(a) line of FIG. 13, (b) is sectional drawing which follows the (b)-(b) line of FIG. 13, and turned the base part to the horizontal direction Indicates the state. It is a perspective view which shows the other example of the heat sink which concerns on this invention. (A) is sectional drawing which follows the (a)-(a) line of FIG. 13, (b) is sectional drawing which follows the (b)-(b) line of FIG. 13, and turned the base part to the horizontal direction Indicates the state. It is a perspective view which shows an example of the conventional heat sink.

In the present embodiment, the following features are disclosed.
The first feature is that a plate-like base portion having an electronic component contact surface on one side and an enclosing portion protruding from the peripheral side of the base portion so as to surround the other internal space with the base portion as a boundary. The surrounding portion is provided with a ventilation portion that communicates the internal space with an external space on the side of the surrounding portion, and a protruding piece portion that protrudes toward the internal space side at the inner edge of the ventilation portion. (See FIGS. 1 to 8).
Here, the “venting portion” includes a through hole or a notch that penetrates the surrounding portion.

  The second feature is that the ventilation part is a long hole, and the protruding piece part is provided along the long edge of the ventilation part (see FIGS. 1 to 8).

  The third feature is that the protruding piece portions are provided along the long edges on both sides of the ventilation portion, and the protruding piece portions on both sides open between end portions in the longitudinal direction (FIG. 6). To FIG. 8).

A fourth feature is that the ventilation portion includes a first ventilation portion that is long to the other side and a second ventilation portion that is long in the direction along the base portion. Each of the first and second ventilation portions is provided with the protruding piece along the long edge (see FIG. 7).

Fifth aspect, as the ventilation portion, the first vent portion said extending to the other side in an elongated shape, the second vent portion in a direction along the base portion extending in the elongated Of the first ventilation part and the second ventilation part, one of the ventilation parts is provided with the protruding piece part protruding toward the internal space along the long edge, The vent portion is provided with a projecting piece that protrudes toward the external space (see FIG. 8).

  As a sixth feature, in the surrounding portion, a third ventilation that penetrates the surrounding portion in the thickness direction and communicates the internal space and the external space at a portion other than the ventilation portion having the protruding piece portion. (See FIGS. 1, 5 to 8, and 11 to 16).

As a seventh aspect, the surrounding portion is formed on the rectangular tube having an inner corner between you adjacent circumference Nyo piece, said third vent portion, the inner corner side of the protrusion portion (See FIGS. 1, 5 to 8, and FIGS. 11 to 16).

  As an eighth feature, the surrounding portion is provided with a plurality of ventilation portions having the projecting piece portions at intervals, and among the plurality of ventilation portions, between the two adjacent ventilation portions, the third ventilation portion is provided. The ventilation part is provided (see FIGS. 11 to 12).

  As a ninth feature, the surrounding portion is formed in a rectangular tube shape from a plurality of surrounding pieces, and at least one of the plurality of surrounding pieces includes a ventilation portion having the protruding piece portion and the protruding portion. There is no piece and the third vent is provided (see FIGS. 13 to 16).

  A tenth feature is an electronic component package using the heat sink, wherein the electronic component is in contact with the electronic component contact surface of the base portion (see FIGS. 3 to 4, 12, 14, and 16). reference).

<First embodiment>
Next, specific embodiments having the above characteristics will be described in detail with reference to the drawings.
The heat sink A shown in FIGS. 1 to 4 surrounds a plate-like base portion 10 having one surface on the electronic component contact surface 11 and an inner space S2 on the other side with the base portion 10 as a boundary. And the surrounding portion 20 protruding from the peripheral side.

The heat sink A constitutes an electronic component package (see FIGS. 3 and 4) by bringing the electronic component contact surface 11 into contact with an electronic component X (for example, a CPU, a transistor, a thyristor, another semiconductor, an electronic component, etc.). . In addition, you may make it provide a fan around this electronic component package as needed.
The heat sink A is formed from a metal material including aluminum, copper, stainless steel, nickel, magnesium, or the like, and an alumite treatment is performed on the surface thereof.

The base portion 10 is formed in a rectangular flat plate shape (a square flat plate shape in the illustrated example), and a surface located on one side in the thickness direction (a lower side in the illustrated example) is formed in a flat shape to form an electron. An electronic component contact surface 11 for contacting the component X is used.
The surface on the other side (upper side in the illustrated example) of the base portion 10 is formed in a flat shape without through holes or irregularities, but it is possible to provide heat-radiating fins having an appropriate shape as necessary. is there.

  The surrounding portion 20 includes a plurality of surrounding pieces 21 and projecting piece portions 22 and 23 protruding toward the internal space S2 along the ventilation portion 21a inside the surrounding piece 21.

Each of the surrounding pieces 21 rises substantially vertically from the edge portion along each side of the base portion 10 to the counter heat source side (the opposite side to the electronic component X side).
Each of the surrounding pieces 21 is provided with a plurality of ventilation portions 21a arranged in a direction along the surface of the base portion 10 (horizontal direction in the illustrated example).
The plurality of surrounding pieces 21 are formed in a rectangular tube shape (in the illustrated example, a rectangular tube shape) surrounding the internal space S2, and open on the side opposite to the base portion (upper side in the drawing).
An inner corner portion and an outer corner portion between each surrounding piece 21 and the base portion 10 are formed into a curved surface by bending or the like.

  Each ventilation portion 21a is formed in a long shape (rectangular shape according to the illustrated example) along the rising direction of the surrounding piece 21, and penetrates the surrounding piece 21 in the thickness direction, and passes the internal space S2 to the side of the surrounding portion 20. It communicates with the external space S1.

  The projecting pieces 22 and 23 are flat projections projecting toward the inner space S2 along the inner edge of the ventilation portion 21a.

If it demonstrates in detail, the one protrusion piece part 22 will be formed in the elongate shape along the long edge (long side) of the both sides of the ventilation | gas_flowing part 21a, and protrudes to the internal space S2 side.
The projecting piece portion 22 positioned between the two adjacent ventilation portions 21a and 21a is formed in a single plate shape that partitions the spaces on both sides.

The other protruding piece portion 23 is formed along the short edges (short sides) on both sides of the ventilation portion 21a and protrudes into the internal space S2. As shown in FIG. 1, the two projecting pieces 23, 23 straddling the adjacent ventilation portions 21 a, 21 a are continuous.
That is, as shown in FIG. 1, the projecting piece portions 22 and 23 are formed in a rectangular tube shape projecting toward the internal space S <b> 2, and a plurality of the projecting piece portions 22 and 23 are arranged in the illustrated horizontal direction.

Next, the characteristic effect of the heat sink A having the above-described configuration will be described in detail.
In a state where the electronic component contact surface 11 of the base portion 10 is in contact with the electronic component X that is generating heat (see FIGS. 3 and 4), the internal space S2 above the base portion 10 is heated by the heat of the base portion 10. A rising air flow is formed. For this reason, the air of the external space S1 having a relatively low temperature is drawn into the rising air flow, and a continuous air flow F is formed.
Therefore, the air that flows continuously as described above comes into contact with the projecting piece portions 23, so that efficient heat exchange is performed, and temperature rises of the base portion 10 and the electronic component X are suppressed.

  Note that the air around the heat sink A may be made to flow by natural convection, but as another example, a blower may be provided at an appropriate place to force the surrounding air to flow.

  Further, a third ventilation portion 21b shown by a two-dot chain line in FIG. 1 may be provided for the heat sink A having the above-described configuration to further improve the air fluidity. The third ventilation portion 21b is located closer to the inner corner 21c than the projecting piece portion 22, is formed to communicate the inner space S3 on the inner corner 21c side with the outer space S1, and is located on the inner corner 21c side of the inner space S3. This prevents the air from stagnating and causes high heat, and further improves the heat dissipation effect of the heat sink A as a whole.

<Second embodiment>
Next, another embodiment of the heat sink according to the present invention will be described. In addition, since the embodiment shown below changes a part of embodiment mentioned above, it explains in detail mainly the change part, and description of a common part is abbreviate | omitted suitably using the same code | symbol.

  The heat sink B shown in FIG. 5 is obtained by replacing the heat sink A having the above configuration with the ventilation portion 21a and the projecting piece portions 22 and 23 by the ventilation portion 21a 'and the projecting piece portions 22' and 23 '.

The ventilation portion 21a 'is formed in a long shape (rectangular shape according to the illustrated example) in the direction along the base portion 10 in the surrounding piece 21, and penetrates the surrounding piece 21 in the thickness direction to surround the internal space S2. It communicates with the external space S1 on the 20 side.
A plurality (three in the illustrated example) of the ventilation portions 21 a ′ are provided along the rising direction of the surrounding piece 21.

  The projecting piece portions 22 ′ and 23 ′ are flat projections that protrude toward the inner space S <b> 2 along the inner edge of the ventilation portion 21 a ′.

  The one protruding piece 22 'is formed along the short edges (short sides) on both sides of the ventilation portion 21a' and protrudes into the internal space S2. Two projecting pieces 22 'and 22' straddling the adjacent ventilation portions 21a 'and 21a' are continuous as shown in FIG.

The other protruding piece 23 ′ is formed in a long shape along the long edges (long sides) on both sides of the ventilation portion 21a ′, and protrudes toward the internal space S2.
The projecting piece portion 23 ′ positioned between the two adjacent ventilation portions 21a ′ and 21a ′ is formed in a single plate shape that partitions the spaces on both sides in the vertical direction.

According to the heat sink B having the above configuration, as in the heat sink A, an air flow rising due to the heat of the base portion 10 is formed in the internal space S2 above the base portion 10. For this reason, the air of the external space S1 having a relatively low temperature is drawn into the rising air flow, and a continuous air flow F is formed.
Therefore, the continuously flowing air comes into contact with the projecting piece 23 ′, efficient heat exchange is performed, and the temperature rise of the base 10 and the electronic component X is suppressed.

  In the heat sink B, similarly to the heat sink A, a third ventilation portion 21b (refer to a two-dot chain line in FIG. 5) corresponding to the inner corner 21c side of the inner space S2 is provided, and the inner space on the inner corner side is provided. It is possible to prevent air from stagnating in S3 and further improve the heat dissipation effect.

<Third embodiment>
The heat sink C shown in FIG. 6 is obtained by omitting the upper and lower projecting piece portions 23 and 23 (see FIG. 1) corresponding to the ventilation portions 21a from the heat sink A having the above configuration.
That is, in this heat sink C, the protruding piece 22 is provided along the long edges on both sides of the ventilation portion 21a. And these protrusion piece parts 22 and 22 are opening between the edge parts in the longitudinal direction, and it distribute | circulates air to this opening.
According to this heat sink C, the air that has entered the ventilation portion 21a from the external space S1 rises between the adjacent projecting piece portions 22 and 22 and escapes upward from between the projecting piece portions 22 and 22 so as to be relatively resistant. A continuous air flow F that is not easily received is formed.
For this reason, in addition to acting in substantially the same manner as the heat sink A described above, more efficient heat exchange is performed by the air flow F, and as a result, the temperature rise of the base portion 10 and the electronic component X is more effectively performed. Can be suppressed.

  In this heat sink C as well as the heat sinks A and B, a third ventilation portion 21b (refer to the two-dot chain line in FIG. 6) corresponding to the inner corner 21c side of the internal space S2 is provided to further increase the heat dissipation effect. It is possible to improve.

<Fourth embodiment>
The heat sink D shown in FIG. 7 is different from the heat sink C having the above-described configuration in that the ventilation portion 21a and the projecting piece portion 22 on both sides facing each other with the internal space S2 therebetween are the second ventilation portion 21a ′ and the projecting piece portion, respectively. 23 ″.
That is, the heat sink D has a first ventilation portion 21a that is elongated to the other side (the upper side in the figure) as a ventilation portion, and a first ventilation portion that is elongated in a direction along the surface of the base portion 10. The first vent portion 21a and the second vent portion 21a ′ are provided with projecting pieces 22 and 23 ′ along their long edges, respectively.

  The first ventilation portion 21a and the protruding piece portion 22 are configured in the same manner as the ventilation portion 21a and the protruding piece portion 22 in the heat sink C (see FIG. 6), and are indicated by the same reference numerals as those of the heat sink C.

The second ventilation portion 21a ′ and the protruding piece portion 23 ′ are configured in substantially the same manner as the ventilation portion 21a ′ and the protruding piece portion 23 ′ in the heat sink B (see FIG. 5), and have the same reference numerals as those of the heat sink B. It is shown.
Note that two adjacent projecting piece portions 23 ′ and 23 ′ pass through in the direction along the surface of the base portion 10 (the horizontal direction in the drawing), which is different from that of the heat sink B.

According to the heat sink D having the above-described configuration, as in the case of the heat sink C, it is possible to effectively suppress the temperature rise of the base portion 10 and the electronic component X by efficient heat exchange, and the posture of the heat sink D as a whole is changed. The same effect can be obtained even if it is changed.
More specifically, in this heat sink D, for example, the protruding piece portion 23 ′ is in a posture in which the electronic component contact surface 11 of the base portion 10 faces sideward and the surrounding piece 21 having the ventilation portion 21 a faces downward. It becomes a long air flow path which continues in the vertical direction. For this reason, even when used in such a horizontal posture, the air flow in the internal space S2 can be made favorable and efficient heat exchange can be performed.

  In the heat sink D, similarly to the heat sinks A to C, a third ventilation portion 21b (refer to a two-dot chain line in FIG. 7) corresponding to the inner corner 21c side of the internal space S2 is provided. It is possible to prevent air from stagnating in the internal space S3 and further improve the heat dissipation effect.

<Fifth embodiment>
A heat sink E shown in FIG. 8 is obtained by replacing the heat sink D having the above-described configuration with a protruding piece portion 23 ″ facing the internal space S2 with a protruding piece portion 23 ″ moving toward the external space S1.
That is, the heat sink E extends as a ventilation portion in a long shape in the direction along the surface of the base portion 10 and the first ventilation portion 21a extending in a long shape toward the other side (the upper side in the drawing). And a second ventilation portion 21a ′ provided.
Of the first ventilation portion 21a and the second ventilation portion 21a ', one of the ventilation portions (the first ventilation portion 21a according to the illustrated example) has an internal space S2 along its long edge. A projecting piece portion 22 projecting toward the external space S1 is provided in the other vent portion (second vent portion 21a ′ in the illustrated example). .

According to the heat sink E, as in the heat sinks A to D described above, the heat flow can be efficiently exchanged by the air flow F, and the protruding piece portion 23 ″ is disposed on the external space S1 side where the air temperature is relatively low. Therefore, the heat dissipation effect can be further improved.
In particular, the heat sink E is effective when there is a sufficient installation space in the protruding direction of the protruding piece 23 ″.

  In the heat sink E, as in the heat sinks A to C, the third ventilation portion 21b (see the two-dot chain line in FIG. 8) corresponding to the inner corner 21c side of the internal space S2 is used as the protruding piece portion 23 ″. It is possible to prevent the air from stagnation in the inner space S3 on the inner corner side and further improve the heat dissipation effect.

<Computer analysis results of heat sinks A and C>
Next, the results of computer analysis in which the air flow is visualized for the heat sink A (see FIGS. 1 to 4) and the heat sink C (see FIG. 6) having the above-described configuration will be described. In this computer analysis, it is assumed that the base portion 10 is in a vertically placed posture facing downward, and the heat source is in contact with the electronic component contact surface 11 at the lower end.

As a result of this analysis, in the heat sink A, a continuous air flow F is formed such that the air in the external space S1 having a relatively low temperature is drawn into the air flow rising by the heat of the base portion 10. Was confirmed (see FIG. 9).
Further, in the heat sink C, it was confirmed that the flow on the upper side inside the surrounding piece 21 was larger than that in the case of the heat sink A (see FIG. 10).
From these analysis results, it is considered that the continuous air flow F promotes heat exchange and effectively suppresses the temperature rise of the base portion 10.

  Further, regarding the heat sinks A and C having the above configuration, when the temperature rise value at the same location (base portion 10) was obtained by computer analysis, the heat sink A was 82.3 ° C. with the base portion 10 facing downward. It was confirmed that the heat sink C had a temperature of 73.7 ° C. and the heat sink C had a higher heat dissipation effect.

The heat sink of the above embodiment is preferably used in a vertically placed shape with the base portion 10 facing downward as shown in the illustrated example. However, as another example of use, the base portion 10 faces sideways. It is also possible to use it in a shape.
In particular, the embodiment described below is a preferable embodiment in which the change in heat dissipation performance is relatively small even when the base portion 10 is directed to the side.

<Sixth embodiment>
The heat sink G shown in FIGS. 11 to 12 replaces the projecting piece portions 22 and 23 with the projecting piece portions 24 and 25 for each of the first ventilation portions 21a with respect to the heat sink A, and a third ventilation portion is provided at a key point. 21b is provided.

In this heat sink G, a plurality of first ventilation portions 21a are arranged on the surrounding pieces 21 constituting the surrounding portion 20 at intervals in the direction along the surface of the base portion 10 (in the illustrated example, closer to the center in the lateral direction). 2) provided.
Each first ventilation portion 21a is formed in a long shape (rectangular shape in the illustrated example) along the rising direction of the surrounding piece 21, and penetrates the surrounding piece 21 in the thickness direction to surround the internal space S2. It communicates with the external space S1 on the 20 side.

Each first ventilation portion 21a is provided with projecting piece portions 24 and 25 so as to protrude from the inner edge portion toward the inner space S2.
One protrusion piece 24 is provided along each long edge of the both sides of the 1st ventilation part 21a. The other protruding piece 25 is provided along the upper and lower short edges of the first ventilation portion 21a. And these both sides and the up-and-down protrusion part parts 24 and 25 are comprised by the cylinder shape which protrudes from the inner surface of the surrounding piece 21 to internal space S2.

Further, in the heat sink G, the third ventilation portion 21b is a portion of the surrounding portion 20 other than the first ventilation portion 21a having the projecting piece portions 24 and 25, and penetrates the surrounding piece 21 in the thickness direction. S2 communicates with the external space S1.
If it demonstrates in detail, the surrounding part 20 will be formed in the square cylinder shape which has the inner corner 21c between the adjacent surrounding pieces 21 and 21. FIG. The third ventilation portion 21 b is provided closer to the inner corner 21 c than the projecting piece portions 24 and 25 in each surrounding piece 21.
Furthermore, the third ventilation portion 21b is also provided between the two adjacent first ventilation portions 21a and 21a in each surrounding piece 21.

According to the heat sink G having the above configuration, in the posture in which the base portion 10 is directed downward (see FIG. 11), the internal space S2 above the base portion 10 rises due to the heat of the base portion 10 in the same manner as the heat sink A. A flow of air is formed. For this reason, the air of the external space S1 having a relatively low temperature is drawn into the rising air flow, and a continuous air flow F is formed.
Therefore, the continuously flowing air comes into contact with the projecting piece portions 24 and 25 and the like, and efficient heat exchange is performed, and the temperature rise of the base portion 10 and the electronic component X can be suppressed.

  In particular, in this heat sink G, when it is used in a posture in which the base portion 10 is directed sideways and the X direction is vertical (see FIGS. 12A and 12B), it depends on the air resistance or the like of the projecting pieces 24 and 25. The decrease in the air flow rate can be compensated for by the increase in the air flow rate by the third ventilation portion 21b, and consequently the change in the heat dissipation performance due to the difference in posture can be reduced.

The following is a result of comparison between the heat sink G and the conventional heat sink 100 (see FIG. 17) obtained by comparing the temperature rise values at the same location (base portion 10) under the same conditions by computer analysis.
The heat sink G was 74.5 ° C. in a posture with the Z direction vertical (see FIG. 11) and 80.8 ° C. in a posture with the X direction vertical (see FIG. 12).
On the other hand, the conventional heat sink 100 was 74.0 ° C. in a posture in which the Z direction was vertical (see FIG. 17) and 88.7 ° C. in a posture in which the X direction was vertical.
That is, in the heat sink G, the temperature difference due to the difference in the posture in the ZX direction is relatively small, and in particular, in a posture in which the X direction is vertical, a temperature lower than that of the conventional product was obtained.

  The conventional heat sink 100 is provided with a large number of columnar radiating fins on the upper surface of the base portion, and the outline (outside) dimension in the XYZ direction (25 × 25 × 15 mm) is substantially the same as that of the heat sink A. Is.

<Seventh embodiment>
The heat sink H shown in FIG. 13 to FIG. 14 is a third ventilation part that does not have the protruding piece part by omitting the protruding piece parts 22 and 23 from the two surrounding pieces that are opposed to the heat sink A. 21b is provided.

  More specifically, the surrounding portion 20 of the heat sink H includes the first ventilation portion 21a with the protruding piece portions 22 and 23 and the opposed surrounding pieces 21 and 21 and the third ventilation portion without the protruding piece portion. It has a portion 21b and has opposing surrounding pieces 21 'and 21', and is configured in a quadrangular cylindrical shape.

Each of the surrounding pieces 21 includes a first ventilation portion 21 a and projecting piece portions 22 and 23 having substantially the same configuration as the heat sink A.
Each of the other surrounding pieces 21 ′ is provided with a plurality of third ventilation portions 21 b having no projecting piece portions at intervals in the surface direction of the base portion 10. Each third ventilation part 21b is formed narrower than the first ventilation part 21a.

According to the heat sink H configured as described above, in the posture in which the base portion 10 faces downward (see FIG. 13), the internal space S2 above the base portion 10 rises due to the heat of the base portion 10 in the same manner as the heat sink A. A flow of air is formed. For this reason, the air of the external space S1 having a relatively low temperature is drawn into the rising air flow, and a continuous air flow F is formed.
Therefore, the continuously flowing air contacts the projecting piece portions 22 and 23, and efficient heat exchange is performed, and the temperature rise of the base portion 10 and the electronic component can be suppressed.

  In particular, in this heat sink H, in the posture (see FIGS. 14A and 14B) in which the X direction shown in FIG. This can be compensated by an increase in the air flow rate due to the ventilation portion 21b. As a result, good heat dissipation performance can be obtained in this posture.

The following is the result of comparing the heat sink H by calculating the temperature rise value at the same location (base portion 10) under the same conditions by computer analysis.
The heat sink H was 73.0 ° C. in a posture in which the Z direction was vertical (see FIG. 13), and 77.4 ° C. in a posture in which the X direction was vertical (see FIG. 14).
That is, the heat sink H can obtain a lower temperature than the conventional heat sink 100 (see FIG. 17) described above, and even when the X direction is substantially vertical (see FIG. 14), The change was small.

<Eighth embodiment>
The heat sink I shown in FIG. 15 to FIG. 16 has protrusion pieces 22 and 23 as protrusion pieces for each of the first ventilation portions 21a of two surrounding pieces of the heat sink A. For the other two surrounding pieces, the protruding pieces 22 and 23 are omitted, the third ventilation portions 21b and 12b ′ having no protruding pieces are provided, and the adjacent surrounding pieces 21 are replaced. , 21 ′ is provided with a third ventilation portion 21b ″.

  More specifically, the surrounding portion 20 of the heat sink I has a first ventilation portion 21a with projecting piece portions 24 and 25 and two opposing surrounding pieces 21 and 21, and a third portion without a projecting piece portion. The two surrounding pieces 21 'and 21' are opposed to each other and are formed in a rectangular cylindrical shape.

  Each of the surrounding pieces 21 has rectangular tubular protruding pieces 24 and 25 protruding from the inner edge to the internal space S2 for each first ventilation portion 21a, and between the adjacent protruding pieces 24 and 25. Has a gap.

Each of the other surrounding pieces 21 ′ is provided with a plurality of third ventilation portions 21 b and 21 b ′ at intervals in the surface direction of the base portion 10.
A plurality (three in the illustrated example) of the third ventilation portions 21b located closer to the center in the width direction of each of the surrounding pieces 21 'are formed narrower than the first ventilation portions 21a.
The third ventilation portions 21b 'and 21b' located on both sides of the third ventilation portion 21b are formed wider than the third ventilation portion 21b.

  Further, a gap is provided between two adjacent surrounding pieces 21 and 21 ′, and this gap functions as a third ventilation portion 21 b ″ that communicates the external space S 1 and the internal space S 2.

According to the heat sink I having the above configuration, as in the case of the heat sink A, in the posture in which the base portion 10 faces downward (see FIG. 15), the internal space S2 above the base portion 10 rises due to the heat of the base portion 10. A flow of air is formed. For this reason, the air of the external space S1 having a relatively low temperature is drawn into the rising air flow, and a continuous air flow F is formed.
Therefore, the continuously flowing air comes into contact with the projecting piece portions 24 and 25, efficient heat exchange is performed, and temperature rise of the base portion 10 and the electronic component X can be suppressed.

  In particular, in this heat sink I, in a posture (see FIGS. 16A and 16B) in which the X direction shown in FIG. Can be compensated by an increase in the air flow rate due to the ventilation portions 21b, 21b ′, 21b ″. As a result, good heat dissipation performance can be obtained in this posture.

The following is the result of comparing the heat sink I by calculating the temperature rise value at the same location (base portion 10) under the same conditions by computer analysis.
The heat sink I was 71.8 ° C. in a posture with the Z direction vertical (see FIG. 15) and 76.8 ° C. in a posture with the X direction vertical (see FIG. 16).
That is, the heat sink I can obtain a temperature lower than that of the conventional heat sink 100 (see FIG. 17) described above, and in particular, even when the X direction shown in FIG. The change was small.

  In addition, this invention is not limited to the embodiment mentioned above, In the range which does not change the summary of this invention, it can change suitably.

10: Base part 11: Electronic component contact surface 20: Go part 21, 21 ': Go piece 21a: Ventilation part (first ventilation part)
21a ': Ventilation part (second ventilation part)
21b, 21b ′, 21b ″: Third ventilation portion 22, 22 ′, 23, 23 ′, 23 ″, 24, 25: Projection piece S1: External space S2: Internal space S3: Internal space on the inner corner side A ~ I: Heat sink F: Air flow

Claims (10)

A plate-like base portion having a surface on one side as an electronic component contact surface, and a surrounding portion protruding from the peripheral side of the base portion so as to surround the other side internal space with the base portion as a boundary,
The surrounding portion is provided with a ventilation portion that communicates the internal space with an external space on the side of the surrounding portion, and a projecting piece portion that protrudes toward the internal space is provided at an inner edge of the ventilation portion. A heat sink characterized by being.   The heat sink according to claim 1, wherein the ventilation portion is a long hole, and the protruding piece portion is provided along a long edge of the ventilation portion. The protruding piece portions are respectively provided along long edges on both sides of the ventilation portion,
The heat sink according to claim 2, wherein the projecting piece portions on both sides are open between ends in the longitudinal direction. As the ventilation part, it has a first ventilation part that is long to the other side, and a second ventilation part that is long in the direction along the base part ,
The first vent portion and the second vent portion are each provided with the protruding piece portion along the long edge thereof. The heat sink described.
As the ventilation part, it has a first ventilation part extended in a long shape toward the other side, and a second ventilation part extended in a long shape in a direction along the base part ,
Of these first and second ventilation parts, one of the ventilation parts is provided with the projecting piece that protrudes toward the internal space along the long edge, and the other ventilation part has The heat sink according to any one of claims 1 to 3, further comprising a projecting piece that protrudes toward the external space.
  The surrounding portion is provided with a third ventilation portion that penetrates the surrounding portion in the thickness direction and communicates the internal space and the external space at portions other than the ventilation portion having the protruding piece portion. The heat sink according to any one of claims 1 to 5, wherein The surrounding portion is formed on the rectangular tube having an inner corner between you adjacent circumference Nyo piece,
The heat sink according to claim 6, wherein the third ventilation portion is provided closer to the inner corner than the protruding piece portion.
  The surrounding portion is provided with a plurality of ventilation portions having the protruding piece portions at intervals, and the third ventilation portion is provided between two adjacent ventilation portions among the plurality of ventilation portions. The heat sink according to claim 6 or 7, wherein the heat sink is provided. The go portion is formed in a square tube shape from a plurality of go pieces,
The at least one surrounding piece among the plurality of surrounding pieces is characterized in that the ventilation portion having the protruding piece portion and the protruding piece portion are not provided and the third ventilation portion is provided. Item 7. A heat sink according to item 6. The electronic component package using a heat sink according to claim 1, wherein an electronic component is in contact with the electronic component contact surface of the base portion.

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