JP2019102538A - Heat sink and electronic component package - Google Patents

Abstract

To improve heat dissipation.SOLUTION: A heat sink includes: a plate-like base part 10 in which a surface on one side is an electronic component contact surface 11; and a surrounding part 20 projecting from a peripheral side of the base part 10 so as to surround a space S1 on the other side with the base part 10 as a border. The surrounding part 20 includes a penetrated long hole 31c and a projecting piece part 22 projecting along a long edge 31c1 of the long hole 31c at the outside of the space S1.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a heat sink and an electronic component package adapted to dissipate heat of electronic components and the like.

  Conventionally, in this type of invention, as described in, for example, Patent Document 1, a base portion, projecting pieces projecting upward from the left and right ends of the base portion, and a plurality projecting outward from the respective projecting pieces And a power transistor mounted on the base portion between the left and right protrusions, and there is a heat dissipation device configured substantially in a U-shape.

59-103496 (Fig. 1)

As in the prior art, in the heat dissipating device configured in a three-dimensional manner, since the surface area of the fin or the like exposed to the external air is relatively large, a certain degree of effective heat dissipating performance is expected.
However, the projecting pieces, the plurality of fins, and the like may block the flow of the ambient air around them and may cause an unexpected temperature rise due to stagnant ambient air.

In view of such a subject, the present invention comprises the following composition.
It has a plate-like base portion whose one side surface is an electronic component contact surface, and a surrounding portion which protrudes from the peripheral side of the base portion so as to surround the space on the other side bordering the base portion, the surrounding portion A heat sink characterized by having a through-like elongated hole and a projecting piece projecting along the long edge of the long hole outside the space.

  Since the present invention is configured as described above, heat dissipation can be improved.

It is a perspective view showing an example of the heat sink concerning the present invention. It is sectional drawing which follows the (II)-(II) line in FIG. It is a perspective view which shows the other example of the heat sink which concerns on this invention. It is a perspective view which shows the other example of the heat sink which concerns on this invention. It is a perspective view which shows the other example of the heat sink which concerns on this invention. It is sectional drawing in alignment with the (VI)-(VI) line in FIG. It is a perspective view which shows the other example of the heat sink which concerns on this invention. It is sectional drawing in alignment with the (VIII)-(VIII) line in FIG. It is a perspective view which shows the other example of the heat sink which concerns on this invention. It is a perspective view which shows the other example of the heat sink which concerns on this invention. It is a figure which shows the flow of the air by computer analysis on sectional drawing which follows the (VI)-(VI) line of the heat sink of FIG. It is a perspective view which shows the heat sink of a comparative example.

The following features are disclosed in the present embodiment.
The first feature is a plate-like base having an electronic component contact surface on one side, and a surrounding part protruding from the peripheral side of the base so as to surround the space on the other side of the base. The surrounding portion has a penetrating long hole and a projecting piece that protrudes along the long edge of the long hole outside the space.

  The second feature is that the elongated hole is rectangular, and the projecting piece is formed in a rectangular cylindrical shape along the elongated hole (see FIGS. 1, 5 and 7).

  A third feature is that the elongated hole is rectangular, and the projecting piece is configured to be concave along the long edge and the short edge on one side of the elongated hole (see FIGS. 3 and 9). ).

  As a fourth feature, two of the projecting pieces are provided along the long edges on both sides of the long hole, and these two projecting pieces are divided on both sides so as to sandwich the long hole (see FIG. 4 and FIG. 10).

  As a fifth feature, a plurality of the elongated holes are provided so as to line up in the lateral direction, and the projecting piece portion is provided corresponding to each elongated hole (see FIG. 1).

  As a sixth feature, the surrounding portion has a flat surrounding piece that rises from the peripheral edge of the base portion to the other side, and the elongated hole penetrates the surrounding piece in the thickness direction, The projecting piece projects from the surrounding piece to the opposite side to the space (see FIGS. 1 to 4).

  As a seventh feature, the surrounding portion has a collar portion protruding from the peripheral portion of the base portion to the outside of the space, and the long hole penetrates the collar portion in the thickness direction, and the protrusion The one piece protrudes to the anti-electronic component contact surface side from the said collar part (refer FIGS. 5-10).

  An eighth feature is an electronic component package using the above-mentioned heat sink, wherein the electronic component is in contact with and supported by the electronic component contact surface of the base portion (see FIGS. 2, 6 and 8). .

In the embodiment to be described later, an invention in which only the following configuration requirements are essential is disclosed.
That is, according to the present invention, a plate-like base having an electronic component contact surface on one side and a surrounding portion protruding from the peripheral side of the base so as to surround the space on the other side bordering the base. The heat sink includes a flange portion projecting from the peripheral edge of the base portion to the outside of the space, and the flange portion includes a vent hole penetrating the flange portion in the thickness direction. And a projection that protrudes from the inner edge of the vent to the side opposite to the contact surface of the electronic component (see FIGS. 5 to 10). Here, the vent includes, for example, a long hole, a hole of a perfect circle, a hole of a polygonal shape, a hole of another shape, and the like.
According to the present invention, relatively low temperature air outside the space flows through the air vent, and the heat of the projecting portion is effectively dissipated to the air. Therefore, for example, even when the base portion is formed in a flat shape in which the overall length in the thickness direction is relatively small, the heat dissipation performance is good.

First Embodiment
Next, specific embodiments having the above features will be described in detail based on the drawings.
The heat sink A shown in FIGS. 1 and 2 has a plate-like base portion 10 whose surface on one side (the lower side according to FIG. 1) is the electronic component contact surface 11 and the other side (the base portion 10 According to FIG. 1, the surrounding portion 20 rising from the peripheral side of the base portion 10 is integrally provided so as to surround the upper space S1.
The raw materials of the heat sink A include a pure metal consisting of a single metal element, and a plurality of metal elements or an alloy consisting of a metal element and a nonmetal element. Here, examples of the metal element include aluminum, copper, stainless steel, nickel or magnesium.
Further, the heat sink A may be formed of a single material, or may be formed of a composite material in which two or more different materials are integrally combined.
Then, the heat sink A in the illustrated example forms an electronic component package (see FIG. 2) by bringing the electronic component contact surface 11 into contact with the electronic component X (for example, CPU, transistor, thyristor, other semiconductors, electronic components, etc.) Do.

The base portion 10 is formed in a rectangular flat plate shape (a square flat plate shape according to the illustrated example), and an electronic component for forming a surface located on one side in the thickness direction into a flat shape and contacting the electronic component X The contact surface 11 is used.
According to the illustrated example, the surface on the other side (opposite side) of the base portion 10 is formed in a flat shape without a through hole or unevenness, but it is also possible to provide a radiation fin or the like having an appropriate shape as needed. It is possible.

  The surrounding portion 20 includes a plurality of surrounding pieces 21 having penetrating long holes 21a, and projecting pieces 22 and 23 protruding along the long edge 21a1 of the long holes 21a outside the space S1 and the surrounding pieces 21. , And encloses the space S1 from four directions, and opens the side opposite to the base portion (upper side according to FIG. 1) of the space S1.

The surrounding piece 21 rises on the side opposite to the heat source side (the opposite side to the electronic component a side) so as to surround the space S1 from the peripheral portion (each side according to the illustrated example) of the base portion 10.
According to the illustrated example, a plurality of surrounding pieces 21 are provided to correspond to the respective sides of the base portion 10, and stand up substantially perpendicularly to the base portion 10.
Each surrounding piece 21 is formed in a rectangular flat plate shape. The surrounding piece 21 is provided with an elongated hole 21 a penetrating in the thickness direction.

The elongated hole 21a is a hole having two different radial dimensions crossing each other, and according to the illustrated example, the dimension in the vertical direction with respect to the base portion 10 is formed in a rectangular shape longer than the dimension in the horizontal direction. The long hole 21a has two long edges 21a1 substantially parallel to each other at intervals, and two short edges 21a2 connected at right angles to one end side and the other end side of the long edges 21a1.
Then, a plurality of the elongated holes 21a having the above-described configuration are arranged at a predetermined pitch (seven for each one surrounding piece 21 according to an example in FIG. 1) so as to be aligned in the short direction.

The projecting piece portion 22 is formed in a long rectangular flat plate shape along the long edge portions 21a1 on both sides of each long hole 21a, and protrudes from the long edge portion 21a1 to the opposite side to the space S1.
Further, the projecting piece portion 23 is formed in a rectangular flat plate shape shorter than the projecting piece portion 22, and protrudes from the short edge portions 21a2 on both sides of the long hole 21a to the opposite side to the space S1.
And these projecting piece parts 22 and 23 comprise the long cylinder part a of the rectangular cylinder shape which follows the long hole 21a. The inner surface of the long cylindrical portion a is continuous with the inner surface of the long hole 21a.

As shown in FIG. 1, the two adjacent long cylindrical portions a and a are configured in a robust structure integrated by sharing the projecting portion 22 between them.
Further, the two adjacent long cylindrical portions a, a connect the protruding pieces 23, 23 on both sides (upper and lower sides according to the illustrated example) in a continuous manner.

Next, with regard to the heat sink A having the above-described configuration, the characteristic effects and advantages thereof will be described in detail.
In a state where the electronic component contact surface 11 of the base portion 10 is in contact with the heat-generating electronic component X (see FIG. 2), the surrounding air temperature is enclosed in four directions and is relatively close to the electronic component X The space S2 outside the surrounding portion 20 is lower than the inner space S1. Moreover, the air of the outer side of space S1 passes the long hole 21a and the elongate cylinder part a, and is easy to flow.
For this reason, the heat of the projecting pieces 22 and 22 constituting the elongated cylindrical portion a is thermally transferred to the relatively low temperature air flowing in the elongated cylindrical portion a, so that effective heat dissipation is performed.

  The air around the heat sink A may be made to flow by natural convection, but as another example, a blower is provided at an appropriate place to forcibly convect the surrounding air and heat dissipation is performed more effectively. You may do so.

Second Embodiment
Next, another embodiment of the heat sink according to the present invention will be described. Note that the embodiment shown below is a partial modification of the above-described embodiment, and therefore, mainly the changed portions will be described in detail, and the description of the common portions will be appropriately omitted by using the same reference numerals.

The heat sink B shown in FIG. 3 is obtained by omitting the projecting portion 23 on the heat source side (the base portion 10 side) of the heat sink A having the above configuration.
That is, in this heat sink B, it is positioned at one of the long projecting pieces 22 and 22 along the long edges 21a1 and 21a1 on both sides of each long hole 21a and the same long hole 21a (upper side according to the illustrated example) The concave-shaped wall part b which protrudes to the space S1 and the outer side of the surrounding piece 21 is comprised by the short protrusion part 23 of the shape of short.
According to the heat sink B, the heat of the projecting piece portions 22 and 23 constituting the concave wall portion b is thermally transferred to the relatively low temperature air flowing in the concave wall portion b, and effective heat dissipation is performed.

  In the heat sink B of the illustrated example, the projecting portion 23 on the side opposite to the heat source with respect to the heat sink A is omitted, but as another example, the projecting portion 23 on the heat source side with respect to the heat sink A is omitted It is also possible for the concave wall b to be upside down.

Third Embodiment
The heat sink C shown in FIG. 4 is obtained by omitting the projecting pieces 23 on both sides of the heat sink A having the above configuration.
That is, in this heat sink C, the long projecting piece portions 22 and 22 along the long edges 21a1 and 21a1 on both sides of each long hole 21a are divided into two so as to sandwich the long hole 21a, and the space S1 and Parallel fins c project substantially parallel to the outside of the surrounding piece 21.
According to the heat sink C, the heat of the projecting piece portions 22 and 22 constituting the parallel fin c is transferred to the relatively low temperature air flowing between the projecting piece portions in substantially the same manner as the heat sink A Heat dissipation is performed.

Fourth Embodiment
The heat sink D shown in FIG. 5 is formed of the same metal material as the heat sink A, and has a plate-like base portion 10 with the surface on one side (lower side in FIG. 6) as the electronic component contact surface 11; Surrounding the space S1 on the other side (upper side according to FIG. 1) bordering on the boundary, and integrally including a surrounding portion 30 projecting from the peripheral side of the base portion 10; Contact the electronic component X.

  The surrounding portion 30 is a flange portion 31 which protrudes from the peripheral edge portion (each side portion according to the illustrated example) of the base portion 10 to the outside of the space S1, and an anti-electronic component contact surface side (upper side in FIG. 6) from the flange portion 31 And projecting pieces 32 and 33 protruding therefrom.

  As shown in FIG. 6, the ridge portion 31 projects from the inner surface of the base portion 10 to the anti-electronic component contact surface side in each of the base portion 10, and further projects from the tip end thereof to the outside of the space S1. According to the illustrated example, the rising piece 31a rising substantially vertically from each piece of the base 10 and the protruding end of the rising piece 31a protrude in the direction opposite to the space S1 substantially parallel to the base 10 And a flat portion 31b.

A long hole 31c (vent) is provided in the flat plate portion 31b of the flange portion 31 so as to penetrate in the thickness direction.
Similar to the long hole 21a, the long hole 31c is a hole having two different diametrical dimensions that intersect each other, and according to the illustrated example, the dimension along one side of the base portion 10 is perpendicular to the one side Two long edges 31c1 (see FIG. 6) which are formed in a rectangular shape longer than the above and spaced apart and substantially parallel to each other, and two orthogonally connected to one end side and the other end side of these long edges 31c1 respectively And a short edge portion 31c2.
A plurality (two according to the example of FIGS. 5 and 6) of the elongated holes 31c is provided along each side of the base portion 10.

The projecting pieces 32 project from the long edges 31c1 on both sides of each long hole 31c to the side opposite to the heat source (the side opposite to the electronic component contact surface). Similarly, the projecting portion 33 protrudes from the short edge portions 31c2 on both sides of the elongated hole 31c to the side opposite to the heat source.
And each of these protrusion parts 32 and 33 comprises the elongate cylindrical part d of a rectangular shape seeing from opening side so that it may illustrate in FIG.

As shown in FIG. 5, two long cylindrical portions d, d adjacent to each other along one side of the base portion 10 are configured in a robust structure integrated by sharing the projecting portion 33 therebetween. .
The two adjacent long cylindrical portions d, d connect the protruding portions 32, 32 on both sides in the short direction along one side of the base portion 10.

  Further, according to an example of FIG. 5, between the two elongated cylindrical portions d and d along one side of the base portion 10 and the two elongated cylindrical portions d and d along the other side orthogonal to the one side. , A gap g1 is provided. The gap g1 functions as an air circulation space while improving the formability of the long cylindrical portion d.

Next, with respect to the heat sink D having the above-described configuration, the characteristic effects and advantages thereof are described in detail.
When the electronic component contact surface 11 of the base portion 10 is in contact with the electronic component X generating heat (see FIG. 6), the ambient air temperature is enclosed in the surrounding portion 30 surrounded by four sides and relatively close to the electronic component X The space S2 outside the surrounding portion 30 is lower than the space S1 of the above. Moreover, the air of the outer side of space S1 passes the elongate cylinder part d, a long hole, etc., and is easy to flow.
For this reason, the heat of the projecting pieces 32, 32 constituting the elongated cylindrical portion d is thermally transferred to the relatively low temperature air flowing in the elongated cylindrical portion d, and effective heat dissipation is performed.
Moreover, according to the heat sink D, the entire length in the thickness direction of the base portion 10 can be formed in a flat shape smaller than the heat sinks A to C described above. For example, the heat sink D is disposed parallel at relatively narrow intervals In the case where the heat sink D and the electronic component X are provided between two substrates, it is possible to cope with a space-saving installation mode.

<Fifth embodiment>
The heat sink E shown in FIG. 7 is different from the heat sink D having the above configuration in the arrangement of the long cylindrical portion.
The heat sink E has a flange portion 31 substantially similar to that of the heat sink D at the peripheral portion of the base portion 10 substantially the same as the heat sink D.
A plurality of elongated cylindrical portions e are provided in the collar portion 31 along opposite one side of the base portion 10, and a plurality of elongated cylindrical portions are formed along the other two sides orthogonal to the one side. f is provided.

Each one of the long cylindrical parts e is long along the one side of the base part 10, and according to the illustrated example, the projecting pieces 32 and 32 on both sides in the short direction and the projecting pieces on both sides in the longitudinal direction 33 and 33 are formed in a rectangular cylindrical shape. The inner surface of the long cylindrical portion e is continuous with the inner surface of a long hole 31 c (see FIG. 8) which passes through the collar portion 31.
A plurality (three according to the illustrated example) of the elongated tube portions e are juxtaposed along one side of the base portion 10, and a plurality (two according to the illustrated example) are arranged along the intersecting direction with respect to the one side. It will be set up.
The two long cylindrical parts e, e adjacent along the one side have a gap g2 between them. The gap g2 not only makes the formability of each long cylindrical portion e good but also functions as an air circulation space.
The two elongated tube portions e, e adjacent in the cross direction are connected by sharing the projecting portion 32 therebetween.

The other long cylindrical portion f is formed in a rectangular cylindrical shape which is long in the same direction as the long cylindrical portion e and shorter than the long cylindrical portion e, and the projecting pieces on both sides in the short direction It has portions 32 'and 32' and projecting pieces 33 'and 33' on both sides in the longitudinal direction.
A plurality of the long cylindrical portions f are arranged in parallel along the cross direction, and two adjacent long cylindrical portions f and f share the projecting piece portion 32 'therebetween and are integrated. .
Further, a gap g3 is secured between the plurality of elongated cylindrical portions f and the elongated cylindrical portions e on both sides thereof. The gap g3 not only makes the formability of the long cylindrical portion f good but also functions as an air circulation space.

  Therefore, according to the heat sink E configured as described above, the heat of the projecting piece portions 32, 33, 32 ', 33' constituting the long tubular portions e, f is substantially the same as the heat sink D, the long tubular portion e , F, heat is transferred to the relatively low temperature air flowing in the inside, and effective heat dissipation is performed. Further, also in the heat sink E, the entire length in the thickness direction of the base portion 10 can be made relatively small, and the space-saving installation mode can be coped with.

Sixth Embodiment
The heat sink F shown in FIG. 9 is obtained by omitting one projecting piece 33, 33 'in the longitudinal direction of the long cylindrical parts e, f from the heat sink E of the above configuration.
That is, in this heat sink F, a concave wall portion h is formed from the projecting pieces 32 and 32 on both sides in the short direction and the projecting part 33 in one longitudinal direction (downward according to FIG. 9). The concave wall portion i is composed of the projecting pieces 32 ′ and 32 ′ and the projecting piece 33 ′ in the longitudinal direction (downward in FIG. 9), and these concave walls h and i It arrange | positions similarly to the elongate cylinder parts e and f.
The inner space of the concave wall h is continuous with the long hole 31 c (vent) passing through the ridge 31. Similarly, the internal space of the concave wall portion h is continuous with the long hole 31 c ′ (vent hole, see FIG. 9) passing through the collar portion 31.
According to the heat sink F, the heat of the projecting piece portions 32, 33, 32 ', 33' constituting the concave wall portions h, i flows in the concave wall portions h, i in substantially the same manner as the heat sink E Heat is transferred to relatively low temperature air, and effective heat dissipation is performed. Further, also in the heat sink F, the entire length in the thickness direction of the base portion 10 can be made relatively small, and a space-saving installation mode can be coped with.

  In the heat sink F of the illustrated example, the protruding pieces 33, 33 'on the upper side with respect to the heat sink E are omitted, but as another example, a protrusion on the opposite side (lower side in the figure) to the heat sink E It is also possible to set it as the aspect (concave wall parts h and i of illustration shown up-down inversion form) which abbreviate | omitted piece part 33, 33 '.

Seventh Embodiment
The heat sink G shown in FIG. 10 is the heat sink E of the above configuration, except that the protruding pieces 33, 33 'in the longitudinal direction of the long cylindrical parts e, f are omitted.
That is, in this heat sink F, the projecting piece portions 32 on both sides sandwiching the long hole 31c in the lateral direction constitute parallel fins j separated into two, and the projecting pieces on both sides sandwiching the elongated hole 31c 'in the lateral direction The portion 32 'constitutes a parallel fin k separated into two.
A plurality of parallel fins j and k are disposed on the flange 31 in the same arrangement as the heat sink E.
According to this heat sink G, the heat of the projecting piece portions 32, 32 'constituting the parallel fins j, k is transferred to the relatively low temperature air flowing between the fins in substantially the same manner as the heat sink E, Effective heat dissipation is performed. Further, also in the heat sink G, the entire length in the thickness direction of the base portion 10 can be made relatively small, and it is possible to cope with a space-saving installation mode.

Next, the results of computer analysis of temperature rise values at the same portion (surrounding portion) of the heat sinks A to G configured as described above and the heat sink 100 of the comparative example shown in FIG. 12 will be described.
The heat sink 100 (see FIG. 12) includes the base 10 having substantially the same dimensions as the heat sinks A to G, and a plurality of honeycomb-shaped heat dissipating fins 101 penetrating inside and outside are provided in each surrounding piece 21 of the surrounding part 20 surrounding the space S1. It has high heat dissipation performance compared to general conventional heat sinks.
As a result of the computer analysis, the temperature rise value of the heat sink 100 of the present invention was 39 to 42 ° C. while the temperature rise value of the heat sink 100 of the comparative example was about 47 ° C.
In the heat sinks A to G of the present invention, since the projecting pieces 22, 32, 32 'are elongated along the longitudinal direction of the long holes 31c, 31c', the contact area with air is compared on the outside of the space S1. It is considered that heat can be dissipated more effectively than the heat sink 100 as a result.

FIG. 11 is a view showing the flow of air by computer analysis on the cross section taken along the (VI)-(VI) line of the heat sink D of FIG. 5.
In this computer analysis, the heat sink D is in a posture (vertical posture) in which the base portion 10 is directed in the vertical direction, and a heat source is in contact with the electronic component contact surface 11.
As a result of this analysis, as indicated by an arrow in FIG. 11, there is a flow F1 of air passing from the space S2 side to the substrate side (the electronic component X side) in the upper long cylindrical portion d. It was found that there is a flow F2 of air passing from the substrate side to the space S2 side in the elongated tube portion d. In the drawing, the symbol F0 indicates the rise of air in the surrounding unit 30 (space S1).
From this analysis result, it was found that in the heat sink D, relatively low temperature air outside the surrounding portion 20 (space S2) passes through the inside of the long cylindrical portion d. Therefore, it is considered that the heat of the projecting portion 32 is effectively dissipated by the low temperature air.

  In the above embodiment, the long holes 31c and 31c 'formed in the ridge portion 31 are formed in a rectangular shape, but as another example, the long hole may be in an oval shape, a rhombus shape, or a long polygonal shape. It is possible to make the shape or any other long shape.

  Further, in the above embodiment, the heat sinks A to C are used in the downward posture of the base portion 10 (see FIGS. 1 to 4), and the heat sinks D to G are used in the horizontal posture (see FIGS. 5 to 10) of the base portion 10 However, the postures of the heat sinks A to G are not limited to the illustrated example, and can be appropriately set according to the relationship with the surrounding components.

  Moreover, although the said heat sink DG (FIG. 5-FIG. 10) showed the specific example excellent in especially heat dissipation, as another invention, about the heat sink DG which has the collar part 31, the rectangular long length It is also possible to replace the holes 31c and 31c 'with air holes having a shape other than a rectangle, and even in this case, the base portion can be formed into a flat shape with a small dimension in the thickness direction, and good heat dissipation You can get it.

  Moreover, this invention is not limited to the embodiment mentioned above, It can change suitably in the range which does not change the summary of this invention.

Reference Signs List 10: base portion 11: electronic component contact surface 20: surrounding portion 21: surrounding piece 21a: elongated hole 21a1: long edge portion 21a2: short edge portion 22, 23, 32, 33, 33 ′, 33 ′: projecting portion 31 : Barbed portion 31c, 31c ': Long hole (vent)
31c1: Long edge (inner edge)
31c2: Short edge (inner edge)
A to G: heat sinks S1 and S2: space a: long cylinder b: concave wall c: parallel fin d, e, f: long cylinder g, h, i: concave wall j, k: parallel fin

Claims (8)

  It has a plate-like base portion whose one side surface is an electronic component contact surface, and a surrounding portion which protrudes from the peripheral side of the base portion so as to surround the space on the other side bordering the base portion, the surrounding portion A heat sink characterized by having a through-like elongated hole and a projecting piece projecting along the long edge of the long hole outside the space.   The heat sink according to claim 1, wherein the elongated hole is rectangular, and the protrusion is formed in a rectangular cylindrical shape along the elongated hole.   The heat sink according to claim 1, wherein the elongated hole is rectangular, and the projecting portion is configured to be concave along long edges on both sides and one short edge of the elongated hole.   The protrusion pieces are provided in two along the long edges on both sides of the long hole, and these two protrusion pieces are divided on both sides so as to sandwich the long hole. Heat sink described.   5. The plurality of elongated holes are provided so as to line up in the direction of the short side, and the projecting piece portion is provided corresponding to each of the elongated holes. heatsink.   The surrounding portion has a flat surrounding piece that rises from the peripheral edge of the base portion to the other side, the long hole penetrates the surrounding piece in the thickness direction, and the protruding portion The heat sink according to any one of claims 1 to 5, wherein the heat sink protrudes from the surrounding piece to the opposite side to the space.   The surrounding portion has a hook that protrudes from the peripheral edge of the base to the outside of the space, the elongated hole penetrates the hook in the thickness direction, and the projection is the hook The heat sink according to any one of claims 1 to 5, wherein the heat sink protrudes from the part to the side opposite to the electronic component contact surface.   The electronic component package using the heat sink according to any one of claims 1 to 7, wherein the electronic component is in contact with and supported by the electronic component contact surface of the base portion.

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