TWM441308U - Heat dissipating fin and heat dissipating device - Google Patents

Heat dissipating fin and heat dissipating device Download PDF

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Publication number
TWM441308U
TWM441308U TW101208612U TW101208612U TWM441308U TW M441308 U TWM441308 U TW M441308U TW 101208612 U TW101208612 U TW 101208612U TW 101208612 U TW101208612 U TW 101208612U TW M441308 U TWM441308 U TW M441308U
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TW
Taiwan
Prior art keywords
heat
fixing portion
heat dissipating
dissipating
width
Prior art date
Application number
TW101208612U
Other languages
Chinese (zh)
Inventor
Chia-Yu Lin
Yen Tsai
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Cooler Master Co Ltd
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Priority to TW101208612U priority Critical patent/TWM441308U/en
Publication of TWM441308U publication Critical patent/TWM441308U/en

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367Cooling facilitated by shape of device
    • H01L23/3672Foil-like cooling fins or heat sinks
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814Conductive parts
    • H01L21/4871Bases, plates or heatsinks
    • H01L21/4882Assembly of heatsink parts
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

A heat dissipating fin includes a fin body and a protruding member. The fin body includes a heat dissipating portion, a fixing portion and an overflow-proof structure. The overflow-proof structure is connected between the heat dissipating portion and the fixing portion. A width of the overflow-proof structure is larger than a width of the heat dissipating portion. The protruding member includes an engaging portion and a protruding portion. The protruding portion protrudes from the engaging portion. The engaging portion is engaged with the fixing portion such that the protruding member is fixed on the fixing portion.

Description

M441308 五、新型說明: 【新型所屬之技術領域】 本創作有關於-種散熱韓片及散熱裝置,尤指一種可在製造散 熱裝置之過程愤止溢料並且與基絲密結合之散熱韓片。 【先前技術】M441308 V. New Description: [New Technology Field] This creation is about a kind of heat-dissipating Korean film and heat sink, especially a heat-dissipating Korean film that can be used in the process of manufacturing a heat sink and combined with the base wire. . [Prior Art]

散録置與電子產品的發展息息_。由於電子產品在運作 時’電路中的電流會因阻抗的影響而產生不必要的熱能,如果這些 熱能不能有效輯_累齡電子產品㈣的電子元件上,電子元 影 件便有可㈣為顿升高的溫度而損壞。因此, 響電子產品的運作甚鉅。 们慢义 請參閱第1圖,第1圖為先前技術之平板型散熱歸片12的示音 圖…般㈣’散熱裝置上係設置有第丨圖所示 ^ 12。如第i圖所示,平板 &政…-片 體成型。由於壓鑄製程中鏡模程絲座10 一 中的脫模而永,平板型散熱鰭片12需要有-至三度的脫模角α,所以缽#會旦龢本 而戈^一 ^ 整體4滅重,域片高度會受到限制。 此外,在相同大小的散熱灯中,脫則α會使得㈣數量較少, 造成散熱面積不足,散熱性能較差。 【新型内容】 本創作提供一種可在製造散埶 座緊密結合之散熱則。此鱗雜愤止㈣並且與基 此顏.^相成型製程成型,可不需習 3 M441308 知散熱鰭片之脫模角。 根據一實施例,本創作之散熱鰭片包含一鰭片本體以及一宍出 元件。鰭片本體包含一散熱部、一固定部以及一防溢料結構。防溢 料結構連接於散熱部與固定部之間。防溢料結構之寬度大於散熱部 之寬度。突出元件包含一^合部以及一突出部。突出部自卡合部突 出。卡合部用以與固定部卡合,以使突出元件固定於固定部上。於 此實施例中,突出部之表面可形成有一咬合結構。 根據另-實施例,本創作之散熱裝置包含一基座以及一散熱韓 片。散熱韓片包含-鰭片本體以及一突出元件。鰭片本體包含一散 熱部、-固定部以及-防溢料結構。防溢料結構連接於散熱部與固 定部之間。防溢料結構之寬度大於散熱部之寬度4技件包含一 卡合部以及-突出部。突出部自卡合部突出。卡合部用以盘固定邻 卡合,以使突出元件固定测定部上。突出元件與固定部—起固定 於基座中。於此實施例巾,突ά部之表面可形成有―咬合結構。 綜上所述,本創作可先以成型製程(例如,銘擠型製程 散熱轉片之鰭片本體,將突出元件固定於本體之固定^上, 以壓鑄製程將熔化金屬材料成型包覆鰭片本體之固定部與二:再 的基^本創作之散熱,鰭狀則本體具有隨料結構二 結構可於壓鑄製程中防止熔化金屬材料溢出造成毛邊。 他料 之散熱制之則本體係以颜製程成型,本創作之散熱 M441308 而W放熱鰭月之脫模角。因此’本創作 且韓片高度亦可做得比習知散敎續片古―曰片的重置較輕, 裝置怜本創作之散伽片數旦2卜’在相同大小的散熱 加散熱面積,提高散酿能。再者,:=進而增 面上的咬合結構可於磨鑄㈣φ ^ 4 4讀之突出部之表 與散熱則之結合強度中有效抓住金屬材料,進而增加基座 下的創作詳述及所附圖式 關於本創作之優點與精神可以藉由以 得到進一步的瞭解。 .【實施方式】 請參閱第2圖至第5圖,第2圖為根據本創作第一實施例之散 熱裝置3的立體圖’第3圖為第2圖中的散熱裝置3的爆炸圖,第 回丫幻狀…褒直UA線的剖面圖,第5圖為第*圖 中的散熱.H片32的爆炸圖。如第2圖至第5圖所示,散熱裝置3 — 包含-基座30以及-散熱韓片32。散熱則32包含一韓片本體, 以及三突出元件322。於此實施辦,散熱則32為—平板型散熱 縛片。·鰭片本體320包含一散熱部3200、_固定部·以及一防 溢料結構3綱。防溢料結構32〇4連接於散熱部32〇〇與固定部3皿 之間。又,縛片本體观更可以包含-凹槽結構遍、,其中°凹槽結 構3206形成於固定部3202上。 日 如第4圖所示,防溢料結構3204之寬度W1大於散熱部邏 5 M441308 之寬度W2且大於凹槽結構32〇6中的固定部3202之寬度W3。於 此實施例中’防溢料結構3204自凹槽結構3206中的固定部3202 向外突出之長度L可介於1毫米與10毫米之間,其中防溢料結構 3204係為等厚度。於另一實施例中,防溢料結構3204之厚度亦可 呈梯度變化。 每一個突出元件322分別包含一·^合部3220以及一突出部 3222。突出部3222自卡合部322〇突出。卡合部322〇用以與韓片本 體320之固定部3202卡合,以使突出元件322固定於鰭片本體32〇 之固定部3202上。於此實施例中,卡合部3220可為一 U形凹槽且 以緊配的方式與鰭片本體320之固定部3202卡合。 ^請參閱第6圖’第6圖為第2圖中的散熱裝置3之製造方法年 流程^。首先,執行步驟S100,以一成型製程成型韓片本體32〇。 ;此貫施例中’上述之成型製程可為一銘播型製程,以使缝片本儀 —成型為—平板型散m接著,執行轉训2,使突出元治 之卡合部3220以緊配的方式與鰭月本體32〇之固定部32〇2卡 。以使穴出το件322固定於鰭片本體MO之固定部3观上。接著 執財驟S1G4,將散熱則32放入一模具(未顯示)中。接著, _行步驟S1G6,將i化金屬材料(例如,轉)注人模具中。最 ^ ’執行步驟S1G8 ’以-_製程祕化金屬材料細基座%,其 座30 ^覆犬出70件322與鰭片本體320之固定部3202,使得 件322與鰭片本體320之固定部3202 -起固定於基座30中, M441308 5第二圖所*。於此實施例中,轉片本體32G之防溢料結構32〇4 二ΓΜ (鑄裝程中防止熔化金屬材料溢出造成毛邊。當防溢料結構 书盘自1槽結構3206中的固定部3202向外突出之長度L介於1亳 =0毫米之間時,即可於壓鎊製程中有效防止溶化金屬材料溢出 =⑽。此外’籍片本體32〇之凹槽結構遍可有效抓住金屬材 厂,以增加基座30與散熱鰭片32之結合強度。 • 本創作可配合基座30的結構設計,在鰭片本體32〇之固定部 3搬上設置至少-突出元件322。至於突出元件您的數量及設置 =,可根據基錢的實際結構麵定,不以第3 _ 之^=圖,_第7圖,第7 _據本創作第二實施例 月L裝置3的到面圖。散熱裝置3,與上述的散熱裝置3的主 同之處在於,散熱裝置3,之基座3〇,包含一箱體3〇〇以及一 其中箱體300内部具有-容置空間3G4,且凸緣如自箱體… 周圍向外突出。於實際麵巾,可___、鉚接、焊接或 1 它固定方式將凸緣細定於岐平面上,進㈣散熱裝置赠 於固定平面上^當本創作之散熱裝置3,設置於戶外時(例如,基地 台),有散鱗麵電子元件可容置於基麵之, 刚料,_概樓物^_。2 的疋’第7圖中與第4圖中所示相同標號的元件, 相同,在此*雜述。 、㈣原理大致 7 M441308 配合第5圖,請參閱第8圖,第8圖為四種不同樣式的突出元 件322'的立體圖。突出元件322'與上述的突出元件322的至要不同 之處在於’突出元件322’之突出部3222之表面形成有一咬合結構 3224。如第8圖(A)所示,咬合結構3224為一螺紋;如第8圖(B) 所示,咬合結構3224為一斜紋;如第8圖(〇所示,咬合結構3224 為一網紋;如第8圖(D)所示,咬合結構3224為一直紋。需說明 的是,第8圖中與第5圖中所示相同標號的元件,其作用原理大致 相同,在此不再贅述。 第4圖中的突出元件322可以第8圖中的突出元件奶•替換。 在基座3〇的成型過程中,馆化金屬材料會包覆突出元件微之咬合 結構3224 _片本體320之固定部通。換言之,在基座: 後,突出元件⑽之咬合結構3224可有效抓住金屬材料,以增祕 座30與散熱鰭片32之結合強度。 土 相較於先触術,本創作可先以成型製程(例如,雜型 型散_之本體,將突_ _則本體之固^ 上’私闕製程將熔化金屬材料成型包 ^ ,構 出元件的基座。本創作之散熱則之則本體销突 本創作之散熱鰭片之鰭片本體係以成型製.—㈣邊。由於 製程中防止溶化金屬材料溢出造:Γ 片可不需習知散熱鰭片之脱模角 因此,本創作之散熱鰭片的 程成型’本創作之散熱鰭 重量 較輪’且鰭>{高度亦可做得比習 _ 的散熱t置中,本創作之。此外,在相同大小 進而增加散執面積I可裝設比習知散_片多, 部之表面上的咬°再者,形成議树之突出 加基座與細財有咖金細,進而增 W上所述僅為摘叙錄實關,凡 之均等變化綱,蝴撕娜翻相耗圍所做 【圖式簡單說明】 第1圖為先前技術之平板型散麟片的示意圖。 第2圖為根據本創作第-實施例之散熱裝置的立體圖。 第3圖為第2圖中的散熱裝置的爆炸圖。 第4圖為第2圖中的散熱裝置沿Α·Α線的剖面圖。 第5圖為第4圖中的散熱鰭片的爆炸圖。 第6圖為第2圖中的散熱裝置之製造方法的流程圖。 第7圖為根據本創作第二實施例之散熱裝置的剖面圖。 第8圖為四種不同樣式的突出元件的立體圖。 【主要元件符號說明】 10 ' 30 - 30' 300 基座 箱體 3'3' 散熱裝置 12'32 散熱鰭片 M441308 302 凸緣 320 It片本體 3200 散熱部 3204 防溢料結構 3220 卡合部 3224 咬合結構 L 長度 S100-S108 步驟 304 容置空間 322 ' 322' 突出元件 3202 固定部 3206 凹槽結構 3222 突出部 Wl ' W2 > W3 寬度 A-A 剖面線The development of scatter and electronic products is _. Since the current in the circuit will generate unnecessary heat due to the influence of the impedance when the electronic product is in operation, if the heat energy cannot be effectively collected, the electronic element will be available on the electronic components of the electronic product (4). Damaged by elevated temperatures. Therefore, the operation of electronic products is huge. We are slow. Please refer to Figure 1. Figure 1 shows the schematic diagram of the flat-type heat-dissipating and splicing 12 of the prior art. (4) The heat-dissipating device is provided with the figure shown in Figure ^. As shown in Figure i, the tablet & Due to the demoulding of the mirror mold base 10 in the die-casting process, the flat fins 12 need to have a draft angle α of -3 degrees, so 钵#会旦和本戈^一^ overall 4 If the weight is removed, the height of the field slice will be limited. In addition, in the same size of the heat sink, the off α will make the number of (4) less, resulting in insufficient heat dissipation area and poor heat dissipation performance. [New content] This creation provides a heat dissipation that can be closely combined in the manufacture of a dilatant seat. This scale is irritating (4) and is formed by the molding process of the base. It is not necessary to learn the mold release angle of the heat sink fins. According to an embodiment, the heat sink fin of the present invention comprises a fin body and a pick-up element. The fin body includes a heat dissipating portion, a fixing portion and an anti-flash structure. The anti-overfill structure is connected between the heat dissipation portion and the fixing portion. The width of the anti-overfill structure is greater than the width of the heat sink. The protruding element includes a hinge portion and a protrusion portion. The protruding portion protrudes from the engaging portion. The engaging portion is configured to engage with the fixing portion to fix the protruding member to the fixing portion. In this embodiment, the surface of the projection may be formed with a snap structure. According to another embodiment, the heat sink of the present invention includes a base and a heat sink. The heat sink contains a fin body and a protruding element. The fin body includes a heat radiating portion, a fixing portion, and an anti-flash structure. The anti-overfill structure is connected between the heat dissipation portion and the fixing portion. The width of the anti-overfill structure is greater than the width of the heat dissipating portion. 4 The technical component comprises a engaging portion and a protruding portion. The protruding portion protrudes from the engaging portion. The engaging portion is used for fixing the adjacent engagement of the disk so that the protruding member is fixed to the measuring portion. The protruding element and the fixing portion are fixed in the base. In this embodiment, the surface of the abutment can be formed with a "bite structure". In summary, the creation can be preceded by a molding process (for example, a fin body of a squeezing process heat-dissipating fin, the protruding component is fixed on the fixing body of the body, and the molten metal material is formed into a covered fin by a die-casting process) The fixed part of the body and the second part: the heat of the base is created, and the fin body has the structure of the material. The structure can prevent the molten metal material from overflowing and causing the burr during the die-casting process. The heat dissipation system of the material is made by the system. Process molding, the heat dissipation of the creation M441308 and the release angle of the fins of the heat fins. Therefore, 'this creation and the height of the Korean film can also be made lighter than the sequel of the sequel to the sequel. The scatter of the creation of the galaxies is 2 lbs. 'In the same size of heat dissipation plus heat dissipation area, improve the energy of the scatter. Moreover, the occlusal structure of the increased surface can be polished (4) φ ^ 4 4 The combination of the strength of the heat and the heat can effectively grasp the metal material, thereby increasing the details of the creation under the pedestal and the advantages and spirit of the drawing regarding the creation can be further understood. [Embodiment] See also Figure 2 to 5, FIG. 2 is a perspective view of the heat sink 3 according to the first embodiment of the present invention. FIG. 3 is an exploded view of the heat sink 3 in FIG. 2, and a cross-sectional view of the first UA UA line Fig. 5 is an exploded view of the heat sinking H chip 32 in Fig. 4. As shown in Figs. 2 to 5, the heat sink 3 includes a base 30 and a heat sink 32. The heat sink 32 includes A Korean body, and a three-projection element 322. In this implementation, the heat dissipation 32 is a flat-plate heat-dissipating die. The fin body 320 includes a heat-dissipating portion 3200, a fixing portion, and an anti-flash structure 3 The anti-overfill structure 32〇4 is connected between the heat dissipating portion 32〇〇 and the fixed portion 3. Further, the tab body view may further include a groove structure, wherein the groove structure 3206 is formed on the fixing portion 3202. As shown in Fig. 4, the width W1 of the anti-overfill structure 3204 is larger than the width W2 of the heat dissipating portion logic 5 M441308 and larger than the width W3 of the fixing portion 3202 in the groove structure 32〇6. In this embodiment The length L of the anti-overfill structure 3204 protruding outward from the fixing portion 3202 in the groove structure 3206 may be between 1 mm and 10 mm. The intermediate anti-overfill structure 3204 is of equal thickness. In another embodiment, the thickness of the anti-overfill structure 3204 may also vary in gradient. Each of the protruding elements 322 includes a first portion 3220 and a protruding portion 3222. The protruding portion 3222 protrudes from the engaging portion 322. The engaging portion 322 is configured to engage with the fixing portion 3202 of the Korean piece body 320 such that the protruding member 322 is fixed to the fixing portion 3202 of the fin body 32. In the embodiment, the engaging portion 3220 can be a U-shaped groove and is engaged with the fixing portion 3202 of the fin body 320 in a tightly fitting manner. ^ Please refer to FIG. 6 'Fig. 6 for heat dissipation in FIG. Year of the manufacturing method of the device 3 ^. First, step S100 is performed to form the Korean body 32 一 in a molding process. In this embodiment, the above-mentioned forming process can be a Ming-type process, so that the sewing machine can be formed into a flat-plate type, and then the transfer training 2 is performed, so that the protruding part of the Yuanzhi Zhihe 3220 is tight. The matching method is matched with the fixing portion 32〇2 of the fin body 32〇. The hole-out member 322 is fixed to the fixing portion 3 of the fin body MO. Then take the financial step S1G4 and put the heat sink 32 into a mold (not shown). Next, in step S1G6, the i-metal material (for example, turning) is injected into the mold. The most 'execution step S1G8' is to use the -_ process to secretize the thin base of the metal material, and the seat 30 is to cover 70 pieces 322 and the fixing portion 3202 of the fin body 320, so that the piece 322 and the fin body 320 are fixed. The portion 3202 is fixed to the base 30, and the M441308 5 is shown in the second figure. In this embodiment, the anti-flash structure 32 〇 4 ΓΜ of the rotor body 32G (the molten metal material is prevented from overflowing during the casting process to cause burrs. When the anti-flash structure book is fixed from the fixing portion 3202 in the 1-slot structure 3206 When the length L of the outward protrusion is between 1 亳 and 0 mm, the molten metal material can be effectively prevented from overflowing in the pressing process (10). In addition, the groove structure of the body 32 can effectively grasp the metal. The material factory is used to increase the bonding strength between the susceptor 30 and the heat dissipation fins 32. The present invention can be combined with the structural design of the susceptor 30 to provide at least a protruding member 322 on the fixed portion 3 of the fin body 32 。. The number of components and settings = can be based on the actual structure of the base money, not the 3 _ ^ = map, _ 7th, 7th _ according to the second embodiment of the creation of the month L device 3 The heat dissipating device 3 is the same as the above-mentioned heat dissipating device 3 in that the heat dissipating device 3 has a base 3〇, and includes a box body 3〇〇 and a case body 300 having an accommodation space 3G4 therein. And the flange is like the self-container... The outer surface protrudes outward. In the actual face towel, it can be ___, riveted, welded or 1 The fixing method is to fix the flange on the crucible plane, and the (4) heat dissipating device is given on the fixed plane. When the heat dissipating device 3 of the present invention is installed outdoors (for example, the base station), the scaly electronic components can be accommodated. In the base surface, the material of the _ _ _ _ _ _ _ _ _ _ 2 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 M M M Figure 5, see Fig. 8, which is a perspective view of four different types of protruding elements 322'. The protruding element 322' is different from the protruding element 322 described above in that the protruding element 322 is protruding. The engaging portion 3224 is formed with a meshing structure 3224. As shown in Fig. 8(A), the engaging structure 3224 is a thread; as shown in Fig. 8(B), the engaging structure 3224 is a twill; as shown in Fig. 8 (〇) As shown, the occlusal structure 3224 is a textured; as shown in Fig. 8(D), the occlusal structure 3224 is a straight line. It should be noted that the same reference numerals are used in Fig. 8 and Fig. 5, The principle of action is substantially the same and will not be described here. The protruding element 322 in Fig. 4 can be protruded in Fig. 8. Component milk • Replacement. During the molding process of the base 3〇, the paved metal material will cover the protruding part micro-biting structure 3224 _ the fixed part of the sheet body 320. In other words, after the base: the protruding element (10) The occlusal structure 3224 can effectively grasp the metal material to enhance the bonding strength between the secret seat 30 and the heat dissipating fins 32. The soil phase can be first formed by a molding process (for example, the body of the miscellaneous type scatter, compared with the first touch technique). The _ _ _ the body of the solid ^ on the 'private process will be melted metal material forming package ^, the pedestal of the component. In the form of molding. - (four) side. Due to the prevention of the overflow of molten metal material in the process: the sheet can eliminate the need for the draft angle of the fins. Therefore, the heat sink fins of this creation are formed by the weight of the fins and the fins and fins. Can also be done than the _ heat sink t, this creation. In addition, in the same size and then increase the sprawl area I can be installed more than the traditional scattered _ film, the surface of the part of the bite °, the formation of the tree is highlighted and the pedestal and fine money are fine, and then increase W is only for the narrative record, the average change of the program, the butterfly tears the phase of the consumption of the surrounding [simplified schematic description] Figure 1 is a schematic diagram of the prior art flat-type scattered sapphire film. Fig. 2 is a perspective view of a heat sink according to the first embodiment of the present invention. Figure 3 is an exploded view of the heat sink in Figure 2. Fig. 4 is a cross-sectional view of the heat sink device taken along line Α·Α in Fig. 2; Figure 5 is an exploded view of the heat sink fins in Figure 4. Fig. 6 is a flow chart showing a method of manufacturing the heat sink in Fig. 2. Figure 7 is a cross-sectional view showing a heat sink according to a second embodiment of the present invention. Figure 8 is a perspective view of four different styles of protruding elements. [Main component symbol description] 10 ' 30 - 30' 300 Base case 3'3' Heat sink 12'32 Heat sink fin M441308 302 Flange 320 It piece body 3200 Heat sink 3204 Anti-flash structure 3220 Engagement part 3224 Bite structure L length S100-S108 Step 304 accommodating space 322 ' 322' protruding element 3202 fixing part 3206 groove structure 3222 protrusion Wl ' W2 > W3 width AA hatching

Claims (1)

M441308 .六、申請專利範圍: 1. 一種散熱鰭片,包含: 一鰭片本體,包含一散熱部、一固定部以及一防溢料結構, 該防溢料結構連接於該散熱部與該固定部之間,該防溢料 結構之寬度大於該散熱部之寬度;以及 -突出元件’包含-卡合部以及—突出部,該突出部自該卡 合部突出,該卡合部用以與該固定部卡合,以使該突出元 # 件固定於該固定部上。 2. 如請求項1所述之散熱韓片,其中該卡合部為一 u形凹槽且以 緊配的方式與該固定部卡合。 3..如請求们所述之散熱韓片,其中該突出部之表面形成有一咬 合結構。 »4 如請未項3所述之散熱韓片:其中該受合結構為—螺纹、一斜 故、—網紋或一直紋。 5.如請求項1所述之散熱韓片,其中該縛片本體更包含一凹槽結 構,形成於該固定部上。 月求項1所述之散熱n片,其巾該防溢料結構之寬度大於該 固定部之寬度。 11 .如請求項6所述之散熱籍片,其中該防溢料結構自該固定部向 外突出之長度介於1毫米與1〇毫米之間。 8·如晴求項1所述之散熱·鳍片,其中該防溢料結構為等厚度。 9.如凊求項!所述之散熱鳍片,其為一平板型散熱續片。 10· —種散熱裝置,包含: 一基座;以及 一散熱鰭片,包含: -鰭片本體,包含-散熱部一固定部以及—防溢料結構, 該防溢料結構連接於該散熱部與該固定部之間,該防溢 料結構之寬度大於該散熱部之寬度;以及 犬出元件包含—_^合部以及一突出部,該突出部自該 卡合部犬出,該卡合部用以與該固定部卡合,以使該突 出元件固疋於該固定部上,該突出元件與該固定部一起 固定於該基座中。 11. 如請求項10所述之散熱裝置,其中該卡合部為一 U形凹槽且以 緊配的方式與該固定部卡合。 12. 如請求項1G所述之散_置,其中該突出部之表面形成有一咬 12 合結構。 13. 如請求項12所述之散熱震置,t 紋、一網紋或一直紋。 "中該咬合結構為一螺紋、一斜 14. 如請求項1〇所述之散熱裝置 構,形成於該固定部上。 片本體更包含一凹槽結 15. 如請求項10所述之散熱骏置 固定部之寬度。 x、該防溢料結構之寬度大於該 外突出之長度介於1M441308. VI. Patent application scope: 1. A heat dissipating fin comprising: a fin body comprising a heat dissipating portion, a fixing portion and an anti-overflow structure, wherein the anti-overflow structure is connected to the heat dissipating portion and the fixing Between the portions, the width of the anti-overfill structure is greater than the width of the heat dissipating portion; and - the protruding member 'includes - the engaging portion and the protruding portion, the protruding portion protrudes from the engaging portion, the engaging portion is used for The fixing portion is engaged to fix the protruding member to the fixing portion. 2. The heat-dissipating Korean piece according to claim 1, wherein the engaging portion is a u-shaped groove and is engaged with the fixing portion in a tight fit manner. 3. The heat-dissipating Korean piece as claimed in the claim, wherein the surface of the projection is formed with a snap-fit structure. »4 The heat-dissipating Korean film as described in Item 3: The structure of the joint is - threaded, slanted, - textured or straight. 5. The heat sink of claim 1, wherein the body further comprises a groove structure formed on the fixing portion. The heat dissipating n piece of the item 1 is characterized in that the width of the anti-overfill structure is larger than the width of the fixing portion. The heat-dissipating film according to claim 6, wherein the anti-overfill structure protrudes outward from the fixing portion by a length of between 1 mm and 1 mm. 8. The heat dissipation fin according to claim 1, wherein the anti-flash structure is of equal thickness. 9. If you are asking for it! The heat dissipation fin is a flat heat dissipation fin. The heat dissipation device comprises: a base; and a heat sink fin, comprising: a fin body, comprising: a heat dissipating portion, a fixing portion and an anti-flash structure, wherein the anti-overflow structure is connected to the heat dissipating portion Between the fixing portion, the width of the anti-overfill structure is greater than the width of the heat dissipating portion; and the dog-out element includes a _^ joint portion and a protruding portion, the protruding portion is dogd out from the engaging portion, the engaging portion The portion is engaged with the fixing portion to fix the protruding member to the fixing portion, and the protruding member is fixed in the base together with the fixing portion. 11. The heat sink of claim 10, wherein the engaging portion is a U-shaped groove and is engaged with the fixing portion in a tight fit manner. 12. The method of claim 1 , wherein the surface of the protrusion is formed with a bite structure. 13. The heat dissipation as described in claim 12, t-pattern, a texture or a continuous pattern. < The occlusal structure is a thread, a slant 14. The heat sink structure as claimed in claim 1 is formed on the fixing portion. The sheet body further includes a grooved knot 15. The width of the heat dissipating fixing portion as set forth in claim 10. x, the width of the anti-flash structure is greater than the length of the outer protrusion is between 1 16. 如請求項15所述之墩叙壯m •如請求項1G所述之散熱裳置, 其中該防溢料結構為等厚度。 其中該散熱鰭片為一平板型散熱 18.如請求項10所述之散熱裝置, •如請求項10所述之散熱農 内部具有一容置空間。 置,其中該基座包含一箱體,該箱體 20·如請求項19所述之散熱裳 箱體之周圍向外突出。 置’其中該基座更包含一凸緣,自該16. The claim of claim 15 wherein the anti-flash structure is of equal thickness as described in claim 1G. The heat dissipating fin is a flat type heat dissipating device. 18. The heat dissipating device according to claim 10, wherein the heat dissipating agricultural unit has an accommodating space. The base includes a case, and the case 20 protrudes outward from the periphery of the heat sink case as claimed in claim 19.设置' wherein the base further includes a flange, since
TW101208612U 2012-05-08 2012-05-08 Heat dissipating fin and heat dissipating device TWM441308U (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013159564A1 (en) * 2012-04-27 2013-10-31 讯凯国际股份有限公司 Heat dissipation fin and heat dissipation device
EP2894954A4 (en) * 2013-12-06 2016-06-15 Marchesi Metal Technology Suzhou Co Ltd Heat dissipation housing structure connected to heat dissipation fin

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013159564A1 (en) * 2012-04-27 2013-10-31 讯凯国际股份有限公司 Heat dissipation fin and heat dissipation device
EP2894954A4 (en) * 2013-12-06 2016-06-15 Marchesi Metal Technology Suzhou Co Ltd Heat dissipation housing structure connected to heat dissipation fin

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