1309764 九、發明說明： 【發明所屬之技術領域】 本發明屬於散熱領域’涉及一種散熱裝置組合的製造 方法，尤其涉及一種保證散熱裝置同時與電路板上的多個 發熱晶片都緊密接觸的製造方法。 【先前技術】1309764 IX. Description of the Invention: [Technical Field] The present invention relates to a method of manufacturing a heat sink assembly, and more particularly to a manufacturing method for ensuring that a heat sink is in close contact with a plurality of heat generating chips on a circuit board . [Prior Art]
隨著半導體技術的發展，晶片的集成度越來越高，功 能愈來愈強，但是晶片功耗也隨著增大，單晶片功耗甚至 達到上百瓦的水準，對散熱提出了更高的要求。如果要提 高晶片的散熱能力，首先要求散熱器能夠提供較強的散熱 月b力再者要求散熱器與晶片之間的介面熱阻小，這就需 要保證散熱裝置能夠和晶片良好接觸。 而 一现电峪板上往往設有多個晶片，由於這些晶片在奎 ^製造時其外部尺寸存在—定的差異，且在焊接到電路相 時其底部的焊錫層厚度也不—致，因此這些晶#的頂面高 度不易精確控制，會在__定的尺寸範圍内發生上下變動， 假，其中—晶片的頂面高度為8± Q 3·，而另—晶 面间度為6± G. 2mm ’那麼兩晶片的頂面高度差將在ι 5〜 的範圍内發生變化，可見如果使用—個傳統的板式 U置同時為電路板上的多個 致散熱裝置僅能歲雷餘…β八二択U奋易導 在與果= 如中國大陸專利順4974·6所揭示的散熱裝置，其是 1309764 通過將一個銅材質的元件套接裝設在現用的鋁材質的散熱 . 裝置上，利用銅的高導熱性能來提高現用的鋁材質的散熱 裝置的散熱效果，並且這種採用銅紹元件互相套接的設計 也比採用全銅的散熱裝置較為廉價。但是這種設計的銅材 質元件是利用一肩部與鋁材質的散熱裝置上的臺階形部分 相配合固定到散熱裝置上，然後再—體裝設到電腦晶片上 方，因此這種散熱裝置並不具有與晶片高度變化相適應的 特點，如果用在設有多個晶片的電路板上，也會像傳統的 I 平板式散熱裝置一樣僅能與電路板上的部分晶片接觸。 緣是’本發明人有感上述缺失之可改善，提出一種設 s十合理且有效改善上述缺失之本發明。 【發明内容】 本發明的目的在於提供一種保證散熱裝置同時與電路 板上的多個發熱晶片都緊密接觸的製造方法，其能保證散 熱裝置以適當的壓力同時貼接在多個發熱晶片頂部，提高 晶片的散熱效果。 • *為了實現上述目的，本發明提供一種散熱裝置組合的 ，造方法，該製造方法包括以下步驟：準備一電路板及一 政熱裝置，该電路板上設有兩發熱晶片；該散熱裝置包括 二主體及一調節組件，該主體包括一基座及由該基座向上 突伸出的若干散熱鰭片，該基座上還預先固設有一銅柱， 並開設有-通孔；該調節組件設有一底座，其中該底座的 外周面與該主體的通孔關面之間呈間隙配合，從而可上 了’舌動地到社體基座的通孔内；先將該主體裝設到 :亥，路板上’使該鋼柱的底面貼接到—發熱晶片上；在該 ㉝即組件底座的相Φ塗上焊接材料後，再將該調節組件 1309764 脰的通孔内；使用—加壓裳置施加適 :在=調節組件上，使其分別與兩發熱晶片緊密相: 後將上述由電路板、主體及調節組件組成的散 體心-起進行加熱焊接，使其焊接成為—不可拆分的整 桂底具有以下有益效果：這種製造方法在主體的銅 内上下滑動二:::另再::調節組件在主體通孔 片都緊密_健散絲置㈣與電路板上❹個發熱晶 τ在接觸，從而達到理想的散熱效果。 閱以步瞭解本發明之特徵及技術内容，請參 供參考細說明與關，然而所附圖式僅提 【實施&Γ，細娜她以限制者。 合的圖至第五圖’本發明提供—種散熱裳置組 ，化万去’該製造方法包括以下步驟： -主路ί 1及一散熱裝置2，該散熱襞置2包括 片10、12 ^調節組件5，該電路板1上設有兩個發熱晶 其包括-其/個鎖固孔14 ;該主體3是―材製成的， 片32，3〇及由該基座3〇向上突伸出的若干散熱鰭 3〇的中3〇的四角各裝設有一固定元件34，該基座 孔36，該诵Γ電路板1上的發熱晶片12開設有—圓形通 30的—側、f 36具有一圓環形的内周面狀，而在該基座 鋼柱40 ·兮/應電路板1上的發熱晶片10預先固設有一 ，μ啁節組件5是由銅材製成的，其包括一圓形底 1309764 ^50及由該底座50向上突伸出的若干散熱鰭片52，該調 筇組件5底座50也具有一圓環形的外周面,其中該底 座50的外徑是略小於通孔36的内徑，該調節組件5底座 5〇的外周面54與該主體3通孔36的内周面⑽之間呈間 隙配合’目而該調節組件5可上下輯地裝設到該主體3 基座30的通孔36内，並且還可以由上至下貫穿通過該通 先將四固定元件34的一端對應穿插到該電路板丨的四With the development of semiconductor technology, the integration of wafers is getting higher and higher, and the functions are getting stronger and stronger, but the power consumption of the chips is also increasing. The power consumption of single-chips even reaches the level of hundreds of watts, which raises the heat dissipation. Requirements. If you want to improve the heat dissipation capability of the chip, you first need to provide a strong heat dissipation for the heat sink. The heat resistance of the interface between the heat sink and the wafer is small, which requires the heat sink to be in good contact with the wafer. On the one hand, a plurality of wafers are often provided on the power board, and since the outer dimensions of the wafers are different in the manufacturing process, the thickness of the solder layer at the bottom of the wafer is not uniform when soldered to the circuit phase. The top surface height of these crystals is not easy to precisely control, and it will change up and down within the size range of __, where the top surface height of the wafer is 8±Q 3·, and the inter-planetary degree is 6± G. 2mm 'The difference in the top surface height of the two wafers will vary within the range of ι 5~. It can be seen that if a conventional board U is used, the multiple heat sinks on the board can only be used for years...八八二択U奋易导在 with fruit = such as the Chinese mainland patent shun 4974·6 disclosed in the heat sink, which is 1309664 by mounting a copper component on the current aluminum heat dissipation device The high thermal conductivity of copper is used to improve the heat dissipation effect of the current aluminum heat sink, and the design of the copper-based components is also cheaper than the copper-based heat sink. However, the copper material of this design is fixed to the heat sink by a shoulder portion and a stepped portion on the aluminum heat sink, and then mounted on the computer wafer, so the heat sink is not It has the characteristics of adapting to the variation of the height of the wafer. If it is used on a circuit board provided with a plurality of wafers, it can only be in contact with a part of the wafer on the circuit board like a conventional I flat-plate heat sink. The reason is that the inventors have felt that the above-mentioned deficiency can be improved, and the present invention has been proposed to provide a reasonable and effective improvement of the above-mentioned deficiency. SUMMARY OF THE INVENTION An object of the present invention is to provide a manufacturing method for ensuring that a heat dissipating device is in close contact with a plurality of heat generating chips on a circuit board at the same time, which can ensure that the heat dissipating device is simultaneously attached to the top of a plurality of heat generating wafers with appropriate pressure. Improve the heat dissipation of the wafer. In order to achieve the above object, the present invention provides a heat sink assembly method, the method comprising the steps of: preparing a circuit board and a thermal device, wherein the circuit board is provided with two heat generating chips; a main body and an adjusting component, the main body includes a base and a plurality of fins protruding upward from the base, the base further pre-fixing a copper post and opening a through hole; the adjusting component The base is provided with a clearance fit between the outer peripheral surface of the base and the through hole closing surface of the main body, so that the tongue can be moved into the through hole of the social base; the main body is first installed to: On the road board, the bottom surface of the steel column is attached to the heat-generating wafer; after the welding material of the phase Φ of the assembly base 33 is applied, the adjustment component 1309764 is then passed through the through hole; The pressing device is applied: on the adjusting component, respectively, it is closely phased with the two heat-generating wafers: then the above-mentioned hollow body composed of the circuit board, the main body and the adjusting component is heated and welded, so that the welding becomes non-removable Subdivision The bottom has the following beneficial effects: the manufacturing method slides up and down in the copper of the main body::: again: the adjusting component is tight in the main body through-hole sheet, and the heat generating crystal is placed on the circuit board. Contact to achieve the desired heat dissipation. Read the steps to understand the features and technical contents of the present invention, please refer to the detailed description and the reference, but the drawing only mentions [Implementation & The present invention provides a heat dissipation device set, and the manufacturing method includes the following steps: - a main circuit ί 1 and a heat sink 2, the heat dissipation device 2 including the sheets 10, 12 ^ Adjustment assembly 5, the circuit board 1 is provided with two heating crystals including - one / locking holes 14; the main body 3 is made of material, the sheets 32, 3 〇 and the pedestal 3 Each of the four corners of the protruding fins 3〇 is provided with a fixing member 34, and the base hole 36 is provided with a heat generating wafer 12 on the circuit board 1 The f 36 has an annular inner peripheral surface shape, and the heat generating wafer 10 on the base steel column 40 is disposed in advance, and the μ啁 joint assembly 5 is made of copper. And comprising a circular bottom 1309764 ^ 50 and a plurality of heat dissipation fins 52 protruding upward from the base 50 , the base 50 of the raft assembly 5 also has an annular outer peripheral surface, wherein the base 50 is outside The diameter is slightly smaller than the inner diameter of the through hole 36, and the outer peripheral surface 54 of the base 5〇 of the adjusting assembly 5 and the inner peripheral surface (10) of the through hole 36 of the main body 3 are in a clearance fit. The assembly 5 can be mounted up and down into the through hole 36 of the base 30 of the main body 3, and can also be inserted into the circuit board 对应 from the top to the bottom through which the four fixing members 34 are first inserted.
鎖固孔14内，從而將該主體3裝設到該電路板丨上，使主 體3上的銅柱40的底面貼接到發熱晶片10的頂面，再從 電路板1的背面為四固定元件34與鎖固孔14的接合處塗 上焊接材料； 在該調節組件5底座5G的外周面54或該主體3的通 =36的内周面38塗上焊接材料（如錫膏）後，再將該調 =組件5裝設到該主體3的通孔36 β，使該調節組件5 底座50的底面初步貼接到發熱晶片12的頂面； 使用一夾持在電路板1上下兩侧的加壓裝置（圖未示） 7刀別施加適當壓力作用在主體3和調節組件5上，使主體 3二峰二，组件5底座5〇的底面分別與兩發熱晶 片10、12緊密相貼接； 壯罟ft?由電路板1、主體3及調節組件5組成的散埶 與力，裝置一起放入到焊接爐（圖未示）中騎 二接材料冷卻凝固後再拆除加壓· 3與電路板卜調節組件5與主體3焊接成為一 不可拆为的整體，從而使主體3的鋼柱 ： 能同時與兩發熱晶片1Q、12保持良好接觸。鳴、、 1309764 採用這種製造方法的優越性在於當主體3的銅柱4〇 底面與發熱晶片10貼接後，再通過加入可以在主體3通孔 36内上下滑動進行調節的調節組件$與另一發熱晶片12 貼接，保證焊接完成後該主體3的銅柱4〇及調節組件5 能同時與發熱晶片1 〇、12保持良好的接觸，達到理想的散 熱效果。The main body 3 is mounted on the circuit board , so that the bottom surface of the copper post 40 on the main body 3 is attached to the top surface of the heat-generating wafer 10, and then fixed from the back surface of the circuit board 1 The joint of the element 34 and the locking hole 14 is coated with a solder material; after the outer peripheral surface 54 of the base 5G of the adjusting assembly 5 or the inner peripheral surface 38 of the main body 3 is coated with a solder material (such as solder paste), The adjustment component 5 is mounted to the through hole 36β of the main body 3, so that the bottom surface of the base 50 of the adjustment component 5 is initially attached to the top surface of the heat-generating wafer 12; Pressing device (not shown) 7 applies a proper pressure to the main body 3 and the adjusting assembly 5, so that the bottom surface of the main body 3 is two, and the bottom surface of the base 5 of the assembly 5 is closely attached to the two heat generating wafers 10 and 12, respectively.接 ; 由 由 由 由 由 由 由 由 由 由 由 由 由 由 由 由 由 由 由 由 由 由 由 由 由 由 由 由 由 由 由 由 由 由 由 由 由 由 由 由 由 由 由 由 由 由And the circuit board adjustment assembly 5 and the main body 3 are welded into a non-detachable whole, so that the steel column of the main body 3: When the two heating wafer 1Q, 12 maintain good contact. The advantage of this manufacturing method is that when the bottom surface of the copper post 4 of the main body 3 is attached to the heat-generating wafer 10, the adjustment component $ can be adjusted by sliding in the through-hole 36 of the main body 3 to adjust The other heat-generating wafer 12 is attached to ensure that the copper pillars 4 and the adjusting component 5 of the main body 3 can be in good contact with the heat-generating wafers 1 and 12 at the same time to achieve an ideal heat-dissipating effect.
上述實施方式僅是本發明散熱裝置組合的製造方法中 的一種，還可以在其基礎上作出適當的變更。例如：該主 體3不與發熱晶片1G的頂面貼接，而通過在該主體上再加 ^一通孔（圖未示）及—調節組件（圖未示）來達到為發 二晶片10散熱的目的；該主體3上也可以不預先固設一銅 40而改為直接用主體3基座3〇的底面與發熱晶片 =相貼接。另外當電路板上設有n(n>2)個需要提高散熱 月的發熱電子疋件時，還可以通過在主體3上設置 個與發熱電子元件相對應的通孔（圖未示）及調節组件 使每—調節組件分別對應與相應的發熱晶片相貼接 來達到同時為多個發熱電子元件散熱的效果。 、妾 惟以上所述僅為本發明之較佳實施例，非意欲 發明之專卿護，故舉凡利本發明說明書及圖式^ 谷所為之等效變化，均同理"含於本發明 $ 圍内，合予陳明。 钏侏4軏 【圖式簡單說明】 第-圖是本發_散熱裝置組合的讀分解圖； 第二圖是本發明的散熱裝置組合的立體組合圖； 1309764 第三圖是本發明的散熱裝置組合的侧視圖； 第四圖是本發明的散熱裝置組合的俯視圖； 第五圖是第四圖的A-A剖視圖。 【主要元件符號說明】 1電路板The above embodiment is only one of the manufacturing methods of the heat sink assembly of the present invention, and may be appropriately modified on the basis of the above. For example, the main body 3 is not attached to the top surface of the heat-generating wafer 1G, and the heat dissipation for the second wafer 10 is achieved by adding a through hole (not shown) and an adjusting component (not shown) to the main body. The main body 3 may be directly attached to the heat generating wafer with the bottom surface of the base 3 of the main body 3 without fixing a copper 40 in advance. In addition, when n(n>2) heat-generating electronic components requiring heat dissipation months are provided on the circuit board, a through hole (not shown) corresponding to the heat-generating electronic component may be disposed on the main body 3 and adjusted. The assembly causes each of the adjustment components to be respectively attached to the corresponding heat-generating wafer to achieve the effect of simultaneously dissipating heat for the plurality of heat-generating electronic components. The above descriptions are only preferred embodiments of the present invention, and are not intended to be invented by the present invention. Therefore, the equivalent changes of the present specification and the drawings are the same as in the present invention. Within the area, it is given to Chen Ming.钏侏4軏[Simplified illustration of the drawing] The first drawing is a reading exploded view of the heat sink assembly of the present invention; the second drawing is a three-dimensional combination diagram of the heat sink assembly of the present invention; 1309764 The third drawing is the heat sink of the present invention A side view of the combination; a fourth view is a plan view of the heat sink assembly of the present invention; and a fifth view is a cross-sectional view taken along line AA of the fourth figure. [Main component symbol description] 1 circuit board
10發熱晶片 12發熱晶片 14鎖固孔 散熱裝置 主體 30基座 32散熱鰭片 34固定元件 36通孔 38内周面 40銅柱 調節組件 50底座 52散熱鰭片 54外周面 1010 Heated Wafer 12 Heated Wafer 14 Locking Hole Heat Dissipation Body 30 Base 32 Heat Sink 34 Fixing Element 36 Through Hole 38 Inner Face 40 Copper Post Adjustment Assembly 50 Base 52 Heat Sink 54 Outer Surface 10