TWM441306U - Heat dissipating fin and heat dissipating device - Google Patents
Heat dissipating fin and heat dissipating device Download PDFInfo
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- TWM441306U TWM441306U TW101207716U TW101207716U TWM441306U TW M441306 U TWM441306 U TW M441306U TW 101207716 U TW101207716 U TW 101207716U TW 101207716 U TW101207716 U TW 101207716U TW M441306 U TWM441306 U TW M441306U
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财41306 五、新型說明： 【新型所屬之技術領域】 本創作有關於-種散熱韓片及散熱裝置，尤指一種可在製造散 熱裝置之過程愤止溢料並且與基座緊密結合之散熱韓片。 【先前技術】 士散熱裝置與電子產品的發展息息相關。由於電子產品在運作 時’電路巾㈣流相阻抗触響而赵不必要的醜，如果這些 熱能不能有效地排除而累積在電子產品内部的電子元件上，電子元 ==::高的_壞，此，散_的_ 請圖’第丄圖為先前技術之圓柱型散細片12的示意 圖。—般而§，散熱裝置上係設置有第1 • 12。如第i圖所示，圓柱型散熱.鰭片12是由二主=熱韓片 .體成型。由於壓鑄製程中的脫模需求，圓心二： -至三度的脫模角α，所以整體重量較重 而要有- 此外，在相同大小的散熱裝置中 1片南度會受到限制。 造成散熱面積不足，散熱性能較差。、"會使得縛片數量較少， 【新型内容】 本創作提供-種可在製造散熱裝 座緊密結合之散 3 知散熱鰭片之脫模角。 及細，叙繼心—娜卩一固定部以 接於散1^構部之表面形成有—咬合結構。防溢料結構連 熱。咖定部導㈣騎構之寬度大於餘部之寬度。 埶鍵片x f只磁1本創作之散熱裝置包含—基座以及複數個散 構:==散熱縫片包含一散熱部、一固定部以及一防溢料結 溢料叫疋於基座中，且固定部之表面形成有一咬合結構。防 部之=連接於散熱部與固定部之間。防溢料結構之寬度大於散熱 散二所：=:先以成型製程(例如，拉釘製程)成型 狀…、釋片’以表面處理製程於散熱鰭片之邱 構’再以顯製程觀化金屬材料成:固^合結 座。本創作之散熱,鰭片具有防溢料㈣—曰片之固疋部的基 程令防止雜金細确造成毛邊。*騎簡結構可於壓鵠製 成型製程成型，本創作之雜則可散_片係以 因此，本創作之散熱鰭片量較輕，且 ϋ片之脫摈角。 散熱鰭片高。此外，在相同大小的散熱裝置曰j亦可做得比習知 =可裝設比習知散熱韓片多，進而增加散1=7 再者，形成於散熱⑽之固定部之表面n⑽熱性能。 中有效抓住金屬材料，進而增加基座與散熱ς之鱗製程 料41306 關於本創狀伽婦神可簡由以下_作詳述及所附圖式 得到進一步的瞭解。 【實施方式】 請參閱第2圖至第5圖，第2圖為根據本創作第一實施例之散 熱震置3的立體圖，第3圖為第2圖中的散熱裝置3於另一視角的 •立體圖，第4圖為第2圖中的散熱裝置3沿八-a線的剖面圖，第$ 圖為第4圖中的散熱，鰭片32的立體圖。如第2圖至第4圖所示，散 …、f置匕3基座以及複數個散熱韓片32。如第4圖與第5 圖所示’每-個散熱縛片32包含一散熱部32〇、一固定部322以及 J防溢料結構324。於此實施射，每一個散熱，鳍片32為一圓柱型 散熱縛片。固定部322 gj定於基座％中。防溢料結構324連接於散 熱部320與固定部322之間。又，每-個散熱韓片32更可以包含一 馨凹槽結構326，其中凹槽結構326形成於固定部322上。如第4圖 根據基座30不同部位的厚度設計，每—個散熱韓片％之固 .2部322之長度亦不盡相同。此外，固定部322之表面形成有一咬 合結構328。如第5圖所示，咬合結構328為-螺紋。 防溢料結構324之寬度W1大於散熱部320之寬度W2且大於 =槽結構326中的固定部322之寬度W3。於此實施例中，防溢料 結，324自凹槽結構326中的固定部322向外突出之長度l可介於 1 *米與ίο毫米之間，其中防溢料結構324係為等厚度。於另一實 M441306 施例中，防溢料結構324之厚度亦可呈梯度變化。 於此實施例中，基座30可包含一箱體300以及一凸緣3〇2，其 中箱體300内部具有一容置空間304，且凸緣3〇2自箱體3〇〇之周 圍向外突出。於實際應用中，可利用螺絲鎖固、鉚接、焊接或其它 固定方式將凸緣302固定於固定平面上，進而將散熱裝置3固定於 固定平面上。當本創作之散熱裝置3設置於戶外時（例如，基地台）， 有散熱需求的電子元件可容置於基座3〇之箱體3〇〇内部的容置空間 3〇4中，以保護電子元件免於遭受風吹雨打而損壞。 請參閱第6圖，第6圖為第2圖至第4圖中的散熱裝置3之製 造方法的触®。魏，執行細S1n賴製 個 散熱則32。於此實施财，上述之成型製程可為-錄 2每一個散熱則32成型為—圓柱型散熱則。接著，執行步驟 ⑽2’以-表面處理製程於每—個散熱鰭片力之 一屬材料成::座 32之固料322，如第4 _ _ f中基座3G包覆母—個散熱.鰭片 32之防溢料沾椹物面^。於此實施例中’每一個散熱韓片 邊。當防溢^構321=製程中防止繼屬材料溢出造成毛 長度L介於丨毫米盘iG ^結構326中的固定部322向外突出之 〜、$米之啊’即可祕鑄製財有效防止 M441306 炫化金屬材料溢出造成毛邊。此外，每一個散熱鰭片32之凹槽結構 與咬合結構328可有效抓住金屬材料，以增加基座3〇與散熱鰭 片32之結.合強度。 · 配合第5圖，請參閱第7圖。第7圖為三種不同樣式的散熱鰭 片32的立體圖。第7圖中的散熱鰭片32與第5圖中的散熱鰭片32 的主要不同之處在於咬合結構328的紋路樣式。如第7圖（A)所 不，咬合結構328為一斜紋；如第7圖（B)所示，咬合結構328 為一網紋；如第7圖（C)所示，咬合結構328為一直紋。需說明 的疋，第7圖中與第5圖中所示相同標號的元件，其作用原理大致 相同，在此不再贅述。 、相較於先前技術，本創作可先以成型餘（例如，铭拉釘製程） 成型散熱則，喊面處理製程於散熱則之狀狀表面 =構’再以壓鑄製程贿化金屬材料成型包覆散熱則之固定部 本創作之散熱則具有防溢料結構，额溢料結構可於壓 金屬材料溢出造成毛邊。由於本創作之散熱韓片 角。^ ί 鑛之散朗片可不需習知散賊片之脫模 角因此，本創作之散熱鰭片的體重量較輕，且 比習知散熱韓片高。此外，在相同大^ 熱_量可裝設_散熱_，、^裝置中’本創作之散 熱性能。再者，形成於散舖…定=加散熱面積，提高散 壓矯製程中有效抓住金屬材料，私C面上的咬合結構可於 曰加基座與散熱鰭片之結合強 7 M441306 度。 以上所述僅為本_之較佳實補，驗捕作申請專概圍所做 之均等變化與蘭’皆麟本_之縫顧。 【圖式簡單說明】 第1圖為先前技術之圓柱型散熱鰭片的示意圖。 第2圖為根據本創作第一實施例之散熱裝置的立體圖。 第3圖為第2圖中的雜裝置於另—視角的立體圖。 第4圖為第2圖_的散熱裝置沿Α·Α線的剖面圖。 第5圖為第4圖+的散熱鰭片的立體圖。 第6圖為第2圖至第4圖中的散熱裝置之製造方法的流程圖。 第7圖為三種不同樣式的散熱鰭片的立體圖。 【主要元件符號說明】 3 散熱裴置 12、32 散熱鰭片 302 凸緣 320 散熱部 324 防溢料結構 328 咬合結構 L 長度 S100-S108 步驟 10、30 基座 300 箱體 304 容置空間 322 固定部 326 凹槽結構 Wl ' W2 ' W3 寬度 Α-Α 剖面線Finance 41306 V. New Description: [New Technology Area] This creation is about a kind of heat-dissipating Korean film and heat sink, especially a heat-dissipating Korean that can be used in the process of manufacturing a heat sink and tightly combined with the base. sheet. [Prior Art] The heat sink is closely related to the development of electronic products. Since the electronic product is in operation, the circuit-phase (four) flow phase impedance is irritated and unnecessary. If these heat energy cannot be effectively eliminated and accumulated on the electronic components inside the electronic product, the electronic element ==:: high _ bad Here, the __图图' is a schematic view of the prior art cylindrical slab 12 . As a general rule, § 1 is set on the heat sink. As shown in Fig. i, the cylindrical heat dissipation fins 12 are formed by two main = hot Korean sheets. Due to the demolding requirements in the die-casting process, the center 2: - to the third-degree draft angle α, the overall weight is heavier and there is - in addition, one piece of southness is limited in the same size of heat sink. The heat dissipation area is insufficient and the heat dissipation performance is poor. , " will make the number of tabs less, [new content] This creation provides a stripping angle that can be closely combined with the heat sink. And fine, Xu Jixin-Na卩-fixed part is formed with a occlusal structure on the surface of the scattered 1^ structure. The anti-overfill structure is connected to heat. The width of the ride is greater than the width of the rest.埶Keypad xf only magnetic 1 The heat sink of the creation includes a pedestal and a plurality of bulk structures: == the heat sinking seam comprises a heat dissipating portion, a fixing portion and an anti-overflowing material called smashing in the pedestal. And the surface of the fixing portion is formed with a meshing structure. The control part is connected between the heat radiating portion and the fixing portion. The width of the anti-overfill structure is larger than that of the heat dissipating two: =: firstly formed by a molding process (for example, a pull nail process), and the release piece is treated by a surface treatment process on the heat sink fins. The metal material is formed into a solid seat. The heat dissipation of this creation, the fins have anti-flash material (4) - the base of the solid part of the cymbal sheet prevents the burrs from being finely formed. *The simple structure of the ride can be formed in the press forming process. The complexity of this creation can be dissipated. Therefore, the heat sink fins of this creation are lighter and the dislocation angle of the bracts. The heat sink fins are high. In addition, the same size of the heat sink 曰j can also be made more than the conventional = can be installed than the conventional heat sink Korean, and then increase the dispersion 1 = 7 again, formed on the surface of the heat sink (10) fixed part n (10) thermal performance . In the effective grasp of the metal material, and then increase the pedestal and heat dissipation 鳞 scale material 41306 About this creation gamma God can be further understood from the following _ detailed description and the drawing. [Embodiment] Please refer to FIG. 2 to FIG. 5, FIG. 2 is a perspective view of the heat dissipation device 3 according to the first embodiment of the present creation, and FIG. 3 is a perspective view of the heat dissipation device 3 of FIG. • A perspective view, Fig. 4 is a cross-sectional view of the heat sink 3 along line VIII-a in Fig. 2, and Fig. 3 is a perspective view of the heat sink and fin 32 in Fig. 4. As shown in FIGS. 2 to 4, the vacant ..., the f-position 3 pedestal and the plurality of heat-dissipating Korean films 32 are provided. As shown in Figs. 4 and 5, each of the heat dissipating fins 32 includes a heat radiating portion 32, a fixing portion 322, and a J overflow preventing structure 324. In this case, each of the heat dissipation fins 32 is a cylindrical heat sinking tab. The fixing portion 322 gj is set in the susceptor %. The flash prevention structure 324 is connected between the heat dissipation portion 320 and the fixing portion 322. Moreover, each of the heat dissipation Korean sheets 32 may further include a scented groove structure 326 in which the groove structure 326 is formed on the fixing portion 322. As shown in Figure 4, the thickness of each part of the base 30 is designed to be fixed. The length of each of the two heat sinks is different. The length of the two parts 322 is also different. Further, the surface of the fixing portion 322 is formed with a nip structure 328. As shown in Fig. 5, the snap structure 328 is a - thread. The width W1 of the flash prevention structure 324 is greater than the width W2 of the heat dissipation portion 320 and greater than the width W3 of the fixing portion 322 in the groove structure 326. In this embodiment, the length l of the anti-overburden knot 324 protruding outward from the fixing portion 322 in the groove structure 326 may be between 1 * m and ί mm, wherein the anti-overfill structure 324 is equal in thickness. . In another embodiment of the M441306, the thickness of the anti-flash structure 324 may also vary in gradient. In this embodiment, the base 30 can include a box body 300 and a flange 3〇2, wherein the box body 300 has an accommodating space 304 therein, and the flange 3〇2 extends from the periphery of the box body 3〇〇 Outstanding. In practical applications, the flange 302 can be fixed to a fixed plane by screwing, riveting, welding or other fixing means, thereby fixing the heat sink 3 to the fixed plane. When the heat sink 3 of the present invention is installed outdoors (for example, a base station), electronic components having heat dissipation requirements can be accommodated in the housing space 3〇4 inside the housing 3 of the base 3 to protect Electronic components are protected from wind and rain damage. Referring to Fig. 6, Fig. 6 is a toucher of the manufacturing method of the heat sink 3 in Figs. 2 to 4. Wei, the implementation of fine S1n depends on the heat dissipation 32. In this implementation, the above molding process can be - recording 2 each heat dissipation 32 is formed into a cylindrical heat dissipation. Then, the step (10) 2'--surface treatment process is applied to each of the heat-dissipating fin forces to form a solid material 322 of the seat 32, such as the base 3G of the fourth _ _ f-coated heat sink. The anti-overflow of the fins 32 adheres to the object surface ^. In this embodiment, each of the heat sinks is on the side of the film. When the anti-overflow structure 321=prevents the overflow of the secondary material in the process, the hair length L is between the fixed portion 322 of the 丨mm disk iG^ structure 326, and the rice is protruded outwardly. Prevents M441306 from smashing metal material and causing burrs. In addition, the groove structure and the snap structure 328 of each of the heat dissipation fins 32 can effectively grasp the metal material to increase the joint strength of the base 3 and the heat dissipation fins 32. · With Figure 5, please refer to Figure 7. Figure 7 is a perspective view of three different types of heat sink fins 32. The main difference between the heat dissipation fins 32 in FIG. 7 and the heat dissipation fins 32 in FIG. 5 is the texture pattern of the occlusion structure 328. As shown in Fig. 7(A), the engaging structure 328 is a twill; as shown in Fig. 7(B), the engaging structure 328 is a net; as shown in Fig. 7(C), the engaging structure 328 is always Pattern. It should be noted that the components of the same reference numerals as those shown in Fig. 5 in Fig. 7 have substantially the same operation principle and will not be described again. Compared with the prior art, the creation can first form a heat dissipation by molding (for example, the nail pull process), and the surface treatment process of the heat treatment is performed on the surface of the heat-dissipating surface. The heat-dissipating part of the fixing part of the present invention has an anti-overflow structure, and the overflow structure can cause burrs in the overflow of the pressed metal material. Due to the creation of the heat sink Korean corner. ^ ί The scatter of the mine can eliminate the need for the detachment of the thief. Therefore, the heat sink fins of this creation are lighter in weight and higher than the conventional heat sink. In addition, in the same large heat quantity can be installed in the _ heat dissipation _, ^ device "the thermal performance of the creation. Furthermore, it is formed in the slab... fixed = heat-dissipating area to improve the effective grasping of the metal material during the squeezing process, and the occlusal structure on the private C surface can be combined with the heat sink fins by 7 M 441 306 degrees. The above is only the best practice of this _, and the average change made by the application for the inspection and arrest is the same as that of Lan’s. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic view of a cylindrical heat sink fin of the prior art. Fig. 2 is a perspective view of the heat sink according to the first embodiment of the present invention. Fig. 3 is a perspective view of the miscellaneous device of Fig. 2 in another perspective view. Fig. 4 is a cross-sectional view of the heat sink of Fig. 2 along the Α·Α line. Fig. 5 is a perspective view of the heat sink fin of Fig. 4+. Fig. 6 is a flow chart showing a method of manufacturing the heat sink in Figs. 2 to 4. Figure 7 is a perspective view of three different types of heat sink fins. [Main component symbol description] 3 Heat dissipating device 12, 32 Heat sink fin 302 Flange 320 Heat sink 324 Anti-flash structure 328 Bite structure L Length S100-S108 Step 10, 30 Base 300 Box 304 Housing space 322 Fixed Part 326 Groove structure Wl ' W2 ' W3 Width Α - 剖面 Section line
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW101207716U TWM441306U (en) | 2012-04-25 | 2012-04-25 | Heat dissipating fin and heat dissipating device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW101207716U TWM441306U (en) | 2012-04-25 | 2012-04-25 | Heat dissipating fin and heat dissipating device |
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| TWM441306U true TWM441306U (en) | 2012-11-11 |
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| TW101207716U TWM441306U (en) | 2012-04-25 | 2012-04-25 | Heat dissipating fin and heat dissipating device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013159564A1 (en) * | 2012-04-27 | 2013-10-31 | 讯凯国际股份有限公司 | Heat dissipation fin and heat dissipation device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013159564A1 (en) * | 2012-04-27 | 2013-10-31 | 讯凯国际股份有限公司 | Heat dissipation fin and heat dissipation device |
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