201128159 六、發明說明： 【發明所屬之技術領威】 [0001]本發明係有關〆種散熱器的結構和方法，尤指一種散熱 器的製作方法及其製成品。 【先前技術】 [0002] 〇 隨著電腦之處理器（如：CPU)的運算速度被不斷提昇後， 其所產生的熱量亦越來越高，加上利用此等處理器所產 製出的電子產品，亦不斷的朝向微型化及小型化來設計 ，是以用來解決此等處理器之熱量的散熱器，該如何作 相應的設作變化則是從事散熱行業所關注焦點。 [〇〇〇3]習知的散熱器，主要由多數個散熱鰭片所組合而成，此 等散熱鰭片大部份均以銅或鋁等材料身製成，其中以銅 材料所製成的散熱鰭片雖具有較佳的導散熱效能，伸名 存在有重量重及成本高等諸多問題待克.服。另，以在呂材 料所製成的散熱鰭片，雖然可以解決前述事量重和成本 高’卻另外存在有導散熱性不如前述銅散熱鰭片的問題 ’且此等鋁散熱鰭片在與銅等相異材料進行結合時，都 必須再次經過㈣等工序，才能使其可和鱗熱板或: 熱管的結合；本發明人基於前述理由而對本案進行如下 的創新發明。 【發明内容】 [0004]本發明之一目的，在於提供一種散熱器的製作方法及其 製成品，其可有效地擴大散熱表面積而增加散熱效能； 並可改善其與相異材料間的結合穩固度及焊接性。 _5]為了達成上述之目的，本發明提供—種散鮮，其包括 099104402 表單編號A0101 第3頁/共17頁 0992008277-0 201128159 多數個散熱鰭片，每一該散熱鰭片的一表面以喷塗方式 成型有一金屬彼覆層，在任一該散熱鰭片的至少一端彎 折有一折邊，且任二相鄰該散熱鰭片係以該折邊相互疊 接組成。 [0006] 為了達成上述之目的，本發明提供一種散熱器的製作方 法，其方法步驟包括： [0007] a)備具一金屬料帶； [0008] b)提供一喷塗裝置，以該喷塗裝置對該金屬料帶的一表 面進行喷塗而形成有一金屬披覆層； [0009] c)提供一沖壓裝置，以該沖壓裝置對經步驟b)的該金屬 料帶進行下料及成型而構成一散熱鰭片；以及 [0010] d)將多數的該散熱鰭片相互堆疊組接而成。 [0011] 本發明還具有以下功效，其是在鋁材料的散熱鰭片表面 直接直接喷塗銅材料，因此不必對散熱鰭片進行鍍鎳等 加工，不僅環保且能降低材料和加工等各項成本。 【實施方式】 [0012] 有關本發明之詳細說明及技術内容，配合圖式說明如下 ，然而所附圖式僅提供參考與說明用，並非用來對本發 明加以限制者。 [0013] 請參閱第四圖所示，本發明係提供一種散熱器，其主要 是由多數相互疊接的散熱鰭片10所組合而成，每一散熱 鰭片10係以鋁或鋁合金等導熱性良好的材料所製成，在 任一散熱鰭片10的一表面11以噴塗方式成型有一金屬披 099104402 表單編號A0101 第4頁/共17頁 0992008277-0 201128159 覆層20，此金屬彼覆層20係可為鎳、銅或其合金等導熱 性良好的材料，且其係以不規則的粗糙表面形成在前述 的表面11上。另，在各散熱鰭片10的上、下兩端分別彎 折成型有相互對應的二折邊12、13，藉以利用此等折邊 12、13以輿相鄰散熱鰭片10之間形成有一間隔通道14。 又，金屬披覆層20是形成在各散熱鰭片10被彎折後的外 侧表面上。此外，此散熱鰭片10亦可為單一折邊12或13 型態（圖未示出）。 [0014] 再者，本發明的散熱器更包括一導熱板30，此導熱板30 係可為銅或其合金等導熱性良好的材料所製成，前述形 成在折邊12外側的金屬坡覆層2 0是與導熱板30的表面相 互密貼且經加熱方式而接合。 [0015] 請參閱第一至七圖所示，分別本發明散熱器的製作方法 流程圖及各結構圖，其方法步驟包括： [0016] a)備具一金屬料帶100 ;此金屬料帶100係以鋁或鋁合金 AA 之竣 4.L 1.1 A ».々，/_ 1 I 、»*，l z〆 All I、 寻守热'1'王艮灯的砰ft尸/]·装；％ ° 〇 [0017] b)提供一喷塗裝置6，以喷塗裝置6對金屬料帶100的一表 面進行喷塗而形成有一金屬彼覆層20 ;此處係以喷銅（Cu Plasma Inject ion)方式為之。此外可在金屬料帶1 00 的全部表面或部份表面作噴塗披覆。 [0018] c)提供一沖壓裝置，以沖壓裝置對經步驟b)的金屬料帶 100a進行下料及成型而構成一散熱鰭片10 ;此散熱鰭片 10係被成型為一「U」字狀，上、下兩端分別彎折成型有 相互對應的二折邊12、13。同理，在此步驟中是可在前 099104402 表單編號A0101 第5頁/共17頁 0992008277-0 201128159 述其中之一折邊12(或13)開設有一凹槽15(如第八圖所 不）°另外’此散熱鰭片10亦可為其他文字或幾何形狀所 構成，並不以本實施例的型態來作為限制；如省略上方 折邊12。 [0019] d)將多數的散熱鰭片1 0相互堆疊組接而成。任二相鄰散 熱雜片10以前述之二折邊12、13相互疊接組成，而於相 鄰散熱鰭片10之間形成有一散熱通道14(如第六圖所示） 〇 [0020] 另’本發明散熱器的製作方法，其係在步驟d)2後更包 括一步驟e) ’該步騁e)備具一導無板3〇，將等散熱鰭片 10置設於導熱板30上。 [0021] 又，步驟e)之後更包括一步驟f)，該步赛丨）提供一加溫 裝置，以加溫裝置對各散熱鰭片1〇及導熱板3〇加熱，而 以金屬披覆層20連接各散熱鰭片1〇及導熱板30。其中各 乂. ：： · 散熱鰭片10和導熱板30是利用加熱.方式，而使金屬彼覆 層2〇焊固於各散熱鰭片10及導熱板3〇。 [0022] 再者，本發明散熱器的製作方法，係可以一步驟e，）來替 代前述步驟e’），該步驟e’）備具一熱管40，將熱管40的 一端穿入凹槽15中（如第八圖所示）。 [0023] 同理，在步驟e’）之後更包括一步驟f，），該步驟f，）提 供一加溫裝置’以加溫裝置對各散熱鰭片10及熱管4〇加 熱’而以金屬彼覆層20連接各散熱鰭片10及熱管40(如第 八圖所示）。其中各散熱鰭片1〇和熱管40是利用加熱方式 ，而使金屬披覆層20焊固於各散熱鰭片10及熱管40。 099104402 表單編號A0101 第6頁/共17頁 0992008277-0 201128159 [0024] 請參閱第八圖所示，本發明散熱器更包括一導熱板30及 一熱管40，其係在各散熱鰭片10之下方折邊13的中央位 置設有一凹槽15，另在導熱板30上亦同樣開設有一槽溝 31，由於金屬披覆層20是喷塗在各散熱鰭片10上，因此 熱管40的一端穿入前述凹槽15後對金屬披覆層20加熱而 熱接合，熱管40的另一端穿入導熱板30的槽溝31中；如 此，即可將熱管40及導熱板30共同組合成本發明之另一 實施例的散熱器。 [0025] 綜上所述，本發明之散熱器的製作方法及其製成品，確 %J 可達到預期之使用目的，而解決習知之缺失，又因極具 新穎性及進步性，完全符合發明專利申請要件，爰依專 利法提出申請，敬請詳查並賜准本案專利，以保障發明 人之權利。 【圖式簡單說明】 [0026] 第一圖係本發明散熱器製作流程圖。 [0027] 第二圖係本發明之金屬料帶以喷塗裝置加工示意圖。 ^ [0028] 第三圖係本發明之散熱鰭片立體外觀圖。 [0029] 第四圖係本發明之散熱鰭片組與導熱板立體分解圖。 [0030] 第五圖係本發明之散熱鰭片組與導熱板組合示意圖。 [0031] 第六圖係本發明之散熱鰭片組與導熱板組合剖視圖。 [0032] 第七圖係第六圖之A區域局部放大圖。 [0033] 第八圖係本發明散熱器之另一實施例組合示意圖。 【主要元件符號說明】 099104402 表單編號A0101 第7頁/共17頁 0992008277-0 201128159 [0034] <本發明> [0035] 金屬料帶 100、100a [0036] 散熱鰭片10 [0037] 表面 11 折邊 1 2、1 3 [0038] 間隔通道14凹槽1 5 [0039] 金屬彼覆層20 [0040] 導熱板30 [0041] 槽溝31 [0042] 熱管 4 0 [0043] 喷塗裝置6 0992008277-0 099104402 表單編號A0101 第8頁/共17頁201128159 VI. Description of the Invention: [Technical Leadership of the Invention] [0001] The present invention relates to a structure and a method of a heat sink, and more particularly to a method of manufacturing a heat sink and a finished product thereof. [Prior Art] [0002] 〇 As the computing speed of a computer processor (such as a CPU) is continuously increased, the amount of heat generated is also higher and higher, and the output produced by using such processors Electronic products are also constantly being designed towards miniaturization and miniaturization. They are heat sinks used to solve the heat of these processors. How to make corresponding changes is the focus of the thermal industry. [〇〇〇3] The conventional heat sink is mainly composed of a plurality of heat radiating fins, and most of the heat radiating fins are made of copper or aluminum, and the like is made of copper material. Although the heat-dissipating fins have better heat-dissipating performance, there are many problems such as heavy weight and high cost. In addition, the heat-dissipating fins made of Lu materials can solve the above-mentioned problems and high cost, but there is another problem that the heat-dissipating heat is not as good as the aforementioned copper heat-dissipating fins, and these aluminum heat-dissipating fins are When the dissimilar materials such as copper are combined, they must be subjected to the steps (4) again, so that they can be combined with the scale hot plate or the heat pipe; the inventors made the following innovative inventions based on the above reasons. SUMMARY OF THE INVENTION [0004] An object of the present invention is to provide a method for fabricating a heat sink and a finished article thereof, which can effectively expand the heat dissipating surface area and increase heat dissipation efficiency; and can improve the bonding between the dissimilar materials and the dissimilar materials. Degree and weldability. _5] In order to achieve the above purpose, the present invention provides a kind of scatter, which includes 099104402 Form No. A0101 Page 3 / Total 17 Page 0992008277-0 201128159 A plurality of heat sink fins, one surface of each of the heat sink fins is sprayed The coating is formed with a metal coating, and at least one end of any of the heat dissipation fins is bent with a flange, and any two adjacent heat dissipation fins are formed by overlapping the flanges. [0006] In order to achieve the above object, the present invention provides a method of fabricating a heat sink, the method steps of which include: [0007] a) preparing a metal strip; [0008] b) providing a spraying device to Spraying the surface of the metal strip to form a metal coating layer; [0009] c) providing a stamping device for blanking the metal strip of step b) Forming a heat sink fin; and [0010] d) stacking a plurality of the heat sink fins on each other. [0011] The present invention also has the following effects, which directly sprays copper material directly on the surface of the heat dissipating fin of the aluminum material, so that it is not necessary to perform nickel plating and the like on the heat dissipating fin, which is not only environmentally friendly but also can reduce materials and processing. cost. The detailed description and technical content of the present invention are set forth below with reference to the accompanying drawings. [0013] Referring to the fourth figure, the present invention provides a heat sink, which is mainly composed of a plurality of heat dissipating fins 10 stacked one on another, each of which is made of aluminum or aluminum alloy. Made of a material with good thermal conductivity, a metal coating is formed on one surface 11 of any of the heat dissipating fins 10 by a spray. 099104402 Form No. A0101 Page 4 / 17 pages 0992008277-0 201128159 Cladding 20, this metal coating The 20 series may be a material having good thermal conductivity such as nickel, copper or an alloy thereof, and is formed on the aforementioned surface 11 with an irregular rough surface. In addition, two upper and lower edges 12 and 13 are respectively formed on the upper and lower ends of each of the heat dissipation fins 10, so that the flanges 12 and 13 are formed by using the flanges 12 and 13 to form a space between the adjacent heat dissipation fins 10. Interval channel 14. Further, the metal coating layer 20 is formed on the outer surface of each of the heat radiating fins 10 after being bent. In addition, the heat dissipation fins 10 may also be of a single hem 12 or 13 type (not shown). [0014] Furthermore, the heat sink of the present invention further includes a heat conducting plate 30 which can be made of a material having good thermal conductivity such as copper or an alloy thereof, and the metal slope formed on the outer side of the flange 12 The layer 20 is bonded to the surface of the heat conducting plate 30 and joined by heating. [0015] Please refer to the first to seventh figures, respectively, a flow chart of the method for manufacturing the heat sink of the present invention and various structural diagrams, the method steps comprising: [0016] a) preparing a metal strip 100; the metal strip 100 series with aluminum or aluminum alloy AA 竣 4.L 1.1 A ». 々, / _ 1 I, » *, lz 〆 All I, 守 热 ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' % ° 〇 [0017] b) A spraying device 6 is provided, and a surface of the metal strip 100 is sprayed by the spraying device 6 to form a metal coating 20; here copper is sprayed Plasma Inject ion). In addition, it can be spray coated on the entire surface or part of the surface of the metal strip 100. [0018] c) providing a stamping device for blanking and molding the metal strip 100a of step b) to form a heat sink fin 10; the heat sink fin 10 is formed into a "U" shape The upper and lower ends are respectively bent and formed with mutually corresponding bi-folds 12 and 13. Similarly, in this step, one of the flanges 12 (or 13) can be opened in the first 099104402 Form No. A0101, page 5 / page 17 0992008277-0 201128159 (as shown in the eighth figure) ° Further, the heat dissipating fins 10 may be formed of other characters or geometric shapes, and are not limited by the form of the embodiment; for example, the upper folded edge 12 is omitted. [0019] d) forming a plurality of heat dissipation fins 10 stacked on each other. Any two adjacent heat dissipating chips 10 are formed by overlapping the two folded edges 12 and 13 , and a heat dissipating channel 14 is formed between the adjacent heat dissipating fins 10 (as shown in FIG. 6 ). [0020] The method for fabricating the heat sink of the present invention further comprises a step e) after the step d) 2, the step of preparing a non-plate 3, and placing the heat dissipating fins 10 on the heat conducting plate 30. on. [0021] In addition, after step e), a step f) is further included, which provides a heating device for heating the heat dissipating fins 1 and the heat conducting plate 3 by the heating device, and coating with metal The layer 20 connects the heat dissipation fins 1 and the heat conduction plate 30. Each of the heat sink fins 10 and the heat conductive plate 30 is heated to the respective heat sink fins 10 and the heat conductive plates 3〇 by means of heating. [0022] Furthermore, the method for fabricating the heat sink of the present invention may replace the foregoing step e') with a step e'), the step e') is provided with a heat pipe 40, and one end of the heat pipe 40 is inserted into the groove 15 Medium (as shown in the eighth picture). [0023] Similarly, after step e'), a step f,) is further included, which provides a heating device 'heating the heat dissipating fins 10 and the heat pipes 4' with the heating device to the metal The cover layer 20 connects the heat dissipation fins 10 and the heat pipes 40 (as shown in the eighth figure). The heat dissipation fins 1 and the heat pipes 40 are heated by heating, and the metal cladding layer 20 is welded to the heat dissipation fins 10 and the heat pipes 40. 099104402 Form No. A0101 Page 6 of 17 0992008277-0 201128159 [0024] Referring to FIG. 8 , the heat sink of the present invention further includes a heat conducting plate 30 and a heat pipe 40 which are attached to the heat dissipating fins 10 . A groove 15 is defined in the central portion of the lower flange 13 , and a groove 31 is also formed in the heat conducting plate 30 . Since the metal coating layer 20 is sprayed on each of the heat dissipation fins 10 , one end of the heat pipe 40 is worn. After the recess 15 is inserted into the groove 15, the metal coating layer 20 is heated and thermally joined, and the other end of the heat pipe 40 is inserted into the groove 31 of the heat conducting plate 30; thus, the heat pipe 40 and the heat conducting plate 30 can be combined together to form another A heat sink of an embodiment. [0025] In summary, the manufacturing method and the finished product of the heat sink of the present invention can achieve the intended purpose of use, and solve the lack of the prior art, and is completely in line with the invention because of the novelty and the progressiveness. The patent application requirements are filed in accordance with the Patent Law. Please check and grant the patent in this case to protect the rights of the inventor. BRIEF DESCRIPTION OF THE DRAWINGS [0026] The first figure is a flow chart of the heat sink of the present invention. [0027] The second drawing is a schematic view of the metal strip of the present invention processed by a spraying device. [0028] The third figure is a perspective view of the heat sink fin of the present invention. [0029] The fourth figure is an exploded perspective view of the heat dissipation fin set and the heat conduction plate of the present invention. [0030] The fifth figure is a schematic diagram of the combination of the heat dissipation fin set and the heat conduction plate of the present invention. [0031] FIG. 6 is a cross-sectional view showing the combination of the heat dissipation fin group and the heat conduction plate of the present invention. [0032] The seventh figure is a partial enlarged view of the A area of the sixth figure. [0033] The eighth figure is a schematic view showing a combination of another embodiment of the heat sink of the present invention. [Main component symbol description] 099104402 Form number A0101 Page 7/17 page 0992008277-0 201128159 [0034] <The present invention> [0035] Metal strip 100, 100a [0036] Heat sink fin 10 [0037] Surface 11 Folding Edge 1, 2, 1 3 [0038] Interval Channel 14 Groove 1 5 [0039] Metallic Overlay 20 [0040] Thermal Conductive Plate 30 [0041] Groove 31 [0042] Heat Pipe 4 0 [0043] Spray Mount Set 6 0992008277-0 099104402 Form No. A0101 Page 8 of 17