CN215006543U

CN215006543U - Symmetrical radiator

Info

Publication number: CN215006543U
Application number: CN202120301347.5U
Authority: CN
Inventors: 叶博森
Original assignee: Guangzhou Longhui Electronic Technology Co ltd
Current assignee: Guangzhou Longhui Electronic Technology Co ltd
Priority date: 2021-02-02
Filing date: 2021-02-02
Publication date: 2021-12-03
Anticipated expiration: 2031-02-02

Abstract

The utility model discloses a symmetrical radiator, including first radiator unit, with the second radiator unit of first radiator unit symmetric distribution, first radiator unit includes first base, a plurality of sets up the first radiator fin on first base, the upper portion of first base forms the upside terminal surface, the upside terminal surface with first radiator fin's angle is 30-60 degrees; the second heat dissipation assembly comprises a second base and a plurality of second heat dissipation fins arranged on the second base; the first base and the second base are rectangular, and the side part of the first base and the side part of the second base are fixed through friction welding. In the use process, the airflow moves towards two sides along the first radiating fins and the second radiating fins, the radiating effect is good, meanwhile, the structure is simple, the manufacturing is convenient, and the problems of poor radiating effect and high processing cost are solved.

Description

Symmetrical radiator

Technical Field

The utility model relates to a radiator field especially relates to a symmetrical formula radiator.

Background

At present, the heat dissipation of a CPU is mainly realized through a conduction mode, which relates to a medium, namely a heat dissipation sheet, which is in direct contact with a processor, wherein the heat dissipation sheet dissipates heat in a convection mode after absorbing the heat, the heat dissipation area is mainly determined by the surface area of a heat dissipation fin in the convection heat dissipation process, and the larger the surface area is, the better the heat dissipation effect is; the smaller the surface area, the poorer the heat dissipation effect. The means commonly used in the industry mainly include: the number of the radiating fins is increased, the length of the radiating fins is increased, and one data is 'thickness-height ratio', namely the ratio of the thickness to the height of the radiating fins, the smaller the value is, the denser the radiating fins in unit volume can be made, the larger the number is, the larger the effective radiating surface area is, and the better the radiating performance is. Heat fins, referred to as heat sinks for short, are classified as "passive heat dissipating elements" in the field of electronic engineering design. The metal with good thermal conductivity, light weight and easy processing is attached to the heating surface to dissipate heat in a composite heat exchange mode.

However, the conventional heat sink has the following drawbacks:

1. the heat radiator on the market has poor heat radiation effect;

2. the radiator on the market is usually manufactured by an integral die-casting production mode, and an aluminum alloy die casting piece is too heavy and has general heat radiation performance; when the radiator needs a large size, the die-casting die needs to be made larger and more complicated, and the tonnage of a machine table needed to be used is also larger, so that higher cost is generated.

SUMMERY OF THE UTILITY MODEL

In order to overcome the defects of the prior art, one of the purposes of the utility model is to provide a symmetrical radiator, which can solve the problems of poor radiating effect and high processing cost.

The utility model discloses an one of the purpose adopts following technical scheme to realize:

a symmetrical radiator comprises a first radiating assembly and a second radiating assembly symmetrically distributed with the first radiating assembly, wherein the first radiating assembly comprises a first base and a plurality of first radiating fins arranged on the first base, the upper part of the first base forms an upper side end face, and the angle between the upper side end face and the first radiating fins is 30-60 degrees; the second heat dissipation assembly comprises a second base and a plurality of second heat dissipation fins arranged on the second base; the first base and the second base are rectangular, and the side part of the first base and the side part of the second base are fixed through friction welding.

Furthermore, the first heat dissipation assembly is manufactured by extrusion forming, and a side arc-shaped chamfer is arranged at the joint of the first heat dissipation fin and the first base.

Further, the angle between the upper end surface and the first heat dissipation fin is 45 degrees.

Further, the surface of the first base is perpendicular to the surface of the first heat dissipation fin.

Further, the surface of the first cooling fin is 90 ° to the surface of the second cooling fin.

Compared with the prior art, the beneficial effects of the utility model reside in that:

the first heat dissipation assembly comprises a first base and a plurality of first heat dissipation fins arranged on the first base, wherein the upper part of the first base forms an upper side end face, and the angle between the upper side end face and the first heat dissipation fins is 30-60 degrees; the second heat dissipation assembly comprises a second base and a plurality of second heat dissipation fins arranged on the second base; the first base and the second base are rectangular, and the side part of the first base and the side part of the second base are fixed through friction welding. In the use process, the airflow moves towards two sides along the first radiating fins and the second radiating fins, the radiating effect is good, meanwhile, the structure is simple, the manufacturing is convenient, and the problems of poor radiating effect and high processing cost are solved.

The foregoing description is only an overview of the technical solutions of the present invention, and in order to make the technical means of the present invention more clearly understood, the present invention may be implemented according to the content of the description, and in order to make the above and other objects, features, and advantages of the present invention more obvious and understandable, the following preferred embodiments are described in detail with reference to the accompanying drawings.

Drawings

FIG. 1 is a perspective view of a preferred embodiment of the symmetrical heat sink of the present invention;

FIG. 2 is a perspective view of the symmetrical heat sink of FIG. 1;

FIG. 3 is another perspective view of the symmetrical heat sink of FIG. 1;

fig. 4 is another perspective view of the symmetrical heat sink of fig. 1.

In the figure: 10. a first heat dissipation assembly; 11. a first base; 111. arc chamfering is carried out on the side surface; 101. an upper side end face; 12. a first heat radiation fin; 20. a second heat dissipation assembly; 21. a second base; 22. and a second heat dissipation fin.

Detailed Description

The present invention will be further described with reference to the accompanying drawings and the detailed description, and it should be noted that the embodiments or technical features described below can be arbitrarily combined to form a new embodiment without conflict.

It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When a component is referred to as being "connected" to another component, it can be directly connected to the other component or intervening components may also be present. When a component is referred to as being "disposed on" another component, it can be directly on the other component or intervening components may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

Referring to fig. 1-4, a symmetric heat sink includes a first heat sink 10 and a second heat sink 20 symmetrically distributed with the first heat sink 10, where the first heat sink 10 includes a first base 11 and a plurality of first heat fins 12 disposed on the first base 11, the adjacent first heat fins 12 are disposed in parallel, an upper end surface 101 is formed at an upper portion of the first base 11, and an angle between the upper end surface 101 and the first heat fins 12 is 30 ° -60 °; the second heat dissipation assembly 20 includes a second base 21 and a plurality of second heat dissipation fins 22 disposed on the second base 21, and the adjacent second heat dissipation fins 22 are disposed in parallel; the first base 11 and the second base 21 are rectangular, and the side of the first base 11 and the side of the second base 21 are fixed by friction welding. In the using process, the airflow moves towards two sides along the first radiating fins 12 and the second radiating fins 22, the radiating effect is good, meanwhile, the structure is simple, the manufacturing is convenient, and the problems of poor radiating effect and high processing cost are solved.

Specifically, the first heat dissipation assembly 10 is formed by extrusion molding, and a side arc-shaped chamfer 111 is arranged at a joint of the first heat dissipation fin 12 and the first base 11. Compared with die castings, the aluminum alloy die casting with higher heat conductivity of the radiator has the heat conductivity coefficient of about 120W/m.K, and the heat conductivity coefficient of aluminum extrusion is about 210W/m.K.

Preferably, the angle between the upper end surface 101 and the first heat dissipation fin 12 is 45 °, which is more favorable for heat to diffuse outwards. The surface of the first base 11 is perpendicular to the surface of the first radiator fin 12. The surface of the first cooling fins 12 is at 90 ° to the surface of the second cooling fins 22. Whole device compact structure, novel structure, design benefit, the suitability is strong, the facilitate promotion.

The above embodiments are only preferred embodiments of the present invention, and the protection scope of the present invention cannot be limited thereby, and any insubstantial changes and substitutions made by those skilled in the art based on the present invention are all within the protection scope of the present invention.

Claims

1. The utility model provides a symmetrical formula radiator, includes first radiator unit, with the second radiator unit of first radiator unit symmetric distribution, its characterized in that:

the first heat dissipation assembly comprises a first base and a plurality of first heat dissipation fins arranged on the first base, wherein the upper part of the first base forms an upper side end face, and the angle between the upper side end face and the first heat dissipation fins is 30-60 degrees;

the second heat dissipation assembly comprises a second base and a plurality of second heat dissipation fins arranged on the second base;

the first base and the second base are rectangular, and the side part of the first base and the side part of the second base are fixed through friction welding.

2. The symmetric heat sink of claim 1, wherein: the first heat dissipation assembly is manufactured by extrusion forming, and a side arc-shaped chamfer is arranged at the joint of the first heat dissipation fin and the first base.

3. The symmetric heat sink of claim 1, wherein: the angle between the upper side end surface and the first radiating fins is 45 degrees.

4. The symmetric heat sink of claim 1, wherein: the surface of the first base is perpendicular to the surface of the first heat dissipation fin.

5. The symmetric heat sink of claim 1, wherein: the surfaces of the first heat dissipating fins and the surfaces of the second heat dissipating fins are at 90 degrees.