CN101460043A - 散热器组合 - Google Patents

散热器组合 Download PDF

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Publication number
CN101460043A
CN101460043A CN200710203090.4A CN200710203090A CN101460043A CN 101460043 A CN101460043 A CN 101460043A CN 200710203090 A CN200710203090 A CN 200710203090A CN 101460043 A CN101460043 A CN 101460043A
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CN
China
Prior art keywords
radiator
motherboard
gripping arm
pressure section
buckling device
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
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CN200710203090.4A
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English (en)
Inventor
陈明科
孙珂
叶振兴
陈晓竹
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Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
Original Assignee
Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Publication date
Application filed by Hongfujin Precision Industry Shenzhen Co Ltd, Hon Hai Precision Industry Co Ltd filed Critical Hongfujin Precision Industry Shenzhen Co Ltd
Priority to CN200710203090.4A priority Critical patent/CN101460043A/zh
Priority to US11/967,056 priority patent/US20090154109A1/en
Publication of CN101460043A publication Critical patent/CN101460043A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093—Snap-on arrangements, e.g. clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

一种散热器组合，包括一散热器及一用以将该散热器固定于一主机板的散热器扣合装置，该主机板设有一对卡扣部，该散热器扣合装置是由一弹性金属条弯折而成，其包括一抵压于该散热器的抵压部及一对扣持臂，该对扣持臂分别自该抵压部的两端延伸，每一扣持臂包括一位于该散热器上方的操作部及一连接于该操作部的扣钩，该对扣钩可与该主机板的卡扣部对应卡扣。该散热器扣合装置的操作部位于该散热器的上方，使该散热器的拆装过程方便、快捷。

Description

散热器组合
技术领域
本发明涉及一种散热器组合。
背景技术
电脑主机板上的电子元件(如南北桥芯片)上需要安装散热器。一种安装方式是在主机板上设置若干卡扣件，通过一设有若干弹性扣持臂的扣合装置将散热器固持在该电子元件上，再操作该弹性扣持臂与主机板上的卡扣件对应卡合而将该散热器固定。
为了节约主机板的空间，通常该电子元件与对应的卡扣件之间的距离较小，在拆装该散热器时，需要用手指靠近该散热器的底部进行操作，操作不便。
发明内容
鉴于以上，有必要提供一操作方便的散热器组合。
一种散热器组合，包括一散热器及一用以将该散热器固定于一主机板的散热器扣合装置，该主机板设有一对卡扣部，该散热器扣合装置是由一弹性金属条弯折而成，其包括一抵压于该散热器的抵压部及一对扣持臂，该对扣持臂分别自该抵压部的两端延伸，每一扣持臂包括一位于该散热器上方的操作部及一连接于该操作部的扣钩，该对扣钩可与该主机板的卡扣部对应卡扣。
相较现有技术，该散热器组合的散热器扣合装置包括一位于该散热器上方的操作部，使该散热器的拆装过程方便、快捷。
附图说明
图1是本发明散热器组合的较佳实施方式与一主机板的立体分解图。
图2是图1的立体组合图。
具体实施方式
请参照图1，本发明散热器组合的较佳实施方式包括一散热器20及一用以将该散热器20固定于一主机板40的散热器扣合装置10。该主机板40上设有一电子元件42及一对卡扣部44。
请共同参照图2，该散热器扣合装置10是由一弹性金属簧条弯折而成，其包括一杆状的抵压部12及一对分别自该抵压部12两端向上反向倾斜延伸的扭臂141。该对扭臂141分别自其末端水平反向延伸形成一对操作部142。每一操作部142的末端向下垂直延伸一扣钩144，该对扣钩144分别位于该抵压部12的两侧。该对扭臂141与对应的操作部142及扣钩144共同于垂直该抵压部12的平面内形成一对大致呈n形的扣持臂14。
该散热器20具有一基座22及若干设于该基座22顶面上的间隔排列的散热鳍片24，其中中部的两列散热鳍片24之间形成一可收容该散热器扣合装置10的抵压部12的安装槽26。
组装时，将该散热器20放置于该主机板40的电子元件42上，使该散热器20的一对对角分别靠近该主机板40对应的卡扣部44；将该散热器扣合装置10的抵压部12收容在该散热器20的安装槽26内，该对扣持臂14的操作部142位于该散热器20的上方。下压该散热器扣合装置10的操作部142，使该对扣持臂14的扭臂141弹性变形，将该对扣持臂14的扣钩144勾扣于该主机板40对应的卡扣部44，即完成该散热器20的安装。
拆卸时，下压该散热器扣合装置10的操作部142，使该对扣钩144脱离该主机板40对应的卡扣部44，即可将该散热器20从该主机板40上取下。

Claims (4)

  1. 【权利要求1】一种散热器组合，包括一散热器及一用以将该散热器固定于一主机板的散热器扣合装置，该主机板设有一对卡扣部，该散热器扣合装置是由一弹性金属条弯折而成，其包括一抵压于该散热器的抵压部及一对扣持臂，其特征在于：该对扣持臂分别自该抵压部的两端延伸，每一扣持臂包括一位于该散热器上方的操作部及一连接于该操作部的扣钩，该对扣钩可与该主机板的卡扣部对应卡扣。
  2. 【权利要求2】如权利要求1所述的散热器组合，其特征在于：该散热器扣合装置的扣持臂大致呈n形，每一扣持臂包括一自该抵压部的一端向上倾斜延伸的扭臂，该对扣持臂的操作部自对应扭臂的末端水平延伸，该对扣持臂的扣钩自对应的操作部的末端垂直向下延伸形成。
  3. 【权利要求3】如权利要求2所述的散热器组合，其特征在于：该散热器扣合装置的抵压部为杆状，该散热器扣合装置的扣持臂所在的平面垂直于该抵压部。
  4. 【权利要求4】如权利要求3所述的散热器组合，其特征在于：该主机板的卡扣部分别靠近该散热器的两对角，该对扣持臂的扣钩分别处于该抵压部的两侧。
CN200710203090.4A 2007-12-14 2007-12-14 散热器组合 Pending CN101460043A (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN200710203090.4A CN101460043A (zh) 2007-12-14 2007-12-14 散热器组合
US11/967,056 US20090154109A1 (en) 2007-12-14 2007-12-29 Heat sink assembly

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN200710203090.4A CN101460043A (zh) 2007-12-14 2007-12-14 散热器组合

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CN101460043A true CN101460043A (zh) 2009-06-17

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CN (1) CN101460043A (zh)

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CN102346526A (zh) * 2010-07-30 2012-02-08 鸿富锦精密工业（深圳）有限公司 电源组合
CN103687403A (zh) * 2012-09-24 2014-03-26 特拉博斯股份有限公司 包括弹性紧固件的电路板系统

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CN103116389A (zh) * 2011-11-16 2013-05-22 鸿富锦精密工业（深圳）有限公司 散热器组合
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US10064287B2 (en) 2014-11-05 2018-08-28 Infineon Technologies Austria Ag System and method of providing a semiconductor carrier and redistribution structure
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CN103687403A (zh) * 2012-09-24 2014-03-26 特拉博斯股份有限公司 包括弹性紧固件的电路板系统
CN103687403B (zh) * 2012-09-24 2018-12-04 特拉博斯股份有限公司 包括弹性紧固件的电路板系统

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Open date: 20090617