CN103116389A - 散热器组合 - Google Patents

散热器组合 Download PDF

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Publication number
CN103116389A
CN103116389A CN2011103634240A CN201110363424A CN103116389A CN 103116389 A CN103116389 A CN 103116389A CN 2011103634240 A CN2011103634240 A CN 2011103634240A CN 201110363424 A CN201110363424 A CN 201110363424A CN 103116389 A CN103116389 A CN 103116389A
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CN
China
Prior art keywords
heating radiator
holding section
combination
base plate
row
Prior art date
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Pending
Application number
CN2011103634240A
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English (en)
Inventor
谭亮
马小峰
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
Original Assignee
Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Filing date
Publication date
Application filed by Hongfujin Precision Industry Shenzhen Co Ltd, Hon Hai Precision Industry Co Ltd filed Critical Hongfujin Precision Industry Shenzhen Co Ltd
Priority to CN2011103634240A priority Critical patent/CN103116389A/zh
Priority to TW100142266A priority patent/TW201322901A/zh
Priority to US13/304,390 priority patent/US20130120932A1/en
Publication of CN103116389A publication Critical patent/CN103116389A/zh
Pending legal-status Critical Current

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    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/20Cooling means
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093Snap-on arrangements, e.g. clips
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

一种散热器组合,包括一散热器、一设有一电子元件的主机板和两扣合件,该散热器包括一贴设于该电子元件的底板和自该底板向上垂直延伸的若干列间隔设置的鳍片,该底板于两组相邻两列鳍片之间分别设有一列间隔设置的固定块,每一列固定块设有共轴线且上部形成有开口的穿孔,该主机板于该电子元件的两侧凸设两卡扣件,每一扣合件包括一卡合于一卡扣件的卡合部和可自开口卡入对应穿孔的两固定部。该散热组合的扣合件的固定部卡入散热器的穿孔,扣合件的卡合部卡合于该主机板的对应卡扣件,即可固定散热器,非常方便。

Description

散热器组合
技术领域
本发明涉及一种散热器组合。
背景技术
散热器通常用弹性卡扣或弹性扣具固定于主机板以给电子元件散热。然而,这些固定方式比较复杂,而且成本较高。
发明内容
鉴于以上,有必要提供一种方便固定散热器的散热器组合。
一种散热器组合,包括一散热器、一设有一电子元件的主机板和两扣合件,该散热器包括一贴设于该电子元件的底板和自该底板向上垂直延伸的若干列间隔设置的鳍片,该底板于两组相邻两列鳍片之间分别设有一列间隔设置的固定块,每一列固定块设有共轴线且上部形成有开口的穿孔,该主机板于该电子元件的两侧凸设两卡扣件,每一扣合件包括一卡合于一卡扣件的卡合部和可自开口卡入对应穿孔的两固定部。
相较现有技术,该散热组合的扣合件的固定部卡入散热器的穿孔,扣合件的卡合部卡合于该主机板的对应卡扣件,即可固定散热器,非常方便。
附图说明
图1是本发明散热器组合的较佳实施方式的立体分解图。
图2是图1中散热器的侧视图。
图3是图1的立体组装图。
主要元件符号说明
扣合件 10
卡合部 12
固定部 14
延伸部 140
连接部 142
插接部 144
散热器 20
底板 22
鳍片 24
固定块 25
穿孔 26
主机板 40
电子元件 42
卡扣件 44
固定片 46
卡钩 48
突齿 49
如下具体实施方式将结合上述附图进一步说明本发明。
具体实施方式
请参照图1和图2,本发明散热器组合的较佳实施方式包括一散热器20及用以将该散热器20固定于一主机板40的两扣合件10。
该散热器20包括一底板22和自该底板22的顶面向上垂直延伸的若干列相间隔的鳍片24。该底板22于两组相邻两列鳍片24之间分别对应地形成一列相间隔的固定块25。每列鳍片24的相邻鳍片24之间形成一间隙,每列固定块25的相邻固定块25之间也对应形成一间隙。每一列固定块25共轴线地设有开口向上的穿孔26。本实施方式中,这些固定块25突设于该底板22。
该主机板40上设有一电子元件42及位于该电子元件42两侧的两卡扣件44。每一卡扣件44包括一固定于该主机板40的固定片46和两背向突设于该固定片46的中部的卡钩48。该两卡钩48于顶部的外侧分别延伸出一突齿49。
每一扣合件10由一弹性金属簧条弯折而成,包括一U形的卡合部12及对称地设置在该卡合部12的两端的两U形的固定部14。每一固定部14包括一垂直连接于该卡合部12的一端的延伸部140、自该延伸部140的末端远离该卡合部12垂直延伸的连接部142和自该连接部142的末端向另一固定部14垂直延伸的一插接部144。
请参照图3,组装时,每一扣合件10的两插接部144自该散热器20的对应穿孔26的开口卡入穿孔26,每一扣合件10的每一连接部142穿过对应两列鳍片24及对应两固定块25之间的间隙并位于该底板22的上方。
使用时,将该散热器20置于该电子元件42上,之后朝向该底板22的方向下压该两扣合件10的卡合部12,使该两扣合件10的连接部142贴合于该散热器20的底板22,该主机板40的每一卡扣件44的卡钩48夹置于对应的扣合件10的卡合部12内。该卡扣件44的突齿49挡止于该卡合部12的顶部。

Claims (6)

1.一种散热器组合,包括一散热器、一设有一电子元件的主机板和两扣合件,该散热器包括一贴设于该电子元件的底板和自该底板向上垂直延伸的若干列间隔设置的鳍片,该底板于两组相邻两列鳍片之间分别设有一列间隔设置的固定块,每一列固定块设有共轴线且上部形成有开口的穿孔,该主机板于该电子元件的两侧凸设两卡扣件,每一扣合件包括一卡合于一卡扣件的卡合部和可自开口卡入对应穿孔的两固定部。
2.如权利要求1所述的散热器组合,其特征在于:每一扣合件的卡合部呈U形,每一卡合部夹置一对应的卡扣件。
3.如权利要求2所述的散热器组合,其特征在于:每一卡扣件包括一固定片及两背向凸设于该固定片的两可卡合对应卡合部的卡钩。
4.如权利要求3所述的散热器组合,其特征在于:每一卡钩于外侧凸设一可挡止于对应卡合部的顶部的突齿。
5.如权利要求1所述的散热器组合,其特征在于:该两固定部分别呈U形且对称地设置在该卡合部的两末端。
6.如权利要求5所述的散热器组合,其特征在于:每一固定部包括自该卡合部的末端垂直向外延伸的延伸部、自该延伸部的末端远离该卡合部垂直延伸的连接部和自该连接部的末端向另一固定部垂直延伸的可卡入对应穿孔的插接部。
CN2011103634240A 2011-11-16 2011-11-16 散热器组合 Pending CN103116389A (zh)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN2011103634240A CN103116389A (zh) 2011-11-16 2011-11-16 散热器组合
TW100142266A TW201322901A (zh) 2011-11-16 2011-11-18 散熱器組合
US13/304,390 US20130120932A1 (en) 2011-11-16 2011-11-24 Motherboard with heat sink

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Application Number Priority Date Filing Date Title
CN2011103634240A CN103116389A (zh) 2011-11-16 2011-11-16 散热器组合

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CN103116389A true CN103116389A (zh) 2013-05-22

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CN (1) CN103116389A (zh)
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CN103874394B (zh) * 2012-12-18 2017-01-04 国网山东省电力公司德州供电公司 电子装置及其散热器模组
DE102015200548A1 (de) * 2015-01-15 2016-07-21 Zf Friedrichshafen Ag Anordnung zum Entwärmen von zumindest einem elektronischen Bauteil
TWI553457B (zh) * 2015-09-25 2016-10-11 奇鋐科技股份有限公司 散熱模組組合結構
US10021813B2 (en) 2015-10-13 2018-07-10 Asia Vital Components Co., Ltd. Thermal module assembling structure
JP6885194B2 (ja) * 2017-05-15 2021-06-09 富士通株式会社 電子機器
EP3824698B1 (de) * 2018-05-25 2022-08-31 Miba Energy Holding GmbH Leistungsbaugruppe mit tragendem kühlkörper

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Application publication date: 20130522