TW201300341A - 陶瓷含硼摻雜糊及用於其之方法 - Google Patents

陶瓷含硼摻雜糊及用於其之方法 Download PDF

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Publication number
TW201300341A
TW201300341A TW101115739A TW101115739A TW201300341A TW 201300341 A TW201300341 A TW 201300341A TW 101115739 A TW101115739 A TW 101115739A TW 101115739 A TW101115739 A TW 101115739A TW 201300341 A TW201300341 A TW 201300341A
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Taiwan
Prior art keywords
boron
ceramic
containing dopant
dopant paste
paste
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TW101115739A
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English (en)
Chinese (zh)
Inventor
Maxim Kelman
Elena V Rogojina
Gong-Hou Wang
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Innovalight Inc
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Publication of TW201300341A publication Critical patent/TW201300341A/zh

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    • C04B35/626Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B
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    • C04B35/01Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
    • C04B35/10Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on aluminium oxide
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    • C04B35/63Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B using additives specially adapted for forming the products, e.g.. binder binders
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    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/22Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities
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    • H10F71/121The active layers comprising only Group IV materials
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    • H10F77/206Electrodes for devices having potential barriers
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TW101115739A 2011-05-03 2012-05-03 陶瓷含硼摻雜糊及用於其之方法 TW201300341A (zh)

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US13/099,794 US9156740B2 (en) 2011-05-03 2011-05-03 Ceramic boron-containing doping paste and methods therefor

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US (1) US9156740B2 (enExample)
JP (1) JP2014522564A (enExample)
CN (1) CN103649011B (enExample)
TW (1) TW201300341A (enExample)
WO (1) WO2012151422A1 (enExample)

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US9059341B1 (en) 2014-01-23 2015-06-16 E I Du Pont De Nemours And Company Method for manufacturing an interdigitated back contact solar cell
CN104261822B (zh) * 2014-09-19 2015-11-25 中南大学 一种氧化锆复合陶瓷及其制备方法
CN104934501B (zh) * 2015-05-30 2017-03-22 浙江理工大学 一种基于Sm2O3/n‑Si异质结构的紫外光电器件的制备方法
US9306088B1 (en) 2015-09-17 2016-04-05 E I Du Pont De Nemours And Company Method for manufacturing back contact solar cells
DE102015226516B4 (de) * 2015-12-22 2018-02-22 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung eingetragener Verein Verfahren zur Dotierung von Halbleitersubstraten mittels eines Co-Diffusionsprozesses
JP2017183648A (ja) * 2016-03-31 2017-10-05 帝人株式会社 ドーパント組成物、ドーパント注入層、ドープ層の形成方法、及び半導体デバイスの製造方法
CN105913896B (zh) * 2016-06-29 2017-12-26 东莞珂洛赫慕电子材料科技有限公司 一种低温固化电极浆料的制备方法
CN108063179B (zh) * 2017-12-20 2019-05-31 清华大学 一种纳米晶多孔块体硅热电材料及其制备方法
CN109860032A (zh) * 2019-03-07 2019-06-07 常州时创能源科技有限公司 含硼掺杂剂浆料及其应用
CN111490128A (zh) * 2019-10-22 2020-08-04 国家电投集团西安太阳能电力有限公司 一种n-pert双面电池氧化硅/氮化硅叠层膜的制备方法
CN111261729B (zh) * 2019-12-31 2022-03-29 上海匡宇科技股份有限公司 一种掺杂用硅浆料、制备方法及硅片的掺杂方法

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US20120280183A1 (en) 2012-11-08
CN103649011B (zh) 2016-07-13
WO2012151422A1 (en) 2012-11-08
CN103649011A (zh) 2014-03-19
JP2014522564A (ja) 2014-09-04
US9156740B2 (en) 2015-10-13

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