TW201234444A - Peeling system, peeling method, and computer storage medium - Google Patents

Peeling system, peeling method, and computer storage medium Download PDF

Info

Publication number
TW201234444A
TW201234444A TW100129958A TW100129958A TW201234444A TW 201234444 A TW201234444 A TW 201234444A TW 100129958 A TW100129958 A TW 100129958A TW 100129958 A TW100129958 A TW 100129958A TW 201234444 A TW201234444 A TW 201234444A
Authority
TW
Taiwan
Prior art keywords
substrate
processed
peeling
wafer
cleaning
Prior art date
Application number
TW100129958A
Other languages
English (en)
Chinese (zh)
Inventor
Osamu Hirakawa
Naoto Yoshitaka
Masataka Matsunaga
Norihiko Okamoto
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of TW201234444A publication Critical patent/TW201234444A/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02057—Cleaning during device manufacture
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
TW100129958A 2010-08-23 2011-08-22 Peeling system, peeling method, and computer storage medium TW201234444A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010185897 2010-08-23
JP2011155996A JP5552462B2 (ja) 2010-08-23 2011-07-14 剥離システム、剥離方法、プログラム及びコンピュータ記憶媒体

Publications (1)

Publication Number Publication Date
TW201234444A true TW201234444A (en) 2012-08-16

Family

ID=45723270

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100129958A TW201234444A (en) 2010-08-23 2011-08-22 Peeling system, peeling method, and computer storage medium

Country Status (3)

Country Link
JP (1) JP5552462B2 (ja)
TW (1) TW201234444A (ja)
WO (1) WO2012026262A1 (ja)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5314057B2 (ja) * 2011-01-07 2013-10-16 東京エレクトロン株式会社 剥離システム、剥離方法、プログラム及びコンピュータ記憶媒体
JP5323867B2 (ja) * 2011-01-19 2013-10-23 東京エレクトロン株式会社 基板反転装置、基板反転方法、剥離システム、プログラム及びコンピュータ記憶媒体
JP2013219328A (ja) * 2012-03-13 2013-10-24 Tokyo Electron Ltd 剥離装置、剥離システム、剥離方法、プログラム及びコンピュータ記憶媒体
JP5777549B2 (ja) * 2012-03-23 2015-09-09 東京エレクトロン株式会社 剥離装置、剥離システム、剥離方法、プログラム及びコンピュータ記憶媒体
JP5830440B2 (ja) * 2012-06-20 2015-12-09 東京エレクトロン株式会社 剥離システム、剥離方法、プログラム及びコンピュータ記憶媒体
JP2014003237A (ja) * 2012-06-20 2014-01-09 Tokyo Electron Ltd 剥離システム、剥離方法、プログラム及びコンピュータ記憶媒体
JP2014044974A (ja) * 2012-08-24 2014-03-13 Tokyo Electron Ltd 剥離装置、剥離システム、剥離方法、プログラム及びコンピュータ記憶媒体
JP5806185B2 (ja) * 2012-09-07 2015-11-10 東京エレクトロン株式会社 剥離システム
JP5909453B2 (ja) * 2013-03-07 2016-04-26 東京エレクトロン株式会社 剥離装置、剥離システムおよび剥離方法
US9865494B2 (en) 2013-05-23 2018-01-09 Nikon Corporation Substrate holding method, substrate holding apparatus, exposure apparatus and exposure method
JP2015088620A (ja) * 2013-10-30 2015-05-07 東京エレクトロン株式会社 剥離システム、剥離方法、プログラム及びコンピュータ記憶媒体

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000150611A (ja) * 1998-11-06 2000-05-30 Canon Inc 試料の処理システム
JP2004063645A (ja) * 2002-07-26 2004-02-26 Enzan Seisakusho:Kk 半導体ウェハの保護部材剥離装置
JP4144563B2 (ja) * 2003-07-11 2008-09-03 ティアック株式会社 ディスク装置
JP2008153337A (ja) * 2006-12-15 2008-07-03 Tokyo Electron Ltd 貼り合せ基板の分離方法、貼り合せ基板の分離装置及びプログラムを記録したコンピュータ読み取り可能な記録媒体
JP2009111406A (ja) * 2008-12-16 2009-05-21 Canon Inc 試料の処理システム

Also Published As

Publication number Publication date
JP2012069915A (ja) 2012-04-05
WO2012026262A1 (ja) 2012-03-01
JP5552462B2 (ja) 2014-07-16

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