TW201226468A - Epoxy resin and resin composition - Google Patents

Epoxy resin and resin composition Download PDF

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Publication number
TW201226468A
TW201226468A TW100141320A TW100141320A TW201226468A TW 201226468 A TW201226468 A TW 201226468A TW 100141320 A TW100141320 A TW 100141320A TW 100141320 A TW100141320 A TW 100141320A TW 201226468 A TW201226468 A TW 201226468A
Authority
TW
Taiwan
Prior art keywords
resin
epoxy resin
resin composition
mass
formula
Prior art date
Application number
TW100141320A
Other languages
English (en)
Chinese (zh)
Inventor
Takeki Shimizu
Teruyoshi Shimoda
Hiroki Taniguchi
Takeshi Arai
Kenzou Onizuka
Original Assignee
Asahi Kasei E Materials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Kasei E Materials Corp filed Critical Asahi Kasei E Materials Corp
Publication of TW201226468A publication Critical patent/TW201226468A/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Die Bonding (AREA)
TW100141320A 2010-11-25 2011-11-11 Epoxy resin and resin composition TW201226468A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010262810 2010-11-25
JP2011243399 2011-11-07

Publications (1)

Publication Number Publication Date
TW201226468A true TW201226468A (en) 2012-07-01

Family

ID=46145735

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100141320A TW201226468A (en) 2010-11-25 2011-11-11 Epoxy resin and resin composition

Country Status (3)

Country Link
JP (1) JPWO2012070387A1 (ja)
TW (1) TW201226468A (ja)
WO (1) WO2012070387A1 (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI457357B (zh) * 2012-10-29 2014-10-21 Plastics Industry Dev Ct 低氯離子含量之環氧樹脂及其製造方法與應用
TWI575016B (zh) * 2015-12-03 2017-03-21 財團法人工業技術研究院 環氧樹脂組成物及包含該組成物之熱介面材料
TWI593768B (zh) * 2012-09-13 2017-08-01 納美仕有限公司 先設置型半導體封裝用膜
TWI828694B (zh) * 2018-05-25 2024-01-11 日商力森諾科股份有限公司 底部填充材、半導體封裝及半導體封裝的製造方法

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016066614A (ja) * 2014-09-18 2016-04-28 積水化学工業株式会社 導電ペースト、接続構造体及び接続構造体の製造方法
JP6216354B2 (ja) * 2015-09-17 2017-10-18 リンテック株式会社 保護膜形成用フィルム
JP6830191B2 (ja) * 2016-07-11 2021-02-17 パナソニックＩｐマネジメント株式会社 エポキシ樹脂組成物、プリプレグ、金属張積層板及びプリント配線板
WO2020227963A1 (en) * 2019-05-15 2020-11-19 Dow Global Technologies Llc Two-component adhesive compositions, articles prepared with same and preparation methods thereof
JP7491741B2 (ja) * 2020-05-27 2024-05-28 住友化学株式会社 エポキシ樹脂組成物及びその硬化物
JPWO2022113523A1 (ja) * 2020-11-24 2022-06-02

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3446731B2 (ja) * 2000-09-26 2003-09-16 松下電工株式会社 エポキシ樹脂組成物及び半導体装置
JP2002194053A (ja) * 2000-12-22 2002-07-10 Shin Etsu Chem Co Ltd 半導体スクリーン印刷封止用液状エポキシ樹脂組成物
JP2002368233A (ja) * 2001-06-07 2002-12-20 Nippon Kayaku Co Ltd 光電変換素子
JP4067916B2 (ja) * 2002-08-26 2008-03-26 新日鐵化学株式会社 液状エポキシ樹脂組成物
JP4066174B2 (ja) * 2003-05-12 2008-03-26 信越化学工業株式会社 液状エポキシ樹脂組成物、フリップチップ型半導体装置及びその封止方法
JP2005306952A (ja) * 2004-04-20 2005-11-04 Japan Epoxy Resin Kk 発光素子封止材用エポキシ樹脂組成物
JP4737364B2 (ja) * 2004-05-18 2011-07-27 信越化学工業株式会社 液状エポキシ樹脂組成物及び半導体装置
JP5057714B2 (ja) * 2006-07-07 2012-10-24 三菱レイヨン株式会社 繊維強化複合材料用エポキシ樹脂組成物および繊維強化複合材料中間体
JP2008094896A (ja) * 2006-10-06 2008-04-24 Sumitomo Bakelite Co Ltd 半導体封止用樹脂組成物及び半導体装置
JP5105974B2 (ja) * 2007-07-03 2012-12-26 日東電工株式会社 光半導体素子封止用エポキシ樹脂組成物およびそれを用いた光半導体装置
WO2010035451A1 (ja) * 2008-09-24 2010-04-01 積水化学工業株式会社 半硬化体、硬化体、積層体、半硬化体の製造方法及び硬化体の製造方法

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI593768B (zh) * 2012-09-13 2017-08-01 納美仕有限公司 先設置型半導體封裝用膜
TWI457357B (zh) * 2012-10-29 2014-10-21 Plastics Industry Dev Ct 低氯離子含量之環氧樹脂及其製造方法與應用
TWI575016B (zh) * 2015-12-03 2017-03-21 財團法人工業技術研究院 環氧樹脂組成物及包含該組成物之熱介面材料
CN106832222A (zh) * 2015-12-03 2017-06-13 财团法人工业技术研究院 环氧树脂组合物及包含该组合物的热界面材料
US10059866B2 (en) 2015-12-03 2018-08-28 Industrial Technology Research Institute Epoxy resin compositions and thermal interface materials comprising the same
TWI828694B (zh) * 2018-05-25 2024-01-11 日商力森諾科股份有限公司 底部填充材、半導體封裝及半導體封裝的製造方法

Also Published As

Publication number Publication date
JPWO2012070387A1 (ja) 2014-05-19
WO2012070387A1 (ja) 2012-05-31

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