TW201224903A - Touch panel - Google Patents
Touch panel Download PDFInfo
- Publication number
- TW201224903A TW201224903A TW100136098A TW100136098A TW201224903A TW 201224903 A TW201224903 A TW 201224903A TW 100136098 A TW100136098 A TW 100136098A TW 100136098 A TW100136098 A TW 100136098A TW 201224903 A TW201224903 A TW 201224903A
- Authority
- TW
- Taiwan
- Prior art keywords
- touch panel
- sensing electrode
- layer
- electrode array
- easy
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
- G06F3/0446—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
- G06F3/0445—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Position Input By Displaying (AREA)
Abstract
Description
201224903 jy/4^pif 六、發明說明: 【發明所屬之技術領域】 本案是有關於反射色度優異的感測(sensor )電極陣 列(array )、使用於投影型靜電容量方式的觸控面板(t〇uch panel)的較佳的感測電極陣列、感測電極陣列的使用方 法、製造方法以及觸控面板。 【先前技術】 一般而言,靜電容量方式的觸控面板是位置輸入裝 置,該位置輸入裝置捕捉人的指尖與導電膜之間的靜電容 量的變化’從而對指尖的位置進行檢測,上述靜電容量方 式的觸控面板有表面型觸控面板與投影型觸控面板。表面 型觸控面板的構造簡單,但難以同時對2個點以上的接觸 (多點觸控(multitouch))進行偵測。另一方面,投影型 觸控面板是多個電極排列為矩陣(matrix)狀而構成,多 具體而έ ’多個第1電極群沿著水平方向排列,隔著絕海 層’多個第2電極群沿著垂直方向排列,從而構成投影君 觸控面板,該投影型觸控面板為如下的構成,即,利則 個第1電極群以及多個第2電極群來依序逐步對容 量變十 進行檢測,藉此,可檢測出多點觸控。 近年來|對於如上所述的觸控面板,多酬控與大』 ::的品求i曰強’正在開發上述投影型的靜電容量方式* Π。逐步使用透明導電體即氧化銦錫(麗⑽Ti 二二二等作為電極材料,但對於大晝面化所需的1 °、、’. ^ 1述電極材料的電阻高,此成為細線化201224903 jy/4^pif VI. Description of the Invention: [Technical Field of the Invention] The present invention relates to a sensor electrode array excellent in reflection chromaticity and a touch panel used in a projection type electrostatic capacitance method ( A preferred sensing electrode array, a method of using the sensing electrode array, a manufacturing method, and a touch panel. [Prior Art] In general, a capacitive touch panel is a position input device that captures a change in electrostatic capacitance between a fingertip of a person and a conductive film to detect the position of the fingertip. The capacitive touch panel has a surface type touch panel and a projection type touch panel. The surface type touch panel has a simple structure, but it is difficult to detect more than two points of contact (multitouch) at the same time. On the other hand, the projection type touch panel is configured such that a plurality of electrodes are arranged in a matrix shape, and more specifically έ 'a plurality of first electrode groups are arranged in the horizontal direction, and a plurality of second layers are interposed. The electrode groups are arranged in the vertical direction to form a projection touch panel, and the projection type touch panel has a configuration in which the first electrode group and the plurality of second electrode groups are gradually changed in capacity. The detection is performed, whereby multi-touch can be detected. In recent years, for the touch panel as described above, the multi-favorite control and the large-sized product are being developed. The above-mentioned projection type electrostatic capacitance method* is being developed. A transparent conductor, indium tin oxide (Lithium (10) Ti 222 or the like, is gradually used as the electrode material, but the resistance of the electrode material of 1 °, '. ^ 1 required for the large-faced surface is high, which becomes thinning.
S 4 201224903 jy/44pif 及觸控面㈣應性的阻礙。為了解決上制題,正在開發 如下的技術,該技術是對金、銀、以及崎的金屬薄膜進 加工,糟由不會被觸控者看到的線寬的導電性細線 來構成電極群(專利文獻1 )。 又,關於利用金屬薄膜時的微妙的金屬色、及光澤對 晝面產生的影響的問題,於專利文獻2中已揭示有對金屬 表面進行黑色化纽的方法,但耐久性不充分。 即便可藉由金屬薄膜的微細加工來形成低電阻的導電 性細線’實際上,亦難以不使金屬細線產生繼或斷裂而 穩定地製造大面積的電極圖Wpattem)。又,如下的問題 或色調變動的問題亦尚未解決,上述問題是指對於觸控面 板形成之後的環境變化,形成的金屬細線會引起遷移 (migration),使觸控面板的響應性下降。 [先前技術文獻] [專利文獻] [專利文獻1]國際專利公開第2010/014683號小冊子 [專利文獻2]日本專利特開2〇〇6_344163號公報 【發明内容】 本考X月疋考慮了如上所述的問題而成的發明,本發明 的目的在於提供如下的觸控面板,該觸控面板即便面積 大,響應性亦優異,且使用有能夠實現多點觸控的金屬細 線電極。又,本發明的目的在於提供如下的觸控面板,該 觸控面板的反射色調於整個晝面中穩定。又,本發明的其 他目的在於提供如下的觸控面板,該觸控面板使用有對於 5 201224903 jy/44pif 高溫高濕等的環境變動表現得穩定的金屬細線電極。又, :目的ΐ於提供如下的觸控面板,該觸控面板 了穩疋地製造’品質穩定且使用有金屬細線電極。 D —種觸控面板,包括第-感難極陣列,該觸控面 ^=徵在於:上述第—❹⑼轉列是將導電性金屬細 色产述感測電極陣列的反射 色度L a b的L為6〜13,a、_〇 7叫5,〇〜丄2。 )如項1所述之觸控面板,其特徵在於:更包括第二 1所述之觸控面板,其特徵在於:於上述已圖 :、、、電性金屬細線與上述透明基板之間具有至少i個 以上的易黏接層。 板為之觸控面板,其龍在於:上述觸控面 败馬静電谷I方式的觸控面板。 5) 一種靜電容量方式的觸控面板,正交地排列 車顺H㈣糾列,該靜電容量方式的觸 歹1,徵在於:配置於觸控者側的第—感測電極陣 透明!=電性金屬細線圖案化而形成於具有祕接層的 e 11^如項1或項5所述之觸控面板,其·在於:上述 ’、匕的導電性金屬細線於觸控面側具有黑化層。 的表7面):二6所述之觸控面板,其特徵在於:上述黑化層 们表面粗棱度〜為〇.15以下。 201224903 jy/44pif ,十、式8^項5所述之靜電容量觸控面板,其特徵在於:上 電極陣列的反射色度L*a*b*的1^643,4.07 〜,b*為如〜… 。.丨 於· L)i項2至項5中任1所述之觸控面板,其特徵在 Ϊ雷第一感測電極陣列的感測電極是包含由上述 細線所形成網格(mesh)的鑽石(dia_d) 上述第二感測電極陣列的感 疋/、構成上述第一感測電極陣列的感測電極相 構造或條狀(bar)構造。 y^1〇i如項2至項5中任—項所述之觸控面板,其特徵 ;田對正父地排列的上述第一感測電極陣列盘第二感 ,電極陣列進行透視時,已圖案化的導電性金屬^線j 個觸控面形成大致均一的格子花紋。 、 、U)如項1或項5所述之觸控面板,其特徵在於··上 述導電ϋ金屬細線疋使用光微影(phGtGlithQgraphy )的方 =,(^祕加)的方法,將金屬薄膜層圖案 化為線寬為1000 nm至8000 nm的細線圖案。 12) 如項1或項5所述之觸控面板,其特徵在於:上 述導電性金屬細線喊度為厚度的2 5倍以上。 13) 如項3或項5所述之觸控面板,其特徵在於:上 述透明基板包含聚_脂,上料黏接層包含聚醋樹脂、 丙烯酸樹脂或細旨賴,於上述錄接層巾添加有交聯劑。 14) 如項13所述之觸控面板,其特徵在於:上述易黏 接層包含第-易黏接層與第二易黏接層,與上述透明基板 7 201224903 39744pif 相接的第-易黏接層包含聚輯脂H黏接層包含兩 稀酸樹脂或胺g旨樹脂。 15) 如項13所述之觸控面板,其特徵在於:上述交聯 劑為噁唑啶(oxazolidine)化合物、環氧化合物、氰 酸醋化合物。 ~ 16) 如項14所述之觸控面板,其特徵在於:上述交聯 劑為噁唑啶化合物、環氧化合物、或異氰酸酯化合物。 [發明的效果] 如以上的§兒明所述,根據本發明的感測電極陣列、感 測電極陣列的使用方法以及觸控面板,可獲得如下的觸控 面板,該觸控面板即便面積大,響應性亦優異,可實現多 點觸控,且對於高溫高濕等的環境變動表現得穩定,而真 可獲得可穩定地製造且品質穩定的觸控面板。 【實施方式】 如上述「發明所欲解決的問題」項所述,本發明是如 下的發明,該發明的目的在於提供如下的觸控面板,該觸 控面板即便面積大’響應性亦優異,且使用有可實現多點 觸控的金屬細線電極,而且上述發明的目的在於提供如下 的觸控面板’該觸控面板的反射色調於整個畫面中穩定, 且對於高溫高濕等的環境變動亦表現得穩定,可穩定地製 造且品質穩定。 以下,詳細地對上述本發明的觸控面板進行說明。再 者,於本說明書中’「〜」是作為如下的意思而被使用,該 意思是包含「〜」則後所揭示的數值作為下限值以及上限 201224903 iy/44pif 值。 圖1(a)、圖i(b)表示第一本發明的觸控面板1〇 六^圖’該圖1 (a)、圖1 (b)例示了多層構成的靜電 ^ =方式觸控面板,該多層構成的靜電容量方式觸控面板 明鉍,1: (a)的上側的觸控者側起,包含:構成觸控面的透 曰材料層16、兼作為絕緣層的黏著層19、第一感測電極陣 ,易黏接層18、透明基板15、兼作為絕緣層的黏著 曰—、第二感測電極陣列12、易黏接層18,、透明基板15,、 黏著f 19',、以及剝離薄膜(film) 17。圖1 (a)、圖!(b) 的鱗層與剝離薄膜是用以使本發明的觸控面板附 像顯示裝置等的要件,且亦可不存在該要件。圖 的構成與圖1 (a)的構成的不同點在於:易黏接層、 Ϊ測電極陣列、以及黏著層呈對稱地積層於透明基板15 的兩個面。 上述圖1 (a)表示將上部電極與下部電極形成於不同 基板上時的較佳構成,® 1⑻表示在—塊透明基 於表背面形成第-感測電極_與第二感測電極陣列時 的季义佳構成。 再,’圖中雖未顯示,但第一感測電極陣列的配置方 。、與第二感測電極陣列的配置方向是設定為隔著透明基 ^而彼此正又地配置,且採料對乡點觸控進行檢測的 成。 以下,依序對上述感測電極中所使㈣材料以及電極 的製造方法進行說明。 201224903 •iy.mpif [透明材料層、透明基板] 上述構成觸控面的透明材料層16、及透明基板15、15, 中所使用的透明的材料可為相同的材料,亦可分別使用不 同的材料,可使用_薄膜(plastic film)、塑膠板、以及 玻璃(glass)板等。較佳為根據各個用途來適當地對層的 厚度進行選擇。上述材料較佳為具有可撓性。 —作為上述塑膠薄膜以及塑膠板的原料,例如可使用聚 ^ _ f ^ ^ ^ Polyethylene Terephthalate > PET ) > ( Polyethylene Naphthalate > PEN) f 的t S曰類’聚乙烯(p〇lyethylene,pE )、聚丙浠 (Polypropylene,PP)、聚苯乙烯、以及乙烯醋酸乙稀酯 〔EthyleneVinylAcetate’EVA)等的聚稀烴類;乙稀系樹 脂;此外,可使用聚碳酸酯(Polycarbonate,PC)、聚醯胺、 聚醯亞胺、丙烯酸樹脂、以及三乙醯纖維素 (Triacetylcellulose,TAC)等。 作為較佳的材料’PET (熔點:258°C)、PEN (溶點: 269°C)、PE (熔點:i35°C)、PP (熔點:163<t)、聚苯乙 烯(溶點:230°C )、聚氯乙烯(熔點:18〇。〇)、聚偏二氣 乙烯(熔點:212。〇或TAC (熔點:29(TC)等的熔點約 為290Ϊ以下的塑膠薄膜或塑膠板較佳,根據光透射性或 加工性等的觀點,pET尤佳。薄膜或板的厚度較佳為5〇 至 300 μιη。 為了防止由觸控引起的污垢、塵土的附著,上述構成 觸控面的透明材料層16亦可設置防污層。又,亦可設置抗 201224903 39744pif 反射層,該抗反射層用以對由外部光線的反射所引起的畫 面的杈糊度進行改良。關於上述增設層,可利用抗反射薄 膜或防眩薄膜的領域中的眾所周知的技術(日本 2005-535934號、日本專利特開2〇〇7_3〇197〇號等)。 、 [易黏接層中所使用的材料與層的形成方法] 本發明的易黏接層18、18'於透明基板上包括一層或二 層易黏接層,於該層中含有黏合劑(binder)樹脂、交聯 劑以及添加劑。 本發明中所使用的黏合劑樹脂並無特別的限制,但可 較佳地使用(a)丙烯酸樹脂、(b)聚胺酯樹脂、(c)聚酯 樹脂、以及(d)橡膠系樹脂等的聚合物(p〇lymer)。曰 (a) 丙烯酸樹脂是以丙烯酸、曱基丙烯酸以及該兩者 的衍生物為成分的聚合物。作為具體性例示,可列舉如下 的聚合物,該聚合物是以丙烯酸、曱基丙烯酸、曱基丙烯 酸曱醋、丙烯酸乙酯、丙烯酸丁酯、2_丙烯酸乙基己酯、 丙烯酸醯胺、丙烯腈、以及羥基丙烯酸酯等為主成分,對 可與上述主成分共聚的單體(例如苯乙烯、二乙烯基苯等) 進行共聚而成。 (b) 聚胺酯樹脂是於主鏈中包括胺基曱酸酯鍵結的聚 合,的總稱二且通常是藉由聚異氰酸酯與多元醇的反應而 獲付。聚異氰酸酿有TDI、MDI、NDI、TODI、HDI、以 及IPDI荨,多元醇有乙二醇、丙二醇、丙三醇、以及己三 醇等。又,亦可使用如下的聚合物作為本發明的異氰酸酯, 該聚合物是對藉由聚異氰酸酯與多元醇的反應而獲得的聚 11 201224903 39744pif 胺醋聚合物進行鏈延長處理,使分子量增大而成。關於以 所述的聚異紐⑽、多元醇以及鏈延長處理,例如已揭 示於「聚細旨樹脂手冊」(岩田敬治編,日刊工業新聞社, 昭和62年發行)中。 ,(c)聚酯樹脂是於主鏈中包括酯鍵結的聚合物的總 稱’且通常是藉由多紐與多元醇的反應而獲得。多緩酸 例如有富馬酸、亞曱基丁二酸、己二酸、癸二酸、對苯二 曱酉夂以及間等,多元醇例如可列舉上述醇。關 於聚酉日樹脂以及該聚δ旨樹脂的原料,例如已揭示於「聚酿 樹脂手冊」(滝山榮一郎著,日刊工業新聞社,昭和 發行)中。 …、酬縣丁—烯、4乙烯.丁二稀共聚物、〕 fr二參_腈共聚物、苯⑽C乙稀基苯: ΐ系樹二—i丙烯腈共聚物、以及聚氯丁二締等。關則 果(奴)朝倉書店,昭和42年發行)中。 作為本發明中所使用的交聯劑,例如 I。一物、三聚氛胺化合物、以及異;St: 化合用峨化合物,可列舉多聚環I 化合物等早氧化合物、以及縮水甘油月 聚縮水ί、“為環氧化合物,例如可列舉山梨糖醇 蝴H醇聚縮水甘_、季戊四醇聚縮7S 4 201224903 jy/44pif and touch surface (four) should be hindered. In order to solve the above problems, the following technology is being developed, which is a process for processing metal films of gold, silver, and saki, and forming a group of electrodes by a line of conductive thin wires that are not visible to the touch person ( Patent Document 1). Further, in the case of the problem of the influence of the subtle metallic color and the gloss on the kneading surface by the use of the metal thin film, Patent Document 2 discloses a method of blackening the metal surface, but the durability is insufficient. Even if a low-resistance conductive thin wire can be formed by microfabrication of a metal thin film, it is difficult to stably produce a large-area electrode pattern without causing the metal thin wire to be broken or broken. Further, the following problems or problems of color tone change have not been solved. The above problem means that the metal thin wires formed cause migration and the responsiveness of the touch panel is lowered due to environmental changes after the formation of the touch panel. [Prior Art Document] [Patent Document 1] [Patent Document 1] International Patent Publication No. 2010/014683 (Patent Document 2) Japanese Patent Laid-Open Publication No. Hei. No. Hei. The invention has been made in view of the above problems, and an object of the present invention is to provide a touch panel which is excellent in responsiveness even when the area is large, and uses a metal thin wire electrode capable of realizing multi-touch. Further, it is an object of the present invention to provide a touch panel in which the reflected hue of the touch panel is stabilized throughout the entire surface. Further, another object of the present invention is to provide a touch panel using a metal thin wire electrode which is stable against environmental changes such as 5 201224903 jy/44pif high temperature and high humidity. Further, the purpose of the present invention is to provide a touch panel which is stably manufactured with a stable quality and using a metal thin wire electrode. D-type touch panel, comprising a first-inductive hard-to-pole array, wherein the touch surface is characterized in that: the first - (9) transition is a conductive metal thin color to produce a reflection chromaticity L ab of the sensing electrode array L is 6 to 13, and a, _〇7 is called 5, 〇~丄2. The touch panel of the first aspect, further comprising the touch panel of the first aspect, characterized in that: between the above-mentioned, and the thin metal wires and the transparent substrate; At least i or more easy adhesion layers. The board is a touch panel, and the dragon is: the touch panel of the above-mentioned touch surface. 5) A touch panel of electrostatic capacitance type, which is arranged orthogonally to the H (four) alignment, and the touch panel 1 of the electrostatic capacitance method is characterized in that: the first sensing electrode array disposed on the toucher side is transparent! The touch panel according to Item 1 or 5, wherein the conductive metal thin wires of the above-mentioned 匕 are blackened on the touch surface side. Floor. The touch panel of the second aspect is characterized in that the surface roughness of the blackened layer is less than or equal to 15.15. 201224903 jy/44pif, the electrostatic capacitance touch panel according to item 5, wherein the reflection chromaticity L*a*b* of the upper electrode array is 1^643, 4.07~, b* is as follows. ~... The touch panel of any one of item 2 to item 5, wherein the sensing electrode of the first sensing electrode array of the first layer is a mesh formed by the thin line. Diamond (dia_d) The sense of the second sensing electrode array described above, the sensing electrode phase configuration or the bar configuration of the first sensing electrode array. The touch panel of any one of clauses 2 to 5, characterized in that: the second sensing of the first sensing electrode array disk arranged in the right parent, when the electrode array is fluoroscopy, The patterned conductive metal lines j touch faces form a substantially uniform lattice pattern. The touch panel according to Item 1 or 5, characterized in that the conductive thin metal wire is made of a light film (phGtGlithQgraphy), and a metal film is used. The layer is patterned into a thin line pattern having a line width of 1000 nm to 8000 nm. The touch panel according to Item 1 or Item 5, wherein the conductive metal thin line has a thickness of 25 times or more. The touch panel of item 3 or 5, wherein the transparent substrate comprises a poly-lipid, and the adhesive layer comprises a polyester resin, an acrylic resin or a fine-grained layer, A crosslinking agent is added. The touch panel of claim 13, wherein the easy-adhesive layer comprises a first easy-adhesive layer and a second easy-adhesive layer, and the first easy-adhesive layer is connected to the transparent substrate 7 201224903 39744pif The bonding layer comprises a polyurethane grease layer comprising a dilute acid resin or an amine resin. The touch panel according to Item 13, wherein the crosslinking agent is an oxazolidine compound, an epoxy compound, or a cyanide compound. The touch panel according to Item 14, wherein the crosslinking agent is an oxazolidine compound, an epoxy compound, or an isocyanate compound. [Effect of the Invention] As described in the above, according to the sensing electrode array, the method of using the sensing electrode array, and the touch panel of the present invention, the following touch panel can be obtained, and the touch panel has a large area. It is also excellent in responsiveness, can achieve multi-touch, and is stable against environmental changes such as high temperature and high humidity, and it is really possible to obtain a touch panel that can be stably manufactured and has stable quality. [Embodiment] The present invention is the following invention as described in the above-mentioned "Problems to be Solved by the Invention", and an object of the present invention is to provide a touch panel which is excellent in responsiveness even when the area is large. Moreover, a metal thin wire electrode capable of realizing multi-touch is used, and the above invention aims to provide a touch panel in which the reflection color of the touch panel is stable throughout the entire screen, and environmental changes such as high temperature and high humidity are also It is stable in performance, stable in manufacturing and stable in quality. Hereinafter, the touch panel of the present invention described above will be described in detail. In the present specification, "~" is used as the following meaning, which means that the numerical value disclosed after "~" is used as the lower limit value and the upper limit 201224903 iy/44pif value. 1(a) and 1(b) show a first embodiment of the touch panel of the present invention. FIG. 1(a) and FIG. 1(b) illustrate a multi-layered electrostatic ^= mode touch panel. The multi-layered electrostatic capacitance type touch panel is characterized in that: (a) the upper side of the toucher side includes: a transparent material layer 16 constituting the touch surface, and an adhesive layer 19 serving as an insulating layer, The first sensing electrode array, the easy adhesion layer 18, the transparent substrate 15, the adhesive layer which also serves as an insulating layer, the second sensing electrode array 12, the easy adhesion layer 18, the transparent substrate 15, and the adhesion f 19' , and the release film 17 . Figure 1 (a), figure! The scale layer and the release film of (b) are required for attaching the touch panel of the present invention to a display device or the like, and may not exist. The configuration of the drawing differs from the configuration of Fig. 1(a) in that the easy-adhesion layer, the electrodeposition electrode array, and the adhesive layer are symmetrically laminated on both faces of the transparent substrate 15. Fig. 1(a) shows a preferred configuration when the upper electrode and the lower electrode are formed on different substrates, and ® 1(8) indicates that the first sensing electrode is formed on the front and back surfaces based on the front and back electrodes. Ji Yijia constitutes. Further, although not shown in the drawing, the arrangement of the first sensing electrode array is also shown. And the arrangement direction of the second sensing electrode array is set to be positively arranged with each other across the transparent substrate, and the material is detected for the touch of the rural area. Hereinafter, the (four) material and the method of manufacturing the electrode in the above-described sensing electrode will be described in order. 201224903 • iy.mpif [Transparent material layer, transparent substrate] The transparent material used in the transparent material layer 16 and the transparent substrate 15 and 15 constituting the touch surface may be the same material, or may be differently used. For the material, a plastic film, a plastic plate, a glass plate, or the like can be used. It is preferred to appropriately select the thickness of the layer in accordance with each use. The above materials are preferably flexible. - As a raw material of the above plastic film and plastic plate, for example, t 曰 曰 'polyethylene (p〇lyethylene) of poly _ f ^ ^ Polyethylene Terephthalate > PET ) > ( Polyethylene Naphthalate > PEN) f can be used. Polyethers such as pE), Polypropylene (PP), polystyrene, and Ethylene Vinyl Acetate 'EVA; Ethylene resins; in addition, polycarbonate (Polycarbonate, PC) can be used. Polyamide, polyimine, acrylic resin, and triacetyl cellulose (TAC). Preferred materials are 'PET (melting point: 258 ° C), PEN (melting point: 269 ° C), PE (melting point: i35 ° C), PP (melting point: 163 < t), polystyrene (melting point: 230 ° C), polyvinyl chloride (melting point: 18 〇. 〇), polyvinylidene gas (melting point: 212. 〇 or TAC (melting point: 29 (TC), etc., melting point of about 290 的 plastic film or plastic plate Preferably, pET is particularly preferable from the viewpoints of light transmittance, workability, etc. The thickness of the film or the sheet is preferably from 5 Å to 300 μm. In order to prevent adhesion of dirt and dust caused by touch, the above-mentioned touch surface is formed. The transparent material layer 16 may also be provided with an antifouling layer. Further, an anti-reflective layer against the 201224903 39744pif layer may be provided for improving the gradation of the picture caused by reflection of external light. A well-known technique in the field of an anti-reflection film or an anti-glare film can be used (Japanese Patent Laid-Open Publication No. 2005-535934, Japanese Patent Laid-Open Publication No. Hei No. Hei No. Hei No. Hei No. Hei. Forming method of the layer] The easy-adhesion layer 18, 18' of the present invention is included on the transparent substrate One or two layers of an adhesive layer containing a binder resin, a crosslinking agent, and an additive. The binder resin used in the present invention is not particularly limited, but can be preferably used (a) a polymer such as an acrylic resin, (b) a polyurethane resin, (c) a polyester resin, and (d) a rubber-based resin. The cerium (a) acrylic resin is acrylic acid, methacrylic acid, and the like. The derivative of the present invention is a polymer of the component. Specific examples thereof include the following polymers: acrylic acid, methacrylic acid, decyl acrylate vinegar, ethyl acrylate, butyl acrylate, and 2-acrylic acid. Ethylhexyl ester, decylamine acrylate, acrylonitrile, and hydroxy acrylate are main components, and a monomer copolymerizable with the above main component (for example, styrene or divinylbenzene) is copolymerized. The polyurethane resin is a polymerization comprising an amine phthalate linkage in the main chain, and is generally obtained by the reaction of a polyisocyanate with a polyol. The polyisocyanate is TDI, MDI, NDI, TODI. , HDI, and IPDI荨, the polyol is ethylene glycol, propylene glycol, glycerol, hexanetriol, etc. Further, as the isocyanate of the present invention, the polymer is used for the polyisocyanate and the polyol. The poly 11 201224903 39744pif amine vinegar polymer obtained by the reaction is subjected to a chain extension treatment to increase the molecular weight. With regard to the above-mentioned polyisoprene (10), polyol, and chain extension treatment, for example, it has been disclosed in "Polyfine resin". Handbook (edited by Iwata Katsuyuki, Nikkan Kogyo Shimbun, published in Showa 62). (c) Polyester resin is a generic term for polymers that include ester linkages in the main chain' and is usually multi-nuclear and multi-component Obtained by the reaction of an alcohol. The polyacid is, for example, fumaric acid, sulfinic acid, adipic acid, sebacic acid, terephthalic acid, and the like. Examples of the polyhydric alcohol include the above alcohols. The raw materials of the poly-resin resin and the poly-resin resin are disclosed, for example, in the "Hand Brewing Resin Handbook" (written by Daisuke Eiyama, Nikkan Kogyo Shimbun, Showa). ..., Ding County butyl-ene, 4 ethylene. Dibutyl diene copolymer,] fr di-n-acrylonitrile copolymer, benzene (10) C ethylene benzene: lanthanide di-i acrylonitrile copolymer, and polychloroprene Wait. Guan Shiguo (slave) Asakura Bookstore, issued in Showa 42). As the crosslinking agent used in the present invention, for example, I. a compound, a trimeric amine compound, and a different; St: compound hydrazine compound, examples thereof include an early oxygen compound such as a polycyclic ring compound, and a glycidol polycondensate, and are "epoxy compounds, for example, sorbose. Alcohol, H-alcohol, polycondensation, and pentaerythritol condensation
S 12 201224903 39744pif 甘油醚、二丙三醇聚縮水甘油醚、三縮水甘油基三(2_羥乙 基)異氰酸酯、丙三醇聚縮水甘油醚、以及三羥曱基丙烷聚 縮水甘油醚;作為二環氧化合物,例如可列舉新戊二醇二 縮水甘油醚、1,6-己二醇二縮水甘油醚、間苯二酚二縮水 甘油醚、乙二醇二縮水甘油醚、聚乙二醇二縮水甘油醚、 丙一醇二縮水甘油謎、聚丙二醇二縮水甘油_、以及聚丁 二醇二縮水甘油醚;作為單環氧化合物,例如可列舉烯丙 基環氧丙基醚、2-乙基己基縮水甘油醚、苯基縮水甘油醚; 作為縮水甘油胺化合物,可列舉]^3,:^,,:^,-四縮水甘油基_ 間二甲苯二胺、1,3-雙(N,N-縮水甘油基胺基)環己烷等。 本發明中所使用的噁唑啉化合物較佳為含有噁唑啉基 的聚合物。可藉由含有加成聚合性噁唾琳基的單體單獨製 作此種聚合物,或可藉由與其他單體聚合而製作此種聚合 物。含有加成聚合性„惡嗤琳基的單體可列舉 乙稀基_4_曱基一、2_^ 噁唑啉、2-異丙烯基-2-噁唑啉、2-異丙烯基_4_甲基噁唑 琳以及2-異丙稀基-5-乙基-2-"惡唾琳等,可使用上述一種 含有加成聚合性噁唑啉基的單體,或可使用2種以上的含 有加成聚合性η惡σ圭琳基的单體的混合物。其中,2_異丙稀 土 2惡唾琳於工業方面亦易於獲得,因此較佳。其他單體 只要是可與含有加成聚合性噁唑啉基的單體共聚的單體, 則無限制,例如可列舉丙烯酸烷基酯、曱基丙烯酸烷基酯 (烷基為曱基、乙基、η_丙基、異丙基、η丁基、異丁基、 t 丁基、2-乙基己基、及環己基)等的y (〆夕)夕"儿酸 13 201224903 jy/44pif 工只丁小類;丙烯酸、甲基丙烯酸、亞曱基丁二酸、馬來 酸、富馬酸、巴豆酸、苯乙蝉磺酸及其鹽(鈉鹽'鉀鹽、 銨鹽、及第三胺鹽等)等的不飽和羧酸類;丙烯腈、曱基 丙烯腈等的不飽和腈類;丙烯醯胺、曱基丙烯醯胺、N_= ^丙烯醯胺、N-烷基曱基丙烯醯胺、N,N_二烷基丙烯醯 胺、及Ν,Ν·二烷基曱基丙烯酸酯(烷基為曱基、乙基、n_ =基、異丙基、η-丁基、異丁基、t_丁基、2乙基己基及 %己基等)等的不飽和醯胺基類;乙酸乙烯酯、丙酸乙烯 酿等的乙烯賴;甲基乙烯_、乙基乙稀轉的乙稀賴; 伸乙基、丙烯等的α-烯烴類;氣乙烯、偏二氣乙烯、及氟 J;烯等的含豳素α,Ρ-不飽和單體類;以及苯乙烯、α_甲基 笨乙烯等的α,β-不飽和芳香族單體等,可使用上述一種單 體’或可使用2種以上的單體。 、本發明中所使用的三聚氰胺化合物較佳為如下的化合 =以及上述化合物的混合物’上述化合物是使作為低級醇 的甲醇、乙醇、及異丙醇等與對三聚氰胺與甲酸進行縮合 =得的羥曱基三聚氰胺衍生物發生反應而醚化所得。作: I甲基二聚氰胺衍生物,例如可列舉單經甲基三聚氰胺二 ^經甲基二聚氰胺、二經曱基三聚氰胺、四經甲基三聚氰 胺五羥甲基三聚氰胺、以及六羥曱基三聚氰胺等。 —作為本發明中所使用的異氰酸酯化合物,例如可列舉 :笨二異氰酸酯、二苯基甲烷_4,4,_二異氰酸酯、間氣 =酸'六亞甲基♦二異氰義、W二異氰酸醋己燒、 本一異氰酸酯與己三醇的加成物、曱苯二異氰酸酯與三S 12 201224903 39744pif glyceryl ether, diglycerol polyglycidyl ether, triglycidyl tris(2-hydroxyethyl)isocyanate, glycerol polyglycidyl ether, and trishydroxypropylpropane polyglycidyl ether; Examples of the diepoxy compound include neopentyl glycol diglycidyl ether, 1,6-hexanediol diglycidyl ether, resorcinol diglycidyl ether, ethylene glycol diglycidyl ether, and polyethylene glycol. Diglycidyl ether, propanol diglycidyl mystery, polypropylene glycol diglycidyl _, and polybutylene glycol diglycidyl ether; as the monoepoxy compound, for example, allyl epoxypropyl ether, 2- Ethylhexyl glycidyl ether, phenyl glycidyl ether; as the glycidylamine compound, exemplified by ^3, :^,::^,-tetraglycidyl_m-xylylenediamine, 1,3-double ( N,N-glycidylamino)cyclohexane or the like. The oxazoline compound used in the present invention is preferably a oxazoline group-containing polymer. Such a polymer may be produced by a monomer containing an addition polymerizable oxalate group, or may be produced by polymerization with other monomers. Examples of the monomer having an addition polymerization property of oxalinyl group include ethyl 4-amino group 1, 2 oxazoline, 2-isopropenyl-2-oxazoline, 2-isopropenyl _4. _Methyloxazole and 2-isopropyl-5-ethyl-2-" oxalate, etc., may use one of the above-mentioned monomers containing an addition polymerizable oxazoline group, or two types may be used. The above mixture containing a monomer having an addition polymerizable η σ 圭 圭 圭 。 。 。 。 。 。 。 。 2 2 2 异丙 异丙 异丙 异丙 异丙 异丙 异丙 异丙 异丙 异丙 异丙 异丙 异丙 异丙 异丙 异丙 异丙 异丙 异丙 异丙 异丙 异丙 异丙 异丙The monomer copolymerized with the polymerized oxazoline group is not limited, and examples thereof include an alkyl acrylate and an alkyl methacrylate (alkyl group is an alkyl group, an ethyl group, an η-propyl group, and an isopropyl group). y (〆 ) ) 夕 夕 夕 夕 夕 夕 夕 夕 夕 夕 夕 夕 夕 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 Unsaturation of acrylic acid, sulfhydryl succinic acid, maleic acid, fumaric acid, crotonic acid, styrene sulfonic acid and its salts (sodium salt 'potassium salt, ammonium salt, and third amine salt, etc.) Carboxylic acid; propylene Unsaturated nitriles such as nitrile and mercapto acrylonitrile; acrylamide, mercapto acrylamide, N_= propylene amide, N-alkyl mercapto decylamine, N,N-dialkyl decyl amide And hydrazine, bis-dialkyl methacrylate (alkyl group is fluorenyl, ethyl, n_ = group, isopropyl, η-butyl, isobutyl, t-butyl, 2-ethylhexyl and Unsaturated guanamine group such as % hexyl or the like; ethylene lysate such as vinyl acetate or vinyl propionate; methyl ethylene _, ethyl ethene ethylene ruthenium; Olefins; gas-containing ethylene, ethylene-terminated ethylene, and fluorine-J; alkenes-containing alizarin-α, anthracene-unsaturated monomers; and α,β-unsaturated aromatics such as styrene and α-methyl stupidene As the monomer or the like, one type of the above monomer may be used or two or more types of monomers may be used. The melamine compound used in the present invention is preferably a combination of the following = and a mixture of the above compounds. Alcohol methanol, ethanol, and isopropanol react with hydroxymercapto melamine derivative obtained by condensation of melamine with formic acid The obtained: as a methyl melamine derivative, for example, methyl melamine, methyl melamine, dimercapto melamine, tetramethyl melamine pentamethylol melamine, and Hexahydroxyindole melamine, etc. - As the isocyanate compound used in the present invention, for example, stupid diisocyanate, diphenylmethane_4,4,_diisocyanate, methane = acid 'hexamethylene ♦ 2 Isocyanide, W diisocyanate hexane, an adduct of monoisocyanate and hexane triol, indole diisocyanate and three
S 14 201224903 39744pif 羥曱基丙烷的加成物、多元醇改性二苯基曱烷_4,4,_二異氰 酸酯、碳二酿亞胺改性二笨基曱烧_4,4,_二異氰酸酯、異佛 爾酮二異氰酸酯、1,5-萘二異氰酸酯、3,3,_二曱笨基^,4, 一異氰酸酯、3,3 —曱基二笨基曱烷_4,4L二異氰酸酯、 及間苯基二異氰酸酯等。 ..........“〜抑牧/百叼叉聯劑的添加重而言,相: 於黏合劑,較佳為以1 wt%〜i0〇 wt%的範圍來進行添加, 5 wt%〜50 wt%的範圍更佳。若添加量少於i加%,則 Ϊ =會^ 了面’若添加量超過 桩爲可,根f各個目的而將各_加舰用於本發明的易黏 〜^落L ^ =本專物㈣_3635號的段落27 落:二::為射二 =微粒子、上述專利的段 滑劑'以及上述專利的段落3 = = == = 種界面活性劑等。 "I怖性改良用的各 包含對:接性,易黏接層亦可 於雙層構成的情形時,若=-易黏接層。 明基板相接的第-易黏接層包;下的構成,即,與透 含丙稀酸樹脂或胺s旨樹脂,則容易表日=二易黏接層包 易黏接層與第二易輪層中^易轉性。第-化合物、環氧化合物、或異 聯劑較佳為射啶 接層成為最外層,因此,由於第二易黏 15 201224903 39744pif 、第一易黏接層的厚度較佳為30 nm以上且為3〇〇 nm 以下,更佳為65 nm以上且為i5〇 nm以下。於上述第一 易黏接層的厚度不足30 nm的情形時,透明基板與第i層 的黏接性有可能不充分。若上述第—易雜層的厚度超^ 3〇〇 nm ’則第1層的表面狀態有可能會變差,因此不佳。 第二易黏接層的厚度並無特別的限制,但為了一面確 保優異的透雜’-面實現易減性,上述第二易黏接層 的厚度較佳為10nm以上且為5〇〇〇nm以下,更佳為2〇腕 以上且為1500 nm以下。若第2層的厚度不足10 nm,則 與上層之_雜性有可能不充分,另—方面,若厚度超 過5000 nm,則表面狀態有可能會變差。 、、較佳為藉由塗佈來設置本發明的易黏接層 '然而,形 成塗佈層的方法並無制的限制,可使轉式塗佈機咖 coater)塗佈、斜板式塗佈機(slidec⑽塗佈等的眾所 周知的方法。再者,當形成第一層與第二層時,可使用相 同的方法,亦可使用不_方法。又,當形成第二層時, ^與第-層同時進行塗佈之後,使該第—層與第二層乾 燥’亦可料-層崎塗佈且使該第—層乾狀後,對第 二層進行塗佈。 —可將不具有導·的黏接舰用於兼作為絕緣層的黏 ί層!9 _、19 °存在多種黏接劑,其中,可使用丙稀酸樹脂 系、,%氧樹脂系、苯齡樹脂系、以及乙稀基樹脂系等。用 以形成層的方法並無特別的限制,可使用網版 (screen ) 印刷法等。S 14 201224903 39744pif Addition of hydroxymercaptopropane, polyol modified diphenyl decane _4,4, _ diisocyanate, carbon dinitride modified bismuth 曱 4, 4, _ 2 Isocyanate, isophorone diisocyanate, 1,5-naphthalene diisocyanate, 3,3,-dioxaphenyl, 4, monoisocyanate, 3,3-nonyldiphenyldecane-4,4L diisocyanate And m-phenyl diisocyanate. .......... "In addition to the weight of the addition of the grazing/Baiyu cross-linking agent, the phase: is preferably added in the range of 1 wt% to i0 〇 wt% of the binder, The range of 5 wt% to 50 wt% is better. If the addition amount is less than i plus %, then Ϊ = will be the surface 'If the addition amount exceeds the pile, the root f is used for each purpose. The invention is easy to stick ~ ^ L ^ = this special (4) _3635 paragraph paragraph 27 fall: two:: shot two = microparticles, the above-mentioned patent paragraph slip agent ' and paragraph 3 of the above patent = = = = = species interface activity <I ** terror improvement for each of the pairs: the connection, the easy adhesion layer can also be used in the case of double layer, if =- easy to bond layer. The first substrate is connected to the first easy adhesion The layered package; the lower composition, that is, the resin containing the acrylic resin or the amine sulphate, is easy to turn on the surface of the easy-adhesive layer and the second easy-wheel layer. - the compound, the epoxy compound, or the dissociating agent is preferably the outermost layer of the pyridine layer, and therefore, the thickness of the first easy-adhesion layer is preferably 30 nm or more and 3 due to the second easy adhesion 15 201224903 39744pif 〇〇nm below, more 65 nm or more and i5 〇 nm or less. When the thickness of the first easy-adhesion layer is less than 30 nm, the adhesion between the transparent substrate and the ith layer may be insufficient. The thickness of the first layer may be deteriorated and the thickness of the first layer may be deteriorated. Therefore, the thickness of the second easy-adhesion layer is not particularly limited, but in order to ensure excellent penetration. The thickness of the second easy-adhesion layer is preferably 10 nm or more and 5 〇〇〇 nm or less, more preferably 2 〇 or more and 1500 nm or less. If the thickness of the second layer is less than 10 If the thickness is more than 5,000 nm, the surface state may be deteriorated. In other words, it is preferable to set the easy adhesion of the present invention by coating. Layer 'However, there is no limitation on the method of forming the coating layer, and it is possible to apply a coating coater or a slant plate coater (slidec (10) coating, etc.). When using one layer and the second layer, the same method can be used, or the method can be used. In the second layer, after the coating is applied simultaneously with the first layer, the first layer and the second layer are dried, and the layer can be coated and the layer can be dried. Coating - The adhesive ship without the guide can be used as the adhesive layer of the insulating layer! 9 _, 19 ° There are many kinds of adhesives, among which acrylic resin can be used, % oxygen Resin type, benzene age resin type, and ethylene base resin type. The method for forming a layer is not particularly limited, and a screen printing method or the like can be used.
16 201224903 3y/44pif 圖2 (a)〜圖2 (d)表示第二本發明的觸控面板1〇 的剖面圖,圖2 (a)表示本發明的第一感測電極陣列u 形成於透明基板15上的情形,圖2 (b)表示第一感測電 極陣列11與第二感測電極陣列12以與圖丄(a)、圖i (b) 相同的方式積層的情形。再者,圖中雖未顯示,但第一感 測電極陣列的配置方向、與第二感測電極陣列的配置方向 疋δ又疋為隔著透明基板而彼此正交地配置,且採用可實現 多點觸控的構成。 圖2 (c)以及圖2 (d)表示如下的情形,即,於圖2 (b)的2個層的電極上設置有構成觸控面板所必需的層, 且升>成有與圖1 (a)及圖1 (b)相同的觸控面板。 上述第二本發明中所使用的[透明材料層、透明基 板]、[易黏接層]的材料以及形成方法可使用第一本發明的 項中所說明的材料以及形成方法。 [反射色度] 本發明的感測電極陣列的導電性金屬層具有固有的反 射色’因此’必須儘可能地將反射色調整為中性色 (neutral) ’較佳為對反射色度進行調整,使L*a*b*表色系 統(color specification system)中的 L*為 6〜13,a*為-0.7 〜1.5,b*為-5.0〜1.2。 更佳為,L*為6〜12,a*為-0.6〜1.2,b*為-4.8〜1.0。 再者’ L a b表色系統是國際照明委員會(Commission16 201224903 3y/44pif FIGS. 2(a) to 2(d) are cross-sectional views showing a second touch panel of the present invention, and FIG. 2(a) shows that the first sensing electrode array u of the present invention is formed in a transparent manner. In the case of the substrate 15, FIG. 2(b) shows a case where the first sensing electrode array 11 and the second sensing electrode array 12 are laminated in the same manner as in the drawings (a) and (i). Furthermore, although not shown in the figure, the arrangement direction of the first sensing electrode array and the arrangement direction 疋δ of the second sensing electrode array are arranged orthogonally to each other across the transparent substrate, and The composition of multi-touch. 2(c) and 2(d) show a case where the layers necessary for the touch panel are provided on the electrodes of the two layers of FIG. 2(b), and the thickness of the touch panel is as shown in FIG. 1 (a) The same touch panel as Figure 1 (b). The material of the [transparent material layer, transparent substrate], [easy adhesion layer] used in the second invention described above and the method of forming the same can be used as described in the first aspect of the invention. [Reflected chromaticity] The conductive metal layer of the sensing electrode array of the present invention has an inherent reflected color 'so 'must adjust the reflected color to a neutral color as much as possible'. It is preferable to adjust the reflected chromaticity. Therefore, L* in the L*a*b* color specification system is 6 to 13, a* is -0.7 to 1.5, and b* is -5.0 to 1.2. More preferably, L* is 6 to 12, a* is -0.6 to 1.2, and b* is -4.8 to 1.0. Furthermore, the 'L a b color system is the International Commission on Illumination (Commission)
Internationale de l’Eclairage,CIE)於 1976 年製定的表色 方法,本發明中的L*值、a*值、以及b*值是根據JIS-Z8729 : 17 201224903 jy /44pif 1994所規定的方法來進行測定所得的值。JIS_Z8729的測 定方法有利用反射的測定方法、以及利用透射的測定方 法,但於本實施形態中,使用利用反射來進行測定所得的 值。 關於L a b表色系統中的l*值、a*值、以及值,眾 所周知,L值表示明度,a*值與b*值表示色相與彩度。具 體而言,若a值的符號為正,則表示紅色的色相,若〆值 的符號為負,則表示綠色的色相。若b*值的符號為正,則 $黃色的*色相,若b*值的符號為負,則為藍色的色相。又, a值與b值均是輯值越大’則表示顏色的彩度越大且顏 ^越鮮豔,絕對值越小,則表示彩度越小。於本發明中: a值自清晰的紅色系朝儘可能小的值變更,且b*值自清晰 的黃色朝微不足道的藍色變更,藉此,意圖獲得易於識別 的觸控面板。測定方法的詳情揭示於實例的項中。 [感測電極陣列的構造] 圖3是對本發明的第一感測電極陣列u進行說明 圖,利用2根導電性細線,沿著乂方向將正交格子狀的網 格予以連結,構成一根電極。此種電極沿著Y方向排列, 形成=極陣列。此處,關於X方向、γ方向,將製作觸# 面板時的觸控畫面的縱方⑦定義為X方向,將橫方向定^ 為Υ方向。圖3的網格構造為正方格子且外形亦大致= 方形,自電極方向所見的外形為菱形。於上述網格的外= m成有由i表示的導電性雜線。目4是對本發明 的第一感測電極陣列12進行說明的圖,利用2根導電性細Internationale de l'Eclairage, CIE) The colorimetric method established in 1976. The L* value, the a* value, and the b* value in the present invention are according to the method specified in JIS-Z8729: 17 201224903 jy /44pif 1994. The value obtained by the measurement was performed. The measurement method of JIS_Z8729 includes a measurement method using reflection and a measurement method using transmission. However, in the present embodiment, a value obtained by measurement using reflection is used. Regarding the l* value, the a* value, and the value in the L a b color system, it is well known that the L value represents brightness, and the a* value and b* value represent hue and chroma. Specifically, if the sign of the a value is positive, it represents the hue of red, and if the sign of the 〆 value is negative, it represents the hue of green. If the sign of the b* value is positive, then the yellow *color phase, if the sign of the b* value is negative, is the blue hue. Further, both the a value and the b value are larger the value, and the greater the chroma of the color and the brighter the color, the smaller the absolute value, the smaller the chroma. In the present invention, the value of a changes from a clear red color to a value as small as possible, and the b* value changes from a clear yellow to a negligible blue color, whereby an easily recognizable touch panel is intended. Details of the assay method are disclosed in the examples. [Structure of Sense Electrode Array] FIG. 3 is an explanatory view of the first sensing electrode array u of the present invention, and two orthogonal conductive lines are used to connect orthogonal grid-shaped grids along the 乂 direction to form one electrode. Such electrodes are arranged in the Y direction to form a = pole array. Here, regarding the X direction and the γ direction, the vertical direction 7 of the touch screen when the touch panel is created is defined as the X direction, and the horizontal direction is defined as the Υ direction. The grid structure of Fig. 3 is a square lattice and the shape is also roughly square, and the shape seen from the electrode direction is a diamond shape. The outer = m of the above grid is formed with a conductive miscellaneous line represented by i. The fourth embodiment is a diagram for explaining the first sensing electrode array 12 of the present invention, using two conductive thin
S 18 201224903 3y/44pif 線,沿著丫杨將正交格子_網料 與第一感測電極陣列u相同。 連、、'。,除此以外, 列進測電極陣列與第二感測電極陣 性細線的大致均-的格;子級於控面’形成有導電 石槿1i、、文。感測電極的部分通稱為鑽 石構w錢於餘之間且隔著電 不與電極導通的導電性 」’配置有 未配詈有上、;I·.道啻W* 、、。右在隔著電極的非導電部 反射率、#減電喊i’則由於電極部與料電部的 、…斤射率、以及極小的色調的差異 圖案有可能舍祜丟$丨丨m ,L 邱等電4的 〜二:ΐ 配置不導通的細線i。圖3 圖的不V通的細線i被記載為孤立 上述細線i另外連結於電極,且 U仁17了將 电徑1用以對寄生電容進行控制。 2狀的網格構造的導紐細線的較健為05哗 „ Η) μΐη町’更佳為i μιη以上且為8阿以下, 的:寶Γ以上且為5 μιη以下。將上述導電性細線 的線寬汉為0.5叫以上且為10 μιη以下,藉此,可易於加 工且可防止產生干涉條紋。 構成網格的格子的一條邊的長度較佳為⑽叫以上 且為600叫以下,進而較佳為15〇 μιη以上且為35〇 _ 以下。將上述格子的一條邊的長度設為1〇〇 以上且為 600 μιη以下,藉此,可兼顧光的透射性與低電阻值。 為了避免由尚週波驅動引起的導通,隔著電極的非導 電部的寬度較佳為50 μηι以上,更佳為⑽μηι以上,進 而較佳為150 μιη以上且為350 μιη以下。 201224903 感測電極陣列的電極的間隔較佳為2麵以上且為8 mm以下’進而較佳為3 mm以上且為7mm以下。 π η 〜圖8是表不與圖3〜圖5的鑽石構造的電極圖案 不同的帶狀構造的電極圖案的圖。 圖6表示帶狀的第一感測電極陣列,且例示了如下的 情形,即,構成陣列的電極沿著γ方向延伸,且沿著χ J向I,個電極心圖中的〜表示感測電極η的寬 度,^示感測電極之間的非導電性的邊界區域的寬度。 荽γ +電極Γ1為如下的細部構造,即,將4根沿 二伸的直線狀的細線予以連結,且包含多㈣上 根細線予以連結的χ方向的連結線。。以如下的方式 ==線C,,即便4根沿著Υ方向延伸的直線狀 的、、'田線中的任—根細線發靖料的故障,林會損 為感測電極的功能。於上述連結線e的延 二:二 電性的細線的短線i。該單線丨是 ^ ^ 二=’將4根構成―個電極的直線狀的細 丄二::下所揭示的電極之間的距離與細線 圖7表示帶狀的第二感測電極陣列, 情形,即’構成陣列的電極e_j沿著χ方向延伸,且 Μ。圖中的CW表示感測電“ 同。然而,亦可根據觸控面板的縱横比等來將S 18 201224903 3y/44pif line, along the 丫杨, the orthogonal grid _ net material is the same as the first sensing electrode array u. even,,'. In addition, a substantially uniform lattice of the array electrode array and the second sensing electrode array thin line is formed; the sub-level is formed with the conductive sarcophagus 1i, the text on the control surface. The portion of the sensing electrode is generally referred to as a diamond structure and is electrically connected to the electrode without being electrically connected to the electrode, and is disposed without any alignment; I·. 啻W*, . On the right side, the non-conducting portion reflectance across the electrode, #电减叫i', due to the difference between the electrode portion and the material portion, and the difference in color tone, it is possible to lose $丨丨m. L Qiu et al. 4~2:ΐ Configure the thin wire i that is not conductive. The thin line i of the non-V-pass in Fig. 3 is described as being isolated. The thin line i is additionally connected to the electrode, and the U-input 17 uses the path 1 to control the parasitic capacitance. The shape of the thin line of the two-dimensional grid structure is 05哗„Η) μΐη町' is preferably i μιη or more and is 8 or less, and is more than 5 μηη. The line width is 0.5 or more and 10 μm or less, whereby the processing can be easily performed and interference fringes can be prevented. The length of one side of the lattice constituting the mesh is preferably (10) or more and 600 or less. It is preferably 15 〇 μηη or more and 35 〇 _ or less. The length of one side of the lattice is set to 1 〇〇 or more and 600 μηη or less, thereby achieving both light transmittance and low resistance value. The conduction caused by the drive of the sinusoidal wave is preferably 50 μηι or more, more preferably (10) μηι or more, further preferably 150 μm or more and 350 μηη or less across the electrode. 201224903 Electrodes of the sensing electrode array The interval is preferably 2 or more and 8 mm or less, and more preferably 3 mm or more and 7 mm or less. π η to 8 is a strip shape which is different from the electrode pattern of the diamond structure of FIGS. 3 to 5 . Diagram of the constructed electrode pattern Fig. 6 shows a strip-shaped first sensing electrode array, and exemplifies a case where the electrodes constituting the array extend in the γ direction, and along χ J to I, the 〜 in the electrode diagram indicates sensing. The width of the electrode η indicates the width of the non-conductive boundary region between the sensing electrodes. The 荽γ + electrode Γ1 is a detailed structure in which four linear thin lines extending along the two sides are connected, and A line connecting the χ direction in which a plurality of (4) upper thin wires are connected. In the following manner == line C, even if four straight lines extending along the Υ direction, 'any line in the field line' In the failure of the material, the forest will be damaged as the function of the sensing electrode. The extension of the above-mentioned connecting line e: the short line i of the second electric thin line. The single line 丨 is ^ ^ two = '4 pieces constitute an electrode Straight line 2: The distance between the electrodes and the thin line disclosed below Fig. 7 shows a strip-shaped second sensing electrode array, in which case, the electrode e_j constituting the array extends in the z-direction, and Μ. The CW in the figure indicates that the sensing power is the same. However, it can also be based on the aspect ratio of the touch panel, etc.
S 20 201224903 3y/44pif cd予以變更。 、圖8表示對上述第—感測電極陣列與第二感測電極陣 列進行正交配置時的透視圖,於整_控面,形成有導電 性細線的大致均-的格子花紋。於第_感測電極陣列與第 二感測電極陣列未重疊的部分,以將上述第—感測電極陣 列與第二感測電極陣列的間隙予以填埋的方式,配置有連 結線c以及孤立的短線i。以於整個觸控面形成導電性細線 的大致均i格子花紋的方式,配置連結線e以及孤立的 短線1 ’使%·不會產生視認性上的問題。亦可將上述細線i 另外連結於電極,且用以對寄生電容進行控制。、 構成帶狀的感測電極陣列的各個電極的細線、連結部 C的細線、以及孤立短線i的細線的線寬較佳為〇 5叫以 上且為10 _以下,更佳為1叫以上且為8 μηχ以下,進 而較佳為2 μιη g上且為5 μηι以下。將上述細線的線寬設 為〇.5 μΓη以上且為10 μιη以下,藉此’可易於加工且可防 止產生干涉條紋。 構成電極的細線的間隔較佳為1〇〇 _以下,進而較佳為15〇卿以上且為35〜以$: 上述細線的間隔設為100 μπι以上且為6〇〇 μηι以下,藉 此,可兼顧光的透射性與低電阻值。 為了避免由尚週波驅動引起的導通,隔著電極的非導 電部的寬度cd、rd較佳為5〇 μιη以上,更佳為丨⑻叫以 上,進而較佳為150 μιη以上且為35〇 μηι以下。 感測電極陣列的電極的間隔(rw + rd或c w + c d )較佳 21 201224903 jy/^pif 為2 mm以上且為8 mm以下,進而較佳為3匪以上且為 7 mm以下。 圖9 (a)、圖9 (b)是於作為本發明的觸控面板的形 態的圖1 (a)及圖1 (b)、圖2 (c)及圖2⑷的第一感 測電極陣列11與第二感測電極陣列12的觸控者側表面設 置有黑化層2 0及2 0,的圖。圖9 ( b )㈤第二感測電極陣列 的黑化層設置於易黏接層與電極陣列之間。 於本發明中,黑化層是為了實現如下的目的而設置的 層,上述目的例如為使由形成導電性金屬細線的導電性金 屬所具有的金屬綺產生的著色、高反射率利起的觸控 面板晝面賴糊度緩和;或防止導電性金制腐姓或遷 移。黑化層的顏色較佳為可實質上被識別為黑色的顏色, 但只要可抑制金屬光澤,則,林—定必須為純黑色:根據 上述目的’黑化層的位置較佳為處於與導電性金屬層相接 的觸控者側。根據上述觀點,與圖9⑻的第二感測電極 陣列的黑化層相比較,® 9 (a)的第二感測電極陣列的黑 化層的位置構成在防止腐Ιά或遷移的方面更佳。 [感測電極的材料] 以下,對可形成本發明的第一感測電極及第二感測 極的導電性材料進行說明。 〜、 、先别使用ΙΤΟ等的具有光透射性的導電性材料作為 構成感測電極的材料,但本發明的感測電極利用1心m以 下的導電性細線’因此’必須使用電阻比先前的ITO等的 電阻更低的材料’且較佳為使用導電性高的金顧合金。 Ο 22 201224903 ^y/44pif 作為此種金屬,例如可列舉銅、銀、金、纟 紹、鈷、铑、鉉、鐵、釘、H 、‘巴錄、錫、 銅 佳 鉍、銻、以及鉛等。上述金屬中 ’·,‘、鈮、鈕、鈦、 銅、銀.、金、鉑、鈀、鎳、錫、鋁 变吳的硯點, '呂乂及迠些金屬的合金較 當利用上述金屬或合金來形成電極時,可 A)〜C)所揭示的材料與方法。於本發下的 的材料與方法尤佳。 A)與B) A)金屬箔或薄膜的利用。 當用作薄膜時,首先,藉由真 (sputtering)法、離子錢〇 '蒸鍍法 '濺鍍 哎刺用供厶太々入e# P g)法、以及電鑛法等’ #的貼合等,於基材上形成上述金屬 或合金的金屬薄膜。該金屬薄膜 这至屬 但例如為刚nm至_ 艮定, 以下的圖案化而形成網格電極。當藉由光巧施 Ttf)絲紅述鳴_時,於金屬_上形成 用顯影液來顯影,藉此,形成光阻膜的網格圖案。藉由= ί ί來對上述光阻膜的網格圖案進行#刻,將光阻^予以 二除去,藉此,軸包含細金屬線 、 光阻劑絲成上述網格圖案時,網版 ^版(抑職)印刷、以及_ (祕⑻#的方法 ===圖案印刷至金屬薄膜上,藉由侧液來對金 屬相中的光阻劑包覆部以外的部分進行則,將光阻膜 23 201224903 jy/44pif 予以剝離,藉此,形成金屬細線的網格圖案。 B)藉由包含導電性的奈米(職〇)粒子的墨水w) (或漿料(paste))來印刷上述網格圖案的方法。 導電性奈絲子除了可使訂述金屬的微粒子之外, 亦可使用碳―)。導電性奈米粒子較佳為金、銀、把、 始、銅、碳、或包含上述金屬的混合物的粒子。奈米粒子 的平均粒徑為2叫下,較佳為細咖至· nm,在形成 網格圖案的方面,粒㈣先前的« (mi瞻〇粒子的粒 子較佳。可使用網版印刷法或凹版印刷法來印 墨水(或聚料)所含的導電材料亦可並非為金屬粒子 而是導電性纖維。於本案巾,包含金觀(wife)、被稱 奈米線(皿⑽wire)的纖維狀的物質、中空構造的管(如“)、 以及奈米管(_tube)細,稱為導電性纖維。金 米線的平均短轴長度(有時稱為「平均短軸直徑」、「平二 直徑」)幸交佳為io〇nm以下,更佳為lnm〜5〇nm,進而 較佳為10 mn〜4〇 nm,尤佳為ls nm〜35伽。當使 電性纖維來形成導電層時,例如可將日本 二 2009-215594、日本專利特開2〇〇9·24麵日本專利^ 2009- 299162、日本專利特開2〇1〇 84173、日本專利特 2010- 871〇5、以及日本專利特開2〇1〇 86714所揭示的= 加以組合來形成上述導電層。 C)方法’該方法是使用照片中所使用的齒化銀照 感光材料’賴材料實施網格圖案曝光之後,進行顯影、 24 201224903 jy/H^pir 定影處理,利用顯影銀來獲得導電性的細線圖案。 本毛月中的獲得導電性的細線圖案的方法根據感光材 料與顯影處1的形態,包含如下麟的3個形態。 (1)形態:對不包含物理顯影核的感光性_化銀黑白 感光材料進行化學顯影或_影,使金屬銀部形成於該感 光材料上。 (2 )形態:對在鹵化銀乳劑層中包含物理顯影核的感 光性_化銀黑自感光材料進行溶解物理顯影,使金屬銀部 形成於該感光材料上。 (3 )形態:使不包含物理顯影核的感光性鹵化銀里白 感光材料、與具有包含物理顯影核的非感光性層的顯像片 (sheet)重疊,且進行擴散轉印顯影,使金 非感光性麟>}上。 ^ 上述⑴的形態為一體型黑白顯影類型(ty 於 感光材料上戦光透射性導電膜等的透紐導電性膜。辑 得的顯影銀,化學㈣銀或_景彡銀,祕細絲㈤她二 的比表面積高,於後續的電鑛或物理顯影過財 對於上述(2)的形態而言,於曝光部中,物理= 近緣的自化絲子溶㈣沈積於顯影核上,藉此, 材料上形成光透雜導電性料的透紐導電性膜。、、、 的形態亦為—體型黑白顯影類型。顯影作用為t ^ 的析出作用,因此,活性高,但顯影銀為ί表 面積小的球形。 钓比表 對於上述(3)的形態而言,於未曝光部中,自化銀粒 25 201224903 jy/4*pif 子溶解且擴散,從而沈積於顯像片上的顯影核上,藉此, 於顯像片上形成光透射性導電性膜等的透光性導電性膜。 上述(3)的形態為所謂的分離類型(separatetype),且為 自感光材料將顯像片予以剝離來使用的形態。 任一個形態均可選擇負(negative)型顯影處理以及反 轉顯影處理中的任一種顯影(於擴散轉印方式的情形時, 使用直接正(autopositive)型感光材料作為感光材料,藉 此’可實現負型顯影處理)。 此處所謂的化學顯影、熱顯影、溶解物理顯影、以及 擴散轉印顯影表示如業界通常使用的用語所述的意思,且 解說於照片化學的一般教科書例如菊地真一著的「照片化 學」(共立出版社,1955年發行)、C.E K Mees編的「攝影 (The Theory 〇f Photographic Processes -4thed.)」(Mcmillan社,1977年發行)。本案為與液體處理 相關的m但亦可參考制熱顯影^式作為其他顯影方 式的技術。例如,可應用日本專利特開2004 184693號、 曰本專利特開2004-334077號、以及日本專利特開 2005-010752號的各公報所揭示的技術。 又,關於本發明中所使用的材料與導電性圖案的製 法,可使用網格狀的電磁波屏蔽(shidd)膜的發明即曰本 專利特開2__352G73號的揭轉技術、以及靜電容量方 式的觸控面板的發明即日本專利特願2__265467號的揭 示與技術。 [感測電極的形成方法]S 20 201224903 3y/44pif cd will be changed. Fig. 8 is a perspective view showing a state in which the first sensing electrode array and the second sensing electrode array are arranged orthogonally, and a substantially uniform lattice pattern of conductive thin wires is formed on the entire control surface. Between the first sensing electrode array and the second sensing electrode array, the gap between the first sensing electrode array and the second sensing electrode array is buried, and the connecting line c is isolated and isolated. Short line i. In order to form a substantially uniform lattice pattern of the conductive thin wires over the entire touch surface, the connection line e and the isolated short line 1' are disposed so that %· does not cause a problem in visibility. The thin wire i may be additionally connected to the electrode and used to control the parasitic capacitance. The line width of the thin wires constituting each electrode of the strip-shaped sensing electrode array, the thin line of the connecting portion C, and the thin line of the isolated short line i are preferably 〇5 or more and 10 Å or less, more preferably 1 or more. It is 8 μηχ or less, more preferably 2 μιη g and 5 μηι or less. The line width of the above-mentioned fine line is set to 〇.5 μΓη or more and 10 μηη or less, whereby the processing can be easily performed and interference fringes can be prevented. The interval between the thin wires constituting the electrode is preferably 1 Å or less, and more preferably 15 Å or more and 35 Å to $: The interval between the thin lines is 100 μπι or more and 6 〇〇 μηι or less. Both light transmission and low resistance can be considered. In order to avoid conduction caused by the peripheral wave drive, the widths cd and rd of the non-conductive portion interposed between the electrodes are preferably 5 〇 μm or more, more preferably 丨 (8) or more, and further preferably 150 μm or more and 35 〇 μηι. the following. The interval (rw + rd or c w + c d ) of the electrodes of the sensing electrode array is preferably 21 201224903 jy / ^ pif is 2 mm or more and 8 mm or less, and more preferably 3 Å or more and 7 mm or less. 9(a) and 9(b) are first sensing electrode arrays of Figs. 1(a) and 1(b), 2(c) and 2(4) as a form of the touch panel of the present invention. 11 and the touch-sensing side surface of the second sensing electrode array 12 are provided with a blackening layer 20 and 20. Figure 9 (b) (5) The blackening layer of the second sensing electrode array is disposed between the easy-adhesion layer and the electrode array. In the present invention, the blackening layer is a layer which is provided for the purpose of achieving the following object, for example, a coloring and a high reflectance which are caused by a metal crucible of a conductive metal forming a conductive metal thin wire. The control panel can be moderately relaxed; or the conductive gold can be prevented from surging or migrating. The color of the blackening layer is preferably a color which can be substantially recognized as black, but as long as the metallic luster can be suppressed, the forest must be pure black: according to the above purpose, the position of the blackening layer is preferably in a conductive state. The toucher side of the metal layer is connected. According to the above point of view, the position of the blackening layer of the second sensing electrode array of the ® 9 (a) is better in preventing corrosion or migration than the blackening layer of the second sensing electrode array of FIG. 9 (8). . [Material of Sensing Electrode] Hereinafter, a conductive material which can form the first sensing electrode and the second sensing electrode of the present invention will be described. The light-transmitting conductive material such as tantalum is used as the material constituting the sensing electrode. However, the sensing electrode of the present invention uses a conductive thin wire of 1 m or less. A material having a lower electric resistance such as ITO is preferable to use a gold alloy having high conductivity. Ο 22 201224903 ^y/44pif Examples of such metals include copper, silver, gold, bismuth, cobalt, ruthenium, osmium, iron, nail, H, 'bar, tin, copper, bismuth, and lead. Wait. In the above metals, '·, ', 铌, button, titanium, copper, silver, gold, platinum, palladium, nickel, tin, aluminum become the point of Wu, 'Lv乂 and some of the metal alloys use the above metals When materials or alloys are used to form electrodes, the materials and methods disclosed in A) to C) can be used. The materials and methods under this issue are particularly preferred. A) and B) A) Utilization of metal foil or film. When used as a film, first, by the sputtering method, the ion 〇 'vapor deposition method', the sputtering method, the # 々 e e e e e e e e e e e e 电 电 电 电 电 电 电 电 电 电 电A metal thin film of the above metal or alloy is formed on the substrate. The metal thin film is, for example, just in the range of nm to _, and the following patterning forms a grid electrode. When the blush is expressed by the light, the developing solution is formed on the metal _, whereby a mesh pattern of the photoresist film is formed. The grid pattern of the photoresist film is engraved by = ί ί, and the photoresist is removed. Thus, when the shaft includes a thin metal wire and a photoresist wire into the above grid pattern, the screen is ^ Edition (inhibition) printing, and _ (secret (8) # method === pattern printing onto the metal film, by the side liquid to the part of the metal phase other than the photoresist coating portion, the photoresist The film 23 201224903 jy/44pif is peeled off, thereby forming a mesh pattern of metal thin wires. B) Printing the above by using ink w) (or paste) containing conductive nano particles (paste) The method of grid pattern. Conductive nanowires can also use carbon-) in addition to the fine particles of the metal. The conductive nanoparticle is preferably gold, silver, ruthenium, copper, carbon, or a particle containing a mixture of the above metals. The average particle size of the nanoparticles is 2, preferably fine to nm, in terms of forming a grid pattern, the particles (4) of the previous « (mi particles of the particles are preferred. Screen printing can be used) Or the gravure printing method may not be a metal particle but a conductive fiber contained in the ink (or the material). In the case of the case, it includes a wife, which is called a nanowire (10) wire. Fibrous substances, hollow-structured tubes (such as "), and nanotubes (_tube) are thin, called conductive fibers. The average short-axis length of the golden rice noodle (sometimes called "average short-axis diameter", " The diameter of the flat two"" is preferably below io 〇 nm, more preferably from 1 nm to 5 〇 nm, further preferably from 10 mn to 4 〇 nm, and particularly preferably from ls nm to 35 gamma. When electrical fibers are formed In the case of the conductive layer, for example, Japanese Patent No. 2009-215594, Japanese Patent Laid-Open No. Hei No. 2, No. 9-24, Japanese Patent No. 2009-299162, Japanese Patent Laid-Open No. Hei No. Hei No. Hei. And the combination of the disclosed Japanese Patent Laid-Open Publication No. Hei. No. Hei. The method is to perform development using a dentifrice photosensitive material used in a photograph, and then perform development, 24 201224903 jy/H^pir fixing treatment, and obtain a conductive thin line pattern by developing silver. The method of obtaining the conductive fine line pattern in the present month includes three forms of the following lining depending on the form of the photosensitive material and the developing portion 1. (1) Morphology: Chemical development or photographic of a photosensitive _ silver black-and-white photosensitive material not containing a physical development nucleus, and a metal silver portion is formed on the photosensitive material. (2) Form: The photosensitive sensitized silver black-containing photosensitive material containing a physical development nucleus in the silver halide emulsion layer is subjected to dissolution physical development, and a metallic silver portion is formed on the photosensitive material. (3) Form: a photosensitive silver halide white photosensitive material not containing a physical development core is superposed on a sheet having a non-photosensitive layer containing a physical development core, and diffusion transfer development is performed to make gold Non-photosensitive Lin >}. ^ The form of the above (1) is an integrated black-and-white development type (ty-transparent conductive film such as a light-transmitting conductive film on a photosensitive material. The developed silver, chemical (four) silver or _ jing silver, secret silk (five) she The specific surface area of the second is high, and the subsequent electrowinning or physical development is too rich. For the form of the above (2), in the exposed portion, the physical = near-edge self-chemically soluble (4) is deposited on the developing core, whereby The conductive conductive film of the light-transmitting conductive material is formed on the material, and the form is also a black-and-white development type. The development effect is a precipitation of t ^ , and therefore, the activity is high, but the developed silver is a ί surface area. Small spherical shape. For the form of the above (3), in the unexposed portion, the self-forming silver particles 25 201224903 jy/4*pif are dissolved and diffused, thereby depositing on the developing core on the developing sheet, Thereby, a light-transmitting conductive film such as a light-transmitting conductive film is formed on the developing sheet. The form of the above (3) is a so-called separate type, and the developing sheet is peeled off from the photosensitive material. The form of use. Any form is optional Any of the negative type development processing and the reverse development processing (in the case of the diffusion transfer method, an autopositive type photosensitive material is used as the photosensitive material, whereby 'negative development processing can be realized' The chemical development, thermal development, dissolved physical development, and diffusion transfer development referred to herein mean the meanings as used in the industry, and are explained in general textbooks of photochemistry, such as "Photo Chemistry". (Kyoritsu Press, issued in 1955), "The Theory 〇f Photographic Processes -4thed." edited by CE K Mees (Mcmillan, issued in 1977). This case is related to liquid handling but can also be referenced. The heat-developing type is used as a technique of other development methods. For example, the techniques disclosed in the respective publications of Japanese Patent Laid-Open No. 2004-184693, Japanese Patent Laid-Open No. Hei No. 2004-334077, and Japanese Patent Laid-Open No. Hei No. 2005-010752 can be applied. Further, as for the method for producing the material and the conductive pattern used in the present invention, a grid-like electromagnetic wave shielding (shidd) film can be used. The invention is the disclosure and technology of the invention of Japanese Patent Application No. 2__265467, which is the disclosure of the Japanese Patent Application No. 2__352G73, and the invention of the electrostatic capacitance type touch panel. [Method of Forming Sensing Electrode]
S 26 201224903 丧者 '欵硎電極及第 '埶測電極的形 判个%、明的第 成方法進行說明。 金屬$_膜(上述Γ);0作(:)形二面對利用 =說明。圖1〇 (a)是兼作為絕緣層的透4明:::方 接者在該薄膜的表面設置金屬 、表面 ⑻)。設置薄μ的方牛右亩Λ #層21 (圖10 離3 3 ^法_真空製膜法°賤鍵法或 ^ ^ I too ^ ^1 ^ ^ ^ *於膜厚超過500⑽的情形時,可使 i無電解電錄法,能夠以低成本來 銅、述i1)所揭示的材料’但較佳為使用銀、 =金。可使職法等作為薄層的形 薄,則相1仇、他方法。形成的金屬的薄層的厚度越 ^貝I越不易剝離,因此較佳,但若上述金屬的薄層的厚 ^専’則電阻會變高,作為觸控面板的響應性會變差,因 2上述金屬的薄層的厚度較佳為αι μιη以上且為3叫 泛更佳為0.2 μιη以上且為2 μιη以下。為了防止剝離, ==字「線寬/厚度」的比率設為2.5以上,進而較佳為 财上述比率設為4以上。 接著,於上述已形成的金屬薄膜上形成光阻膜, j (根據圖3、圖4、圖6、以及圖7等,該光單為產生 遮罩翻的構件)祕光,且_顯影絲齡彡,藉此, 27 201224903 jy/44pif 硬化的光_的網格圖案。藉由⑽液來對上述網格 祕刻’將硬化的光阻臈予以剝離除去,藉此,形 細金屬線的網格圖案(圖10((〇)。圖10⑷的 表不形成的網格圖案的導電性細線。 於上述已形成的感測電極上設置包覆層32 (圖 (d))。於本發明中’將上述包覆層稱為黑化層。該黑化 曰/、有不使金屬或合金的金屬光澤顯眼的視覺性功能,且 具有因防止金屬騎及防止遷移而使耐久性提高的功能。 乂下另外對上述黑化層(包覆層)的材料進行說明。黑 化層(包覆層)的厚度較佳為5 μιη以下,更佳為3叫以 下,尤佳為0.2 μιη以上且為2 μιη以下。 、接著、,除去上述黑化層(包覆層)的不將電極細線予 以包覆的視認部上的黑化層,藉此,可形成視認性、财久 性優異的網格圖案的電極(圖10 (e))。 當使用包含導電性的奈米粒子的墨水(或喂料)時(上 述B)) ’可將上述網格圖案直接印刷至兼作為絕緣層的透 明基體層。於印刷之後,當根據需要,於進行熱處理等而 形成的金屬圖案上設置黑化層時,可進行心_同的處 理〇 [黑化層中所使用的材料與層的形成方法] 構成本發明的黑化層的主成分為選自鎳、鉻、鋅、錫、 以及銅中的元素的至少一種化合物即可,可具有導電性, 亦可不具有導電性。除了本發明的方法之外,、亦可板人地 使用染色法等的方法。 ^ °S 26 201224903 The method of determining the % and the number of the 'electrode and the 'measured electrode' is described. Metal $_film (above Γ); 0 for (:) shape two face use = description. Fig. 1A (a) is a transparent view of the insulating layer::: The contactor is provided with a metal and a surface (8) on the surface of the film. Set the thin μ of Fang Niu right acre Λ #层21 (Fig. 10 from 3 3 ^ method _ vacuum film forming method ° 贱 key method or ^ ^ I too ^ ^ ^ ^ ^ ^ * when the film thickness exceeds 500 (10), It is possible to use i electroless magnetic recording method, and it is possible to use copper at a low cost, and the material disclosed in the above i1) 'but preferably silver or = gold. If the job law is used as a thin layer, it will be a method of hatred. It is preferable that the thickness of the thin metal layer formed is less likely to be peeled off, but if the thickness of the thin metal layer is higher, the electric resistance becomes higher, and the responsiveness as a touch panel is deteriorated. The thickness of the thin layer of the above metal is preferably α1 μm or more and 3 or more is preferably 0.2 μm or more and 2 μm or less. In order to prevent peeling, the ratio of the "= line width/thickness" of the == word is set to 2.5 or more, and it is more preferable that the ratio is set to 4 or more. Next, a photoresist film is formed on the formed metal thin film, j (according to FIG. 3, FIG. 4, FIG. 6, and FIG. 7, etc., the light sheet is a member that generates a mask turning), and the _developing wire Age, by this, 27 201224903 jy/44pif hardened light _ grid pattern. The (10) liquid is used to peel off the hardened photoresist 对 from the above-mentioned mesh, thereby forming a mesh pattern of thin metal wires (Fig. 10 ((〇). The mesh of the table shown in Fig. 10 (4) is not formed) a conductive thin line of the pattern. A coating layer 32 is provided on the above-described formed sensing electrode (Fig. (d)). In the present invention, the above-mentioned coating layer is referred to as a blackening layer. A function that does not make the metal luster of the metal or alloy conspicuous, and has a function of improving durability by preventing metal riding and preventing migration. The material of the blackening layer (cladding layer) is also described below. The thickness of the layer (coating layer) is preferably 5 μm or less, more preferably 3 or less, and particularly preferably 0.2 μm or more and 2 μm or less. Next, removing the blackening layer (cladding layer) The blackened layer on the viewing portion that does not cover the electrode thin wires can form an electrode having a mesh pattern excellent in visibility and longevity (Fig. 10(e)). When using a conductive nano-conductor When the ink (or feed) of the particle (B) above) can directly print the above grid pattern To a transparent substrate layer which also serves as an insulating layer. After the printing, when a blackening layer is provided on the metal pattern formed by heat treatment or the like as needed, the same treatment can be performed 〇 [Used in the blackening layer] Method for forming material and layer] The main component constituting the blackening layer of the present invention may be at least one compound selected from the group consisting of nickel, chromium, zinc, tin, and copper, and may or may not have conductivity. In addition to the method of the present invention, a method such as a dyeing method may be used for the person to be employed. ^ °
S 28 201224903 wmpif 作為本發明中的黑化層的較佳的積層方法的例子,可 列舉電鍍處理與化學蝕刻(Chemicaletching)法。 電鍍處理只要是眾所周知的被稱為黑色電鍍的處理, 則無特別的限制,可列舉黑色鎳電鍍、黑色鉻電鍍、黑色 Sn-Ni合金電鍍、Sn_Ni_Cu合金電鍍、以及黑色辞鉻酸鹽 (chromate)處理等作為例子。具體而言,可使用日本化 學產業(股)製造的黑色電鍍浴(商品名為nikka BLACK,Sn-ni合金系)、(股)金屬化學工業製造的黑色 電鏡浴(商品名為黑鉻(eb〇ny chrome) 85系列,Cr系)、 DIPSOL (股)性的鉻酸鹽劑(商品名為ZB_541,鍍鋅黑 色鉻酸鹽劑)。電鍍法可為無電解電鍍、電解電鍍中的任一 種方法,可採用緩和的條件,亦可為高速電鍍。關於電鍍 厚度,只要可識別出黑色,則厚度並無限定,但通常的電 鍛厚度較佳為5 μιη以下。 於本發明中,亦可對導電性金屬部的一部分進行氧化 處理或硫化處理而形成黑色部。例如於導電性金屬部為銅 的情形時,作為銅表面的黑化處理劑的例子,可使用 MELTEX (股)製造的商品名:ENPLATE ΜΒ438Α、Β ; 三菱瓦斯化學(股)製造的商品名:nPE-900 ; MEC (股) 製造的商品名:MEC etch BOND BO-7770V ; ISOLATE 化 學研究所製造的商品名:COPPER BLACK CuO、COPPER BLACK CuS、及硒系的 COPPER BLACK ηο·65 等。除了 上述之外’當然例如亦可對硫化物進行處理而產生硫化氫 (H2S) ’將銅的表面黑化為硫化銅(CuS)。對於上述處理 29 201224903 jy/44plf :二:i可識別為黑色,則厚度並無限定,但通常上述 每度較佳為3 μιη以下,進而較佳 於本發明♦,為下枯佳為〇.2μιη〜2μιη。 色产,較電極陣列獲得所期望的反射 色度4c佳如2個步驟以上的 如較佳為於氧化處理之後進行還原處理,:=利: 鈉等的氧化劑的心絲: 處理之後’ 含有二曱胺慨、爛氫 等的還原綱溶液來進行處理。馬林 表面變粗μ來增加黑色調,後者心二/疋藉由使 禮—认主工此吨2更者疋將因則者處理而變得不 穩疋的表硫舒以财化,藉此,以。 心面較佳為具有某程度的表面_度 —r叫以下,更佳為_叫〜0.14 μιη。右Ra超過〇.15叫,則耐磨性或密著性有 因此不佳。 —Ra的測定法大致分為呈直線地利用觸針來對面進行 測定的方法(觸針)、以及光學性地進行測定的方法(光切 斷法、光線反射法),亦可上述_方料的任 法來進行測定。 當導電性細線的線寬狹窄,且無法確保測定 區域 (嶋)時,除了將曝光區域擴大之外,以相同的操 對已製作的導電性固體部分進行測定,且計算出Ra。 對應於使用觸控面板的影像顯示裝置的大型化&,亦要 求觸控面板本身實現大型化。對敎魏,電極必須實現 低電阻化,並且電極之間的寄生電容必須降低,因此,若 201224903 39744pif 將擬(dummy)電極配置於電極之間,則有效果 疋不與感測電極連接祕立 結而形成抽出I碰仃㈣,亦可將孤域線予以連 [實例] 明 示的具體例 以下’列舉本發明的實例來更具體地對本發明進 再者,在不脫離本發明的宗旨的範圍内將 以下的實例所示的材料、使用量、比例、處理内 處理順序等予以變更。因此,不應根據以下所 來限定性地對本發明的範圍進行解釋。 首先,對本發明的實例中的評價方法進行說明。 [反射色度的測定法] 將樣本(sample)放置於英國陶瓷研究協會(BritishS 28 201224903 wmpif As an example of a preferable lamination method of the blackening layer in the present invention, a plating treatment and a chemical etching method can be exemplified. The plating treatment is not particularly limited as long as it is a well-known treatment called black plating, and examples thereof include black nickel plating, black chrome plating, black Sn-Ni alloy plating, Sn_Ni_Cu alloy plating, and black chromate. Processing and the like as an example. Specifically, a black electroplating bath (trade name: nikka BLACK, Sn-ni alloy system) manufactured by Nippon Chemical Industry Co., Ltd., and a black electron microscope bath manufactured by the metal chemical industry (trade name: black chrome (eb) can be used. 〇ny chrome) 85 series, Cr series), DIPSOL (stock) chromic acid agent (trade name ZB_541, galvanized black chromate agent). The electroplating method may be any one of electroless plating and electrolytic plating, and may be a mild condition or a high-speed electroplating. Regarding the plating thickness, the thickness is not limited as long as black can be recognized, but the usual wrought thickness is preferably 5 μm or less. In the present invention, a part of the conductive metal portion may be subjected to an oxidation treatment or a vulcanization treatment to form a black portion. For example, when the conductive metal portion is copper, as an example of the blackening treatment agent for the copper surface, a product name: ENPLATE ΜΒ 438 Α, Β manufactured by MELTEX (trade name); a product name manufactured by Mitsubishi Gas Chemical Co., Ltd.: nPE-900 ; MEC (stock) Manufactured under the trade name: MEC etch BOND BO-7770V; ISOLATE Chemical Institute's trade name: COPPER BLACK CuO, COPPER BLACK CuS, and selenium-based COPPER BLACK ηο·65. In addition to the above, it is of course possible to treat the sulfide to produce hydrogen sulfide (H2S) to blacken the surface of the copper to copper sulfide (CuS). For the above-mentioned process 29 201224903 jy / 44plf : 2: i can be recognized as black, the thickness is not limited, but usually the above is preferably 3 μηη or less per degree, and further preferably ♦ ♦ for the present invention. 2μιη~2μιη. Color production, better than the electrode array to obtain the desired reflection chromaticity 4c, such as two steps or more, preferably after the oxidation treatment, reduction treatment: ==: Sodium oxide and other oxidant core: after treatment 'contains two Treatment with a reducing solution such as guanamine or rotten hydrogen. Marin's surface becomes thicker to increase the black tone, and the latter's heart 2/疋 is made by the ritual-recognition of the main worker, and the ton is more stable. This, to. Preferably, the heart surface has a certain degree of surface _ degree - r is the following, more preferably _ is ~ 0.14 μιη. If the right Ra exceeds 〇.15, the wear resistance or the adhesion is not good. - The measurement method of Ra is roughly divided into a method (a stylus) for measuring the surface by a stylus in a straight line, and a method for optically measuring (light cutting method, light reflection method), or the above-described method. The method of doing the measurement. When the line width of the conductive thin wires was narrow and the measurement region (嶋) could not be secured, the prepared conductive solid portion was measured by the same operation except that the exposure region was enlarged, and Ra was calculated. Corresponding to the enlargement of the image display device using the touch panel, it is also required to increase the size of the touch panel itself. For Wei Wei, the electrode must be low-resistance, and the parasitic capacitance between the electrodes must be reduced. Therefore, if 201224903 39744pif places a dummy electrode between the electrodes, it is effective and does not connect with the sensing electrode. The formation of the extraction I contact (4), and the connection of the orphanal line may also be exemplified. [Examples] The following examples are given to enumerate the examples of the present invention to more specifically the present invention without departing from the scope of the present invention. The materials, usage amounts, ratios, processing internal processing order, and the like shown in the following examples are changed. Therefore, the scope of the invention should not be construed as being limited by the following. First, the evaluation method in the example of the present invention will be described. [Measurement of reflection chromaticity] Place the sample in the British Ceramic Research Association (British)
Ceramic Research Association,BCRA)黑瓷碑(tile)(光 澤版)上,自0。方向進行照射,對以45。方向所接受的光 的分光反射率進行測定。 再者’較佳的瓷磚為阪田油墨股份有限公司(Sakata INX ENG.CO.,LTD.)製造的BCRA黑瓷磚(光澤版),關 於黑瓷磚的反射色度,I;為3.6,a*為-0.9,b*為_0.6。可使 用格靈達麥克貝斯(Gretag Macbeth )製造的SpectlO Eye u 作為反射濃度計。 [耐磨性的評價] 利用極細纖維的布即東麗(T0RAY )製造的 「TORAYSEE」,以500 g的負荷來往返地對樣本進行1〇 31 201224903 iy/44pif 次擦拭。以如下的5個階段來對擦拭之後的樣本進行評價。 1 :完全無變化。 2:擦痕微弱且少量。 3 :擦痕微弱,且整體上產生擦痕。 4:擦痕強且少量。 5 :擦痕強,且整體上產生擦痕。 [密著的評價] 利用交叉切割(cross cut)法來對樣本的密著性進行 評價’以如下的5個階段來對接下來的樣本進行評價。 1 :完全無剝離。 2 :於5%以下的部分中有剝離。 3 :於超過5%且為1〇%以下的部分中有剝離。 4 :於超過1〇°/0且為50%以下的部分中有剝離。 5 :於超過50%的部分中有剝離。 [表面粗链度Ra的評價] 於試料上設置5 cmx5 cm的固體曝光的區域,使用 MITUTOYO股份有限公司製造的小形表面粗糙度測定機 SURF TEST SJ-301來進行測定。 實例1 [形成有雙層構成的易黏接層的透明基板A的製造] 對厚度為100 μιη的聚對苯二曱酸乙二醇酯(以下記 載為PET)薄膜支持體的兩個面進行電暈 (corona )放電 處理之後,藉由棒式塗佈法來將下述的第1層塗佈液塗佈 至上述兩個面,使上述第i層塗佈液乾燥’從而形成第1Ceramic Research Association, BCRA) Black porcelain monument (light version), from 0. The direction is illuminated, and the pair is 45. The spectral reflectance of the light received in the direction was measured. Furthermore, the preferred tile is the BCRA black tile (glossy version) manufactured by Sakata INX ENG. CO., LTD., and the reflection color of the black tile, I; 3.6, a* is -0.9, b* is _0.6. A SpectlO Eye u made by Gretag Macbeth can be used as a reflection densitometer. [Evaluation of the abrasion resistance] Using the "TORAYSEE" manufactured by Toray (T0RAY), which is a very fine fiber cloth, the sample was subjected to a round trip with a load of 500 g for 1 〇 31 201224903 iy/44pif times. The samples after wiping were evaluated in the following five stages. 1 : No change at all. 2: The scratches are weak and small. 3: The scratches are weak and scratches are generated as a whole. 4: The scratches are strong and small. 5: The scratches are strong and scratches are generated as a whole. [Evaluation of adhesion] The adhesion of the sample was evaluated by a cross cut method. The next sample was evaluated in the following five stages. 1 : No peeling at all. 2: Peeling is in a portion of 5% or less. 3 : Peeling is carried out in a portion exceeding 5% and being less than 1% by weight. 4 : Peeling in a portion exceeding 1 〇 ° / 0 and being 50% or less. 5 : Peeling in more than 50% of the parts. [Evaluation of Surface Thickness Ra] A solid exposure region of 5 cm x 5 cm was placed on the sample, and measurement was performed using a small surface roughness measuring machine SURF TEST SJ-301 manufactured by MITUTOYO Co., Ltd. Example 1 [Production of Transparent Substrate A Forming Easy-Adhesive Layer of Double Layer Structure] Two faces of a polyethylene terephthalate (hereinafter referred to as PET) film support having a thickness of 100 μm were subjected to After the corona discharge treatment, the following first layer coating liquid is applied to the above two surfaces by a bar coating method, and the i-th layer coating liquid is dried to form the first
S 32 201224903 39744pif 層。然後,藉由棒式塗佈法來將下述的 至已形成的第1層的表面,使上述第 '塗佈液塗佈 t卜也制PET _ 使上之第2層塗佈液乾燥,藉 屏ϋ二祕广 薄膜於薄膜的兩個面包括雙 層構成的易黏接層。再者,f U、第 厚度分別為G.G8 _、_ _。 之後的 第1層塗佈液體的組成 •聚醋樹脂黏合劑(大曰本油墨化學工業(股 FINETEX ES650,固形物為 29 wt%) 、49.7 質量份 •作為交聯劑的環氧系化合物(長瀨化成(股)製= DENACOLEX-314 相對於樹脂黏合劑為6 wt% •界面活性劑A(三洋化成工業(股),SANDETB]L, 固形物10 wt%,陰離子性) 2.3質量份 •界面活性劑B (三洋化成工業(股),nar〇acty HN-100 ’固升>物為5% ’非離子性) 5.36質量份 •作為消光劑A的氧化矽微粒子分散液(曰本 AEROSIL (股)製造,〇χ_5〇的水分散物,固形物為1〇%) 2.4質量份 •作為消光劑Β的膠體氧化矽分散液(曰產化學(股) 製造,SNOWTEX-XL,固形物為1〇〇/0) 4.6質量份 以整體達到1000質量份的方式,添加蒸餾水來進行調 製。 第2層塗佈液體的組成 •丙稀酸樹脂黏合劑(ΜΜΑ59 mol%,St9 mol%, 2EHA26 mol%,HEMA5 mol0/〇,AA1 mol%的乳膠,固形 33 201224903 jy/44pif 物濃度為28 Wt°/〇) 化成(m份 •上述的消_ A 、、上㈣轉合劑為6wt% 2·7質量份 4·6質量份 1·9質量份 5·36質量份 巴西棕搁蠟分散物 7·6質量份 添加蒸餾水來進行調S 32 201224903 39744pif layer. Then, the surface of the first layer formed as described below is applied to the surface of the first layer to be formed by a bar coating method, and the second layer coating liquid is dried by applying the coating liquid to the first coating liquid. The two films on the two sides of the film include an easy-adhesive layer composed of two layers. Furthermore, f U and the first thickness are respectively G.G8 _, _ _. Composition of the first layer coating liquid afterwards • Polyacetate resin binder (Otsuka Ink Chemical Industry Co., Ltd. (FINETEX ES650, solid content: 29 wt%), 49.7 parts by mass • Epoxy compound as a crosslinking agent ( Changchun Huacheng (share) system = DENACOLEX-314 is 6 wt% relative to resin binder • Surfactant A (Sanyo Chemical Industry Co., Ltd., SANDETB) L, solid matter 10 wt%, anionic) 2.3 parts by mass • Surfactant B (Sanyo Chemical Industry Co., Ltd., nar〇acty HN-100 'solid liter> 5% 'nonionic') 5.36 parts by mass • cerium oxide microparticle dispersion as matting agent A (曰本AEROSIL (Stock), water dispersion of 〇χ_5〇, solid content of 1〇%) 2.4 parts by mass • Colloidal cerium oxide dispersion as matting agent 制造 (Manufactured by 曰 化学 化学, SNOWTEX-XL, solid content 1〇〇/0) 4.6 parts by mass is prepared by adding distilled water as a whole to 1000 parts by mass. Composition of the second layer coating liquid • Acrylic resin binder (ΜΜΑ59 mol%, St9 mol%, 2EHA26 mol %,HEMA5 mol0/〇, AA1 mol% latex, solid 33 201224903 jy/44pif concentration is 28 Wt ° / 〇) formation (m parts • the above elimination _ A, upper (four) conversion agent is 6wt% 2·7 parts by mass 4·6 parts by mass 1.9 parts by mass 5.36 5% by mass of Brazilian brown wax dispersion, added with distilled water for adjustment
•上述的消光劑B •界面活性劑A •界面活性劑B •潤滑劑(中京油脂(股), SELOSOL524 固形物為 3 wt% ) 以整體達到1000質量份的方式, [本^明的感測電極陣列的製造] 個面:上透!基板Α的易黏接層的-鍍之後,進行電解電鑛r形成電鑛是於無電解電 接著,於上述已形成的 軍來對該光阻膜進行曝光,利用顯影::::频:使用光 成硬化的光阻膜的網格圖案。於圖6尹,光,形 的圖案,轉鮮是設騎㈣縣• The above-mentioned matting agent B • Surfactant A • Surfactant B • Lubricant (Zhongjing Grease (share), SELOSOL 524 solid content is 3 wt%) In a manner of achieving 1000 mass parts as a whole, [this sensing] Manufacture of the electrode array] Surface: After the plated layer of the easy-adhesion layer of the substrate, after electroplating, the electro-mineralization is performed to form an electric ore, which is electrolessly electrolyzed, and the photoresist film is formed in the above-mentioned formed military Exposure is performed using development::::frequency: a grid pattern of a photoresist film that is hardened using light. In Figure 6, Yin, light, shape of the pattern, turn fresh is set to ride (four) county
It阻而成的圖案。使用韻刻液來對上述圖案: ,"一後,將硬化的光阻膜予以剝離除去,葬 匕含圖6的圖案的導電性細線的感測電極陣列。曰’形成 接著’於以上已製作的圖6的感测電極陣列的包含鋼 34 201224903 3y744pif ^膜的導電性細線部分設置黑化層。於本實例中,將形成 電極陣列的透明基板浸潰於硫化氫液體,僅使 面成為硫化銅的黑色’形成實例丨的感測電極 陣列。 實例2 貫Y j的電極的形狀為圖6的帶狀,相對於此,於實 例中電極的形狀設為圖3的鑽石狀,並且將導電性細 =6 μπι’除此以外’實施與實例ι相同的操作, 製作貫例2的感測電極陣列。 實例3 丄貫彳】2的導電性細線的間距設為500 μιη,除此以 :’貫施與實例2相同的操作,製作實例3的感測電極陣 列。 貫例4 δ 實·ΓΜ巾所使用的形成有㈣接層的透明美板 ,使用日本專利特公平5_74463號的實例 二 層聚醋薄膜(稱為透明基板Β),除此以外,實施^的積 相同的操作’製作實例4的感測電_列。再者:、例1 板B的積層聚㈣膜於重組層(本案的 ’遷明基 三聚氰胺系交軸NIKALAC MW· 12LF (三和^战中包含 製造)。 一匕學(股) 實例5 j用賴法來形成實例2的銅薄膜,將該 度設為0.2 μιη,將電極的導電性細線的寬度設、的厚 呵 J ,且 35 201224903 39744pif 將上述電極的導電性細線的間距設為200 μιη,除此以外, 實施與實例2相同的操作,製作實例5的感測電極陣列。 實例6 代替貫例1的透明基板Α的易點接層中所使用的環氧 系化合物DENACOLEX-314,相對於樹脂黏合劑,使用6 感的三聚氰胺系化合物(三和化學(股)製造的NIKalac MW-12LF),除此以外,實施與實例i相同的操作’製 實例6的感測電極陣列。 實例7 代替實例1的透明基板A的易黏接層中所使用的環氧 系化,^DENACOLEX_314,—於樹脂黏合劑,使用6 異氰咖與三經甲基丙烧的加成物,除此以 外,::與:例i相同的操作,製作實例7的感測電 歹二^ 了溶解交聯劑,將易黏接層塗佈液中的-部 分的水置換為丙嗣。 1 實例8 车化:‘ Ϊ二明基板A的易黏接層中所使用的環氧 wt%,; ,ΖΤΓ'314 * ^ 6 wt/〇的2乙烯基_2•噁唑啉單 物此以外’實施與實例i相同 感測電極陣列。再者/日7卿Μ貫例7的 液中的-部分的水置換為Χ麵,將祕接層塗饰 實例9 5.5 μπι,除此以 將實例1的導紐細線的線寬設為 36 201224903 jy/44pifIt is a pattern of resistance. Using the rhyme solution to the above pattern: , " Thereafter, the hardened photoresist film was peeled off, and the sensing electrode array including the conductive thin wires of the pattern of Fig. 6 was buried.曰' Formation Next, the blackened layer was provided in the portion of the conductive thin wire including the steel 34 201224903 3y744pif film of the sensing electrode array of Fig. 6 which was fabricated above. In the present example, the transparent substrate on which the electrode array was formed was immersed in a hydrogen sulfide liquid, and only the surface became a black electrode of the copper sulfide forming example array of sensing electrodes. Example 2 The shape of the electrode of the Y Y is the strip shape of FIG. 6. In contrast, in the example, the shape of the electrode is set to the diamond shape of FIG. 3, and the conductivity is finer = 6 μπι' except for the above. For the same operation, the sensing electrode array of Example 2 was fabricated. Example 3 The pitch of the conductive thin wires of 2 was set to 500 μm, except that the sensing electrode array of Example 3 was produced by the same operation as in Example 2. Example 4: A transparent plate formed of a (four) layer used in the δ-real smear, and an example two-layered vinegar film (referred to as a transparent substrate Β) of Japanese Patent Publication No. 5_74463, except The same operation was made 'produce the sensed electricity_column of Example 4. Furthermore: Example 1 The laminated poly(tetra) film of plate B is in the recombination layer (in this case, the 'Mengming-based melamine-based axis NIKALAC MW·12LF (manufactured in Sanwaji Battle). Yixue (share) Example 5 j The copper film of Example 2 was formed by Laifa, and the degree was set to 0.2 μm, and the width of the conductive thin wire of the electrode was set to be thick, and 35 201224903 39744pif The pitch of the conductive thin wires of the above electrodes was set to 200 μm. Except for this, the same operation as in Example 2 was carried out to fabricate the sensing electrode array of Example 5. Example 6 Instead of the epoxy compound DENACOLEX-314 used in the easy-contact layer of the transparent substrate of Example 1, the relative A sensing electrode array of Example 6 was carried out in the same manner as in Example i except that a 6-sensed melamine-based compound (NIKalac MW-12LF manufactured by Sanwa Chemical Co., Ltd.) was used as the resin binder. Instead of the epoxy resin used in the easy-adhesion layer of the transparent substrate A of Example 1, ^DENACOLEX_314, for the resin binder, an adduct of 6 isocyanate and trimethyl propyl hydride was used, and , ::: is the same as: example i Operation, the sensing electrophoresis of Example 7 was made to dissolve the cross-linking agent, and the water in the portion of the easy-adhesion layer coating liquid was replaced with propionate. 1 Example 8 Chelation: 'Ϊ二明基板A Epoxy wt% used in the easy-adhesion layer;;, ΖΤΓ '314 * ^ 6 wt / 2 2 vinyl _2 oxazoline monoliths other than the implementation of the same sensing electrode array as Example i. The water in the liquid of Part 7 is replaced with a kneading surface, and the sealing layer is painted with an example of 9 5.5 μπι, except that the line width of the thin wire of the example 1 is set to 36 201224903 Jy/44pif
外,實施與妙!丨綱的操作,製作實例9喊測電 列。 I 實例10 將實例1的導電性細線的線寬設為4μιη,除此 實施與實例1相同的操作,製作實例10的感測電 : 比較例1 於實例1的第二易黏接層中不使用交聯劑,除此以 外,實施與實例1相同的操作,製作比較例丨的感測電極 陣列。 比較例2 將比較例1的導電性細線的線寬設為3 μιη,除此以 外,實施與比較例1相同的操作,製作比較例2的感測電 極陣列。 比較例3 將實例4的透明基板Β的三聚氰胺系交聯劑予以除 女,除此以外’實施與實例4相同的操作’製作比較例3 的感測電極陣列。 上述實例與比較例的試料的密著性歸納於表丨中。 37 201224903 jy/44pif [表1] 透明基板 的序號與 交聯劑 金屬薄膜的 製法與膜厚 (μηι) 細線寬度 (μηι) 細線間距 (μηι) 電極形狀 密著性(剝 離比例) 實例1 A 環氧系 電鍍 2 5 300 帶狀 5% 實例2 A 環氧系 電鍍 2 6 300 鑽石 0% 實例3 A 環氧系 電鍍 2 8 500 鑽石 0% 實例4 B 三聚氰胺 系 電鍍 2 5 300 帶狀 2% 實例5 A 環氧系 濺鍍 0.2 3 200 鑽石 0% 實例6 A 三聚氰胺 系 電鍍 2 5 300 帶狀 5% 實例7 A 異氰酸鹽 系 電鍍 2 5 300 帶狀 5% 實例8 A °惡。生啭系 電鍍 2 5 300 帶狀 5% 實例9 A 環氧系 電鍍 2 5.5 300 帶狀 0% 實例10 A 環氧系 電鍍 2 4 300 帶狀 5% 比較例1 A 無 電鍍 2 5 300 帶狀 15% 比較例2 A 無 電鍍 2 3 300 帶狀 30% 比較例3 B 無 電鍍 2 5 300 帶狀 15% 根據以上的結果,必須於易黏接層中添加交聯劑,尤 其若使用環氧系、三聚氰胺系、異氰酸酯系、以及噁唑啉 系的交聯劑,則可對透明基材與銅薄層的密著性進行改 良。又,亦已確認:只要導電性細線的線寬為厚度的2.5 倍以上,則可對密著性進行改良。 實例21In addition, implementation and wonderful! In the operation of the gang, the example 9 is called to test the electric train. I Example 10 The line width of the conductive thin wires of Example 1 was set to 4 μm, except that the same operation as in Example 1 was carried out, and the sensing electricity of Example 10 was produced: Comparative Example 1 was not in the second easy-adhesion layer of Example 1. The same operation as in Example 1 was carried out, except that a crosslinking agent was used, to prepare a sensing electrode array of Comparative Example. Comparative Example 2 The same operation as in Comparative Example 1 was carried out except that the line width of the conductive thin wires of Comparative Example 1 was changed to 3 μm, and a sensing electrode array of Comparative Example 2 was produced. Comparative Example 3 A sensing electrode array of Comparative Example 3 was produced by performing the same operation as in Example 4 except that the melamine-based crosslinking agent of the transparent substrate of Example 4 was removed. The adhesion of the above examples to the samples of the comparative examples is summarized in the table. 37 201224903 jy/44pif [Table 1] The number of the transparent substrate and the method and film thickness of the cross-linking metal film (μηι) Thin line width (μηι) Fine line pitch (μηι) Electrode shape adhesion (peeling ratio) Example 1 A ring Oxygen plating 2 5 300 Band 5% Example 2 A Epoxy plating 2 6 300 Diamond 0% Example 3 A epoxy plating 2 8 500 Diamond 0% Example 4 B Melamine plating 2 5 300 Band 2% Example 5 A epoxy sputter 0.2 3 200 diamond 0% Example 6 A melamine plating 2 5 300 strip 5% Example 7 A isocyanate plating 2 5 300 strip 5% Example 8 A ° Evil. Oyster plating 2 5 300 Band 5% Example 9 A Epoxy plating 2 5.5 300 Band 0% Example 10 A Epoxy plating 2 4 300 Ribbon 5% Comparative Example 1 A Electroless plating 2 5 300 Ribbon 15% Comparative Example 2 A Electroless plating 2 3 300 Ribbon 30% Comparative Example 3 B Electroless plating 2 5 300 Ribbon 15% According to the above results, it is necessary to add a crosslinking agent to the easy-adhesion layer, especially if epoxy is used. The adhesion of a transparent substrate to a copper thin layer can be improved by a melamine-based, isocyanate-based, or oxazoline-based crosslinking agent. Further, it has been confirmed that the adhesion can be improved as long as the line width of the conductive thin wires is 2.5 times or more the thickness. Example 21
38 201224903 jy/44pif 於實例1中已製作的透明基板A(包括雙層構成的易 黏接層)的易黏接層的一個面上,藉由電鍍法而形成銅的 薄膜。電鍍是於無電解電鍍之後,進行電解電鍵,形成厚 度為2 μιη的銅的薄層。使用與實例1相同的方法,於上 述銅薄膜上,形成包含圖6的圖案(導電性細線的寬度為 5 μιη ’細線的間距為3〇〇 μπι)的導電性細線的感測電極陣 列。將該感測電極陣列設為試料21-1。於該感測電極陣列 的包含銅薄膜的導電性細線部分,藉由下述的還原處理或 氧化處理方法而設置黑化層。 [黑化處理方法之一] 處理條件:於4(TC的下述液體中浸潰3分鐘,然後洗 淨。 液體的組成:硼氫化鈉 3,8 g 添加1升的水。 [黑化處理方法之二] ^ 處理條件:於的下述液體中浸潰4分鐘,然後洗 淨。 液體的組成:亞氣酸鈉55 g 氫氧化鈉 15 g 磷酸三鈉 1〇 g 添加1升的水。 1、將對上述試料21-1實施上述黑化處理方法之一所得 的5式料設為21-2。又,將對上述試料21-1實施上述黑化處 理方法之二所得的試料設為21-3。將進一步對上述試料 39 201224903 方法之一所得物核為2i-4。對 著料L W的試料21]至試料2U4的反射色度、密 者性、上及耐磨性進行測試,將測糾結果表示於表2中。 [表2] 試料的序號 反射色度 21-1 ___無處理 21-2 L* 23,0 a* 7.2 b* 4.0 密著性 5 耐磨性 5 Ra 0.20 備註 比較例 j法之一 20.5 5.9 2.8 5 5 0.17 比較例 21-3 21-4 ^階段處理 11.9 10.6 0.7 Γ^Γ~ -0.3 -1.3 1 2 1 0.10 0.09 本發明 本發明 亡3果’已知:為了獲得所期望的反射色度, ::氧:還原處理來進行黑化處理時,與還原處理相比 二:化处理更佳,進,較佳為於氧化處理之後實施還原 ^又、’已口 ·對於試料21-3 '試料21-4而言,與密著 性、,稱為耐磨性的耐久性相_性能亦已被改良。 實例31 拯展?作的透明基板a (包括雙層構成的易黏 ^層)的㈣接層的-個面上,料f鍍法㈣成銅的薄 =。電鍍是於無鶴電狀後,進行f解電鍍,形成厚度 ί2叫的銅的薄層。使用與實例1相同的方法,於上述 銅薄膜上,形成包含圖6的圖案(導電性細線的寬度為5 線的間距為300哗)的導電性細線的感測電極陣 列。將該制電極陣列設為試料3lq。於該感測電極陣列 201224903. 的包含銅薄膜的導電性細線部分,實施下述利用電鍍的黑 化處理’設置黑化層。 [黑化處理方法之三] 處理條件:浸潰於40°c的下述電鍍液,以3.2 A/cm電 锻0.5分鐘,然後洗淨。 電鍍液體的組成(補充液亦為相同的組成) 硫酸鎳六水合物 硫氰酸錢 硫酸辞七水合物 硫酸鈉 添加水 pH (利用硫酸與氫氧化鈉來進行調整)5 〇 [黑化處理方法之四] 123 g 17g 3g38 201224903 jy/44pif A film of copper was formed by electroplating on one surface of the easy-bonding layer of the transparent substrate A (including the two-layer adhesive layer) which was produced in Example 1. Electroplating is performed after electroless plating, and electrolytic bonding is performed to form a thin layer of copper having a thickness of 2 μm. In the same manner as in Example 1, a sensing electrode array including conductive thin wires having a pattern of the pattern of Fig. 6 (the width of the conductive thin wires of 5 μm Å) was 3 μm μm was formed on the above copper film. This sensing electrode array was set as the sample 21-1. The blackened layer is provided by the reduction treatment or the oxidation treatment method described below in the portion of the conductive thin wire containing the copper thin film of the sensing electrode array. [One of blackening treatment methods] Treatment conditions: Dip for 3 minutes in 4 (TC) of the following liquid, and then wash. Composition of liquid: sodium borohydride 3,8 g Add 1 liter of water. [Blackening treatment Method 2] ^ Treatment conditions: impregnation in the following liquid for 4 minutes, and then washed. Composition of the liquid: sodium sulfite 55 g sodium hydroxide 15 g trisodium phosphate 1 〇 g Add 1 liter of water. 1. The type 5 material obtained by performing one of the above-described blackening treatment methods on the sample 21-1 is 21-2. Further, the sample obtained by subjecting the sample 21-1 to the blackening treatment method 2 is set to 21-3. Further, the core of one of the above samples 39 201224903 is 2i-4. The reflection chromaticity, the viscousness, the upper and the abrasion resistance of the sample 21] to the sample 2U4 of the material LW are tested. The results of the measurement and correction are shown in Table 2. [Table 2] The number of the sample is reflected by the color 21-1 ___No treatment 21-2 L* 23,0 a* 7.2 b* 4.0 Adhesion 5 Abrasion resistance 5 Ra 0.20 Remarks One of the comparison examples j 20.5 5.9 2.8 5 5 0.17 Comparative Example 21-3 21-4 ^ Stage treatment 11.9 10.6 0.7 Γ^Γ~ -0.3 -1.3 1 2 1 0.10 0.09 It is known that in order to obtain the desired reflection chromaticity, :: oxygen: reduction treatment for blackening treatment, compared with the reduction treatment, the treatment is better, preferably, preferably After the oxidation treatment, the reduction was carried out, and the sample 21-4 of the sample 21-3 was tested and the durability and the durability phase called abrasion resistance were improved. Example 31 The surface of the (4) layer of the transparent substrate a (including the easy-adhesive layer composed of two layers) is made of material f plating method (four) into copper thin =. Electroplating is performed after the crane is not electrically The plating was performed to form a thin layer of copper having a thickness of 0.25. Using the same method as in Example 1, a conductive pattern including the pattern of FIG. 6 (the width of the conductive thin wires of 5 lines was 300 Å) was formed on the above copper film. The electrode array of the thin wire is set as the sample 3lq. The conductive thin wire portion including the copper thin film of the sensing electrode array 201224903. is subjected to the following blackening treatment by electroplating. [Blackening treatment method 3] Treatment conditions: the following plating solution impregnated at 40 ° C Forging for 3.5 minutes at 3.2 A/cm, then washing. Composition of electroplating liquid (replenishing liquid is also the same composition) Nickel sulfate hexahydrate thiocyanate, sulfuric acid, heptahydrate, sodium sulfate, water addition pH (using sulfuric acid Adjust with sodium hydroxide) 5 〇 [fourth of blackening treatment method] 123 g 17g 3g
處理條件:浸潰於4(Vt的下述電鍍液,以3 2 A/cm來 電鍍0.5分鐘,然後洗淨。 電鍍液體的組成(補充液亦為相同的組成) 硫酸鎳六水合物 硫亂酸錄 硫酸鋅七水合物 硫酸鈉 123 g 17 g 28 g 添加水 16 g 1升 PH (利用硫酸與氫氧化鈉來進行調整)5〇 „料叫實施上述黑化處理方法之三所得的试料設為31·2。又,將對上述試料3M #施上述黑化處 201224903 jy/^pif 理方法之四所得的試料設為31_3。將進一步對上述試料 31-3實施上述黑化處理方法之三所得的試料設為31_4。 又,將如下的試料設為31-5,該試料是使用市售的鉻系黑 色電鍍浴,以3.2A/cm來對上述試料31_丨電鍍〇 5分鐘, 然後洗淨所得的試料。 對以上述方式獲得的試料3i_i至試料31_5的反射色 度、密紐、以及咖性進㈣試,將順的結果表示於 表3中。 [表3] 試料的序號 31-1 L* 反射色度 a* b* 密著性 耐磨性 Ra 備註 無處理 31^2 23.0 ~12Λ^ 7.2 4.0 5 5 0.20 比較例 方法之三 31-3 —— 08 L5 4 4 0.16 比較例 方法之四 9.0 0.7 -0.3 1 2 0.12 ·— — 本發明 31-4 二階段處理 31-5 8.8 0.1 0.8 -1.7 〇 1 ---- 13.5 1 1 0.08 本發明 4 4 0.17 Ιϊ3^Γ~ ----- 低濃度液與高濃度液來進行的 物的低濃度'夜來+ w ^ 手佳的硫馱鋅七水合 朿進仃處狀後,彻硫_七水合物的高Processing conditions: immersed in 4 (Vt of the following plating solution, electroplating at 3 2 A / cm for 0.5 minutes, and then washed. Composition of the plating liquid (replenishment solution is also the same composition) nickel sulfate hexahydrate sulfur Acid acid zinc sulfate heptahydrate sodium sulfate 123 g 17 g 28 g Water addition 16 g 1 liter PH (adjusted with sulfuric acid and sodium hydroxide) 5 〇 料 料 料 料 料 料 料 料 料 料 料 料 料 料 料 料 料 料 料 料 料 料 料 料 料 料In addition, the sample obtained by the fourth method of the above-mentioned sample 3M #201224903 jy/^pif method is set to 31_3. The blackening treatment method is further applied to the sample 31-3. The sample obtained in the third sample was set to 31_4. The following sample was set to 31-5, and the sample was plated with a commercially available chromium-based black plating bath at 3.2 A/cm for 5 minutes at a rate of 3.2 A/cm. Then, the obtained sample was washed. The reflection chromaticity, the nucleus, and the coffee property of the sample 3i_i obtained in the above manner were tested in (4), and the results are shown in Table 3. [Table 3] 31-1 L* reflection chromaticity a* b* Adhesive wear resistance Ra Remarks no treatment 31^2 23.0 ~12Λ^ 7.2 4.0 5 5 0.20 Comparative Example Method 3 31-3 - 08 L5 4 4 0.16 Comparative Example Method 4 9.0 0.7 -0.3 1 2 0.12 ·- - 31-4 2-stage treatment of the present invention 31-5 8.8 0.1 0.8 -1.7 〇1 ---- 13.5 1 1 0.08 4 4 0.17 Ιϊ3^Γ~ ----- Low concentration of low concentration liquid and high concentration liquid 'night come + w ^ hand good After the sulphur, zinc, and sulphate are in the form of sulphur, the sulphur-seven hydrate is high.
S 42 201224903, jy /叫pif 漠度液來進行處理。 可藉由上述二階段處縣麟具有耐久性的金屬 、,田、、電極。於金屬細線電極的表面設置氧化膜,或實施利 用電鑛處理的低反射處理,例如_黑色鉻來防止反射等 已揭不於日本專利特開2__344163號中 性相關的揭示。 ”〜、町又 ,上述試料31_4以及試料315於6(rc9〇%的環境下 保,〇〇小時,然後在通常的環境下保存24小時之後’進 二山、表3相同的測定。結果,可知:對於試料31-4,僅觀 測出誤差範_變動,㈣於試料31_5,L*增加至= ,止’Ra亦增加至〇 2()為止,朝本發明中的不佳的色产、 ”不佳的表面粗糙度的方向發生了變動。 【圖式簡單說明】 ^ )圖1(b)是本發明的觸控面板的剖面圖。 面板的剖面2 (d)是本發明的感測電極陣列與觸控 圖3 =本發明的第一感測電極陣列11的排列圖。 =4是本發明的第二感測電極陣列12的排列圖。 陣列第一感測電極陣列與第二感測電極 乂配置時的自觸控者側所見的透視圖。 本發明的其他第一感測電極陣列11的排列圖。 明的其他第二感測電極陣列12的排列圖。 電極陣列ΐ行正他第一感測電極陣列與第二感測 進订正又配置時的自觸控者侧所見的透視圖。 43 201224903 jy /HHpif 圖 9 (a)、圖 9 (b) 板的剖面圖。 是本發明的包括黑化層的觸控面 卜Ξ I0 (a)〜圖1〇⑷是本發明的黑化層的形成方法 【主要元件符號說明】 10 :本發明的觸控面板 11 .第一感測電極陣列 12第一感測電極陣列 15 15 ·透明基板 16 ·成為觸控面的透明材料層 17 :剝離薄膜 18 ' =易黏接層 U、19'、19” :黏接劑層/黏著層 20、20’ :黑化層 21 :感測電極的形成層/薄層 31 :網格狀的感測電極 32 :感測電極的包覆層 33 :網格狀的感測電極的包覆層 的非 cb ·表示處於下部電極層的感測電極的電極之 導電性的邊界區域。 曰 cd :表示感測電極之間的非導電性的邊界區域的寬度 c-j ·表示下部電極層的感測電極的序號 CW .表示下部電極層的感測電極的電極寬度 i :孤立導線/導電性細線/細線 44 5 201224903S 42 201224903, jy / called pif desert liquid for processing. It is possible to use the metal, field, and electrode with durability in the above two stages. An oxide film is provided on the surface of the metal thin wire electrode, or a low reflection treatment using an electric ore treatment, such as _black chrome to prevent reflection, etc., has been disclosed in Japanese Patent Laid-Open No. Hei 2__344163. In the case of the above-mentioned sample 31_4 and the sample 315, the same measurement was carried out in the environment of 6 (rc9〇%, 〇〇hour, and then stored in a normal environment for 24 hours). It can be seen that for the sample 31-4, only the error range variation is observed, (4) in the sample 31_5, L* is increased to =, and the 'Ra is also increased to 〇2 (), the poor color production in the present invention, "The direction of the poor surface roughness has changed. [Simple description of the drawings] ^) Fig. 1(b) is a cross-sectional view of the touch panel of the present invention. Section 2 (d) of the panel is an array of sensing electrodes and touch map of the present invention. Figure 3 is an arrangement diagram of the first sensing electrode array 11 of the present invention. = 4 is an arrangement diagram of the second sensing electrode array 12 of the present invention. A perspective view of the array of first sensing electrodes and second sensing electrodes when viewed from the toucher side. An arrangement diagram of other first sensing electrode arrays 11 of the present invention. An arrangement diagram of the other second sensing electrode arrays 12 of the present invention. The electrode array performs a perspective view of the first sensing electrode array and the second sensing alignment as seen from the toucher side. 43 201224903 jy /HHpif Figure 9 (a), Figure 9 (b) Sectional view of the board. The touch panel including the blackening layer of the present invention I0 (a) to (1) is a method for forming a blackening layer of the present invention. [Main element symbol description] 10: Touch panel 11 of the present invention. A sensing electrode array 12, a first sensing electrode array 15 15 · a transparent substrate 16 · a transparent material layer 17 that becomes a touch surface: a release film 18 ' = an easy-adhesion layer U, 19', 19": an adhesive layer /Adhesive layer 20, 20': blackening layer 21: forming layer/thin layer 31 of sensing electrode: grid-shaped sensing electrode 32: cladding layer 33 of sensing electrode: grid-shaped sensing electrode The non-cb of the cladding layer indicates the boundary region of the conductivity of the electrode of the sensing electrode of the lower electrode layer. 曰cd : the width cj of the boundary region indicating the non-conductivity between the sensing electrodes · the lower electrode layer The number of the sensing electrode CW. indicates the electrode width of the sensing electrode of the lower electrode layer i: isolated wire / conductive thin wire / thin wire 44 5 201224903
rb :表示處於上部電極層的感測電極的電極之間的非 導電性的邊界區域 rd:表示處於上部電極層的感測電極的電極之間的非 導電性的邊界區域的寬度 r-i :表示上部電極層的感測電極的序號 rw :表示上部電極層的感測電極的電極寬度 45Rb : a non-conductive boundary region rd between the electrodes of the sensing electrodes of the upper electrode layer: a width ri of the non-conductive boundary region between the electrodes of the sensing electrodes of the upper electrode layer: represents the upper portion The number rw of the sensing electrode of the electrode layer: the electrode width of the sensing electrode of the upper electrode layer 45
Claims (1)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010226020A JP5645581B2 (en) | 2010-10-05 | 2010-10-05 | Touch panel |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201224903A true TW201224903A (en) | 2012-06-16 |
TWI552057B TWI552057B (en) | 2016-10-01 |
Family
ID=46137687
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW100136098A TWI552057B (en) | 2010-10-05 | 2011-10-05 | Touch panel |
TW105115628A TWI576753B (en) | 2010-10-05 | 2011-10-05 | Touch panel |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW105115628A TWI576753B (en) | 2010-10-05 | 2011-10-05 | Touch panel |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP5645581B2 (en) |
KR (1) | KR101968764B1 (en) |
TW (2) | TWI552057B (en) |
Cited By (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI480633B (en) * | 2012-07-12 | 2015-04-11 | Hannstouch Solution Inc | Touch sensing panel and touch sensing liquid crystal display panel using the same |
TWI493409B (en) * | 2013-02-06 | 2015-07-21 | 南昌歐菲光科技有限公司 | Displayer and touch screen inductive module thereof |
CN104956296A (en) * | 2013-01-29 | 2015-09-30 | 夏普株式会社 | Input apparatus, manufacturing method therefor, and electronic information device |
TWI503715B (en) * | 2013-02-06 | 2015-10-11 | Nanchang O Film Tech Co Ltd | Conductive film and manufacture method thereof and touch screen containing the conductive film |
TWI503724B (en) * | 2013-02-06 | 2015-10-11 | Nanchang O Film Tech Co Ltd | Conductive film and manufacture method thereof and touch screen containing the conductive film |
TWI507953B (en) * | 2013-06-06 | 2015-11-11 | Focaltech Systems Ltd | Liquid crystal display with touch function, electronic apparatus thereof and fabricating method thereof |
US9268446B2 (en) | 2013-02-06 | 2016-02-23 | Nanchang O-Film Tech. Co., Ltd. | Monitor, touchscreen sensing module thereof, and method for manufacturing the touchscreen sensing module |
US9557594B2 (en) | 2013-01-18 | 2017-01-31 | Focaltech Systesm, Ltd. | Liquid-crystal display screen with touch-control function and manufacturing method thereof and electronic apparatus |
CN107924253A (en) * | 2015-08-26 | 2018-04-17 | 住友金属矿山股份有限公司 | Conductive board |
TWI634465B (en) * | 2014-01-31 | 2018-09-01 | 日商住友金屬礦山股份有限公司 | Conductive substrate, laminated conductive substrate, manufacturing method of conductive substrate, and manufacturing method of laminated conductive substrate |
US10198121B2 (en) | 2014-03-13 | 2019-02-05 | Noritake Co., Limited | Projected capacitive touch switch panel |
US10331249B2 (en) | 2014-06-24 | 2019-06-25 | Vts-Touchsensor Co., Ltd. | Touch sensor substrate, touch panel, display device, and method for producing touch sensor substrate |
TWI671663B (en) * | 2014-07-31 | 2019-09-11 | 日商住友金屬礦山股份有限公司 | Conductive substrate for touch panel and method for producing conductive substrate for touch panel |
CN112817489A (en) * | 2021-03-08 | 2021-05-18 | 京东方科技集团股份有限公司 | Touch substrate and display device |
Families Citing this family (63)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5892418B2 (en) * | 2012-01-11 | 2016-03-23 | 大日本印刷株式会社 | Touch panel sensor, touch panel sensor manufacturing method, and laminate for manufacturing touch panel sensor |
US9204535B2 (en) * | 2012-04-18 | 2015-12-01 | Lg Chem, Ltd. | Conductive structure and method for manufacturing same |
JP5829647B2 (en) * | 2012-05-08 | 2015-12-09 | 富士フイルム株式会社 | Conductive film |
JP2013250633A (en) * | 2012-05-30 | 2013-12-12 | Toppan Printing Co Ltd | Film-like capacitive type touch panel and manufacturing method of the same, and image display device |
JP2014002434A (en) * | 2012-06-15 | 2014-01-09 | Touch Panel Kenkyusho:Kk | Conductive film and capacitive touch panel |
JP2014002433A (en) * | 2012-06-15 | 2014-01-09 | Touch Panel Kenkyusho:Kk | Conductive film and capacitive touch panel |
KR101987353B1 (en) * | 2012-07-23 | 2019-06-11 | 엘지이노텍 주식회사 | Touch panel and method for manufacturing the same |
JP5983758B2 (en) * | 2012-10-22 | 2016-09-06 | コニカミノルタ株式会社 | Display device with touch panel |
CN104838449B (en) | 2012-12-07 | 2018-06-15 | 3M创新有限公司 | Conductive articles |
JP2014142462A (en) * | 2013-01-23 | 2014-08-07 | Dainippon Printing Co Ltd | Electrode part for touch panel with optical functional layer, electrode part for touch panel with circular polarizing plate, touch panel, and image display device |
KR20150108356A (en) | 2013-01-24 | 2015-09-25 | 도판 인사츠 가부시키가이샤 | Touch panel and display device |
EP2950187A4 (en) | 2013-01-25 | 2016-10-19 | Toppan Printing Co Ltd | Touch panel and display device |
KR102044900B1 (en) * | 2013-03-07 | 2019-11-15 | 삼성디스플레이 주식회사 | touch screen panel |
JP2014174656A (en) * | 2013-03-07 | 2014-09-22 | Dainippon Printing Co Ltd | Electrode member for touch panel, touch panel, and image display device |
JP6322188B2 (en) * | 2013-03-26 | 2018-05-09 | 株式会社カネカ | Conductive film substrate, transparent conductive film and method for producing the same, and touch panel |
KR102108843B1 (en) * | 2013-06-19 | 2020-05-11 | 엘지이노텍 주식회사 | Touch window |
JP2014191660A (en) | 2013-03-27 | 2014-10-06 | Japan Display Inc | Display device with touch detection function and electronic apparatus |
JP6186805B2 (en) * | 2013-03-28 | 2017-08-30 | 大日本印刷株式会社 | Touch panel |
JP5827972B2 (en) * | 2013-04-17 | 2015-12-02 | ジオマテック株式会社 | Touch sensor integrated display device |
JP6013397B2 (en) | 2013-05-10 | 2016-10-25 | サムソン エレクトロ−メカニックス カンパニーリミテッド. | Touch sensor |
JP5943023B2 (en) | 2013-07-08 | 2016-06-29 | 凸版印刷株式会社 | Touch sensor electrode, touch panel, and display device |
JP6376430B2 (en) * | 2013-09-04 | 2018-08-22 | 大日本印刷株式会社 | Display device with touch panel sensor and touch position detection function |
JP5743237B2 (en) * | 2013-09-25 | 2015-07-01 | 大日本印刷株式会社 | Touch panel sensor, touch panel device, and display device |
JP5795038B2 (en) | 2013-10-01 | 2015-10-14 | 日本写真印刷株式会社 | Electrode sheet for capacitive touch panel |
KR102275704B1 (en) * | 2013-10-10 | 2021-07-08 | 엘지디스플레이 주식회사 | Touch panel and manufacturing method thereof |
KR102222194B1 (en) | 2013-10-17 | 2021-03-04 | 엘지이노텍 주식회사 | Touch window and display with the same |
CN105765498B (en) | 2013-10-22 | 2018-11-20 | 夏普株式会社 | Display device with touch sensor |
KR101725075B1 (en) * | 2013-11-11 | 2017-04-11 | 주식회사 아모센스 | Touch Sensor for Touch Screen Panel and Manufacturing Method Thereof |
JP2015125628A (en) * | 2013-12-26 | 2015-07-06 | 大日本印刷株式会社 | Film sensor, display device with touch position detection function, and laminate for manufacturing film sensor |
JP6233024B2 (en) * | 2014-01-06 | 2017-11-22 | 大日本印刷株式会社 | Touch panel sensor, touch panel sensor manufacturing method, and display device with touch position detection function |
JP5941935B2 (en) * | 2014-02-25 | 2016-06-29 | 介面光電股▲ふん▼有限公司 | Touch panel device and electrode structure thereof |
JP6278261B2 (en) * | 2014-02-28 | 2018-02-14 | 大日本印刷株式会社 | Touch panel sensor, touch panel device, display device, and method for manufacturing touch panel sensor |
JP6225793B2 (en) | 2014-03-28 | 2017-11-08 | 凸版印刷株式会社 | Touch sensor electrode, touch panel, and display device |
JP6470264B2 (en) | 2014-04-15 | 2019-02-13 | 株式会社Vtsタッチセンサー | Touch sensor electrode, touch panel, and display device |
JP6344075B2 (en) * | 2014-06-18 | 2018-06-20 | 凸版印刷株式会社 | Capacitive touch panel |
CN106716316A (en) * | 2014-06-30 | 2017-05-24 | 住友金属矿山股份有限公司 | Conductive substrate, layered conductive substrate, method for producing conductive substrate, and method for producing layered conductive substrate |
JP6504456B2 (en) * | 2014-08-21 | 2019-04-24 | 大日本印刷株式会社 | Touch panel sensor and display device with touch position detection function |
KR102344396B1 (en) | 2014-08-28 | 2021-12-29 | 솔브레인 주식회사 | Blacking composition for light―absorbing layer |
JP6384267B2 (en) * | 2014-10-24 | 2018-09-05 | 大同特殊鋼株式会社 | Laminate |
JP2016085653A (en) * | 2014-10-28 | 2016-05-19 | 凸版印刷株式会社 | Touch panel and display device |
KR101658289B1 (en) * | 2014-11-27 | 2016-09-20 | 티-킹덤 컴퍼니 리미티드 | Structure for touch electrode substrate and manufacturing method thereof |
JP2016130912A (en) * | 2015-01-13 | 2016-07-21 | 大日本印刷株式会社 | Touch panel sensor, tough panel device and display device |
KR102275886B1 (en) * | 2015-01-20 | 2021-07-12 | 엘지이노텍 주식회사 | Touch window |
JP6445365B2 (en) * | 2015-03-26 | 2018-12-26 | 大日本印刷株式会社 | Translucent electrode, position detection electrode for touch panel using the translucent electrode, touch panel, and image display device |
KR102313967B1 (en) * | 2015-04-24 | 2021-10-18 | 엘지이노텍 주식회사 | Touch window |
EP3287878A4 (en) | 2015-04-24 | 2018-10-31 | LG Innotek Co., Ltd. | Touch window |
US10725325B2 (en) | 2015-04-30 | 2020-07-28 | Sumitomo Metal Mining Co., Ltd. | Conductive substrate and liquid crystal touch panel |
JP6210087B2 (en) * | 2015-05-08 | 2017-10-11 | 大日本印刷株式会社 | Manufacturing method of touch panel sensor |
JP2017004289A (en) * | 2015-06-11 | 2017-01-05 | 凸版印刷株式会社 | Touch sensor electrode and touch panel |
JP2017016241A (en) * | 2015-06-29 | 2017-01-19 | プロマティック株式会社 | Method for manufacturing electrode film, touch panel sensor including electrode film, and sticking device |
JP6692631B2 (en) * | 2015-11-30 | 2020-05-13 | 株式会社ジャパンディスプレイ | Display device with sensor and sensor device |
JP6588347B2 (en) * | 2016-01-22 | 2019-10-09 | 株式会社ジャパンディスプレイ | Input device and display device |
JP6597487B2 (en) * | 2016-06-15 | 2019-10-30 | 住友金属鉱山株式会社 | Electrode substrate film and method for producing the same |
JPWO2018012535A1 (en) * | 2016-07-15 | 2019-06-20 | 富士フイルム株式会社 | Wiring board manufacturing method, wiring board |
WO2018034324A1 (en) * | 2016-08-19 | 2018-02-22 | 日本電気硝子株式会社 | Touch sensor member, touch sensor, and display panel unit |
WO2018146963A1 (en) * | 2017-02-09 | 2018-08-16 | コニカミノルタ株式会社 | Touch screen and method for manufacturing touch screen |
EP3650999B1 (en) * | 2017-07-05 | 2023-10-18 | Sekisui Polymatech Co., Ltd. | Capacitance-type touch panel |
JP7172211B2 (en) | 2017-07-28 | 2022-11-16 | Tdk株式会社 | Conductive substrates, electronic devices and display devices |
CN109976566B (en) * | 2018-03-23 | 2021-05-18 | 京东方科技集团股份有限公司 | Touch structure, touch substrate, manufacturing method of touch substrate and display device |
KR102113340B1 (en) * | 2018-12-06 | 2020-05-20 | (주)아바비젼 | Method for manufacturing mesh type touch screen for visual improvement and mesh type touch screen using the same |
JP6773258B1 (en) * | 2019-04-02 | 2020-10-21 | 東レ株式会社 | Base material with conductive layer and touch panel |
TWI718654B (en) * | 2019-09-04 | 2021-02-11 | 郡宏光電股份有限公司 | Conductive plate for touch device |
JP7282117B2 (en) | 2021-03-16 | 2023-05-26 | Nissha株式会社 | capacitive touch panel |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05127822A (en) * | 1991-10-30 | 1993-05-25 | Daicel Chem Ind Ltd | Touch panel |
JP4610416B2 (en) | 2005-06-10 | 2011-01-12 | 日本写真印刷株式会社 | Capacitive touch panel |
JP2007140282A (en) * | 2005-11-21 | 2007-06-07 | Fujifilm Corp | Transparent electro-conductive hard coat film, polarizing plate and image display apparatus using the same |
JP5337342B2 (en) * | 2006-12-20 | 2013-11-06 | 富士フイルム株式会社 | Translucent electromagnetic shielding film |
JP5203073B2 (en) * | 2008-07-07 | 2013-06-05 | 東洋紡株式会社 | Upper electrode for touch panel |
CN102160019B (en) | 2008-08-01 | 2014-01-29 | 3M创新有限公司 | Methods of making composite electrodes |
US9244568B2 (en) * | 2008-11-15 | 2016-01-26 | Atmel Corporation | Touch screen sensor |
JP4805999B2 (en) * | 2008-12-09 | 2011-11-02 | 日東電工株式会社 | Transparent conductive film with pressure-sensitive adhesive layer and manufacturing method thereof, transparent conductive laminate and touch panel |
WO2010075308A2 (en) * | 2008-12-26 | 2010-07-01 | Atmel Corporation | Multiple electrode touch sensitive device |
US20110007011A1 (en) * | 2009-07-13 | 2011-01-13 | Ocular Lcd Inc. | Capacitive touch screen with a mesh electrode |
TWM383779U (en) * | 2009-11-02 | 2010-07-01 | Cheung Wing Technology Co Ltd | Structure of capacitive multi-touch touch panel |
-
2010
- 2010-10-05 JP JP2010226020A patent/JP5645581B2/en active Active
-
2011
- 2011-10-04 KR KR1020110100743A patent/KR101968764B1/en active IP Right Grant
- 2011-10-05 TW TW100136098A patent/TWI552057B/en active
- 2011-10-05 TW TW105115628A patent/TWI576753B/en active
Cited By (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI480633B (en) * | 2012-07-12 | 2015-04-11 | Hannstouch Solution Inc | Touch sensing panel and touch sensing liquid crystal display panel using the same |
US9557594B2 (en) | 2013-01-18 | 2017-01-31 | Focaltech Systesm, Ltd. | Liquid-crystal display screen with touch-control function and manufacturing method thereof and electronic apparatus |
CN104956296A (en) * | 2013-01-29 | 2015-09-30 | 夏普株式会社 | Input apparatus, manufacturing method therefor, and electronic information device |
TWI556149B (en) * | 2013-01-29 | 2016-11-01 | Sharp Kk | An input device, a manufacturing method thereof, and an electronic information machine |
TWI503724B (en) * | 2013-02-06 | 2015-10-11 | Nanchang O Film Tech Co Ltd | Conductive film and manufacture method thereof and touch screen containing the conductive film |
US9268446B2 (en) | 2013-02-06 | 2016-02-23 | Nanchang O-Film Tech. Co., Ltd. | Monitor, touchscreen sensing module thereof, and method for manufacturing the touchscreen sensing module |
US9313887B2 (en) | 2013-02-06 | 2016-04-12 | Nanchang O-Film Tech. Co., Ltd. | Conductive film, manufacturing method thereof, and touch screen having the same |
TWI503715B (en) * | 2013-02-06 | 2015-10-11 | Nanchang O Film Tech Co Ltd | Conductive film and manufacture method thereof and touch screen containing the conductive film |
TWI493409B (en) * | 2013-02-06 | 2015-07-21 | 南昌歐菲光科技有限公司 | Displayer and touch screen inductive module thereof |
TWI507953B (en) * | 2013-06-06 | 2015-11-11 | Focaltech Systems Ltd | Liquid crystal display with touch function, electronic apparatus thereof and fabricating method thereof |
TWI634465B (en) * | 2014-01-31 | 2018-09-01 | 日商住友金屬礦山股份有限公司 | Conductive substrate, laminated conductive substrate, manufacturing method of conductive substrate, and manufacturing method of laminated conductive substrate |
US10168842B2 (en) | 2014-01-31 | 2019-01-01 | Sumitomo Metal Mining Co., Ltd. | Conductive substrate, conductive substrate laminate, method for producing conductive substrate, and method for producing conductive substrate laminate |
US10198121B2 (en) | 2014-03-13 | 2019-02-05 | Noritake Co., Limited | Projected capacitive touch switch panel |
US10331249B2 (en) | 2014-06-24 | 2019-06-25 | Vts-Touchsensor Co., Ltd. | Touch sensor substrate, touch panel, display device, and method for producing touch sensor substrate |
TWI666582B (en) * | 2014-06-24 | 2019-07-21 | 日商Vts觸控感測器股份有限公司 | Manufacturing method of touch sensor substrate |
TWI671663B (en) * | 2014-07-31 | 2019-09-11 | 日商住友金屬礦山股份有限公司 | Conductive substrate for touch panel and method for producing conductive substrate for touch panel |
CN107924253A (en) * | 2015-08-26 | 2018-04-17 | 住友金属矿山股份有限公司 | Conductive board |
CN112817489A (en) * | 2021-03-08 | 2021-05-18 | 京东方科技集团股份有限公司 | Touch substrate and display device |
CN112817489B (en) * | 2021-03-08 | 2024-03-15 | 京东方科技集团股份有限公司 | Touch substrate and display device |
Also Published As
Publication number | Publication date |
---|---|
TWI552057B (en) | 2016-10-01 |
KR20120035874A (en) | 2012-04-16 |
JP5645581B2 (en) | 2014-12-24 |
TWI576753B (en) | 2017-04-01 |
KR101968764B1 (en) | 2019-04-12 |
JP2012079238A (en) | 2012-04-19 |
TW201627847A (en) | 2016-08-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TW201224903A (en) | Touch panel | |
CN105189829B (en) | The copper foil of appendix body, copper-cover laminated plate, printed circuit board (PCB), the manufacturing method of e-machine and printed circuit board (PCB) | |
JP6883765B2 (en) | Method for manufacturing fluoroscopic electrode laminate, fluoroscopic electrode material, device and fluoroscopic electrode laminate | |
CN105774118B (en) | The metal base of attached plating | |
JP5227570B2 (en) | Method for producing transparent conductive member | |
JP2012162775A (en) | Silver plated material and method for manufacturing the same | |
KR102169229B1 (en) | Sheet material, metal mesh, wiring substrate, display device and method for manufacturing thereof | |
TW201220981A (en) | Wiring circuit board | |
CN206680431U (en) | A kind of ultra-thin light-shielding conductive metal composite membrane adhesive tape | |
JP2015157392A (en) | Laminate for see-through type electrode and production method for the same, see-through type electrode material and device | |
CN102752964A (en) | Selective PCB (Printed Circuit Board) gold-electroplated manufacturing procedure and anti-plating layer therein | |
JP2008300724A (en) | Transparent base with electromagnetic wave shielding film, and manufacturing method thereof | |
JP5983141B2 (en) | Laminated film | |
TW200934330A (en) | Surface treated copper foil and method for surface treating the same, and stack circuit board | |
TW201208502A (en) | Surface-roughened copper foil and copper-clad laminated substrate | |
JP2019019351A (en) | Thin copper foil provided with peeling metal substrate, and method of producing the same | |
KR102169231B1 (en) | Sheet material, metal mesh and method for manufacturing thereof | |
JP2007274528A (en) | Film antenna | |
TWI791429B (en) | Blackening plating solution and method of manufacturing conductive substrate | |
TW201842437A (en) | Conductive substrate | |
CN100581808C (en) | Copper foil structure for promoting tenacity and its forming method | |
WO2015178455A1 (en) | Copper foil for transparent resin base material, and transparent resin base material having fine copper wiring | |
JP2017019207A (en) | Thin metallic wire film and method for producing the same | |
JP2023069796A (en) | Surface-treated copper foil | |
WO2017130866A1 (en) | Blackening plating solution and method for manufacturing conductive substrate |